DEMPA AEI logo
December 2020
Asia Electronics Industry logo
Asia Electronics Industry
December 2020 Volume 25, Serial No. 291

ASIA ELECTRONICS INDUSTRY (ISSN 1342-422X) is published monthly by Dempa Publications, Inc., 1-11-15 Higashi Gotanda, Shinagawa-ku, Tokyo 141-8715, Japan Tel: +81-3-3445-6111 Fax: +81-3-3445-6890. Editorial e-mail: may@dempa.co.jp; Subscription e-mail: circulationmanila@dempa.co.jp.

The magazine is distributed free to qualified subscribers in ASEAN countries (Thailand, Indonesia, The Philippines, Malaysia, Singapore, Brunei, Vietnam, Myanmar, Cambodia and Laos), as well as Korea,Taiwan and Hong Kong.

Paid air mail subscription is available to non-qualified subscribers in the Asian and Pacific regions for US$150 per year and US$260 for two years. For other areas, air mail subscription fees are US$160 per year and US$280 for two years. Paid subscription is accepted at https://www.dempa.co.jp/en/pdfs/orderform.pdf

Send address corrections to Dempa Publications, Inc., c/o Quantium Solutions (HK) Ltd. Unit 3-6, G/F Pacific Trade Centre, 2 Kai Hing Road, Kowloon Bay, Kowloon, Hong Kong

TAIWAN: International Dempa Trade Co. Ltd., 7F, No. 34, Sec. 1, Nanjing East Road., Taipei, Taiwan 104 Tel: +886-2-2563 4595 Fax: +886-2-2567-5559 KOREA: Dempa Publications, Room 1019, Punglim VIP Tel, 404, Gongdeuk-dong, Mapo, Seoul, Korea 04144, Tel: +82-2-714-2983 Fax: +82-2-714-2984 PHILIPPINES: Dempa Publications, Inc. – Regional Headquarters, Herrera Tower, Room 2510, 98 V.A. Rufino Street, Salcedo Village, Makati City, Philippines, Tel: +63-2-8845-0906 Fax: +63-2-8845-1829

President & Publisher: Tsutomu Hirayama
Copyright © 2020 by Dempa Publications, Inc.

All rights reserved. The contents of this magazine may not be reproduced in whole or in part without the prior permission of the copyright owner. Printed in China.

Cover | Story
A

midst the perilous impact to the economy by the COVID-19 pandemic, the Philippine Economic Zone Authority (PEZA), the top export-oriented investment promotion agency in the Philippines, continues to perform its mandate to register, manage, and operate public and private economic zones in the country. Under the leadership of Director General Charito Plaza, PEZA has turned the threats of the pandemic into opportunities to help the national government keep the economy afloat while catering to the needs of its export-oriented registered business enterprises (RBEs), keeping the jobs of thousands of Filipinos in industries while also taking care of their health and safety in the workplace.

PEZA’s Great Balancing Acts
Since the start of the community quarantines in March 2020 in the Philippines under Proclamation No. 929 titled “Declaring a State of Calamity Throughout the Philippines due to Corona Virus Disease 2019”, PEZA has continued to support and assist the National Government to assist its RBEs so as to continue their operations and not to cripple the economy. PEZA liaises and cooperates with other government agencies to address issues and challenges on implementation of quarantine rules and be part of the solution by giving out business assistance and reprieves.

AEI News
Telecom Giants Join Forces for Germany’s 5G Service

GERMANY and KOREA – SK Telecom Co., Ltd. (SKT) and Deutsche Telekom AG (DT) have agreed to put up a joint venture company in Germany that will introduce a new breed of innovative 5G technologies and services. The 5G-dedicated joint venture company will develop leading-edge technologies in 5G-building solutions.

On a mid- to long-term, the joint venture will tap new market opportunities for augmented reality (AR), virtual reality (VR), mobile edge computing (MEC), and app services.

SKT had already supplied its 5G/LTE dual-mode repeaters to support DT’s customer trial service for in-building coverage, and has carried out test services in eight German cities of Berlin, Hamburg, Bonn, Cologne, Munich, Darmstadt, Frankfurt, and Leipzig from August to October 2020.

The joint venture company will complete the commercialization of the 5G/LTE dual-mode repeaters.

www.sktelecom.com/index_en.html; www.telekom.com/en

In View | This Month
Measuring Instruments Makers Set Sights on Local 5G Implementation

P

rocedures for granting Frequency Range 1 (FR1), or sub-6 band, license for frequencies of up to about 6GHz for local 5G is expected to begin by the end of this year. As a policy, the Ministry of Internal Affairs and Communications of Japan does not approve nationwide mobile phone carriers to obtain a license for the local 5G band at present. It is a business model unique to the Japanese market.

Along this line, measuring instruments manufacturers have been stepping up efforts to cultivate the Japanese market, including collaboration with diverse set of market players who are aiming to enter the market.

The development of systems for local 5G started in Dec. 2019 targeting Frequency Range 2 (FR2), or millimeter wave (mmWave) band, which exceeds 24GHz. At present, frequency bands of 28.2 to 28.3GHz are allocated for local 5G. This time, the expansion of frequency bands in FR2 along with FR1 is anticipated.

Special | Report
Acoustic Technology typography
Pixie Dust Technologies Lifts Acoustic Technology Experience
Through its core technology HAGEN, the company has developed Pixie Dust, a 3D acoustic levitation technology using ultrasonic phased arrays. Innovative sound technology and devices have been realized THROUGH THIS TECHNOLOGY.

P

ixie Dust Technologies, Inc. a startup company of Tsukuba University, has been conducting research and development with the aim of solving various social problems by applying element technologies and application technologies derived from its core technology HAGEN, a wave control technology. Pixie Dust Technologies celebrated its third year of founding last May.

Pixie Dust is a 3D acoustic levitation technology using ultrasonic phased arrays. Although it has been known that objects can be levitated by ultrasound, it is now possible to freely move the levitated objects, or to arrange them in an order different from the conventional setups, by controlling the spatial distribution of ultrasound. The company has been working to operationalize this technology.

TECH | FOCUS
New Method Accurately Measures Luminous Efficiency of GaN Crystals
T

he Institute of Multidisciplinary Research for Advanced Materials, Tohoku University has discovered that a peculiar bimodal shape of the emission spectrum observed by the omnidirectional photoluminescence (ODPL) measurement method*1 (ODPL spectrum) is caused by the light absorption of the crystal itself.

This research has clarified the relationship between the light emission quantum efficiency*2 and light absorption of gallium nitride (GaN) crystals, which are energy-saving materials suitable for products, such as high-performance electronic devices and optical devices. The ODPL method provides an easy way to measure the light absorption spectrum of a semiconductor crystal.

TECH | FOCUS
New VCSEL Module Technology Yields Higher Output

R

OHM Co. Ltd. has combined a vertical cavity surface emitting laser (VCSEL) device and a metal oxide semiconductor field-effect transistor (MOSFET) device into a one-package module to realize a short-pulse drive of a light source (within 10nsec) and is not affected by external noise caused by sunlight.

At the same time, it has established the VCSEL module technology that gives about 30 percent higher output than conventional elements with a VCSEL device and a MOSFET device separately mounted. The 3D space recognition and ranging system, or the 3D time-of-flight (TOF) sensor system, that uses the VCSEL module made by the new technology as the laser light source, can increase the amount of reflected light for the TOF sensor by about 30 percent compared to conventional devices, realizing higher precision. By March 2021, the company will start supplying three product types consisting of bare chips, VCSEL elements, and VCSEL modules for face recognition systems of mobile devices, for automatic guided vehicles (AGVs), and for driver monitoring in automobiles.

NXP’s New PMIC Family Simplifies Safety Implementation in Vehicles

N

XP Semiconductors N.V. has released the FS26 family of scalable safety power management system that powers the microcontroller units (MCUs) in safety-sensitive vehicle applications. It is a plug & play solution with hardware, software, and safety backbone needed to accelerate ECU development.

Innovation in vehicles is driven by electronics that enable connectivity, electrification and autonomy. As electronics proliferate to meet these growth areas, keeping the systems safe becomes increasingly important. As a result, the safe monitoring of MCUs and the precise management of power in electronic systems are taking center stage in design considerations.

TECH | FOCUS
Quartz Gyro Sensor Detects Three Axes Simultaneously

K

YOCERA Corporation has developed the first*1 quartz gyro sensor that can simultaneously detect the tilt and rotation speed of an object on three (X, Y, Z) axes. The sensor can detect the high-speed rotation up to 72,000dps (200rpm), which is about 36 times*2 of conventional products, enabling measurement in the range of high-speed rotation that was previously impossible.

In the future, the company plans to develop ICs compatible with three-axis digital output and modularize them into a three-axis integrated package. Taking advantage of the excellent characteristics of quartz, a noise less than 0.002dps/√Hz and a zero-point variation due to temperature change less than 0.25dps (between −30°C and +85°C) will be realized for the smallest*3 size of 5.0×3.2×1.0mm.

SMTs | IN REVIEW
ASM Reinforces Novel Features of New Placement Platform
The new generation SIPLACE SX offers significantly improved performance, flexibility, and openness, setting new standard for flexible electronics production.

A

SM has introduced the latest generation of the SIPLACE SX placement platform, which comes with new placement head versions, a more powerful vision system, open interfaces for special feeders, and many new software functions. The SIPLACE SpeedStar CP20 raises the placement performance up to 43,250 components per hour with even more accuracy and an expanded component spectrum.

The new generation of the SIPLACE SX (Source: ASM)
The new generation of the SIPLACE SX (Source: ASM)
SMTs | IN REVIEW
FUJI Enhances Modular Multi-Purpose Automated Fabrication Machine
The tool kits help sFAB-D fabrication machine to instantly respond to part additions and changes, and handling of odd-formed components and insertion parts.
F

UJI Corporation has released tool kits for the sFAB-D modular multi-purpose automated fabrication machine.

sFAB-D is a machine to automatically mount odd-form components after surface mounting, and there have been many inquiries in line with the needs for automation in the market.

It has become difficult to flexibly respond to the assembly process of products that are becoming increasingly diversified and are used for shorter period of time using dedicated automatic insertion machines. Meanwhile, manual insertion can affect production volume and quality.

SMTs | IN REVIEW
Manufacturing Industry Bounces Back from COVID-19 Crisis
While the health crisis has almost put a stop to business activities, manufacturing operations have started to get back to normal at par with the pre-COVID level. FA equipment manufacturers express hope in the recovery of the market particularly in China.
D

ealing with the novel coronavirus disease (COVID-19) and achieving economic growth at the same time have brought enormous challenges to the manufacturing industry. Despite this, there has been a notable recovery from the COVID-19 crisis.

In China, operations of factories have almost recovered to pre-COVID-19 levels, and production activities in countries in Southeast Asia have also been gradually recovering. With the recovery of the manufacturing industry, the demand for production equipment, such as surface mounters, has increased.

SMTs | IN REVIEW
Mitsubishi Electric Puts up Philippine FA Center
To provide for the growing market demand for FA equipment in the electronics, food and beverage, and automotive industries, the company has put up a sales base in the country.
A

s part of its efforts to strengthen sales and service system of its factory automation (FA) business in Southeast Asia, Mitsubishi Electric Corporation has established MELCO Factory Automation Philippines Inc. sales office in Manila. The company put up the Philippine FA Center on the premises of MELCO Factory Automation Philippines and started operating last October.

MELCO Factory Automation Philippines was established through a joint capital investment of Mitsubishi Electric; SETSUYO ASTEC CORPORATION, a subsidiary of Mitsubishi Electric; and Integrated Factory Automation (IFA), Mitsubishi Electric’s local sales agency for FA equipment in the Philippines. The company sets its sights on electric, electronics, and food industries to strengthen its sales system and services in the Philippines’ FA market.

SMTs | IN REVIEW
THK Expands Miniature LM Guide Lineup
The company has added the RSX linear motion guide, the smallest in the series, to fit compact spaces. It features an optimized circulation for smooth movement.
T

HK Co., Ltd. has expanded its lineup of the RSX miniature linear motion (LM) guides with the addition of RSX5, the smallest model of RSX. The company has also enriched the variations of the LM block length of RSX7-15, and also started receiving orders for high-temperature models.

The miniature RSX LM guide is provided with two rows of raceways with ball rolling contact surfaces and features an optimized ball circulation through repeated improvements of the existing type, realizing smoother movement. Despite its compact structure that makes it suitable for use in limited space, it can be used individually in locations where movements are applied.

SMTs | IN REVIEW
Tokyo Weld Lifts Value of AOI Systems With AI Function
The integration of AI function to its AOI systems has helped customers improve the ratio of non-defective parts to those that have been judged defective during optical inspection.
T

okyo Weld Co., Ltd. has been expanding its automated optical inspection (AOI) systems business. While advancing the functions of AOI systems, like higher speeds and accommodation to smaller components, the company has been bringing to market a newly developed AOI system with artificial intelligence (AI) function and AOI system for odd-form components, in stages.

In the last five years, Tokyo Weld has put into operation AOI systems that inspect the quality of capacitors, inductors, diodes, and other components on full scale. In doing so, the company has applied resources it accumulated in the production of measuring and sorting machines and taping machines, including transfer technology and image processing technology.

Test | Measurement

Anritsu Supports Development of 5G Mobile Devices

With the MT8000A radio communication test solution at the core of its offering, Anritsu has put in line a broad range of test solutions for 5G mobile communication to reach mainstream.

A

nritsu Corporation has been stepping up the supply of test solutions for fifth-generation (5G) mobile devices. Centering on the MT8000A radio communication test solution, Anritsu responds to a wide range of users’ needs, by offering testers for 4G, such as Long Term Evolution (LTE); and a chamber (radio wave anechoic box) for over-the-air (OTA) test or test in the wireless communications environment.

MT8000A Test Solution
The MT8000A tester for mobile devices has expanded to the United States, India, and countries in Europe, and has been received well especially in the Asian market, which is less severely affected by COVID-19, according to Anritsu.

Component | Materials

Solid Phase-Change Materials Heighten Thermal Responsiveness

Aside from dealing with thermal responsiveness, AIST also improved the adhesiveness of the interface, resistance to water, electrical conductivity, and mechanical toughness by using different materials.
T

he National Institute of Advanced Industrial Science and Technology (AIST) has developed a solid phase-change material (PCM) with excellent thermal responsiveness.

Solid PCM is useful as a heat storage material that maintains its shape because it generates latent heat without melting. Due to the endothermic effect of latent heat and high thermal conductivity comparable to that of metal, it is expected to be used for heat dissipation parts of electronic devices. In addition, the water resistance is significantly improved compared to vanadium dioxide (VO2) ceramics. Therefore, it is considered also as a heat exchanger that can be used in environments containing water.

Component | Materials

Denka Releases Advanced Ceramics for 5G, xEV

The new thermal solution designed for the environment and energy sectors highlights superior thermal conductivity than alumina.
D

enka Company Limited has released the Denka Spherical Magnesia advanced ceramic to provide a new thermal solution to fifth-generation (5G) communication standard and electrified vehicle (xEV) markets.

5G is the next generation of telecom infrastructure utilized for smartphones as well as in devices for healthcare and disaster prevention, and xEV is another key technology that supports the reduction of greenhouse gas emissions. While both of these technologies are significantly important for the realization of a sustainable society, 5G increases the amount and speed of data traffic, and xEV requires high performance electronic components that generate higher heat. Therefore, the demand for superior thermal conductivities and higher reliabilities are significantly increasing.

Closeup view of Denka Spherical Magnesia advanced ceramic
Spherical Magnesia advanced ceramic

Component | Materials

Mektec’s MPI FPC Equals Transmission Speed of LCP FPC

The new flexible printed circuit uses modified polyimide, and features low dielectric properties and higher resistance to bending and heat, making it ideal for 5G standard.
N

ippon Mektron Ltd. (Mektec) has made available in mass volume a new flexible printed circuit (FPC) structure using modified polyimide (MPI) for high speed transmission applications in addition to liquid crystal polymer-based (LCP) FPC.

High-speed transmission FPCs are an essential technology to developing devices that will support fifth-generation (5G) high-speed communication standard. 5G is characterized as a communication technology that enables high speed, high capacity, multiple simultaneous connections with low signal delay. When transmitting, FPCs become the transmission line, meaning FPCs need specialized materials with dielectric properties that minimize transmission loss. Nippon Mektron’s LCP FPCs already support such properties however, had flexibility and cost challenges.

MOBILITY
Kyocera’s Concept Car Fits in Novel Technologies, Design
The car of the future Kyocera envisions integrates not only sophisticated design that adds comfort to mobility experience, but also state-of-the art technologies developed through years of experience the company was able to nurture.
K

yocera Corporation has developed a concept car Moeye in collaboration with Research Center for Advanced Science and Technology, the University of Tokyo, and Fortmarei Inc. Kyocera has proposed the car of the future encompassing worldview features and new values. The team has created a cockpit by adopting the transparent cockpit and naked eye stereoscopic user interface (UI).

Transparent Cockpit

Kyocera has made part of the cockpit of Moeye transparent using its original optical camouflage technology in collaboration with Research Center for Advanced Science and Technology, the University of Tokyo. Fortmarei oversees its design. Technologies Kyocera has nurtured over the years are also incorporated in Moeye.

TECHNOLOGY | HIGHLIGHT
Ka-Band Transceiver Brings Low-Cost Communication to Remote Areas
S

cientists at Tokyo Institute of Technology and Socionext Inc. have developed a novel transceiver (Fig. 1) for enabling seamless communication between earth ground platforms and satellites in the low, middle, and geostationary earth orbits. Among other things, this transceiver could bring internet to people in remote rural areas and at sea.

Taps CMOS Technology
In this information age, communications technologies have reached unprecedented levels of advancement. Yet, bringing connectivity to remote locations, such as rural areas or the open sea, remains difficult. Satellite communication (SATCOM) is an attractive option for providing data links to such places; but for an effective SATCOM, the right equipment must exist both in space and here on earth.

Maxim Integrated Develops Lithium Fuel Gauge Protection IC
T

he new MAX17320 high-accuracy fuel-gauge and protection circuit from Maxim Integrated Products, Inc. extends run-time on multi-cell battery-powered products while also monitoring against self-discharge hazards. MAX17320 is a pack-side fuel gauge and protector IC for 2- to 4-series lithium ion (Li+) cells (2S-4S) and is part of a family of ICs equipped with Maxim Integrated’s ModelGauge m5 EZ algorithm that delivers 40 percent more accurate state-of-charge (SOC) readings than competitive offerings, eliminating the need for battery characterization for most common Li+ cells. This fuel gauge also offers the industry’s lowest quiescent current (IQ), which is 85 percent lower than the nearest competitor and features SHA-256 authentication to safeguard systems from counterfeit batteries.

“Maxim Integrated’s fuel gauge ICs are the industry’s safest and most accurate,” said Bakul Damle, Business Management Director, Mobile Power Business Unit at Maxim Integrated. “The MAX17320 ICs provide additional safety by detecting internal leakage and preventing potentially hazardous outcomes, while enhancing user experience through the industry’s highest accuracy for 2S-4S Li+ battery powered devices using Maxim Integrated’s ModelGauge m5 algorithm.”

PRODUCT | HIGHLIGHT
Connectors Improve Reliability of Inverters, Converters in EVs, HEVs
I

rriso Electronics Co., Ltd. has been expanding the product lineup of the Z-Move board-to-board floating connectors for use in severe environments. These connectors feature high reliability with a resonance absorption function and contribute to improving the reliability of inverters and converters in electric vehicles (EVs) and hybrid electric vehicles (HEVs). Since its release in 2015, the adoption of Z-Move board-to-board floating connectors has been expanding, mainly for automotive electronics.

Today, the automotive industry is undergoing radical transformation, which is said to occur once in a century, and is facing the dawn of the electrification era where the main power of vehicle changes from engine to motor.

PRODUCT | HIGHLIGHT
Sony’s IC Chip Complies with Contactless IC FeliCa Standard
S

ony Corporation has developed a next-generation IC chip for contactless IC card FeliCa Standard. The new IC chip, which will be compatible with the present IC chip FeliCa Standard, enables new data management through cloud. It is equipped with a FeliCa secure ID function that prevents unauthorized use by a third party. Accordingly, the service provider can prevent unauthorized use such as impersonation and identity theft. It flexibly responds to the management of customer information and addition/update of service contents on the cloud in various online services. In addition, this IC chip has the highest level of security in the industry for consumer IC card applications to meet the needs of the times.

FeliCa is widely used in markets where high security and performance are important, such as transportation tickets, electronic money, and employee ID cards, which also serve as access control. So far, more than 1.4 billion IC chips for cards and mobile FeliCa IC chips have been produced and sold.

PRODUCT | HIGHLIGHT
Compact Chip Resistors Suit High-Density 5G Circuit Boards
W

ith the growing demand of high-density circuit integration in a compact design, YAGEO Group has expanded its investment in the production of RC0075 miniature chip resistors with 0.3×0.15mm dimensions, which is smaller than its previous offering of 01005 (0.4×0.2mm).

The RC0075 Series chip resistors are ideal for use in fifth-generation (5G) mobile standard applications, such as wireless communication modules and multi-function mobile devices. These compact components were able to meet the requirement of high-density circuit boards used in 5G. The RC0075 chip resistors feature significant reduction of 44 percent in size compared to previous generations. The series is designed to fulfill the need for miniature, thick film chip resistors, while greatly decreasing the environmental impact through more effective use and disposal of materials used in production.

PRODUCT | HIGHLIGHT
TDK Reinforces Portfolio With New Position Sensor
T

DK Corporation has expanded the portfolio of the Micronas masterHAL sensor family with the release of HAL 3970, a new stray-field robust 3D HAL position sensor. The sensor, suited for automotive and industrial applications, has high accuracy angular detection from 0° to 360°, linear position detection, and uses short pulse width modulation (PWM) code frames (SPC) to transmit the calculated position information.

SPC is an enhancement of the standard sent protocol according to SAE J2716. It enables data to be transmitted based on a trigger pulse sent by an external electronic control unit (ECU), and it supports point-to-point connections as well as a single-wire bus mode with up to four sensors.

PRODUCT | HIGHLIGHT
JAE’s Narrow Pitch Connector Suits Wearables
J

apan Aviation Electronics Industry, Ltd. has introduced the WP56DK Series stacking type board-to-board flexible printed circuit (FPC) connectors that are ideal for use in wearable devices such as smartwatches and smart glasses. The WP56DK Series is an ultra-compact connector with power supply terminals, comes with width of 1.6mm and mated height of 0.6mm. It achieves a 0.3mm terminal pitch, which is the smallest in the industry.

PRODUCT | HIGHLIGHT
All-in-One Communication Module Propels Cellular V2X Technology
A

lps Alpine Co., Ltd. has developed the UMCC1 Series cellular V2X all-in-one communication module (Photo 1) that supports the domains of intelligent transportation, smart cities and autonomous driving.

Fifth-generation (5G) mobile communications technology featuring ultra-fast speeds, ultra-low latency and mass connectivity is expected to play a big role within future social infrastructure. Global efforts have put in place the necessary communications environments while developed related technology gained traction, and momentum for social implementation should grow. The most prominent use for next-generation communications system and a potential killer application is connected vehicles given they will contribute to safe and comfortable autonomous driving. Cellular V2X, or C-V2X, will be a key platform here. In China, cellular V2X is already deployed using fourth-generation mobile communications (4G LTE) in anticipation of 5G-based services. In terms of commercial application of cellular V2X as a platform for V2X, or vehicle-to-everything, connectivity, including vehicle-to-vehicle (V2V) and vehicle-to-infrastructure (V2I) communication, China is a market leader based on market size and stage of network development.

PRODUCT | HIGHLIGHT
High-Luminance OLED Module Eyes Visual Field Test System
S

harp Corporation has developed a 6.4-inch ultrahigh-luminance organic light-emitting diode (OLED) module for visual field test systems that are used in medical institutions.

Last August, Sharp started delivering the module to FINDEX Inc., a Japan-based manufacturer of medical systems and equipment that also conducts research and development. FINDEX’s visual field test system, which adopts the module, is planned for market release in early 2021. This is the first time Sharp sold its OLED module to an outside company.

Show | REPORT
SID2020
High-Transmittance Sensor Module Integrates Fingerprint, Touch Functions
A

t a symposium at Display Week 2020 (SID2020), Japan Display Inc. (JDI) gave a presentation titled “Full-Screen Capacitive Fingerprint Sensor and Touch Sensor” (Paper No. 42.3).(1) The contents of the presentation are discussed in this article.

Concept of Display Devices
Fig. 1 shows the concepts of full-screen capacitive fingerprint sensor and touch sensor functions. The sensor is assumed to be used both as fingerprint sensor and touch sensor. In the touch sensing mode, the sensor exhibits fast sensing report rate and rough scan pitch. Meanwhile, in the fingerprint sensing mode, the scanning pitch is fine, and therefore, high-resolution image needs to be obtained. In addition, the sensor scan area for the fingerprint is limited to the touch area, leading to smaller image size and shorter scan time. The new sensor developed by JDI can achieve a frame scan time of 130msec or shorter in the fingerprint mode, when the scanning area is about 10×10mm.

Show | REPORT
Manufacturing World Osaka
Cutting-Edge Robots Take Spotlight at Manufacturing Event
T

he 23rd Manufacturing World Osaka was held in Osaka from October 7 to 9 and attracted 710 exhibiting companies. At the Mechanical Components & Materials Technology Expo [M-Tech], which is the main exhibition of the event, robot-related manufacturers showcased and introduced leading-edge technologies, products, and systems, which drew inquiries from visitors, offering opportunities for business negotiations. Because of the coronavirus disease (COVID-19) pandemic, most industries, including manufacturing and service industries, have been accelerating efforts and considerations to promote labor saving, automation, and cost reduction using robots; thus providing a tailwind for exhibiting robot manufacturers. In one observation, an exhibitor said that although the number of visitors was fewer than last year, more visitors checked on their booth than initially expected. Overall, their participation at the exhibition had a positive outcome. The company expects considerable demand next year and the year after next as a result.

INDUSTRY | REPORT
High-Frequency Feature Drives PCB Materials Market
T

he development of new materials for printed circuit boards (PCBs) that are compatible with the fifth-generation (5G) communication standard and high-frequency bands, such as millimeter wave (mmWave) band, has been gathering momentum. Chemical materials manufacturers, including manufacturers of copper-clad laminates (CCL), have commercialized new PCB materials one after another. Products using new materials that are suitable for high-speed transmission in high-frequency bands have emerged; and move to bring them to mass production will accelerate in the coming months.

INDUSTRY | HIGHLIGHT

Panasonic Effects Management Changes, Accelerates Reforms
P

anasonic Corporation has recently announced major changes in its leadership. Yuki Kusumi, who is presently Managing Executive Officer of Automotive Segment, and President of Automotive Company, will be promoted as Representative Director, President, and Member of the Board of Panasonic, while Kazuhiro Tsuga, the incumbent President, Representative Director, and Chief Executive Officer will thereafter take the posts Director and Chairman of the Board.

Shusaku Nagae, Director, Chairman of the Board, will be assigned Special Corporate Advisor of Panasonic Corporation. The changes will be effective June 24, 2021. Kusumi will become Chief Executive Officer effective April 1, and Tsuga will resign as Executive Officer and will continue the role of Representative Director, President, Member of the Board of Panasonic Corporation.

Business | Strategy
NICHICON Positions SDGs at Core of Management
N

ICHICON Corporation positions Sustainable Development Goals (SDGs) at the center of its management. The company strengthens its capabilities as a team and accelerates the growth of both capacitor business and the Nichicon Energy Control System Technology (NECST) business of circuits and power supply-applied equipment.

With the keywords of “growth potential,” “competitiveness,” “improvement of productivity,” and “capabilities to change,” every single employee of the NICHICON Group develops abilities and drives the company’s growth by enhancing the capabilities of the team as a whole.

NICHICON plans to gather key persons from all departments by the end of the year, or at the beginning of next year at the latest, to inaugurate “Digitization Promotion Project” and promote digital transformation (DX) of the NICHICON Group.

Ippei Takeda headshot
Ippei Takeda, Chairman and Chief Executive Officer, NICHICON Corporation
COMPANY | ON THE MOVE
NF Makes Foray Into Quantum Science Field
N

F Corporation has started full-fledged deployment in the quantum science field with the announcement of a low-noise signal processing solution for quantum computers. The company has built a system for drive, control and signal detection of superconducting elements, by adding to a conventional low-noise amplifier for minute signals a system that extracts signals from elements (superconducting devices) placed in ultralow temperatures, and provides control signals.

Initial Quantum Products
In the field of quantum computing, NF first developed a low-noise amplifier, which amplifies signals from the element. Then the company has developed a low-noise device under test (DUT) holder for cryostat, which enables stable experiments of superconductivity in low temperatures. This was made possible by implementing an arbitrary waveform generating device, which precisely controls the element and the substrate of the element.

Product | News
Semiconductors, ICs & Modules
SMK’s BT801 Series Module
SMK’s BT801 Series Module chip
SMK Corporation has developed dual-mode Bluetooth modules BT801 Series (BT801 and BT801-AP2) that support both Bluetooth Classic and Bluetooth Low Energy communications. BT801 is a complete module that implements both SPP, a Bluetooth profile that defines the procedures for sending and receiving data by using Bluetooth communication like a virtual serial port, and SSS, which is a serial communication service developed by SMK, and enables data communication with smartphones and tablet devices. BT801-AP2 supports iPod Accessory Protocol of Apple Inc. (iAP) protocol in addition to the specifications of the BT801, enabling data communication with iPhone and iPad via iAP. The dual-mode support enables both the use of the older Bluetooth Classic standard for high-speed transmission of large amounts of data and the newer Bluetooth Low Energy standard for low-speed, ultralow power consumption, which is suitable for internet of things (IoT) devices.
SMK Corporation
www.smk.co.jp
Thanks for reading our December 2020 issue