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August 2020
Asia Electronics Industry logo
Asia Electronics Industry
August 2020 Volume 25, Serial No. 287

ASIA ELECTRONICS INDUSTRY (ISSN 1342-422X) is published monthly by Dempa Publications, Inc., 1-11-15 Higashi Gotanda, Shinagawa-ku, Tokyo 141-8715, Japan Tel: +81-3-3445-6111 Fax: +81-3-3445-6890. Editorial e-mail: may@dempa.co.jp; Subscription e-mail: circulationmanila@dempa.co.jp.

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Cover | Story
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ippon Avionics Co., Ltd., which celebrated its 60th anniversary in April 2020, is engaged in the welding product business leveraging its unique electronics and system technology.

In recent years, due to the rapid spread of information devices and automotive electronics, miniaturization and high functionality of components have evolved, difficulty of component mounting has increased, and high welding technology is required.

Nippon Avionics manufactures and sells four methods of joining equipment, including pulse heat unit, resistance welding, laser welding, and ultrasonic welding that realize stable and highly reliable joining in the assembly of information devices and electrical components.

AEI News
ROHM Partners With Chinese Powertrain Maker for SiC-Based Lab
Dr. Jie Shen shake hands with Shinya Kubota
Dr. Jie Shen, Chairman and General Manager of LEADRIVE (right) shake hands with Shinya Kubota, Managing Director (at that time) of ROHM Semiconductor (Shanghai) Co., Ltd. (left).

JAPAN and CHINA – ROHM Co., Ltd. has partnered with Chinese automotive powertrain maker Leadrive Technology (Shanghai) Co., Ltd. for a joint laboratory on silicon carbide (SiC) technology in China’s Shanghai Pilot Free Trade Zone (Lingang New Area). SiC power devices provide several advantages compared to silicon-based power devices such as IGBTs.

Since 2017, ROHM and LEADRIVE have been collaborating on automotive applications utilizing SiC power devices. Establishing a joint research lab centered on vehicle power modules and inverters utilizing ROHM’s SiC MOSFET bare chips and isolated gate drivers will give both companies the opportunity to further accelerate the development of innovative power solutions.

“Commercializing mature SiC-equipped devices by collecting resources from around the world and carrying out R&D gives us a competitive edge as an automotive Tier 1 manufacturer,” says Dr. Jie Shen, Chairman and General Manager at Leadrive Technology.

Meanwhile, Dr. Kazuhide Ino, Member of the Board, Senior Corporate Officer, CSO and Senior Director of Power Device Business at ROHM says, “ROHM has a proven track record for providing high quality power solutions that combine industry-leading device technology with driver ICs, and we are committed to promote the use of SiC for xEV applications.”

www.rohm.com; www.leadrive.com

In View | This Month
Robust Potential Drives Players to Dive in Robot Market

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he demand for industrial robots has been expanding amid soaring incidents of labor shortages, rising labor costs, and needs for advanced automation in new fields, such as internet of things (IoT) and connected, autonomous, shared & services, and electric (CASE) trends. In particular, collaborative robots that work in cooperation with people are attracting attention.

Increasing number of companies have been making inroads into the business anticipating the growth potential of collaborative robots.

New Features, Functions
Mitsubishi Electric Corporation has entered the collaborative robot market as a new player, and released in May MELFA ASSISTA, which is equipped with safety function, such as collision detection function, targeting automotive, electric and electronic components, foods, medical products, and sanitary goods markets, and RT VisualBox program creation tool, which facilitates the installation and start-up of the robot. It allows training operation (recording and reproduction of movements) to the robot using a dedicated operation button equipped on the robot arm.

Special | Report
Nepcon Asia typography
JUKI Smart Solutions
Automation, Visualization & Connection
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ith the keyword of “JUKI Smart Solutions — Automation, Visualization & Connection,” JUKI Corporation will propose at NEPCON ASIA 2020 latest solutions, targeting the automation, greater efficiency and labor saving of production, the importance of which has been increasing in the period under the coronavirus pandemic.

JUKI
JUKI
Efficiency for SMT Process
JUKI will highlight latest solutions for the mounting line from the printing, mounting to inspection processes, in which higher productivity, higher precision, higher general versatility and higher efficiency are required for the mounting of fifth-generation (5G)-related devices, wearable devices, and mini light-emitting diode (LED) displays.

Specifically, JUKI will showcase its high-speed, high-quality mounting line achieved through the combination of RX-7R, which highlights high-speed and high-precision mounting, and excellent area productivity, and the RS-1R ultimate all-in-one mounter, which features both general versatility and high speed. The company will also combine a printer, a solder paste inspection (SPI) machine, and the RV-2-3DHL new three-dimensional (3D) automated optical inspection (AOI) system and showcase its latest integrated line, which exhibits high throughput, visualization of operation conditions and linkage with machines, as a solution to realize efficient mounting process, along with use cases.

The latest SMT machine lineup
The latest SMT lineup
Special | Report
Nepcon Asia typography
Tokyo Weld New AOI System Meets Higher Reliability, Quality
As electronic components become smaller, the company’s latest solution AIMS to meet the need for HIGH-PERFORMANCE, FLEXIBLE inspection systems.
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okyo Weld Co., Ltd. has been manufacturing taping machines, measuring and inspection machines, and terminal coating machines for discrete semiconductors, such as diodes, transistors, and light-emitting diodes (LEDs), and passive electronic components, such as inductors, capacitors and resistors. The company has also been expanding its automated optical inspection (AOI) systems business, which it positions as one of the major pillars.

In recent years, electronic components have been becoming smaller, and the needs for high-reliability and high-quality inspections have been increasing, mainly with components for automotive application. Responding to these needs, Tokyo Weld has been working to expand its new business, offering the MMxH Series, in which image processing and transfer technologies are applied.

Special | Report
Nepcon Asia typography
ASM Drives Novel Industry 4.0 Solutions in Innovation Center
ASM is the only solutions provider whose portfolio ranges from leadframe to backend to full SMT assembling process. In ASM Innovation Centre Singapore, all these solutions are presented in just one location and the latest technologies, trends and expertise are being shared and demonstrated to help ITS CUSTOMERS achieve process optimization TO ATTAIN KPIs.
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s a technology leader in the electronics industry, the ASMPT Group offers integrated solutions for all phases of electronics production – ranging from leadframes to SMT and including Advanced Packaging (AP). ASM Innovation Centre is the only center out of the five global ASM Centres of Competence (CoC) that showcases the complete portfolio of the group.

In here, visitors can experience new technology through live demonstrations, share insights on market trends, and make discussions on production challenges, process know-hows. In addition, the visitors can have in-depth discussions with ASM experts to learn more of the company’s solutions and ways to improve the production processes to becoming an Integrated Smart Factory.

Special | Report
Nepcon Asia typography
FUJI Builds Profitable, Productive Factories with Customers
With NXTR and NXTR PM at the core of its smart manufacturing concept – FUJI Smart Factory – the company achieves its mission of automated production. The company hopes that more manufacturers join the FUJI Smart Factory network so they can enjoy the benefits of high operation rates and profitability.
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eople’s lifestyles are becoming ever more comfortable and convenient through new innovations and services being developed on a day-to-day basis all over the world. When it comes to cars, these innovations and services include advanced driver-assistance system (ADAS), connected cars, and car sharing, as well as technologies that not only give people convenience, but safety as well. People are also being given more time through money-related technologies such as cashless payment options like mobile wallets and digital currency. At the core of all these beneficial services is a great number of various electronic devices.

Taking a look at the electronics industry, the smartphone sector that was setting the course for the entire industry had lower sales than the previous year for two years in a row in 2017 and 2018, while the cost of labor continues to climb among a shrinking working population.

Special | Report
Nepcon Asia typography
Automated Manufacturing Through FUJI Smart Factory Solutions
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ith FUJI’s production system – Nexim in place as the core system, the management area can be extended across entire production lines (horizontal integration), and this core system can also be connected to key user systems (vertical integration) for a factory which can perform production autonomously purely based on data. In other words, a Smart Factory.

  • Automatic creation of production plans
    Production plans that include information such as product models, deadlines, and production volumes, and that consider which production models should be allocated to which line to implement the most efficient production are created based on work order, while considering changeover work as well.
Special | Report
Nepcon Asia typography
Yamaha’s Smart Solution Gets an Upgrade with Premium Mounter
Beefing up its 1-STOP SMART SOLUTION, Yamaha has added the newly developed YRM20 high-efficiency modular platform featuring a throughput of 115,000cph, the fastest in its class. To develop the new platform, Yamaha simultaneously updated its hardware and software using a new machine control system and new application software.
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mid the advancement of digital transformation today driven by fifth-generation (5G) mobile communication, artificial intelligence (AI), and electric vehicle (EV) trends towards digitization and increased use of electronic components in social infrastructure and products have been accelerating. At the same time, there has been active restructuring of production bases and supply chains and higher needs for measures to cope with labor shortages and soaring labor costs in the medium to long term. As a countermeasure to these trends and needs, smart manufacturing in which internet of things (IoT) technologies typified by Industry 4.0 are applied has been spreading, and adoption has started at electronic components mounting factories as well.

An important key for realizing smart manufacturing is the machine-to-machine (M2M) linkage of equipment in constructing a mounting line. Yamaha Motor Co., Ltd. supports M2M linkage not only among its own machines, but also with other companies’ machines, and already has a track record of installation in many companies.

Special | Report
YAMAHA MOTOR
YAMAHA MOTOR
Yamaha Parades 1 STOP SMART SOLUTION Lineup
Yamaha YRM20 New Premium High-Efficiency Modular Mounter
YRM20 New Premium High-Efficiency Modular Mounter
YRM20 is an innovative and versatile high-speed mounter consisting of an all-new next-generation platform and two types of heads: a newly developed high-speed rotary RM head and a new inline HM head that offers both high speed and high versatility thanks to “1-head solution”. Used in combination with a new high-speed feeder, YRM20 achieved a mounting speed of 115,000cph (during Yamaha’s test on Jan. 10, 2020), the fastest in the two-beam two-head class.
Special | Report
Broadcast Technologies text
Panasonic Takes Live Broadcast Production to New Heights
To achieve its goal to lead innovations in the audio and video fields, the company has put premium technologies together in its next-generation live production platform for INCREDIBLE productivity and efficiency in production workflow.

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anasonic Corporation continues to reinforce its lineup in the film and broadcasting fields to meet the rising expectations around quality of video production, and streaming contents. Nowadays, production teams have been reinforcing ways to broadcast with flexible and cost-effective operation and this is something the company puts into focus as it continues to introduce new products and technologies and address the challenges and possibilities ahead.

Kairos Core (main frame)
Kairos Core (main frame)

Panasonic continues to amplify its portfolio and realize its goal to lead in innovations in audio and video technologies for a more immersive production experience and increased productivity among professionals.

Special | Report
3D Flash Memory Technology text
Competition Heats up in 3D Multi-Stacked NAND Flash Memory
Growing demand from data centers prompts key memory device makers to continue with their technology and product innovations, while newcomers gear up to challenge the norm.

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he development race of 3D NAND flash memories has been becoming fiercer. Against the backdrop of robust demand from data centers, technological development to achieve larger-capacity and higher-density memories advance. This year, products with more than 100 layers are expected to emerge one after another. Although concerns about the effects of the widespread infection of the novel coronavirus might linger, the demand for memories is expected to dramatically increase in the coming years. This trend reflects the increase in the data traffic volume following the full-fledged implementation of 5G high-speed communications.

3D NAND is a technology to increase the capacity of NAND flash memories that are used for the storage of data. 3D lamination technology to vertically stack memory cells in many layers and multi-level recording technology to record multiple bits in a single cell are combined to achieve memories with very high recording density.

Dexerials Eyes Particle-Arrayed ACF as Standard for Smartphones

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exerials Corporation has been endeavoring to make its particle-arrayed anisotropic conductive film (ACF) ArrayFix® a de facto standard in the smartphone market. ArrayFix is suitable for the connection of fine circuits compared with existing ACFs. The company plans to expand sales of particle-arrayed ACFs to the scale of ¥10 billion (US$93.1 million) by FY2023 ending March 2024.

The particle-arrayed ACF commercialized by Dexerials is a joining material, which can stably connect many wirings even in a small space, by arraying conductive particles at the target position. It is suitable for chip-on-glass (COG) connection in which driver IC is mounted on the glass substrate of a display panel. It enables minimum wiring interval of 10μm. Thus, it enhances the accuracy of bonding inspection performed by image processing after mounting, and contributes to the improvement of production yield.

Special | Report
Server Architecture text
Xilinx’s RT Server Design Supports Surge in Live Video Streaming
The new architecture aims to tackle two challenging requirements for bit rate optimization and high-channel density, and is composed of two PCIe solutions – Alveo U50 for bit rate optimization and Alveo U30 for high channel density

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owadays, people stay more time online than before not only to watch movies and other entertainment videos but also shop, do business, join e-class and play real-time online games, and devoting more time on online video streaming services.

Accordingly, live video streaming service platform providers are not only facing huge market opportunities, but also tough challenges, as simultaneous live accesses by tens of thousands of audiences are requiring enormous network bandwidths for seamless and quality services. Especially, as video and audiophiles’ love affairs with crystal-clear, bandwidth-hungry 4K-quality video services are increasingly squeezing their network bandwidth, they are clamoring for cost-efficient and highly optimal video transcoding or coding-encoding (codec) solutions.

TECH | FOCUS
Wireless Communication Modules Comply with Wi-SUN Profiles

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ow Power Wide Area (LPWA), which as its name implies covers a wide area with low power consumption, is attracting increased attention as a wireless protocol for internet of things (IoT). LPWA encompasses numerous methods, each with different advantages and drawbacks. In this article, ROHM Co., Ltd. introduces the latest development trends of Wi-SUN, a protocol the company is promoting.

What is Wi-SUN?
Wi-SUN is the abbreviation of Wireless Smart Utility Network, a newer communication standard formulated in recent years. The Wi-SUN Alliance was established in 2012, and standardization based on IEEE802.15.4g is underway.

Figure 1 shows how Wi-SUN compares with other wireless standards for IoT. As can be seen from the chart, Wi-SUN is characterized by longer communication distance than Wi-Fi and faster speeds than LoRaWAN and Sigfox. These balanced characteristics featuring a moderate transmission rate, which does not depend on a base station, make it the best wireless protocol for the IoT market. This allows it to coexist with 5G, which is expected to be launched in the near future, enabling complementary usage of 5G.

TECH | FOCUS
Functional Chemicals Deal with Vehicle’s Temperature, Heat

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FE Chemical Corporation considers the four fields of precision chemicals, magnetic materials, battery materials, and plastic molding materials as important functional chemicals, and is strengthening its research and development along these areas. With electric vehicle application at the center of its studies, two examples from power-device-related businesses are introduced in this article. The first example is heat-resistant resin material benzoxazine in the field of precision chemicals. The second example is a wide-temperature-range low-loss ferrite core for automotive use in the field of magnetic materials.

Heat-Resistant Resin: Oxydianiline-Type Benzoxazine
A power device is a semiconductor device used for frequency conversion, orthogonal conversion, and voltage conversion of electric power, and is used in various applications, such as electric vehicles, hybrid vehicles, trains, and home appliances. Improving the conversion efficiency of power devices is an important technique for saving energy in these transportation machines and electrical equipment. The conversion efficiency of the conventional silicon (Si) semiconductor is approaching its limit due to the recent increase in the demand for higher current and higher sophistication of energy saving. Correspondingly, silicon carbide (SiC) is attracting attention as a semiconductor for next-generation high-efficiency power devices. Because the SiC semiconductor has a band gap larger than that of Si semiconductor, it has a higher breakdown voltage and can deal with a higher voltage. SiC’s upper limit of operating temperature is at 150°C, while SiC can operate above 200°C. By using the SiC semiconductor, therefore, power conversion is possible with less energy loss.

TECHNOLOGY | HIGHLIGHT
Industry 5.0 Brings Humans Back Into Manufacturing Loop
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echnology never stands still and this is true in the cutting-edge world of manufacturing as it is in any other sector. Just as Industry 4.0 have gotten through most people as a concept of creating highly automated factory environments, where technologies such as sensors, data processing, connectivity, and cloud computing to deliver business benefit, now comes Industry 5.0.

Industry 5.0 is a new paradigm that reintroduces humans to the loop. Industry 5.0 promises a tantalizing new world where robots and people collaborate in ways once believed to be impossible, enabling the implementation of new concepts such as mass customization. So, what’s really going on? Is Industry 5.0 going to change the way manufacturers’ design and build smarter products of the future?

TECHNOLOGY | HIGHLIGHT
All-Solid-State Na-ion Secondary Battery Lowers Internal Resistance
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ippon Electric Glass Co., Ltd. has reduced the internal electric resistance of an all-solid-state sodium (Na) ion secondary battery to 120Ω/cm2, which is 1/20 or less of conventional product, using crystallized glass as the positive electrode material, and succeeded in driving a motor in 0°C environment.

In 2017, the company prototyped an all-solid-state Na-ion secondary battery using a crystallized glass as the positive electrode material and achieved operation in room temperature. After three years, the company successfully proved its performance on the practical level. The company is aiming for mass production of the Na-ion secondary battery in 2025, initially at its factory in Japan. It is expected to be used in a wide range of markets, from in-vehicle and household storage batteries and large storage batteries for power plants to secondary batteries for wearable terminals, electronic board mounting, and internet of things (IoT).

PRODUCT | HIGHLIGHT
Low-Voltage LED Driver Powers Automotive Socket LED Lamps
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OHM Co., Ltd. has developed BD18336NUF-M—the industry’s first light-emitting diode (LED) driver for automotive socket LED lamps. The company started in July the product’s mass production at a pace of 400,000 units per month for the time being. The product was designed for headlamps for daytime running white-LED lamps, and for red- or yellow-LED rear lamps, position lamps, and turn lamps. The company started to offer samples of the product in Dec. 2019. The front-end and back-end processes are carried out at ROHM Hamamatsu Co., Ltd. and ROHM Electronics Philippines, Inc., respectively.

BD18336NUF-M LED
Photo: BD18336NUF-M LED driver
ROHM produces 200 million LED driver units per year. Of these, 140 million units are for automotive use and the remaining 60 million units are for consumer use. The company, which has the highest patent score in terms of the number and quality of related patents, has solved the problems with socket LED lamps by using its own circuit and process technologies.
PRODUCT | HIGHLIGHT
JAE’s Textile Connector Solution Fits Smart Clothing
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apan Aviation Electronics Industry, Limited (JAE) has released the RK01 Series home washable connectors that are ideal for smart textiles used for wearable clothing devices.

Smart Clothing for Medical Use
The popularity of wearable devices is expected to grow as new technological innovation allows for remote monitoring and diagnosis of an aging society with longer life expectancy and lower birthrate. In particular, smart clothing, which is made from smart textiles using conductive fibers and other materials, is expected to be a major driver of innovation and market growth. Smart clothing can collect more advanced information at a medical level, such as electrocardiography and whole-body motion, which is difficult to achieve with other devices such as smart watches.

PRODUCT | HIGHLIGHT
Intelligent Vision Sensors Feature Built-in AI Processing Function
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ony Corporation has developed two models of intelligent vision sensors, which are among the first image sensors to be equipped with artificial intelligence (AI) processing functionality. With the integrated AI processing functionality, high-speed edge AI processing and extraction of only the necessary data is enabled, which, when using cloud services, reduces data transmission latency, addresses privacy concerns, and reduces power consumption and communication costs.

The two models are IMX500 1/2.3-type, a bare chip 12.3-million-effective-pixel intelligent vision sensor, whose sample was shipped last April, and IMX501 1/2.3-type, a packaged 12.3-million-effective-pixel intelligent vision sensor, which was supposed to be released in June (Photo 1).

Among image sensors, these products expand the opportunities to develop AI-equipped cameras, enabling a diverse range of applications in the retail and industrial equipment industries and contributing to building optimal systems that link with the cloud.

MOBILITY
TDK Extends Range of Hybrid-Polymer Aluminum Electrolytic Capacitors
The new product with axial design offers excellent heat dissipation because of its stable mechanical design, which achieves reliable long-term connection to the heat sink.

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DK Corporation has extended its product range of hybrid-polymer aluminum electrolytic capacitors and now offers two series with an axial design. The B40600 and B40700 are designed for rated voltages of 25V and 35V. These cover a capacitance range from 780 to 2,200µF. Capacitors in the 63V voltage class with capacitance values from 390 to 720µF are available under the B40640 and B40740 Series.

Optimized for Thermal Connection
The capacitors are produced in four can sizes ranging from 14×25 to 16×30mm (D×H). These are available in an axial-lead design (B406) or as a solder star version (B407), providing a wide variety of mounting options. The inner structure of all axial hybrid-polymer aluminum electrolytic capacitors is optimized for the thermal connection to a heatsink. Thanks to the stable mechanical design, a reliable long-term connection to the heat sink can be achieved, thereby offering excellent heat dissipation. For designs with heat sinks, versions without shrink-on sleeves are offered in both series, while for freestanding assembly, components with a PET shrink-on sleeve are available.
MOBILITY
Hosiden Taps Novel Systems for Advanced Bluetooth LE Module
As cars of the future expand capabilities, demand for Bluetooth LE devices are expected to increase, and the company has entered the market earlier to provide an optimum module with sophisticated features.
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osiden Corporation has developed HRM3012 system-on-chip (SoC) Bluetooth LE module for automotive applications. This SoC employs the CC2642R-Q1 manufactured by Texas Instruments, which enables embedding of various applications without the need of a host central processing unit (CPU).

The unit features a 48MHz ARM Cortex-M4F processor and 352KB of flash ROM. All the electrical parts mounted, including SoC have acquired certification from Automotive Electronics Council (AEC), and the module is subject to the development/manufacturing process control compliant to IATF16949, which is the global quality management system standard for the automotive industry.

Such high product quality, along with its wide operating temperature range of -40 to +105℃, has allowed the product to enter a versatile scene of automotive applications. The module incorporates a high-performance pattern antenna backed by a technological expertise in consumer products of more than 20 years, ensuring stable communication quality from its compact body.

MOBILITY
Toshiba Augments Interface Bridge ICs for In-Vehicle Systems
The interface bridge ICs are seen to address interface difference problems in automotive systems and to support customers working on system designs.

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oshiba Electronic Devices & Storage Corporation has expanded its new TC9594 interface bridge ICs for automotive in-vehicle infotainment (IVI) systems to its lineup of display interface bridge ICs. The company has already started sampling of the new products.

Supports Current Systems
Automotive IVI systems are becoming increasingly sophisticated, and as the number of displays they incorporate grows, so too do panel choices, moving beyond the widely used low-voltage differential signaling display (LVDS). However, this can present a problem for current systems that do not support the interfaces of new display panels, including Display Serial Interface (DSISM) and Embedded Display Port (eDP). The solution is found in interface bridge ICs.
MOBILITY
Vitesco Technologies, ROHM Collaborate on SiC Power Solutions
The partnership will bring forward the advanced SiC technology to optimize high-voltage power electronics for electric vehicles.
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he powertrain business area of Continental Vitesco Technologies and ROHM Co., Ltd. have agreed to collaborate on silicon carbide (SiC) power solutions. The partnership will enable the two companies to develop solutions and increase the efficiency of its power electronics for electric vehicles (EV). Higher efficiency SiC semiconductors will make better use of the electric energy stored in a vehicle battery.

For this reason, an EV has longer range, or the battery cost can be reduced without impacting the range.

“Energy efficiency is of paramount importance in an electric vehicle. As the traction battery is the only source of energy in the vehicle, any losses caused by power conversion need to be minimized. We are therefore developing a SiC option within our modular power electronics system,” says Thomas Stierle, Executive Vice President of the Electrification Technology business unit at Vitesco Technologies.

SMTs | IN REVIEW
Mounter Manufacturers Beef up Presence in India, Thailand
Leading manufacturers have opened sales bases and showrooms, displaying mounters and industrial robots, in an effort to expand businesses as interests in manufacturing equipment continue to increase.
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apanese mounter manufacturers have intensified their operations in Asia, including India and Thailand by establishing new sales bases and opening showrooms, even during challenging times.

Amid trade tensions between the United States and China, moves of manufacturers to transfer production to Southeast Asian countries to avoid risks have become noticeable among electric and electronic equipment makers. In addition, with the growing infection rate of novel coronavirus around the world, an increasing number of manufacturers are focusing attention on Southeast Asia as part of their standpoint of Business Continuity Plan (BCP).

Expanding Asian Operations
FUJI Corporation established FUJI INDIA CORPORATION PRIVATE LIMITED in Gurugram, Haryana in India in Dec. 2019, and started operations in Mar. 2020. The company aims to improve customer satisfaction in the Indian market and expand the market by strengthening its support for local distributors with the establishment of the subsidiary. FUJI has enhanced after-sales services and distributor support for electronic components mounting robots (mounters).
SMTs | IN REVIEW
Nippon Thompson Releases Absolute Super-Precision Positioning Table
The new positioning table has an absolute type specification, which measures absolute position right after turning On the power, thus reducing start up time.
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ippon Thompson Co., Ltd. has released onto the market the TX super-precision positioning table with the absolute linear encoder specification. The introduction of the tool was part of efforts to expand its portfolio of mechatronics products that combine linear motion rolling guide and electronics.

The TX super-precision positioning table was built based on the high-precision, high-rigidity and well-proven LH precision positioning table. The company used cylindrical rollers for the rolling elements of the positioning table, incorporating the company’s super X linear roller way, which features best-in-class running performance for a linear motion rolling guide. Adopting a fully-closed loop control, the positioning table has achieved high precision almost the same as air stages and has been adopted in a wide range of fields, including assembly equipment for electronic components.

SMTs | IN REVIEW
Tokyo Weld Merges Image Processing, Transfer Technologies in New Handlers
It has developed the MxMH Series handler systems, including Multi Module Test Handler (MMTH), Multi Module Vision Handler (MMVH) and Multi Module Insert Handler (MMIH).
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okyo Weld Co., Ltd. has been endeavoring to expand its business with the market introduction of handler systems. In the development of handler systems, the company applied its resources accumulated in the production of taping machines and automated optical inspection (AOI) systems, such as image processing and transfer technologies.

Tokyo Weld is a manufacturer of terminal coating machines, testing and sorting machines, and taping machines for discrete semiconductors, such as diodes, transistors, and light-emitting diodes (LEDs), and passive electronic components, such as inductors, capacitors, and resistors. The AOI systems business has also expanded with more than 1,000 units now being used globally.

Koji Takahashi headshot
Koji Takahashi, Marketing Director & Chief Technology Officer at Tokyo Weld Co., Ltd.
SK Innovation Breaks Ground of 2nd EV Battery Cell Plant in Georgia
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K Innovation has planned to break ground its second battery cell production facility in Georgia, in the United States last July.

The Korean electric vehicle (EV) secondary battery cell maker signed an agreement with the government of Georgia State on June 25 to invest 1.1 trillion won (US$940 million) to construct its second EV battery cell production line, which is slated to come on line by 2023.

The first production line, which is still under construction, is scheduled to come on line in the second half of 2021, while mass production will begin in early 2022.

Test | Measurement
Anritsu Gets 3GPP Approval for 5G NR Standalone Test for Carrier Aggregation
The company was the first to receive the New Radio SA test for CA on its ME7834NR mobile device test platform.
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nritsu Corporation has received approval for the first 5G New Radio (NR) Standalone (SA) test for Carrier Aggregation. The test is based on 3GPP TS 38.523 and was approved by 3GPP RAN5 working group in Frequency Range 1 (FR1). Subsequently, Anritsu has also achieved 3GPP approval for Carrier Aggregation testing for NR Non-Standalone (NSA) in Frequency Range 1. All these tests are available on Anritsu’s ME7834NR 5G NR Mobile Device Test Platform.

ME7834NR is registered with both the Global Certification Forum (GCF) and PCS Type Certification Review Board (PTCRB) as Test Platform (TP) 251.

ME7834NR 5G NR Mobile Device Test Platform by Anritsu Corporation
ME7834NR 5G NR Mobile Device Test Platform
INDUSTRY | REPORT
Heat Dissipation PCBs Chart New Demand Fields
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here has been a notable increase in demand for heat dissipation printed circuit boards (PCBs), the demand for which traditionally comes from very limited and specialized markets such as lighting equipment.

Recently, however, the market base has expanded to the automotive field, which is witnessing the emergence of electrified vehicles (xEVs), as well as in the industrial-use inverter market.

PCB manufacturers have been stepping up efforts in heat dissipation PCBs as their growth strategies. In addition, companies have entered the heat dissipation PCB business one after another, contributing to the advancement of product technologies, as manufacturers strive to strengthen their competitive edge.

INDUSTRY | REPORT
Novel Power, Anti-Noise Parts Raise Bar of Future Technologies
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ower supply technologies have been advancing at a remarkable pace and form factors are becoming smaller, thinner, and lighter with higher efficiency. New product development has been gaining momentum targeting growth fields, such as automobiles, smartphones, and industrial equipment.

Meanwhile, the importance of noise countermeasure technologies has been increasing as well. The development of products that do not emit noise and products that are immune to noise has been gaining ground. With the onset of the fifth-generation (5G) high-speed communication services, noise countermeasure businesses have been thriving targeting this up-and-coming next-generation communications standard.

Advancements in both power supplies and anti-noise components technologies have been making headway spurred by the development of upcoming mega trends that will change the landscape of various industries.

zoomin
Parts, Materials Makers Take Aim at Bustling Robotics Market
C

omponents and materials manufacturers have been focusing to expand sales of products related to robots. They are putting on the market products that meet requirements for collaborative robots that can work with human without safety fence, as well as service robots, automatic guided vehicles (AGVs), autonomous mobile robots (AMRs), and industrial robots. Parts makers are also looking on products with high output, scaled-down size, high withstand voltage, long life, charge/discharge durability, and safety.

The market of these robots has been growing, primarily because of the need to solve labor shortages and improve productivity. This reason and more have been keeping robot manufacturers from around the world on their feet with many inquiries from prospective clients.

Business | Strategy
JAE Magnifies Connector Business for ADAS Cameras
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apan Aviation Electronics Industry, Limited (JAE) aims to aggressively expand its connector business for automotive advanced driver-assistance systems (ADAS) cameras in the medium term.

JAE saw sales in FY2019 ending March 2020 stagnate due to the decrease in global auto sales. Nevertheless, the company will continue design-in activities steadily targeting to achieve its goal in sales of over ¥20 billion (US$186 million) connectors for ADAS cameras in FY2023 ending March 2024.

JAE has identified the automotive market as one of priority markets in the company-wide business strategies, and endeavors to expand the connector business for the automotive market in the medium term. In particular, the company focuses on technological development to meet the changes of vehicles, mainly related to connected, autonomous, shared & services, and electric (CASE) trends, and aims to dramatically expand connectors for on-board cameras in its ADAS-related connector business in the medium term.

Photo 1: Tsutomu Onohara, President (Representative Director), Japan Aviation Electronics Industry, Limited (JAE)
Photo 1: Tsutomu Onohara, President (Representative Director), Japan Aviation Electronics Industry, Limited (JAE)
Product | News
COMPONENTS and DEVICES
Murata’s BLM18SP_SH1 Series Chip Ferrite Beads
Murata’s BLM18SP_SH1 Series Chip Ferrite Beads
Murata Manufacturing Co., Ltd. has introduced the BLM18SP_SH1 Series, one of the smallest chip ferrite beads for noise suppression in automotive power supply components. The chip beads feature impedance values of 30Ω to 1kΩ and rated current values of 6 to 1.2A. It features a new structural design that uses internal electrode fabrication technology, realizing improved impedance acquisition efficiency along with lower resistance, which leads to a large current. Its smaller package of 1.6×0.8mm, with 50 percent smaller base area compared to conventional products, offers more flexibility in designing automotive power supply circuits and helps to support more sophisticated autonomous driving with smaller in-vehicle components.

In addition to this series, Murata has two other series in 0603-inch size—the BLM18SP_SZ1 Series for in-vehicle infotainment and the BLM18SP_SN1 Series for consumer devices.
Murata Manufacturing Co., Ltd.
www.murata.com

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