DEMPA AEI 2019
December 2019
DEMPA AEI 2019
December 2019
Asia Electronics Industry
December 2019 Volume 24, Serial No. 279
Zoom-In: Electronic Trends Point Toward Realizing Ultra-Smart Society
Special Report: Latest Connectors Hinge on Automotive Information, Communications
Mobility: TE Japan Demonstrates Virtual Flying Vehicle
Departments

ASIA ELECTRONICS INDUSTRY (ISSN 1342-422X) is published monthly by Dempa Publications, Inc., 1-11-15 Higashi Gotanda, Shinagawa-ku, Tokyo 141-8715, Japan Tel: +81-3-3445-6111 Fax: +81-3-3445-6890. Editorial e-mail: may@dempa.co.jp; Subscription e-mail: circulationmanila@dempa.co.jp.

The magazine is distributed free to qualified subscribers in ASEAN countries (Thailand, Indonesia, The Philippines, Malaysia, Singapore, Brunei, Vietnam, Myanmar, Cambodia and Laos), as well as Korea,Taiwan and Hong Kong.

Paid air mail subscription is available to non-qualified subscribers in the Asian and Pacific regions for US$150 per year and US$260 for two years. For other areas, air mail subscription fees are US$160 per year and US$280 for two years. Paid subscription is accepted at https://www.dempa.co.jp/en/pdfs/orderform.pdf

Send address corrections to Dempa Publications, Inc., c/o Quantium Solutions (HK) Ltd. Unit 3-6, G/F Pacific Trade Centre, 2 Kai Hing Road, Kowloon Bay, Kowloon, Hong Kong

Taiwan: International Dempa Trade Co. Ltd.,7F, No. 34, Sec. 1, Nanjing East Road., Taipei, Taiwan 104 Tel: +886-2-2563 4595 Fax: +886-2-2567-5559 Korea: Dempa Publications, Room 1019, Punglim VIP Tel, 404, Gongdeuk-dong, Mapo, Seoul, Korea 04144, Tel: +82-2-714-2983 Fax: +82-2-714-2984 Philippines: Dempa Publications, Inc. – Regional Headquarters, Herrera Tower, Room 2510, 98 V.A. Rufino Street, Salcedo Village, Makati City, Philippines, Tel: +63-2-8845-0906 Fax: +63-2-8845-1829

President & Publisher: Tsutomu Hirayama
Copyright © 2019 by Dempa Publications, Inc.

All rights reserved. The contents of this magazine may not be reproduced in whole or in part without the prior permission of the copyright owner. Printed in China.

Cover | Story
A

mid the rapid expansions of diverse technologies, such as artificial intelligence (AI), internet of things (IoT), fifth-generation (5G) communications, Mobility as a Service (MaaS), and fourth industrial revolution, a Japanese company based in the Saitama subcenter has been making great leaps forward into the global market.

NITTOKU CO., LTD. is the leading manufacturer of custom equipment for the production of coils, which are indispensable to the electronics field. Various high-performance equipment for coils produced by NITTOKU are employed in every single product and industrial equipment that use electricity.

In 1972, NITTOKU started as a small factory in Yachiyoshi, Chiba Prefecture, neighboring Tokyo. During those days, many home electric appliances were released one after another. In Japan, the proliferation of color televisions, coolers, and cars, which were called “3C,” explosively increased the demand for equipment for coils, which NITTOKU manufactured. Backing up the present trends, NITTOKU announced innovative automated coil winding machines one after another, and in only 10 years from its founding, the company grew into a global manufacturer specializing in coil winding machines.

AEI News
Alps Alpine Reinforces Touch Feedback Technology
JAPAN and UNITED STATES – Alps Alpine Co., Ltd. has partnered with Immersion Corporation, a developer and licensor of touch feedback technology, for the production of Haptic technology.

Alps Alpine has license agreement with Immersion regarding touch feedback technology since 2000 and has been developing, manufacturing, and marketing a variety of products since then. The new collaboration agreement on product creation relating to Haptic technology aims to innovate products delivering enhanced operability and diversity by fusing Alps Alpine’s human-machine interface (HMI) technology in areas including touch input, illumination, graphics and sound with Immersion’s advanced software and control algorithms and other expertise.

www.alpsalpine.com; www.immersion.com

Industry | Report
Materials, Mounting Process to Spur Battery Business
J

apanese electronic components manufacturers have been intensifying efforts to prosper their battery business, competing head-to-head in the creation of new battery technologies. At CEATEC Japan 2019, electronic components manufacturers showcased small lithium ion batteries and all-solid-state batteries.

As full-fledged commercial services for fifth-generation (5G) communications is already in the offing, compliant devices like internet of things (IoT)-related terminals are being developed one after another. IoT terminals are expected to make the most of the high-speed and large-capacity transmission of 5G communications technology.

NGK Insulators, Ltd.’s chip ceramics rechargeable batteries won the grand prize in the Devices & Technology category of CEATEC AWARD.
NGK Insulators, Ltd.’s chip ceramics rechargeable batteries won the grand prize in the Devices & Technology category of CEATEC AWARD.
Special | Report
Semiconductor Roadmap typography
Technology Merger Shores up Evolution of Chips
To achieve an optimized design structure, while considering the feasibility of production, cooperation among ultra-miniaturization, 3D integration and high-density packaging of semiconductors becomes necessary.
M

oore’s Law, born from a four-point plot of the number of elements per integrated function in 1965, continued to be valid for more than half a century. Meanwhile, the electronics industry has also evolved following the Law of Accelerating Returns.

With the progress of ultra-miniaturization of semiconductor patterns of 28nm or less, transistors with design rules (logic industry “node range” labeling) 3.0nm (microprocessor unit minimum metal wiring half-pitch 10.5nm in 2024) are currently being discussed in 2019. However, the semiconductor technology based on Dennard’s scaling law, which provides the guiding principle of miniaturization, has practically failed already, and ultra-high-level semiconductors are facing high walls mainly due to economic efficiency because of their complexity including designing.

Special | Report
Next-Generation Display typography
OLEDs Lead Race for De Facto Display Technology
The Contenders for next-generation display are QD-OLED, advocated by Samsung Display, and OLED, which is being embraced by LG Display.
T

he race is on for the best flat panel technology that would dominate over other display innovations. Leading the race are Samsung Display and LG Display – two of the top LCD makers, who are facing tough price competition from Chinese LCD manufacturers. In terms of display technology, Samsung puts its bet on quantum dot OLED (QD-OLED), while LG makes its grip on OLED.

Recently, Samsung has announced its plan to invest 13 trillion won to recalibrate one of its large-size LCD panel fabrication lines at the Tangjeong LCD manufacturing cluster to produce QD-OLED panels. The fabrication line is scheduled to come on line by 2021. Samsung will gradually recalibrate its other LCD lines in Korea into QD-OLEDs.

LG has been running ahead of Samsung in the race, having created and dominated the OLED panel market for large-size, premium TVs for years. Moreover, it is also converting its LCD fabrication lines for OLED panels.

SK Hynix Develops Largest-Density 16Gbit DDR4 DRAM Chip
S

K Hynix, Inc. has developed the 1Znm 16Gbit DDR4 DRAM chip with circuitry width as thin as 10nm.

Following mass production of the chip this year, volume shipments will begin as early as next year. The chip was designed for customers who are looking for high-performance and high-capacity DRAM chips in mind.

“1Znm DDR4 DRAM boasts the industry’s highest density, speed, and power efficiency, making it the best product to meet the changing demands of customers seeking high-performance/high-density DRAM,” said Lee Jung-hoon, Head of 1Z Task Force of DRAM Development & Business at SK Hynix.

SK Hynix plans to expand the 1Znm technology process to a variety of applications, such as LPDDR5 next-generation mobile DRAM, and High-Bandwidth Memory 3 (HBM3).

Parts of a SK Hynix 1Znm 10Gbit DDR4 DRAM
SK Hynix 1Znm 10Gbit DDR4 DRAM
Special | Report
Connector Technologies
Innovations Bring Out New Connector Features
advancements across all fields complementing mega trends have raised the bar of connectors to support high-speed, large-capacity transmissions as well as high currents and withstand voltages.
E

lectronic devices and equipment that have been becoming smaller with higher functionalities and performance have been propelling the advancement of connector technologies. With connectors for smartphones, wearable terminals, and other mobile devices, the development of finer connectors for internal connection and input-output (I/O) connectors that support high-speed transmission and rapid charging has become active.

With connectors for automobiles, industrial equipment, and communications infrastructure, the development of high-reliability connectors that accommodate high-speed, large-capacity transmissions and high currents and high withstand voltages advances. Efforts have also been focused on the development of connectors for fifth-generation (5G) mobile communications infrastructure, 4K/8K broadcast equipment, and medical equipment. Manufacturers aggressively advance the development of new products and technologies, responding to next-generation technology needs in the growth fields.

Special | Report
Latest Connectors Hinge on Automotive Information, Communications
Accompanying the enhanced information and communication systems of new vehicles are connectors that can support high-quality transmission. JAE aims to deliver on that with its latest breed of connectors.
J

apan Aviation Electronics Industry, Ltd. (JAE) has been putting strength into new product development and the expansion of product variations of connectors for automotive information and communications systems. The company intends to cater to a wide range of needs by enriching its product lineup in line with the performance enhancement of automotive information and communications devices and the increase in the number of devices incorporated in a vehicle with the keywords of advanced driver-assistance systems (ADAS), autonomous driving, and connected car.

On-Board Interface Connectors: MX50/53
With on-board interface connectors, JAE has expanded its product lineup of the MX50/53 Series automotive high-definition multimedia interface (HDMI) connectors, by adding new products with improved workability and design freedom.

In recent years, an increasing number of users enjoy music and high-quality videos in vehicles by connecting digital mobile terminals and entertainment devices via HDMI. For this reason, connectors that satisfy the HDMI standard and are compatible with automotive specifications have been required.

Special | Report
High-Speed Transmission Needs Boost Connector Technologies
Sophistication of application technologies have sent connectors, peripherals, and material makers to innovate product development to meet growing need for higher speed transmission and reliable mechanical features.
S

ince early this year, manufacturers have started bringing to the market high-speed transmission connectors, which are to be used in next-generation information and communications devices and systems. In particular, connector makers have been stepping up the development of products that support high-speed communications required for fifth-generation (5G) mobile communications, advanced data centers, enterprise storages, as well as 4K/8K broadcast equipment to provide solutions required in the next generation.

Achieve Maximum High-Speed Rate
TE Connectivity Ltd. has announced Quad Small Form Factor Pluggable Double Density (QSFP-DD) connectors, cages, and cable assemblies, which support high-speed communications up to 400Gbps. Differing from conventional 400Gbps solutions, QSFP-DD connectors are provided with a new backward compatibility design, enabling data center upgrade.

TECH | FOCUS
New Automotive Components Emerge for Enhanced Functions
A

s electronics components are increasingly employed in automobiles and electrified vehicles, technological development of electronic components has been correspondingly advanced to keep up. Electronic components manufacturers set their sights on automotive innovations with the keywords of Connected, Autonomous, Shared & Services, and Electric (CASE), and Mobility-as-a-Service (MaaS). Development efforts are focused on technologies that would have medium- to long-term impact.

ADAS-Related Components
In the automotive industry, European, U.S. and Japanese automakers have been advancing the development of autonomous driving cars of Level 3 and higher targeting to put them to practical use around 2020 to 2021.

TECH | FOCUS
Tiny Automotive-Grade MOSFET Offers Superior Mounting Reliability
M

any of the latest vehicles are equipped with a host of features, but new functions are continually being added using a variety of technologies. Examples include large instrument panels, animated LED head/rear lamps, high-end audio systems, and advanced driver-assistance systems (ADAS).

ADAS, in particular, is being developed for practical realization in many countries around the world, with onboard cameras playing an important role in the configuration of these systems. Cameras mounted at the front, rear, left, and right of the vehicle allow drivers to view the surrounding environment on the instrument panel, significantly improving safety.

The market for vehicle cameras, which totaled around 100 million in 2018, is expected to increase three-fold by 2025. The reason for this rapid expansion can be attributed to the growing number of camera-equipped vehicles as well as to an increase in the number of cameras used per vehicle. A number of today’s vehicles incorporate four cameras, but this is sure to increase as functions such as ADAS become standard and more sophisticated (Fig. 1).

TECH | FOCUS
Onboard Automotive Aluminum Electrolytic Capacitors Rise Above Heat
T

he automotive and onboard automotive industries are characterized by the development of vehicles with self-driving and safety features, such as advanced driver-assistance systems (ADAS). Such innovation is prompting demand for higher performance components, mainly for the sensors they require. Progress in space-saving onboard automotive equipment is accelerating demand for miniaturization, high capacitance, and low electrostatic resistance (ESR) automotive grade capacitors, as well as for components that can withstand harsh, extremely hot environments.

In this article, NICHICON Corporation outlines the latest technological trends for such capacitors, including aluminum electrolytic capacitors, conductive polymer aluminum solid electrolytic capacitors, and conductive polymer hybrid aluminum electrolytic capacitors.

MOBILITY
Novel Sensor Technologies Power Future Car Cabin Space
Mitsubishi Electric’s EMIRAI S concept cabin is equipped with wide range of advanced functionalities and is set to put to practical use and realize mobility-as-a-service (MaaS).
M

itsubishi Electric Corporation has announced EMIRAI S concept cabin, which reproduces a near future cabin space equipped with leading-edge sensor technologies. The company has started to propose the concept cabin to automakers as a mobility space, which safely and securely realizes mobility-as-a-service (MaaS), wherein mobility is used as a service, and aims to put it into practical use as early as possible.

The developed cabin is equipped with a function to measure the driver’s heart rate without contact using a near-infrared camera, and a function to accurately diagnose the driver’s fatigue, drowsiness, and sudden sickness by combining the heart rate and body surface temperature measured with a temperature sensor and automatically brings the vehicle to halt.

EMIRAI S unveiled to the press, making the most of camera and sensor technologies

EMIRAI S unveiled to the press. Making the most of camera and sensor technologies, it can monitor the driver’s conditions and maintain comfortable in-car space.

MOBILITY
Collaboration Aims to Bring Autonomous Driving to Fruition
The consortium targets to address technological complexities to be able to deliver conceptual compute platform that addresses these challenges.
M

obility will play a critical role in addressing some of the most pressing challenges society faces globally today, from urbanization and an aging population to higher levels of pollution and congestion. Technology is evolving to help to overcome these challenges and new approaches to transport are emerging, spurred by innovation in autonomy, electrification, smart infrastructure, shared services and connectivity.

“Advanced driver-assistance systems (ADAS) are already saving lives of drivers, passengers and pedestrians around the world, and the goal of self-driving vehicles now seems to be within our capabilities, bringing with it the potential for safer roads, more accessible mobility for all, and more sustainable cities,” said Dipti Vachani, Senior Vice President and General Manager, Automotive and IoT Line of Business at Arm Limited.

MOBILITY
TE Japan Demonstrates Virtual Flying Vehicle
The company’s state-of-the-art sensor technologies and connectivity have been employed in the virtual flying vehicle.
T

yco Electronics Japan G.K. put on spotlight at the recent CEATEC 2019 its flying vehicle concept, an ultra-compact personal flying device being developed by rFlight Team, which is sponsored by TE Connectivity Ltd. The flying experience demonstration was made possible with the use of virtual reality (VR).

The flying device, a safe, quiet, ultra-compact personal flying device (air mobility), has been developed by rFlight Team, a project team, comprising more than 60 engineers from 50 countries around the world. The flying device participates at GoFly, an international competition, the grand sponsor of which is Boeing. It features a compact design, vertical take-off and landing capability that does not need runway, simple operation (easier than the operation of a helicopter), and about 32km flight without refueling or recharging.

Demonstration of VR flying experience carried out at CEATEC 2019.

Demonstration of VR flying experience carried out at CEATEC 2019.

SMTs | IN REVIEW
EUV Mask Inspection System Suits Finer Chip Patterns
The new tool from Lasertec dramatically improves defect detection sensitivity and supports production of leading-edge semiconductors.
L

asertec Corporation has recently commercialized the ACTIS A150 defect detection system that supports pattern inspection of extreme ultraviolet (EUV) masks used in EUV lithography. It is the world’s first actinic EUV patterned mask inspection system. Amid the advancement of devices to have increasingly finer patterns, ACTIS A150 overcomes challenges in EUV lithography and supports the production of leading-edge semiconductors.

First to Adopt Actinic Inspection

ACTIS A150 is the world’s first EUV patterned mask inspection system that adopts the actinic inspection technology, which uses EUV light with a short wavelength. It features extremely high defect detection sensitivity compared with conventional mask inspection systems that use deep ultraviolet (DUV) laser. It can also detect printable phase defects unique to EUV masks.

Photo 1: Hiroki Miyai, General Manager, Lasertec Corporation
Photo 1: Hiroki Miyai, General Manager, Lasertec Corporation
SMTs | IN REVIEW
FUJI Promotes Atmospheric-Pressure Plasma Unit
The company markets the manufacturing system in China and other parts of Asia for automotive use.
F

UJI Corporation has been cultivating the demand for its atmospheric-pressure plasma unit, Tough Plasma, which improves bonding strength and coating adhesion strength. While strengthening collaboration with Marubun Corporation, an electronics trading company, the company cultivates the demand for the product in the Asian market.

Tough Plasma is a manufacturing system that uses plasma’s property of radicals that are electrically neutral to reform the surface of metals and other materials to enhance their adhesive strength.

It can produce bonding strength equivalent to that produced by flame processing (wherein a mixture of a combustion gas and air is burnt to produce plasma from oxygen in the air), which is the conventional plasma processing. While flame processing involves risk due to heat, FUJI’s atmospheric-pressure plasma unit uses low-temperature irradiation gas to remove organic contaminants, reform surface and improve functions of materials, and increase the bonding strength of metals and glass, as well as rubbers and resins that are weak to heat, without causing qualitative changes to materials. In particular, it has less load on resins as it uses plasma irradiation temperature of 200°C or lower.

SMTs | IN REVIEW
Latest PCB Inspection Systems Meet Growing Demand
PCB inspection system makers have responded to the call for new products, like 3D systems, amid increasing market need.
N

ew printed circuit board (PCB) inspection system, particularly those released from last year, have driven the market expansion. On the mainstream are three-dimensional (3D) inspection systems. Smart inspection systems, including those with machine-to-machine (M2M) capability, also advances.

Amid the shortage of skilled engineers, the needs to prevent human errors, and the requirements for high-quality production, the demand for PCB inspection systems, as replacement to conventional visual inspection, has been increasing worldwide particularly in Japan, China and Southeast Asian countries.

PCB inspection systems are classified into solder paste inspection (SPI) systems and automated optical inspection (AOI) systems.

Electronics Maker Confers Electronics Components Distributor to Digi-Key
D

igi-Key Electronics has been awarded the Electronics Components Distributor of the Year 2019 Award by Electronics Maker (EM) for the company’s outstanding distribution work in the electronics industry.

“High service distribution is key to moving this industry forward, and Digi-Key excels at this year after year,” said Arvind Kumar Vaid, chief editor for Electronics Maker during the awarding ceremony held at The Stellar Gymkhana Club in Greater Noida, India.

The EM Best of Industry Awards celebrates excellence in the market and honors leading performers that are driving the industry forward. The honorees are selected by an independent judging panel comprised of industry leaders and associations.

TEST | MEASUREMENT
Anritsu’s Test Station Verifies Qualcomm’s 5G Modem-RF Systems
MT8000A supports performance validation of Snapdragon X55 5G Modem-RF systems, allowing for faster 5G service rollout.
Q

ualcomm Technologies, Inc. has adopted Anritsu Corporation’s MT8000A Radio Communication Test Station to verify the performance of key 5G features, such as Dynamic Spectrum Sharing (DSS) in the FR1 Frequency Division Duplex (FDD) mode, in the Snapdragon X55 5G Modem-RF System.

This continued collaboration between Anritsu and Qualcomm around testing of advanced 5G technologies will help facilitate early rollout and adoption of 5G devices and services.

Jon Detra, Vice President of Engineering at Qualcomm Technologies, Inc., commented, “We were able to accelerate the verification of cutting-edge 5G technology in our solutions with the adoption of Anritsu’s stable and robust test platform. We aim to continue to cooperate with Anritsu to support the mobile ecosystem in developing and commercializing high-quality 5G devices.”

TEST | MEASUREMENT
New Oscilloscopes Carry Flurry of Functions
Newly released oscilloscopes feature enhanced function, like wide bandwith, high resolution and high-speed sampling.
N

ew oscilloscope models are being released onto the market one after another featuring enhanced functionalities, such as wideband, high resolution, and high-speed sampling.

Oscilloscopes are measuring instruments indispensable for engineers in the electric and electronic fields. Applications of oscilloscopes have broadened over the years, and the demand for oscilloscopes has been expanding for use in technological development associated with advanced electronic control, such as autonomous driving in the automotive field, as well as in the energy-saving and industrial equipment fields.

PRODUCT | HIGHLIGHT
KEL Expands Variation of Industrial Waterproof Connectors
K

EL Corporation has added the FWB01 branch and relay type to its FW Series 5.0mm-pitch waterproof connectors with IP67 rating, expanding variations of its waterproof connectors for industrial equipment.

The FW Series was introduced last year as the company’s first waterproof connectors. It has dustproof and waterproof performance corresponding to the IP67 protection rating, and has the industry’s smallest mating height and length among various 5.0mm-pitch waterproof connectors.

The newly released branch and relay types connectors can reduce the wiring volume inside a chassis by relaying and branching cables. They can pass through a duct with a minimum diameter of 32.6mm (in the case of the 4-pin type), making it easy to check a circuit system in a narrow space. The connector is mainly intended to be attached to a stay or processed sheet metal, and therefore has a shape that is easily fixed with a binding band, making it very handy to use.

Technology | Highlight
Highly Responsive Diode Generates Electricity from Ambient Radio Waves
T

he Japan Science and Technology Agency (JST), Fujitsu Limited, and Tokyo Metropolitan University have developed a highly sensitive rectifying element in the form of a nanowire backward diode, which can convert low-power microwaves into electricity. Through JST’s Strategic Basic Research Programs, the technology was developed by researchers led by Kenichi Kawaguchi of Fujitsu Limited and Professor Michihiko Suhara of the Tokyo Metropolitan University. The new technology is expected to play a role in harvesting energy from radio waves in the environment, where electricity is generated from ambient radio waves, such as those emitted from mobile phone base stations.

To facilitate the commencement of a true internet of things (IoT) era, energy harvesting from environmental radio waves is receiving attention as a means for building sensor networks that do not require batteries. Because of low-voltage rectification characteristics and element sizes of conventional rectifying elements, they had difficulties in converting low-power microwaves that are weaker than microwatts, which account for many of the ambient radio waves, to electricity.

zoomin
Electronic Trends Point Toward Realizing Ultra-Smart Society
T

oward achieving a better smart society in the future, interests in information technology (IT) and electronics technologies have been increasing more than ever. At the 20th edition of CEATEC Japan this year, a comprehensive display of cyber physical system (CPS) and internet of things (IoT) technologies drew visitors to the show. Under the theme of “Connecting Society, Co-Creating the Future,” exhibitors showcased innovative CPS and IoT technologies and solutions.

Japanese electronic manufacturers, electronic components manufacturers, and IT-related companies converged on the exhibition floors, and disseminated “co-creation” by all industries and businesses toward the achievement of Society 5.0, or ultra-smart society.

Kyocera Develops Clay-Type Lithium Ion Rechargeable Battery
K

yocera Corporation has developed Enerezza, the first clay lithium ion rechargeable battery, which has achieved about 30 percent cost reduction from the conventional lithium ion rechargeable batteries through the use of clay-modified electrodes. The company plans to install a mass-production line at its Shiga Yasu Plant in Yasu, Shiga Prefecture, Japan for this battery. It plans to infuse about ¥10 billion in capital investments to construct a production system for an annual production of 20,000 units by fall 2020.

Enerezza, the first clay-type lithium ion rechargeable battery, developed by Kyocera.
Enerezza, the first clay-type lithium ion rechargeable battery, developed by Kyocera.
Enerezza will be commercialized as a home-use battery and released in a limited quantity in Jan. 2020 with mass production aimed to commence in fall.
Business | Strategy
FUJI Holds FUJI Innovation Days in Philippines
F

UJI Corporation held FUJI Innovation Days in Philippines 2019 in Alabang in the capital territory of Manila on Nov. 6 and 7. The event was held in response to strong demand from its customers who had been requesting the company to hold Technical Seminar in the Philippines.

Mitsugu Sagara, Director and General Manager of FujiPhilippines Services, Inc. (FSI), says, “Our company has been able to gain gaining competitive advantage in the Philippine market as we have provided fulfilling after-sales services, aside from the provision of high-performance equipment. In particular, resident Japanese engineers who attend to customers’ needs have been acclaimed by our customers as a strength of FUJI, which is not the case with our competitors.”

Mitsugu Sagara, Director and General Manager of FujiPhilippines Services, Inc.
Mitsugu Sagara, Director and General Manager of FujiPhilippines Services, Inc.
MANUFACTURING | FRONT
Nichicon (Malaysia) Magnifies Role in Group’s Overseas Production Plan

N

ichicon (Malaysia) Sdn. Bhd., the Malaysian subsidiary of Nichicon Corp., is part of the manufacturing sector of Nichicon Group’s international division and is an important manufacturing base. Over the years, the company has increased its capital investments to bolster the production capacity of aluminum electrolytic capacitors and enhance productivity. It has also improved its capabilities.

Established in 1990, Nichicon (Malaysia) has been producing snap-in terminal-type (φ20 to 35), chip-type (φ4 to 10) and lead-type (φ4 to 18) products as a global production base of aluminum electrolytic capacitors.

The plant stands on a 48,280sq.m lot, and has a total floor area of 23,804sq.m. It has over 1,400 employees.

Long Fong Ping
Photo 1: Long Fong Ping, Managing Director, Otax Malaysia Sdn. Bhd.
Panasonic Beefs up Security of IoT Home Electric Appliances
P

anasonic Corporation accelerates efforts to strengthen the security of internet of things (IoT) home electric appliances. Half of cyberattacks that have been increasing in recent years are said to be targeted at IoT appliances, and the strengthening of the security of products has become a challenge.

In 2005, Panasonic launched an organization that works on security measures of networked products, and established Product Security Center in 2016.

In FY2017, the Product Security Center materialized a platform concept to collect, analyze, and utilize threat information to implement countermeasures against rapidly increasing IoT malware and other threats.

Product | News
Components & Devices
PCM Series Capacitors by NICHICON
PCM Series Capacitors
NICHICON CORPORATION has developed the PCM Series chip-type conductive polymer aluminum solid electrolytic capacitors for automotive applications and industrial equipment. At a guaranteed 8,000 hours of operation, the PCM Series features the longest life rating in the industry for capacitors rated at 125°C. It retains the characteristics of the PCR Series, such as capacitance and electro static resistance (ESR), while achieving longer life. The new series with eight sizes from φ6.3×6L to φ10×12.7L mm features a rated voltage range of DC 16 to 80V, rated capacitance range of 12 to 1,000μF, category temperature range of -55 to 125°C. The PCM Series further advances the high heat resistance technology of conductive polymer aluminum solid electrolytic capacitors.
NICHICON CORPORATION
www.nichicon.co.jp

Chinese Section first page
View the Chinese Section of our December 2019 Issue
Thanks for reading our December 2019 issue