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Semiconductors, ICs & Modules
HRM1079 Bluetooth Module by Hosiden
HRM1079 Bluetooth Module by Hosiden

Hosiden Corporation has made available the HRM1079 Bluetooth Low Energy Module, which adopts the Nordic nRF 52832 WLCSP package for miniaturization requirements of beacon terminals. Its high-performance antenna has settings for optimum output power dictated by an application software, allowing it to achieve both wide communication range and low power consumption, and reduce the design load on the customer’s high-frequency circuitry. Moreover, it has a built-in 32kHz sub-clock and a DC/DC converter so that the IC can operate at low power. With support for the LE 2M PHY implementation added in Bluetooth 5.0, it is possible to communicate at twice the transmission speed of Bluetooth 4.2 or earlier modules. These features make HRM1079 applicable for general consumer products and wireless sensors and beacon terminals in the internet of things/internet of everything markets. HRM1079 has also received radio frequency certification under modular equipment conditions, based on the provisions of Japan, the United States and Canada, while for Europe, test reports can be provided.
Hosiden Corporation
www.hosiden.co.jp

Epson’s S2D13V70 Interface IC

Epson’s S2D13V70 Interface IC
Seiko Epson Corporation’s new interface conversion IC for in-vehicle systems converts Embedded DisplayPort eDP) video signals to OpenLDI or open LVDS display interface. Both eDP and OpenLDI are interface standards for transmitting video signals to displays, but eDP supports higher-resolution video and faster speeds than the more widely used OpenLDI. Epson’s S2D13V70 interface conversion IC supports both automotive standards, and satisfies the strict quality requirements of the automotive industry as it is compliant with AEC-Q100 and operates at temperatures up to 105℃. The conversion IC is also equipped with safety functions, like the CRC function, which monitors whether video signals output from an ECU are being properly received, and the blank screen function, which masks the display with a particular image pattern when a problem is detected in the transmission path between an ECU and the conversion IC. S2D13V70 supports the design of dual-display instrument clusters, with a splitter function that splits and outputs video signals on two displays.
Seiko Epson Corporation
https://global.epson.com

Samsung’s mmWave RFIC, DAFE ASIC

Samsung’s mmWave RFIC, DAFE ASIC

Samsung Electronics Co., Ltd. has completed the development of its cutting-edge mmWave radio frequency integrated circuits (RFICs) and digital/analog front end (DAFE) ASICs, which are the core components in a 5G chipset, supporting 28GHz and 39GHz bands. The RFICs and DAFE ASICs enable about 25 percent reduction in size, weight, and power consumption for 5G base stations when compared to the previous iterations. The new RFICs using cutting-edge 28nm CMOS semiconductor technology operate on bandwidths that have been expanded to 1.4GHz, compared to 800MHz for previous RFICs. The size of the RFIC is 36 percent lower and the overall performance is enhanced by decreasing the noise level and improving the linearity characteristics of the RF power amplifier. The new DAFE as an ASIC is low in power consumption and small in size and is essential for digital wireless telecommunications as it provides analog-to-digital conversions and vice versa.
Samsung Electronics Co., Ltd.
www.samsung.com/global

R-REF04-RIA12-1/2 DC/DC Converter Boards by RECOM

R-REF04-RIA12-1/2 DC/DC Converter Boards by RECOM

RECOM Power GmbH has introduced evaluation platforms for its DC/DC railway converters up to 240W, which are in either high-voltage or high-current layouts and include a RIA12 surge stopper. R-REF04-RIA12-1 and R-REF04-RIA12-2 are complete reference designs for railway applications. The R-REF04-RIA12-1 board is populated with components rated for higher DC input voltages up to DC 110V nominal input, while R-REF04-RIA12-2 board is populated with components rated for higher DC input currents up to 10A. Both boards are input-side fused and can be used with DC/DC converters with single output currents up to 45A. The reference designs include a RIA12-conform surge stopper capable of blocking surge voltages up to DC 385V. The universal pinout accommodates DC/DC converters with 2×1in, quarter-brick or half-brick standard case dimensions, including the entire RECOM portfolio of railway DC/DC converters up until 240W.
RECOM Power GmbH
www.recom-power.com

Components & Devices
TDK’s HVC 4420F Motor Controller
TDK’s HVC 4420F Motor Controller

TDK Corporation has released the HVC 4420F embedded motor controller with flash memory extended to 65KB and static RAM to 4KB for the drive of small brush-type, stepper, or brushless motors. It was designed to provide diagnostics capability in smart actuators for the automotive industry. The new HVC 4420F is part of the Micronas high-voltage controller family (HVC) for smart actuators. Powered by a 32-bit CPU core (ARM Cortex-M3) with 64KB flash memory, HVC 4420F contains timers/counters, interrupt controllers, multichannel analog-to-digital converter, SPI, and enhanced pulse width modulators (PWMs) with diagnosis functions. An advanced LIN UART with a LIN 2.x transceiver, as well as voltage regulators to connect the device directly to the automotive board net (5.4 to 18V), make it an all-in-one device. Several power management modes help reduce the current consumption. Various integrated digital and analog circuit units, such as comparators with virtual star point reference, current scaling and an embedded programmable gain amplifier allow users to minimize the number of external components. Due to its high processing power, HVC 4420F allows complex motor control algorithms, such as Space Vector Modulation (SVM) for permanent magnet synchronous motors (PMSM), six-step commutation with sensor feedback or sensorless control, as well as various stepper configurations.
TDK Corporation
www.global.tdk.com;www.micronas.com

SMK’s Dome Switch

SMK’s Dome Switch

SMK Corporation has developed a solderless mountable Mini One Dome Switch with spring contact structure for wearable devices. As wearable devices are prone to dropping or shock from outside, normal switches could be detached from the printed circuit board (PCB) due to the solder joint collapse, which would lead to failure. SMK’s dome switch provides stable contact reliability as the switch is press-mounted on the PCB, which is a solder-free spring contact structure. The thin contact push switch with this spring structure can be held perpendicular to the PCB, improving accuracy of the assemble position. Also, it requires no other parts, like a flexible printed circuit, to connect the switch to the PCB, thus contributing to reducing the number of parts necessary for the assembly of product.
SMK Corporation
www.smk.co.jp

RECOM’s REM3.5E/5E/6E Series DC/DC Converter

RECOM’s REM3.5E/5E/6E Series DC/DC Converter

RECOM Power GmbH has developed medical-grade DC/DC modules offering 3.5W, 5W, and 6W, as well as key features required for critical medical applications. The REM3.5E, REM5E, and REM6E Series of medical-grade regulated DC/DC converters feature reinforced AC 250V continuous working isolation with >8mm creepage/clearance providing 2 × MOPP. They qualify for medical B, BF and CF applications due to their low 1μA leakage current. The compact DIP24 package with industry standard pinout provides reinforced insulation of up to DC 10kV, which is sufficient for virtually every medical application. The tightly regulated single/dual outputs come with UVLO, SCP, OCP, and OVP. The modules operate beyond 80 percent of efficiency in a wide temperature range from -40°C up to +85°C without derating. They are UL marked and certified to CB, IEC, EN and ANSI/AAMI 60601 3rd. Ed. Safety and 4th Ed. EMC medical standards.
RECOM Power GmbH
www.recom-power.com