AEI News
Mitsubishi Electric Expands Philippine FA Business
PHILIPPINES and JAPAN – Mitsubishi Electric Corporation has formed MELCO Factory Automation Philippines Inc. (MELAP) in the Philippines and will be jointly established with Setsuyo Astec Corporation (STC) and Integrated Factory Automation Inc. (IFA), a factory automation (FA) distributor and long-time partner of Mitsubishi Electric in the country.

Mitsubishi Electric and IFA will have 40 percent stake each in the venture while STC will take the remaining 20 percent. The new company, which will start operation in June, will provide sales and technical service for FA products.

The country’s industrial automation market has been experiencing significant growth, particularly in the electronics and food and beverage industries, as well as the active investment in infrastructure. The company sees these an opportunity to expand further its FA business in the country.

Mitsubishi Electric has been providing sales and technical support for FA products to customers in the country through local distributors, such as IFA. MELAP is expected to improve customer satisfaction and enhance Mitsubishi Electric’s local FA business.;

SK Innovation to Invest in Second Battery Facility in Hungary

KOREA and HUNGARY – SK Innovation Inc. has announced plans to invest 945.2 billion Korean won (US$831.9 million) to build a second secondary battery production facility in Hungary. The facility, which is located in Komarom, is estimated to occupy 430,000sq.m.

The said facility is expected to be opened next year while commercial production will start two years later.

Meanwhile, construction of the first secondary battery production line is in full swing already and is expected to start commercial production towards the end of this year with an annual capacity of 7.5GWh. SK Innovation is now operating one secondary battery facility in Korea, with ongoing construction in China and the United States.

Its China plant will start commercial production in the first half of 2020 with an annual capacity of 7.5GWh, while its Georgia facility in the United States is to start around 2022 at a capacity of 9.8GWh.

Xilinx, Samsung Enable 5G NR Commercial Deployment

UNITED STATES and KOREA – Xilinx, Inc. and Samsung Electronics Co., Ltd. have initiated the first 5G New Radio (NR) commercial deployment in Korea. The two companies also plan to replicate the effort in other countries later this year and beyond.

Xilinx and Samsung have been working together to develop and deploy multiple 5G Massive multiple-input, multiple-output (MIMO) and millimeter wave (mmWave) solutions using the Xilinx UltraScale+ platform. Additionally, Samsung is collaborating with Xilinx on its forthcoming Versal adaptable compute acceleration platform (ACAP) products to deliver state-of-the-art 5G solutions. The goal is to address a multi-fold increase in compute density requirements in next-generation 5G mMIMO systems while enabling the use of machine learning algorithms to maximize the benefits of beamforming gains to further boost capacity and performance.

Xilinx showcased the updates to its UltraScale+ platform portfolio along with other adaptable, intelligent 5G infrastructure demonstrations at the recent Mobile World Congress in Barcelona, Spain, while Samsung demonstrated the 5G NR platform in the same event.;

Bosch Taps SIIX as PCB Assembly Supplier

JAPAN and GERMANY – SIIX Corporation has forged a business alliance with Robert Bosch GmbH wherein the Japanese company electronics manufacturing service (EMS) company will supply the German automotive parts maker with printed circuit board (PCB) assembly for its car multimedia.

Its partnership with Bosch will start in September and soon thereafter its mass production of PCBA at SIIX’s Hungary facility.

SIIX procures parts, mounts PCBs, assembles and provides logistics service for its clients, not only automotive but various industrial field by utilizing global network. In the company’s mid-term business plan 2018-2020, SIIX aims to expand its business with customers outside Japan, and considers the business alliance with Bosch, which is leading in IoT technology, as a first step to become a strategic global supplier.;

ON Semiconductor Expands India Operations

UNITED STATES and INDIA – With the goal of integrating its operations across India, ON Semiconductor Corporation has opened a 55,000sq.ft state-of-the-art facility in Bangalore. The facility will have the capability of housing all of the 300 ON Semiconductor Technology India Pvt Ltd employees focused on supporting the company’s global Analog Solutions Group (ASG) and Intelligent Sensing Group (ISG).

The ON Semiconductor Bangalore India Development Center (BIDC) is a critical product development location for industrial, consumer, computing, sensing and automotive market segments. The company has continued to grow in India over the past 10 years through acquisitions and organic growth, investing more than US$20 million to build the workforce, laboratory and infrastructure in Bangalore. ON Semiconductor’s presence in India started with acquisition of Pulsecore in 2009, which brought over 10 years of developing and releasing integrated circuit products in various market segments.

STMicroelectronics, Virscient Partner on Connected Car Systems

SWITZERLAND and NEW ZEALAND – STMicroelectronics and hardware and software development provider Virscient Limited have made a partnership for customers building automotive solutions using ST’s Telemaco3P secure telematics and connectivity processors.

Virscient will offer support to ST’s customers in the development and delivery of advanced automotive applications based on the ST Modular Telematics Platform (MTP).

Incorporating ST’s Telemaco3P telematics and connectivity microprocessor MTP enables the rapid prototyping and development of smart-driving applications, including vehicle connectivity to back-end servers, road infrastructure, and other vehicles. Virscient brings a deep understanding of wireless connectivity technologies and protocols ideal for architecting connected-car systems that rely on technologies such as Global Navigation Satellite System (GNSS), LTE/cellular modems, V2X technologies, Wi‑Fi, Bluetooth, and Bluetooth Low Energy.

The Telemaco3P incorporates dual Arm Cortex-A7 processors with an embedded Hardware Security Module (HSM), an independent Arm Cortex-M3 subsystem, and a rich set of connectivity interfaces.;