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# AEI

ASIA ELECTRONICS INDUSTRY

## Sitemaps

- [XML Sitemap](https://aei.dempa.net/sitemap.xml): Contains all public & indexable URLs for this website.

## Posts

- [Siemens New Investments Boost Global Factories](https://aei.dempa.net/archives/16462) - Siemens' ramp up of global investment in new high-tech factories and innovation labs will expand further its leadership in automation, and sustainability.
- [AMD Aims for New R&D Funding, Targets AI, 6G](https://aei.dempa.net/archives/16604) - AMD has announced plans for continued growth in Ireland through an investment of up to US$135 million over four years. Accordingly, the investment will fund several strategic R&D projects. Specifically, they funding will involve adding up to 290 highly skilled engineering and research positions, as well as a broad range of additional support roles. Ireland’s Minister
- [Techman Robot Partners with NVIDIA on Digital Twin](https://aei.dempa.net/archives/16597) - Techman Robot is collaborating with NVIDIA’s Isaac Sim platform to develop digital twin technology to enhance the efficiency of robot production line inspection. This collaboration targets to reduce robot programming time by 70% and cycle time by 20%, resulting in significant time and cost savings. Specifically, digital twin provides robust support for collaborative robots by
- [Delta Strengthens EV Portfolio in New Acquisition](https://aei.dempa.net/archives/16590) - Delta Electronics, Inc. has announced the signing of a definitive agreement to purchase 100% shareholdings of HY&T Investments Holding B.V. and its subsidiaries, including TB&C Group, from Cooperatief H2 Equity Partners Fund IV Holding W.A. and Te Bokkel Beheer B.V. for 142 million euros (US$156 million). The buyout is done through its subsidiary Delta International
- [New Omron Smart Camera Enables Powerful Machine Vision](https://aei.dempa.net/archives/16568) - Industry-leading automation solutions provider Omron Automation Americas announces the launch of the F440 Smart Camera. Specifically, the smart camera is an innovative solution designed to add flexibility to machine vision applications. It empowers companies to embed a fully self-contained vision system within machines, providing ease of use while improving performance. There is a growing demand
- [Toray to Boost Polypropylene Film Production](https://aei.dempa.net/archives/16465) - Japan-based Toray Industries, Inc., has decided to increase anew production capacity for Torayfan® biaxially oriented polypropylene film at the Tsuchiura Plant in Ibaraki Prefecture. The move is part of ongoing efforts to meet growing demand for automotive capacitor film in an expanding market for electrified vehicles. Accordingly, when they go online in 2025, the upgraded
- [Japan Industrial Robotics Market to Grow 45.5% from 2022-27](https://aei.dempa.net/archives/16486) - The Japan industrial robotics industry is poised to grow 45.5% CAGR from 2022 to 2027. This figure was based on the market research by MarketsandMarkets titled Japan Industrial Robotics Market by Type (Traditional, Collaborative Robots), Component, Payload, Application (Handling, Processing), Industry (Automotive, Food & Beverages) and Region (North America, Europe, APAC, RoW) - Global Forecast
- [imec, AT&S Zero in on Advanced IC Packaging](https://aei.dempa.net/archives/16404) - The advanced semiconductor packaging approach of imec and AT&S enables low-loss, low-cost and mass-manufacturable PCB, enabling next-gen D-Band applications.
- [USI Builds up Powertrain Systems Manufacturing for EV](https://aei.dempa.net/archives/16498) - USI, a leading global electronics manufacturing services provider, is expanding its expertise and capabilities in the electric vehicle (EV) industry. With the growing demand for EVs worldwide, USI is committed to integrating the production of powertrain systems, a critical component in the EV industry. The International Energy Agency (IEA) released a report in April 2023
- [FANUC Releases New Models of ROBOSHOT α-SiB Series](https://aei.dempa.net/archives/16510) - Leading robot manufacturer, FANUC Corporation has released new models in its ROBOSHOT α-SiB robot Series. Specifically, these models are α-S30iB, α-S250iB, α-S300iB, and α-S450iB. The α-S30iB has a clamping force (CF) of 300kN; α-S250iB has CF 2500kN; α-S300iB has CF 3000kN; and α-S450iB has CF 4500kN. Moreover, all new models adopt a 21.5-inch-wide display. Especially
- [Mitsubishi Electric Boosts FA Systems, Adds New Plant](https://aei.dempa.net/archives/16526) - Mitsubishi Electric has poured an additional ¥42.5 billion investment to further strengthen the manufacturing capacity of FA control-system products.
- [Intel, Germany Increase Wafer Fab Scope in Magdeburg](https://aei.dempa.net/archives/16506) - The investment of more than 30 billion euros in Germany is a major expansion of Intel’s manufacturing capacity in Europe.
- [Vitesco Technologies, ROHM Agree on SiC Supply Deal](https://aei.dempa.net/archives/16491) - Vitesco Technologies and ROHM have inked an SiC supply partnership that will enable capacity assurance for energy-efficient SiC power semiconductors.
- [Intel Eyes New Assembly, Test Facility in Poland](https://aei.dempa.net/archives/16478) - Intel is investing near Wrocław, Poland, will help create a first-of-its-kind end-to-end leading-edge manufacturing semiconductor value chain in Europe.
- [Comau Launches Intelligent Bin Picking Solution](https://aei.dempa.net/archives/16453) - Comau introduces MI.RA/Picker, an intelligent advanced automation solution for perception-based random bin picking. Specifically, the fully automated picking solution uses two high-resolution laser sensors and a central camera to autonomously recognize, locate and grasp randomly placed objects at a rate of up to 40 pieces per minute (PPM). These features make it adaptable to any
- [ABB, China Telecom Unveil New IIoT Lab](https://aei.dempa.net/archives/16437) - ABB and China Telecom will explore the extensive integration of process automation solutions with digital transformation tools.
- [Henkel Breaks Ground on New Adhesive Manufacturing Facility in China](https://aei.dempa.net/archives/16434) - Henkel has broken ground on a new manufacturing facility of its Adhesive Technologies business unit within the Yantai Chemical Industry Park in Shandong Province, China. In particular, the company has invested approximately RMB 870 million (US$122 million) for the new plant. Titled with the Chinese name ‘Kunpeng’, the new plant will enhance Henkel's production capacity
- [TI Eyes Two New Factories in Malaysia](https://aei.dempa.net/archives/16428) - Texas Instruments' investments in assembly and test operations further extend the company's cost advantage and provide greater control of supply chain.
- [Delta, NTU Put up New Advanced Robotics Lab in Singapore](https://aei.dempa.net/archives/16366) - Nanyang Technological University (NTU Singapore) and Delta Electronics Co., Ltd. have established the S$24 million Delta-NTU Corporate Lab for Advanced Robotics in Singapore. This partnership is a continuation of their close collaboration in research & development for advanced technologies. The new lab is supported by Singapore National Research Foundation’s Research Innovation and Enterprise (RIE) 2025
- [Siemens Reinforces Xcelerator, Digital Twin Solutions](https://aei.dempa.net/archives/16382) - Siemens' integrated solutions provide customers with real-time visibility into global component availability, demand, cost and compliance data.
- [FormFactor Launches New Panel Metrology and Inspection System](https://aei.dempa.net/archives/16408) - FormFactor, Inc. has introduced the FRT MicroProf® PT, a new semiconductor metrology and inspection tool for rectangular panels up to 600mm. Specifically, these contain 4 to 5X more dies compared to a 300mm wafer. With full automation and hybrid metrology capabilities, a single system can perform multiple types of 3D measurements and defect detection on
- [Epson Expands Lineup of IMU Platform](https://aei.dempa.net/archives/16417) - Seiko Epson Corporation has expanded its inertial measurement unit1 (IMU) lineup with the development of the M-G370PDG (M-G370G), an IMU equipped with a high-performance, six degrees of freedom sensor. The M-G370G will enter volume production in July 2023. First launched in 2011, Epson's IMUs have been used in an array of customer applications. Particularly, from
- [Mitsubishi's New IC Modules Power Industrial Tools](https://aei.dempa.net/archives/16375) - Mitsubishi Electric's NX-type Full-SiC power semiconductor modules will contribute to more efficient, smaller, and lighter industrial equipment.
- [Nidec, Renesas Partner on Next-Gen E-Axle for EVs](https://aei.dempa.net/archives/16346) - Nidec Corporation and Renesas Electronics Corporation have agreed to join forces on the development of semiconductor solutions for a next-generation E-Axle (X-in-1 system). Specifically, the new solution integrates EV drive motor and power electronics for electric vehicles (EVs). Today’s EVs are increasingly adopting the 3-in-1 unit called E-Axle, which integrates a motor, inverter, and gearbox
- [Toyochem Develops Highly Flexible EMI Shielding Films](https://aei.dempa.net/archives/16325) - Toyochem Co., Ltd. of the Toyo Ink Group has rolled out the new LIOTELAN™ line of highly flexible conductive and insulating sheet films. Mainly, the new sheet films are highly flexible with a high elongation of 500 percent. These films, which also exhibit high water resistance, are designed for the protection of electrical and electronic
- [New Technology by Tokyo Electron to Enable Ultra-Fast Etching](https://aei.dempa.net/archives/16308) - Tokyo Electron Limited announced a breakthrough development of an innovative etch technology by its team at Tokyo Electron Miyagi. Specifically, the innovative technology is capable of producing memory channel holes in advanced 3D NAND devices with a stack of over 400 layers. Tokyo Electron Miyagi is the development and manufacturing site for Tokyo Electron’s plasma
- [Honeywell Actuators Advance Li-Ion Battery Production](https://aei.dempa.net/archives/16339) - Honeywell’s actuators deliver unprecedented automation and quality control in the coating and extrusion process, integrating seamlessly into existing lines.
- [Siemens' Power Automation Platform Brings Scalability](https://aei.dempa.net/archives/16320) - Siemens' SICAM 8 delivers a universal automation platform for all applications in the field of power supply and forms part of Siemens Xcelerator portfolio.
- [DNP’s New Line Boosts Capacity for Coating Devices](https://aei.dempa.net/archives/16362) - Dai Nippon Printing has significantly increased the production capabilities of its Mihara facility in Hiroshima, Japan.
- [Azbil Gears up for New Factory in Thailand](https://aei.dempa.net/archives/16331) - Azbil Corporation said the recently announced plan to construct a new facility in Thailand will expand and strengthen its global production system. Moreover, the planned Azbil Production (Thailand) Co., Ltd. in Thailand's Chonburi will also reinforce its business prowess overseas. Over the past 10 years since its founding in 2013, Azbil Production (Thailand) has worked
- [SK Signet Opens New EV Charger Production Site](https://aei.dempa.net/archives/16298) - SK Signet opened an EV charger manufacturing facility in Plano in Texas that will expand U.S.-based manufacturing and R&D for EV charging equipment.
- [Toyota to Boost EV Battery Clout, Eyes New Lab](https://aei.dempa.net/archives/16292) - Opening in 2025, Toyota's new R&D lab will aid in development of EV batteries and support Toyota manufacturing plants in North Carolina and Kentucky.
- [Macnica’s New Solution Boosts Predictive Maintenance](https://aei.dempa.net/archives/16286) - Macnica's portfolio enables manufacturers to reduce downtime and optimize maintenance costs for customers in the manufacturing industry.
- [ABB Robotics Opens Latest Packaging, Logistics Headquarters in U.S.](https://aei.dempa.net/archives/16277) - ABB officially opened its new Robotics Packaging and Logistics Headquarters, located north of Atlanta in Alpharetta, Georgia. The new facility will serve as ABB‘s dedicated center for robotic automation solutions in the logistics and packaging industries. “We are delighted to open our new Robotics Packaging and Logistics Headquarters in Greater Atlanta, home to some of
- [Micron to Soar US Investments to US$250B Amid AI Surge](https://aei.dempa.net/archives/35333) - Micron raises U.S. investment plans to $250 billion and advances New York fab construction to meet growing AI memory demand.
- [Sumitomo, Samsung Electro-Mechanics to Form New JV for Chip Materials](https://aei.dempa.net/archives/35325) - Sumitomo Chemical and Samsung Electro-Mechanics form a joint venture to develop glass core substrates for advanced semiconductor packaging.
- [Micron Expands Automotive Push with New Ford Deal](https://aei.dempa.net/archives/35322) - Micron has signed a supply memory agreement with Ford and support next-generation vehicle production.
- [APEM, Alps Alpine Expand HMI Alliance in Europe](https://aei.dempa.net/archives/35318) - APEM and Alps Alpine Europe expand their partnership to deliver integrated industrial HMI solutions for automation and mobility markets.
- [Infineon to Boost Chip Capacity With New Power Fab](https://aei.dempa.net/archives/35311) - Infineon opens its €5 billion Dresden Smart Power Fab, expanding semiconductor capacity, creating jobs, and supporting AI and energy markets.
- [Micron, GM Lock in Memory Supply in New Strategic Deal](https://aei.dempa.net/archives/35303) - Micron and GM sign a strategic agreement to secure long-term memory and storage supply for future vehicle production.
- [Kyocera Expands Chip Supply Capacity With New Plant](https://aei.dempa.net/archives/35299) - Kyocera opens its Nagasaki Isahaya Plant, expanding production capacity for fine ceramics and semiconductor packages.
- [SEMI: AI Boom to Fuel Memory Fab Spending Past US$50B](https://aei.dempa.net/archives/35296) - AI demand pushes memory fab equipment spending above $50B in 2026, with strong growth expected across DRAM and NAND segments.
- [Applied Materials to Soar AI Chips with New Systems](https://aei.dempa.net/archives/35291) - Applied Materials launches new chipmaking systems to advance 3D architectures and boost AI chip performance, efficiency, and production.
- [IBM Unveils Breakthrough 0.7nm Chip Tech](https://aei.dempa.net/archives/35285) - IBM unveils 0.7nm chip with nanostack architecture, boosting performance and efficiency for AI and next-generation computing.
- [ST to Boost Edge AI With New LiDAR Solution](https://aei.dempa.net/archives/35280) - STMicroelectronics launches VL53L9 LiDAR module, enabling high-resolution 3D sensing for edge AI across robotics, automation, and smart applications.
- [SK hynix to Power AI Growth With Advance HBM4E](https://aei.dempa.net/archives/35276) - SK hynix begins shipping HBM4E, boosting AI performance, efficiency, and scalability for data centers and high-performance computing.
- [Adani, Jabil Target AI Hardware Demand Surge](https://aei.dempa.net/archives/35270) - Jabil and ADANI target GW-scale AI Rack and advanced infrastructure manufacturing for global data center build outs, anchoring India as a premier hub.
- [Fuji’s New CLT-FG Machine Boosts Flexible Production](https://aei.dempa.net/archives/35266) - Fuji Corporation has launched the CLT-FG, a new all-in-one SMT placement machine engineered to meet evolving production demands. Designed with a compact footprint and broad functionality, the system targets manufacturers seeking flexible solutions for increasingly complex assembly environments. The CLT-FG integrates a one-meter-wide machine body with advanced placement technology, enabling manufacturers to manage diverse production
- [Delta Electronics to Accelerate Data Center Buildouts](https://aei.dempa.net/archives/35225) - At the recent COMPUTEX 2026, Delta has introduced faster, energy-efficient AI data center strategies using 800VDC, liquid cooling, and modular infrastructure.
- [Breakthrough Brings 2D Transistors to 300mm Wafers](https://aei.dempa.net/archives/35261) - ASML, TSMC, and imec unveil scalable 300mm integration for 2D transistors, advancing lab-to-fab transition and next-generation chip performance.
- [Tower, IQE Sign InP Deal to Power AI Growth](https://aei.dempa.net/archives/35255) - IQE and Tower have signed a multi-year InP wafer deal to support optical connectivity solutions in AI-driven data center infrastructure.
- [India Targets to Grow from Chip Equipment Boom](https://aei.dempa.net/archives/35247) - Record semiconductor equipment spending highlights AI-led growth, with India set to gain from global supply chain expansion.
- [Applied Materials to Grow AI Chip Grit in Singapore](https://aei.dempa.net/archives/35243) - Applied Materials expands Singapore manufacturing to support AI chip demand with new capacity, R&D integration, and advanced automation.
- [Infineon, Siemens Drive Data Center Reliability With SiC](https://aei.dempa.net/archives/35238) - Infineon and Siemens advance semiconductor circuit breaker technology to improve electrical protection and reliability in AI data centers and industrial systems.
- [Teradyne, TEL Power AI Chip Testing with New System](https://aei.dempa.net/archives/35232) - Teradyne and Tokyo Electron launch integrated test solution for AI and data center devices, improving chip quality and manufacturing yield.
- [NXP Unveils Bold ‘Physical AI’ Vision at COMPUTEX](https://aei.dempa.net/archives/35217) - NXP President and CEO Rafael Sotomayor outlines physical AI future, edge intelligence strategy, and secure real time systems at COMPUTEX 2026 keynote in Taipei.
- [Intel Unveils Powerful AI Vision, New Silicon Push](https://aei.dempa.net/archives/35211) - Intel CEO Lip-Bu Tan outlines AI-first strategy, Xeon 6 Plus launch, hybrid inference, and ecosystem partnerships at COMPUTEX 2026 keynote.
- [Marvell Bets Big on Optical Connectivity in AI Era](https://aei.dempa.net/archives/35208) - Marvell Chairman and CEO Matt Murphy took the COMPUTEX 2026 keynote spotlight Tuesday and emphasized the future of artificial intelligence (AI) scaling is not just a battle of raw processor speeds or memory bandwidth but also of a massive connectivity challenge. In his keynote, Murphy detailed how Marvell has positioned itself as a “connectivity-first” semiconductor
- [Qualcomm Ignites Global AI Agent Hardware Revolution](https://aei.dempa.net/archives/35203) - Qualcomm CEO Cristiano Amon reveals Dragonfly data center brand and details a massive 6G distributed AI edge hardware upgrade cycle at Computex.
- [COMPUTEX 2026: Taiwan ODMs Power Global AI Shift](https://aei.dempa.net/archives/35185) - Taiwanese AI players shatter Q1 2026 expectations, fulfilling industry forecasts with massive infrastructure scaling and strategic market segmentation.
- [NVIDIA: AI Factories Ignite Global Compute Boom](https://aei.dempa.net/archives/35176) - NVIDIA CEO Jensen Huang unveils at GTC Taipei 2026 AI factories, agentic AI systems, and robotics platforms, signaling a shift in edge computing and industry automation.
- [THECA 2026: Asia’s Tech Leaders Set Sights on Thailand](https://aei.dempa.net/archives/35112) - THECA 2026 in Bangkok brings global electronics leaders together, highlighting Thailand’s rise as a key hub for supply chains and innovation.
- [Imec, EVG Push High Yield 200nm Hybrid Bonding](https://aei.dempa.net/archives/35171) - Imec and EVG demonstrate 200nm hybrid bonding with record accuracy, advancing 3D chip stacking for next-generation semiconductor architectures.
- [Applied to Boost EPIC Hub With SCREEN as New Partner](https://aei.dempa.net/archives/35164) - Applied Materials partners with SCREEN SPE to develop advanced semiconductor process for faster commercialization of next-generation chips.
- [Micron to Expand U.S. DRAM Output With New 1α Node](https://aei.dempa.net/archives/35155) - Micron begins 1α DRAM production in Virginia, expanding U.S. memory manufacturing to support critical industries and long-lifecycle applications.
- [AMD to Surge Taiwan’s AI Grit With New Investments](https://aei.dempa.net/archives/35135) - AMD commits over US$10 billion to Taiwan ecosystem to scale AI infrastructure and advance packaging for next-generation computing.
- [TDK to Boost Battery Business in New Linergy Deal](https://aei.dempa.net/archives/35131) - TDK acquires Linergy Power to strengthen battery supply and accelerate growth under its long-term transformation strategy.
- [Imec to Drive Quantum Scale With EUV Tech](https://aei.dempa.net/archives/35126) - imec demonstrates a quantum dot qubit device using High‑NA EUV lithography, marking a step toward scalable, reliable quantum computing.
- [Applied Materials and TSMC Bet Big on AI Scaling](https://aei.dempa.net/archives/35102) - Applied Materials and TSMC expand collaboration at the EPIC Center to accelerate AI semiconductor scaling from research through manufacturing.
- [NVIDIA, Corning to Power AI at Scale in U.S.](https://aei.dempa.net/archives/35099) - NVIDIA and Corning expand U.S. optical manufacturing to power next‑generation AI infrastructure and hyperscale data centers.
- [Avnet to Boost APAC Grip With New Singapore Facility](https://aei.dempa.net/archives/35094) - Avnet has opened a new integration facility in Singapore to boost Asia Pacific supply chain resilience, localization, as well as China-plus-one strategies.
- [SEMICON SEA Special: Players Chart Regional Growth, Resilience](https://aei.dempa.net/archives/35051) - SEMICON Southeast Asia 2026 highlights the critical role of regional collaboration as the chip global market expects to breach the US$1 trillion mark in 2030.
- [Delta Taps AI, Novel Tools to Advance Chip Packaging](https://aei.dempa.net/archives/35087) - Delta Electronics spotlights AI and integrated solutions to advance semiconductor packaging at SEMICON Southeast Asia 2026.
- [TANAKA Highlights Advance Chip Materials, Circular Economy](https://aei.dempa.net/archives/35081) - TANAKA highlights its semiconductor materials portfolio and one-stop recycling solutions to support sustainable semiconductor manufacturing.
- [ASMPT Shows AI-Ready Manufacturing Grit at SEMICON SEA](https://aei.dempa.net/archives/35065) - ASMPT showcased advanced packaging, intelligent SMT, and AI‑ready factory technologies at SEMICON Southeast Asia 2026 in Kuala Lumpur.
- [New esmo System Offers Reliable Changeover in IC Test](https://aei.dempa.net/archives/35062) - esmo group launches X-change Cart for single-operator load board handling for faster, safer, and easier changeovers engineered for high-mix semiconductor test environments.
- [ULVAC Adds Japan Line for Rare‑Earth Magnet Furnaces](https://aei.dempa.net/archives/35045) - With orders expected to triple this year, ULVAC has established a production for rare-earth magnet vacuum melting furnaces in Japan.
- [Strong Margins Push IMI to Profit in 2025](https://aei.dempa.net/archives/35016) - Philippines' Integrated Micro‑Electronics, Inc. (IMI) posts 2025 profit as margins expand and restructuring strengthens cash flow and balance sheet.
- [IMI to Chart 2026 Growth with Strategic Expansion](https://aei.dempa.net/archives/35025) - Following its return to profitability in 2025, Philippines' IMI is now sharpening its 2026 strategy around mobility, power, and connectivity.
- [Foxconn, Mitsubishi Eye New Tie-up on Automotive Tools](https://aei.dempa.net/archives/35031) - Hon Hai Precision (Foxconn) and Mitsubishi Electric have agreed to explore and broaden its strategic cooperation on automotive equipment businesses.
- [New Intel, FPT Deal to Advance AI in Smart Factories](https://aei.dempa.net/archives/35020) - The collaboration brings together Intel’s advanced factory technologies with FPT’s manufacturing platforms for an AI-driven autonomous factory operations.
- [Motion Control Redefines Yield in Advanced Packaging](https://aei.dempa.net/archives/34994) - Aerotech’s Justin Bressi discusses how system-level motion design is solving the nanometer-scale bottlenecks in advanced packaging and hybrid bonding.
- [India Executes Semiconductor Policy Into Full‑Stack Growth](https://aei.dempa.net/archives/34841) - India’s semiconductor push is shifting from policy formulation to execution, as the country builds a full stack ecosystem
- [India Braces for US$400B Electronics Peak by 2030](https://aei.dempa.net/archives/34929) - IESA reports India’s electronics market will hit $400B by 2030, fueling a $100B semiconductor surge.
- [How Atomic Precision Is Changing Chip Manufacturing](https://aei.dempa.net/archives/34878) - Applied Angstrom Technology founder Dr. Richard Yang explains how AI-native atomic‑layer etching is redefining chip manufacturing in the angstrom era.
- [India’s Quantum Leap: Scaling Hardware, Securing Sovereignty](https://aei.dempa.net/archives/34970) - Dr. Ajai Chowdhry outlines India's quantum roadmap, targeting a 1,000-qubit computer and a quantum-secure digital economy by 2030.
- [OMRON, Dassault Bridge Virtual and Real Worlds](https://aei.dempa.net/archives/35003) - OMRON and Dassault Systemes have agreed to partner to unify IT and OT with virtual twins to streamline manufacturing.
- [TSMC Reveals New A13, A12 Process Tech as AI Chips](https://aei.dempa.net/archives/34986) - TSMC's A13 and A12 process chips will push density scaling and energy efficiency to new heights and address industry’s most demanding applications.
- [ROHM's New SiC MOSFETs to xEVs, AI Servers](https://aei.dempa.net/archives/34982) - ROHM Semiconductor has developed the 5th Generation SiC MOSFETs, the latest device of its EcoSiC™ series optimized for high‑efficiency power applications. This technology is ideally suitable for automotive electric powertrain systems – such as traction inverters for electric vehicles (xEVs) – as well as power supplies for AI servers and industrial equipment such as data centers. Rising
- [DEEPX, Hyundai to Build Physical AI Compute for Robots](https://aei.dempa.net/archives/34976) - DEEPX and Hyundai have agreed to collaborate and build a next‑generation Physical AI computing platform for advanced robotics.
- [Tokyo Electron Launches New Prexa SDP Device Prober](https://aei.dempa.net/archives/34962) - Tokyo Electron's new Prexa SDP enables high‑precision testing of singulated devices for advanced semiconductor packaging.
- [NVIDIA Launches Open AI Models for Quantum Computing](https://aei.dempa.net/archives/34958) - NVIDIA introduces Ising, open AI models that significantly accelerate quantum processor calibration and error correction for scalable, useful quantum systems.
- [Rapidus to Boost 2nm Grit With New Chiplet Expansion](https://aei.dempa.net/archives/34954) - Rapidus advances toward 2nm mass production with new analysis and chiplet facilities in Japan.
- [Applied Unveils New Chipmaking Tools for Angstrom-Era](https://aei.dempa.net/archives/34951) - Applied Materials launches new PECVD and ALD deposition systems designed to support 2nm-class GAA scaling in the angstrom era.
- [Global Chip Sales Surge Into 2026 on Record Momentum](https://aei.dempa.net/archives/34940) - Latest report by WSTS points global semiconductor sales surge in early 2026 gears toward the industry’s US$1 trillion forecast.
- [TDK, Nippon Chemical Launch JV to Soar MLCC Innovation](https://aei.dempa.net/archives/34926) - TDK and Nippon Chemical Industrial establish a joint venture to accelerate R&D for MLCC ceramic materials and manufacturing.
- [NVIDIA Expands AI Infrastructure With Marvell Alliance](https://aei.dempa.net/archives/34917) - NVIDIA and Marvell deepen AI infrastructure collaboration through NVLink Fusion and silicon photonics.
- [AEM, ASE to Spur New Phase in AI, HPC Test](https://aei.dempa.net/archives/34910) - AEM and ASE partner to advance AI and HPC semiconductor test solutions at global manufacturing scale.
- [Infineon’s New Module to Redefine AI Power Density](https://aei.dempa.net/archives/34907) - Infineon launches industry‑first TLVR quad‑phase power module enabling higher power density for next‑generation AI data centers.
- [LG Innotek to Accelerate Physical AI with New Alliance](https://aei.dempa.net/archives/34872) - LG Innotek and Applied Intuition partner to advance Physical AI through integrated sensing hardware and autonomous simulation software.
- [ADI Expands Thailand Plant to Boost Supply Chain](https://aei.dempa.net/archives/34858) - Analog Devices scales its Thailand facility to enhance global semiconductor manufacturing resilience, sustainability, and advanced backend testing.
- [Arm Launches AGI CPU: A Bold Pivot to AI Silicon](https://aei.dempa.net/archives/34849) - Arm is no longer just the architect as it enters the silicon market with the AGI CPU, a 3nm chip designed to solve data center bottlenecks for Agentic AI.
- [ST Expands IoT Lead: Begins MCU Production in China](https://aei.dempa.net/archives/34837) - STMicroelectronics begins volume production of STM32 MCUs in China to improve supply chain resilience and support regional IoT growth.
- [Applied Angstrom’s New Atomic Precision Hub Targets AI Chips](https://aei.dempa.net/archives/34824) - Applied Angstrom Technology opens its atomic precision hub in Singapore, signaling a shift toward AI‑native, angstrom‑scale chip equipment for next‑generation logic and memory.
- [Fasford to Unveil New Die Bonder at SEMICON China](https://aei.dempa.net/archives/34833) - Fasford Technology, a subsidiary of Fuji Corporation, has announced the world premiere of XERDIA, its next-generation flagship die bonder. Scheduled for its global debut at SEMICON CHINA 2026 in Shanghai from March 25 to March 27, XERDIA represents a significant leap in semiconductor backend manufacturing technology. Addressing Advanced Packaging Needs As semiconductor devices evolve toward
- [Hirose to Open New Automotive Connector Line in India](https://aei.dempa.net/archives/34827) - Hirose builds its first automotive connector manufacturing plant in India in a bid to strengthen its grip in the Indian market.
- [NVIDIA, Partners to Take Physical AI to Real World](https://aei.dempa.net/archives/34819) - NVIDIA partners with ecosystem partners to scale Physical AI with Cosmos world models and Isaac GR00T framework for intelligent robotics.
- [ST, Leopard Imaging to Soar Robot Vision with NVIDIA](https://aei.dempa.net/archives/34809) - STMicroelectronics and Leopard Imaging launch an NVIDIA Jetson‑ready multimodal vision module combining 2D imaging, 3D depth sensing, and motion perception to accelerate humanoid robotics and physical AI development.
- [NXP, NVIDIA Unveil Physical AI for Humanoid Robotics](https://aei.dempa.net/archives/34814) - NXP partners with NVIDIA to launch Physical AI and humanoid robotics solutions featuring i.MX processors and NVIDIA Holoscan Sensor Bridge.
- [NVIDIA Charts Agentic AI Era With New Vera Rubin](https://aei.dempa.net/archives/34806) - NVIDIA unveils Vera Rubin 3nm architecture at GTC 2026, charting a US$1 trillion roadmap for autonomous robotics and computing.
- [New Thai Plant to Soar Lelon’s Capacity Grit](https://aei.dempa.net/archives/34788) - Lelon Electronics has opened its new Thailand facility in a bid to boost production of capacitors for automotive and AI applications.
- [Micron to Surge Taiwan DRAM Grip, Closes PSMC Fab Deal](https://aei.dempa.net/archives/34795) - Micron has completed its acquisition of PSMC’s P5 fab in Taiwan, expanding DRAM and HBM capacity to support growing AI driven demand.
- [Epson, Taiwan’s Manz to Use Inkjet Tech in Chipmaking](https://aei.dempa.net/archives/34781) - Seiko Epson and Manz Taiwan have agreed to partner to accelerate the adoption of inkjet technology in semiconductor manufacturing.
- [IBM, Lam Research Eye Sub-1nm Era in New Collaboration](https://aei.dempa.net/archives/34765) - IBM and Lam Research will partner on advanced deposition and etch solutions to overcome the physical limits of sub-1nm logic sharing.
- [Applied Materials Taps Micron, SK Hynix as New R&D Partners](https://aei.dempa.net/archives/34775) - Applied Materials has partnered with Micron and SK Hynix for its US$5 billion EPIC Center to accelerate next-gen HBM and DRAM innovation.
- [Lelon Electronics Opens New Thai Manufacturing Line](https://aei.dempa.net/archives/34759) - Lelon Electronics has opened its new Thailand facility in a bid to boost production of capacitors for automotive and AI applications.
- [ABB to Surge Grit in India With New US$75M R&D Funding](https://aei.dempa.net/archives/34751) - ABB will expand further its manufacturing and R&D footprint in India, pouring US$75 million more this year.
- [TI, NVIDIA Partner on Humanoid Safety With Real-Time Sensor](https://aei.dempa.net/archives/34742) - TI and NVIDIA announce a new 3D perception solution for humanoid robots, integrating IWR6243 mmWave radar with Jetson Thor for enhanced safety.
- [Fuji to Soar Chip Placement Tech as New SATAS Member](https://aei.dempa.net/archives/34738) - As a new member of SATAS, Fuji will contribute to advance automation and standardization in semiconductor backend manufacturing through R&D.
- [Ushio Closes Latest Deal on ams OSRAM’s Lamp Unit](https://aei.dempa.net/archives/34733) - Ushio Inc. completes acquisition of OSRAM ENI, launching Ushio Industry & Entertainment for global lighting solutions.
- [Altera to Surge FPGA-Based AI for Robotics, Edge](https://aei.dempa.net/archives/34724) - Pure-play FPGA solutions provider Altera has introduced its Agilex FPGAs to meet the real-time demands of physical AI systems.
- [Rapidus to Soar 2nm Chips in 2027 in New Funding Round](https://aei.dempa.net/archives/34697) - The latest public and private funding round means Rapidus is steadily progressing from the current R&D to mass production of 2nm logic in 2027.
- [Tanaka’s New Transfer Tech to Boost Chip Performance](https://aei.dempa.net/archives/34717) - TANAKA’s transfer technology will boost chip performance through enhanced miniaturization of wiring and greater integration for various types of chips.
- [ROHM Partners With India's Suchi to Boost Chip Grit](https://aei.dempa.net/archives/34709) - ROHM Co., Ltd. and Suchi Semicon Pvt. Ltd. have agreed to form a strategic semiconductor manufacturing partnership in India, with ROHM considering to outsource back-end processes for power devices and IC products to Suchi Semicon. This collaboration reflects a shared commitment to strengthening semiconductor manufacturing capabilities in India while supporting the requirements of both domestic
- [Micron Inaugurates India’s First OSAT Line](https://aei.dempa.net/archives/34700) - Micron's US$2.75 billion OSAT facility in Sanand, a first in India, positions the country as a major global player in backend chip manufacturing.
- [ROHM-TSMC GaN Tech Deal: Securing Supply for AI, EV](https://aei.dempa.net/archives/34692) - With TSMC as a partner, ROHM will have an end-to-end production system for GaN power devices within the ROHM Group
- [Tower Semiconductor, Salience Labs to Advance Optical Circuit Switch Production](https://aei.dempa.net/archives/34689) - Tower Semiconductor and Salience Labs will produce photonic integrated circuit-based optical circuit switchers to enhance AI datacenter infrastructure.
- [New IP Cores to Lift Automotive, Industrial Connectivity](https://aei.dempa.net/archives/34682) - Fraunhofer IPMS and Korean TSN Lab are developing a next-generation 10Base-T1s IP cores for automotive and industrial communications.
- [HCL, Foxconn Break Ground of New OSAT Line in India](https://aei.dempa.net/archives/34678) - Indian Prime Minister Narendra Modi led the groundbreaking ceremony of the joint OSAT facility of HCL Group and Hon Hai Technology Group (Foxconn).
- [Delta Electronics to Help Philippines’ Cebu Soar in EV](https://aei.dempa.net/archives/34673) - Taiwanese power management and smart green solutions provider Delta Electronics said Monday that it will help spur advanced electric vehicle (EV) charging infrastructure across central Philippine province of Cebu. The company has already partnered Danao City government in its Driving Sustainable Transport: Exploration for Danao City EV Charging Station initiative. The program aims to support
- [Japan’s METI Approves GS Yuasa’s Li-Ion Battery Line](https://aei.dempa.net/archives/34669) - Japan's METI has approved the plan of GS Yuasa to build a stationary lithium-ion battery plant to support Japan's goal of building a power grid.
- [Tower, Scintil Offer First DWDM Lasers for AI](https://aei.dempa.net/archives/34666) - Combined with Tower’s multi-site global footprint, Scintil’s unique SHIP platform is ready to take on the challenging requirements of the next generation Hyperscale AI Infrastructure.
- [Microchip, Hyundai Partner on Advanced in-Vehicle Tech](https://aei.dempa.net/archives/34661) - Microchip and Hyundai Motor Group aim to promote advanced in-vehicle network technologies, such as 10BASE-T1S, leveraging each company’s strengths.
- [New Keysight Tools Meet Challenges of AI Data Centers](https://aei.dempa.net/archives/34655) - Keysight's new validation solutions enable data center operators to overcome bandwidth, latency, and interoperability challenges in AI infrastructure.
- [EV’s New System to Meet Needs of High Mix Production](https://aei.dempa.net/archives/34652) - EV Group's EVG120 platform adds in-situ resist thickness metrology, wafer edge exposure and performance in a smaller-scale, highly flexible format.
- [GF, Renesas New Deal to Boost to U.S. Chip Supply](https://aei.dempa.net/archives/34646) - GF and Renesas expand a multibillion-dollar partnership, broadening access to GF technologies to strengthen secure global semiconductor supply chains.
- [Qualcomm to Soar India’s AI Startups with New Funding](https://aei.dempa.net/archives/34642) - Qualcomm has announced its plans to invest up to US$150 million in strategic AI venture fund in India.
- [AMD, TCS to Soar AI in India With Helios Architecture](https://aei.dempa.net/archives/34638) - AMD and TCS will enable enterprises across India to gain access to a new 200MW deployment of the AMD Helios rack-scale AI architecture.
- [Yokogawa, ANYbotics to Automate Plant Inspections](https://aei.dempa.net/archives/34632) - Yokogawa and ANYbotics will integrate their respective platforms for a fully-integrated solution that will improve safety and reduce downtime in factories.
- [Samsung Stirs Grit in AI Race With First HBM4 Chips](https://aei.dempa.net/archives/34629) - Samsung commences mass production for HBM4, the industry-first commercial HBM4 with ultimate performance for AI computing era.
- [Samsung Joins Applied’s EPIC Center, to Soar Chip R&D](https://aei.dempa.net/archives/34622) - With Samsung, Applied Materials’ EPIC Center will boost joint R&D programs to accelerate advanced node scaling, future memory architectures, and 3D integration.
- [ST, AWS Seal New Deal on Cloud, AI Data Center Chips](https://aei.dempa.net/archives/34619) - STMicroelectronics has expanded its engagement with AWS to enable new high performance compute infrastructure for cloud and AI data centers.
- [SEMI: AI Surge Drives Si Wafer Shipments in 2025](https://aei.dempa.net/archives/34616) - SEMI said worldwide silicon wafer shipments in 2025 increased 5.8% to 12,973 MSI while wafer revenue slipped 1.2% to $11.4 billion.
- [Keysight's New Tool Allows AI at Scale in Chip Design](https://aei.dempa.net/archives/34608) - Keysight enables enterprise-scale AI adoption in semiconductor design with SOS Enterprise.
- [Imec’s New NanoIC Line to Boost Sub-2nm SoC](https://aei.dempa.net/archives/34604) - imec has inaugurated its 2,000sq.m cleanroom expansion at its Leuven headquarters, which will play a key role in deploying Europe’s NanoIC pilot line.
- [Murata Completes New R&D Center in Japan's Fukui](https://aei.dempa.net/archives/34598) - Murata Manufacturing has completed the construction of another R&D facility in Fukui in Japan to reinforce its ceramic capacitors.
- [Siemens’ New Deal to Boost Grit in AI-Based Metrology](https://aei.dempa.net/archives/34595) - Siemens has acquired French startup Canopus AI to boost its chip design and manufacturing through AI-based metrology technologies.
- [TI to Soar Wireless Line in US$7.5 B Silicon Labs Deal](https://aei.dempa.net/archives/34589) - Texas Instruments is strengthening its embedded wireless solutions as it moved to acquire Silicon Labs for US$7.5 billion in an all-cash transaction.
- [NVIDIA, Dassault Systèmes New Deal to Soar AI](https://aei.dempa.net/archives/34584) - Dassault Systèmes and NVIDIA will collaborate in building industrial AI platform powering virtual twins and AI infrastructure deployable at scale.
- [Fuji Electric's New Investments to Soar Capacity Grit](https://aei.dempa.net/archives/34580) - Fuji Electric will boost investment at its Tsukuba Factory in Japan to expand its capacity for switchboards and power supplies.
- [EUV Tech to Expand Grit in Asia With New Singapore Office](https://aei.dempa.net/archives/34577) - American manufacturer of advanced extreme ultraviolet (EUV) metrology equipment EUV Tech (EUVT) has officially inaugurated its new office in Singapore. The expansion strengthens the company’s global footprint and enhances its ability to support its varied customers throughout Asia. Therefore, increasing proximity, improving collaboration, and expanding regional presence. The inauguration event took place at Mapletree Hi-Tech
- [ABB to Soar Innovation With New Automation Program](https://aei.dempa.net/archives/34574) - The Automation Extended program helps industries modernize control systems by building on ABB’s proven platforms and safeguarding existing investments.
- [Kioxia, Sandisk to Extend Yokkaichi JV Agreement](https://aei.dempa.net/archives/34569) - Kioxia and Sandisk have agreed to extend their joint venture agreements at Kioxia's Yokkaichi plant, extending through December 2034.
- [SK keyfoundry's New BCD Process to Soar AI Chip Market](https://aei.dempa.net/archives/34565) - SK keyfoundry has introduced its 4th Gen 200V high-voltage 0.18 micron BCD process, accelerating expansion into automotive and AI power chip markets.
- [FPT to Set up New Advanced Chip Line in Vietnam](https://aei.dempa.net/archives/34561) - FPT’s new chip testing and packaging facility aims to position Vietnam more prominently in the global semiconductor value chain.
- [Kyocera Tests Robots With Maxell’s High Tech Modules](https://aei.dempa.net/archives/34558) - Kyocera and Maxell have started running tests of industrial robots and controllers with power modules utilizing Maxell's solid-state batteries.
- [Micron to Boost Chip Supply Grit in New Singapore Line](https://aei.dempa.net/archives/34553) - Micron will pour US$24 billion for its new Singapore line as part of its global investments spree to meet chip demand amid rapid growth of AI applications.
- [Thailand’s 2025 Investment Pledges Reach All-Time High](https://aei.dempa.net/archives/34547) - Thailand BOI said applications for investment in 2025 soared 67% in value to US$60.23 billion, covering about 3,370 projects.
- [ASMPT SMT’s New SIPLACE V Sets Manufacturing Bar High](https://aei.dempa.net/archives/34536) - ASMPT SMT Solutions has introduced the SIPLACE V platform, its latest SMT placement system that features signifcant performance boost.
- [NHK Succeeds in Developing First Blue-Emitting OLED](https://aei.dempa.net/archives/34542) - NHK Science & Technology Research Laboratories (STRL), in collaboration with Professor Hirohiko Fukagawa of Chiba University’s Advanced Science Center and Professor Takuji Hatakeyama of Kyoto University’s Graduate School of Science, has successfully developed the world’s first organic LED display device capable of blue light emission while also generating power. The research was published in the
- [Sumitomo Bakelite to Buy Kyocera’s Chemical Business Spinoff](https://aei.dempa.net/archives/34528) - Japanese conglomerate Kyocera Corporation will spin off its chemical business into a newly established subsidiary, which will be sold in full to Japanese chemicals company Sumitomo Bakelite Co., Ltd. The transaction, through an absorption-type company split and a share transfer agreement, will approximately cost ¥30 billion, subject to final price adjustment based on the share
- [Jabil Boosts Chip Manufacturing in New Investments](https://aei.dempa.net/archives/34524) - Jabil will invest in EHT Semi to accelerate advanced RF and pulsed power solutions for next-generation chip manufacturing.
- [Micron to Soar Memory Grit With New U.S., Taiwan Fabs](https://aei.dempa.net/archives/34519) - Micron Technology, Inc. has made aggressive moves last week to in cementing its global expansion plans after it broke the ground its US$100 billion memory mega fab site in New York and sealed its intent to acquire Powerchip Semiconductor Manufacturing Corporation’s (PSMC) P5 fabrication site in Tongluo, Taiwan for US$1.8 billion. The New York fab,
- [Micron to Break Ground U.S.’ Biggest Chip Fab](https://aei.dempa.net/archives/34455) - Micron Technology, Inc. said it will officially break the ground of its new megafab in Onondaga County in New York on January 16. The company made the announcement after it has finalized the necessary regulatory permit approvals, marking the start of the construction of the US$100 billion project. The project, Micron said, is the largest
- [Sumitomo Bakelite's New Sheet for Power Modules](https://aei.dempa.net/archives/34510) - Sumitomo Bakelite Co., Ltd. has developed a heat-dissipating insulating sheet that combines industry-leading thermal conductivity with electrical insulation properties. Accordingly, the product enables the replacement of conventional ceramic substrates used in power modules. At the same time, it has been adopted as the insulating layer of resin-insulated substrates manufactured by NHK Spring Co., Ltd., which
- [TDK’s New Company to Empower AI Glasses](https://aei.dempa.net/archives/34503) - TDK Corporation has established TDK AIsight to address the intersection of physical AI (artificial intelligence) and generative AI, empowering AI glasses with intuitive and compelling user experiences. Building on TDK’s 90 years of innovations and venture spirit, TDK AIsight will focus on the development of custom chips, cameras, and AI algorithms enabling end-to-end system solutions,
- [FUJI to Soar Next-Gen Mounting in AI Era](https://aei.dempa.net/archives/34494) - FUJI Corporation has been in the forefront of developing equipment technology for mounting next-generation ultra-small electronic components. Recently, the company has succeeded in mounting *016008M (0.16×0.08mm) components on a board, an industry first, using its NXTR electronic component mounting robot. In recent years, the shift to "edge AI" has been accelerating. The industry is moving
- [TCS, AMD to Drive AI Adoption in New Alliance](https://aei.dempa.net/archives/34486) - AMD, Tata Consultancy have agreed to collaborate to help enterprise drive AI adoption at scale for a more secure and high performance digital workplaces.
- [Aerotech Expands Two-Axis Laser Scan Head Line](https://aei.dempa.net/archives/34481) - Aerotech has expanded its 2-Axis Laser Scan Head designed to suite a wide range of laser applications.
- [Yokogawa’s Omega Simulation Launches new Digital Twin](https://aei.dempa.net/archives/34475) - Omega Simulation Co., Ltd., a subsidiary of Yokogawa Electric Corporation, has revamped its OmegaLand plant operation simulation environment as the OmegaLand V4 dynamic digital twin platform. At the same time, it has also released the first version, V4.1. Development Background The plant operation environment has grown more complex in recent years due to intensified market
- [TVs to Use Less Power With Fuji’s New PFC Control IC](https://aei.dempa.net/archives/34460) - Fuji Electric's FA1C20N PFC control IC and FA6C60N LLC control ICs can enable TVs to achieve reduced power consumption even on standby mode.
- [Automotive, AI Grit to Keep Lelon’s Growth Afloat](https://aei.dempa.net/archives/34450) - Capacitors are among the essential electronics components that play critical role in the enablement of sophisticated technologies across various sectors. That said, Lelon Electronics Corporation expects to sustain its brisk outlook for 2026 and a possibility of a double-digit growth rate, primarily propelled by the use of artificial intelligence (AI) in various fields and the
- [Lenovo Charts Next Era of Hybrid Era at CES 2026](https://aei.dempa.net/archives/34442) - At CES 2026, computer and tech company Lenovo has introduced its series of innovations that will propel its vision for a Hybrid AI.
- [Samsung Shows Off AI Grit in CES 2026 First Look](https://aei.dempa.net/archives/34410) - Samsung Electronics kicked off Monday (Sunday evening in Las Vegas, United States) its CES 2026 campaign, two days ahead of the annual event, and announced next-generation AI-powered devices and experiences. TM Roh, CEO and Head of Samsung’s Device eXperience (DX) Division, unveiled its “Companion to AI Living” vision at The First Look CES 2026 event
- [AMD Eyes Yotta-Scale Compute to Enable AI Everywhere](https://aei.dempa.net/archives/34416) - At the opening keynote of CES 2026, AMD Chairman and CEO Dr. Lisa Su took CES 2026 keynote stage Monday night in Las Vegas, United States (Tuesday morning Japan time) and gave the company’s blueprint to enable AI Everywhere. Specifically, AMD plans on providing infrastructure that will focus on Yotta-scale computing to meet the demands
- [Tech Players Harness Power of AI at CES 2026](https://aei.dempa.net/archives/34422) - CES 2026 highlights the shift of AI from being a concept to actual real-world integration and how it will define the next era of human progress.
- [Hyundai Mobis, Qualcomm to Soar SDV, ADAS Tech](https://aei.dempa.net/archives/34431) - Hyundai Mobis and Qualcomm Technologies will co-develop next-generation solutions for SDV and ADAS.
- [SoftBank to Scale AI in New Digital Bridge Deal](https://aei.dempa.net/archives/34393) - SoftBank will acquire DigitalBridge for US$4 billion to expand its data center and connectivity capacity for AI at scale.
- [USI to Soar Data Center Grit, to Grow Vietnam Line](https://aei.dempa.net/archives/34390) - Chinese electronic design and manufacturing company USI will increase investments in Vietnam to grow its optical transceiver capacity.
- [ROHM, Tata to Boost Chip Business in New Alliance](https://aei.dempa.net/archives/34379) - ROHM and Tata Electronics have entered a strategic partnership for semiconductor manufacturing in India, expanding business opportunities for both companies.
- [onsemi-GF New Deal to Soar GaN Power Devices](https://aei.dempa.net/archives/34375) - The partnership with GlobalFoundries will expand onsemi’s power portfolio, including 650V lateral GaN solutions, for AI data centers and other markets.
- [Qualcomm to Soar Grit in AI as it Seals Alphawave Deal](https://aei.dempa.net/archives/34370) - AI growth is driving Qualcomm’s high-performance compute solutions and the Alphawave Semi buyout will boost their presence in the data center market.
- [Imec, ASRA Eye Standard Automotive Chiplet](https://aei.dempa.net/archives/34365) - imec has announced a strategic alignment initiative with Japan’s Advanced SoC Research for Automotive on standardization of automotive chiplet architectures.
- [SEMIFIVE to Soar in Japan With New Office, IC Designs](https://aei.dempa.net/archives/34362) - SEMIFIVE has established a subsidiary in Japan and has secured chip project design wins for AI and HPC, demonstrating its end-to-end expertise.
- [Kioxia Develops Core Tech for High Density 3D DRAM](https://aei.dempa.net/archives/34354) - Japanese memory solutions leader Kioxia Corporation has developed a highly stackable oxide-semiconductor channel transistors that will enable the practical implementation of high-density, low-power 3D DRAM. The company presented this technology at the IEEE International Electron Devices Meeting (IEDM) held in San Francisco, USA, on December 10, and has the potential to reduce power consumption across
- [Teradyne to Soar Robotics Grit With New U.S. Hub](https://aei.dempa.net/archives/34348) - Teradyne Robotics is grooming its new U.S. facility to become a regional hub and will manufacture Universal Robots' cobots, and potentially, MiR AMRs.
- [Siemens, GF to Make More Reliable Chips based on AI](https://aei.dempa.net/archives/34343) - Siemens and GlobalFoundries have partnered to deploy AI-driven manufacturing solutions that will strengthen global semiconductor supply.
- [ST to Boost Europe’s Chip Grit With €1B EIB Credit](https://aei.dempa.net/archives/34332) - STMicroelectronics’ €1 billion credit line granted by European Investment Bank aims to strengthen Europe’s semiconductor industry and support innovation.
- [DNP’s Latest Tech to Soar Advanced Logic ICs](https://aei.dempa.net/archives/34324) - DNP has developed a nanoimprint lithography (NIL) template with circuit line width of 10nm, enabling patterning for logic ICs equivalent to 1.4nm.
- [ASML, Imec to Open  New High NA EUV Lithography Lab](https://aei.dempa.net/archives/27953) - Opening of the joint ASML-imec High NA EUV Lithography Lab marks a milestone in preparing High NA EUV lithography for accelerated adoption in mass manufacturing.
- [Qualcomm to Surge AI CPUs in Data Center](https://aei.dempa.net/archives/33162) - Qualcomm President and CEO Cristiano Amon delivered Monday (May 19) its keynote at COMPUTEX 2025 in Taipei, Taiwan confirming reports the company will soon enter the data center market. The confirmation came minutes before he ended his keynote speech although Amon said more details will be announced soon. Nonetheless, he hinted Qualcomm has some “very
- [SK hynix begins mass production of EUV-based 10nm 8Gb LPDDR4 chips](https://aei.dempa.net/archives/740) - SK hynix started mass-production of 10nm-class 8Gb LPDDR4 mobile DRAM chips using its 4th generation of 10 nm circuitry technology called “1a” Dubbed as the chip maker’s first EUV photolithography technology-based DRAM chip, the LPDDR4 chip are to be shipped to mobile phone makers starting from sometime in the second half. A short for extreme
- [SK hynix Steps up 10nm DRAM with New 1c DDR5](https://aei.dempa.net/archives/30397) - SK hynix Inc. has developed the industry's first 16Gb DDR5 built using its 1c node, the sixth generation of the 10nm process. Primarily, this marks the beginning of the extreme scaling to the level closer to 10nm in the memory process technology. Generally, the degree of difficulty in advancing the shrinking process of the 10nm-range
- [UMC to Surge Si Photonics Grit by Licensing imec Tech](https://aei.dempa.net/archives/34321) - UMC has licensed imec’s silicon photonics technology to accelerate 12-inch silicon photonics platform and propel next-generation connectivity.
- [Rigaku's New Machine to Surge Advanced Chips](https://aei.dempa.net/archives/34316) - Rigaku Corporation, a Japanese X-ray analytical systems company and a subsidiary of Rigaku Holdings Corporation, has introduced the XTRAIA MF-3400, an instrument used in semiconductor manufacturing processes to measure the thickness and composition of wafers. The XTRAIA MF-3400 will significantly enhance productivity in the rapidly growing semiconductor market by enabling high-accuracy evaluation of materials essential
- [AI to Surge Global Chip Market to Strong Growth](https://aei.dempa.net/archives/34309) - The World Semiconductor Trade Statistics raised its 2025 growth outlook for the global semiconductor market, which will carry over through 2026.
- [Toray Develops Bonding Material for Ultra-Thin Wafers](https://aei.dempa.net/archives/34304) - Toray has developed a semiconductor back-end process material that is essential for manufacturing semiconductor wafers 30 micrometers or less in thickness.
- [OKI’s Innovative System to Surge DX in SE Asia Plants](https://aei.dempa.net/archives/34293) - OKI is expanding the reach of its Projection Assembly System to to manufacturing site operations globally, starting in Thailand and Indonesia.
- [Foxconn, OpenAI to Soar U.S. Grit in AI](https://aei.dempa.net/archives/34289) - Foxconn and OpenAI have partnered to strengthen the United States’ manufacturing capability and grit across AI supply chain.
- [ABLIC Unveils New PMIC for Automotive Cameras](https://aei.dempa.net/archives/34285) - ABLIC has introduced its latest PMIC for automotive camera module which supports 16V input and three power output channels.
- [ROHM Latest Deal to Pave Way for Better Cars](https://aei.dempa.net/archives/27627) - ROHM and China’s SoC manufacturer Nanjing SemiDrive Technology Ltd. have jointly developed a smart cockpit reference design for smarter vehicles.
- [SK keyfoundry Launches New Gen4 0.18µm BCD Process](https://aei.dempa.net/archives/30881) - SK keyfoundry, an 8-inch pure-play foundry in Korea, launches its fourth-generation (Gen4) 0.18µm BCD process. Primarily, this new process delivers approximately 20% performance improvement over the previous third-generation (Gen3). With this latest addition, SK keyfoundry provides solutions for improved mobile and automotive power semiconductor performance. Particularly, SK keyfoundry's Gen4 0.18µm BCD process offers power devices
- [Latest Tech from Renesas, Nidec to Make Better EVs](https://aei.dempa.net/archives/32206) - Renesas has announced the world's first “8-in-1” proof of concept* (PoC) for E-Axle systems for EVs in collaboration with Nidec.
- [Renesas Offers New Full Memory Chipset for AI, HPC](https://aei.dempa.net/archives/32404) - Renesas Electronics Corporation has delivered the industry’s first complete memory interface chipset solutions for the second-generation DDR5 Multi-Capacity Rank Dual In-Line Memory Modules (MRDIMMs). Mainly, the new DDR5 MRDIMMs are needed to keep pace with the ever-increasing memory bandwidth demands of artificial intelligence (AI), high-performance compute (HPC) and other data center applications. Particularly, they deliver
- [Vietnam to Soar High in Global Chip Supply Chain](https://aei.dempa.net/archives/34279) - With its strategic semiconductor roadmap, Vietnam stays on track on its vision of becoming a crucial player in the global semiconductor manufacturing industry.
- [GF, Navitas to Soar U.S. GaN Tech in New Collaboration](https://aei.dempa.net/archives/34276) - GlobalFoundries and Navitas will expand the capacity of United States for advanced GaN technology, design, and at-scale manufacturing.
- [IBM, University of Dayton Partner on New Chip Tech](https://aei.dempa.net/archives/34270) - IBM and University of Dayton will work together in a new semiconductor facility that will support advanced research and workforce development.
- [Keysight’s New Test System to Scale PCBA Manufacturing](https://aei.dempa.net/archives/34265) - The compact, modular test system from Keysight comes with integrated multi-test capability for high-volume PCBA manufacturing efficiency.
- [ST’s New MCU is Industry’s First 18nm Chip Tech](https://aei.dempa.net/archives/34259) - STMicroelectronics’ latest STM32V8 is its fastest and most powerful MCU to date, designed with its most advanced 18nm process technology.
- [RIKEN to Deploy NVIDIA-Powered Supercomputers](https://aei.dempa.net/archives/34256) - RIKEN is integrating NVIDIA Blackwell to its two new supercomputers in Japan — one built for AI for science and the other for quantum computing.
- [ST, GF Eye FD-SOI Milestones in New 300MM Facility](https://aei.dempa.net/archives/9167) - STMicroelectronics and GlobalFoundries will jointly operate the new factory, which aims to support demand from digitalization and decarbonization.
- [GF, ST Finalize New 300MM IC Facility Deal](https://aei.dempa.net/archives/16145) - The new facility aims to support a broad range of technologies including GF’s FDX technology and ST’s roadmap to 18nm for various applications.
- [Imec Achieves Breakthrough in Single-Print High NA EUV](https://aei.dempa.net/archives/33913) - Imec achieves new milestones in single patterning High NA EUV lithography, reducing processing steps compared to multi-patterning and may unlock sub-2nm and beyond.
- [GF to Surge Si Photonics Foundry in New Acquisition](https://aei.dempa.net/archives/34248) - With its acquisition of Advanced Micro Foundry, GlobalFoundries has become the largest pure-play silicon photonics foundry, expanding its global capabilities.
- [SK keyfoundry to Boost SiC Tech Grit With New Buyout](https://aei.dempa.net/archives/34245) - SK keyfoundry is bolstering its grit in the global power chip market as it moved to acquire SK powertech, a leading SiC chip design and manufacturing company.
- [TANAKA Unveils First Rh Materials for Probe Pins](https://aei.dempa.net/archives/34235) - TANAKA PRECIOUS METAL TECHNOLOGIES Co., Ltd., an industrial precious metals organization, has announced the development of TK-SR, a rhodium (Rh) material for probe pins used in probe cards during the front-end processes of semiconductor package manufacturing. This first of its kind product will be exhibited on display at Booth 506 and panel displays at SWTest Asia
- [Stable Demand to Boost Mouser’s Grit in South Asia](https://aei.dempa.net/archives/34227) - Mouser Electronics expects to sustain its strong growth in south Asia markets amid global trade conflicts and other geo-political issues hounding the region.
- [Qualcomm's New Data Center Solutions for the AI Era](https://aei.dempa.net/archives/34221) - Qualcomm AI200 and AI250 solutions deliver rack-scale performance and superior memory capacity for fast data center AI inference.
- [Rockwell to Soar Edge GenAI Using NVIDIA Nemotron](https://aei.dempa.net/archives/34215) - Rockwell Automation will advance industrial intelligence through edge-based generative AI with NVIDIA Nemotron technology.
- [Imec’s Breakthrough 300mm GaN uses Shin-Etsu Substrate](https://aei.dempa.net/archives/34211) - IMEC achieves a world-record GaN breakdown voltage exceeding 650V on Shin-Etsu Chemical’s 300-mm QST™ substrate
- [Aerotech’s New Drives Simplify Complex Motion Systems](https://aei.dempa.net/archives/34207) - Aerotech has unveiled its latest drives that make high-performance hexapod control more accessible than ever and simplify system designs.
- [Jabil, Inno to Surge Energy Storage With New Thai Line](https://aei.dempa.net/archives/34200) - Jabil and Inno will invest in new Thailand Facility to produce battery energy storage system enclosures for a more diversified supply chain.
- [DigiKey to Soar Global Operations With New India Base](https://aei.dempa.net/archives/34196) - DigiKey has introduced its new Indian subsidiary and will operate a global capability center in Bengaluru, reinforcing its commitment to the Indian market.
- [ST’s Unique Sensors to Help Empower Industrial DX](https://aei.dempa.net/archives/34192) - STMicroelectronics has introduced the ISM6HG256X, a tiny three-in-one motion sensor for data-hungry industrial IoT applications, serving as an additional catalyst for edge AI advancement. This smart, highly accurate IMU sensor uniquely combines simultaneous detection of low-g (±16g) and high-g (±256g) accelerations with a high performance and stable gyroscope within a single compact package, ensuring no critical
- [Samsung Electro-Mechanics, Sumitomo to Form New JV](https://aei.dempa.net/archives/34187) - Samsung Electro-Mechanics and Sumitomo Chemical have agreed to jointly manufacture glass core, a novel chip package core material.
- [Keysight, MediaTek to Advance Pre-6G ISAC Tech](https://aei.dempa.net/archives/34176) - Keysight and MediaTek will partner to advance pre-6G integrated sensing and communication technology, advancing network performance and spectrum efficiency.
- [SEMI: Surge in AI Propels 3Q Global Silicon Shipments](https://aei.dempa.net/archives/34172) - SEMI said growth in 300mm shipments fueled by AI soared 3Q 2025 global silicon wafer shipments to 3 percent and propelled 1Q to 3Q to 5 percent year-on-year.
- [Lasertec Unveils New EUV Mask Inspection System](https://aei.dempa.net/archives/34181) - Lasertec's new ACTIS A200HiT series delivers a significant enhancement in productivity for EUV mask quality assurance at wafer fabs.
- [Hitachi High-Tech Unveils New SEM With High Throughput](https://aei.dempa.net/archives/34165) - Hitachi High-Tech announces the SU9600 next-generation ultrahigh-resolution scanning electron microscope that will accelerate expansion of digitalized assets.
- [UVJC Unveils Singapore Hub to Propel Innovative Tech](https://aei.dempa.net/archives/34146) - UVJC has officially launched its global office and R&D center in Singapore, with plans to invest SG$50 millionn over the next five years.
- [Onsemi’s New VGaN Tech to Boost AI, Electrification](https://aei.dempa.net/archives/34162) - onsemi’s vertical GaN sets a new benchmark for power density, efficiency and ruggedness to meet demand of AI data centers and electrification.
- [Murata Philippines Sees New Trends to Stir MLCC Growth](https://aei.dempa.net/archives/34133) - Murata has been expanding its MLCC production capacities globally to flexibly respond to future market demand.
- [Delta to Boost IC Process Grit With Japan’s NRF Buyout](https://aei.dempa.net/archives/34126) - Delta Electronics has given a boost its support in chip manufacturing ecosystem as it acquired Japan's Noda RF Technologies.
- [SEMI: Silicon Wafer Shipments to Surge to New High](https://aei.dempa.net/archives/34121) - Global shipments of silicon wafers are projected to increase 5.4% in 2025 to 12,824 million square inches (MSI) followed by steady growth through 2028 when the market is expected to reach a new industry record of 15,485 MSI, SEMI reported in its annual silicon shipment forecast. In 2025, the increase in silicon wafer shipments has
- [NVIDIA, Partners to Lead AI Era Factories in U.S.](https://aei.dempa.net/archives/34117) - Leading American companies are using NVIDIA Omniverse technologies to build robotic factories and autonomous collaborative robots.
- [Micron Expands High Power Memories for AI Data Center](https://aei.dempa.net/archives/34110) - Micron Technology, Inc. has announced customer sampling of 192GB SOCAMM2 to enable broader adoption of low-power memory within AI data centers.
- [Renesas Delivers New MCUs to Drive High End Graphics](https://aei.dempa.net/archives/34107) - Renesas' new RA8M2 and RA8D2 MCUs deliver unmatched compute performance. A dual-core option enables efficient partitioning and task segregation.
- [Yageo to Soar Business Grit, Concludes Shibaura Offer](https://aei.dempa.net/archives/34103) - Taiwanese electronic parts maker YAGEO has completed its tender offer to acquire the shares of Japanese sensor company SHIBAURA Electronics.
- [ASE to Soar Chip Supply Grit in New Deal With ADI](https://aei.dempa.net/archives/34098) - ASE plans to purchase Analog Devices’ Penang facility in Malaysia and have agreed to enter co-investment and long-term supply commitment.
- [TDK, Gelion to Soar Sulfur Battery Tech in New Deal](https://aei.dempa.net/archives/34093) - Gelion and TDK have signed a multi-year collaboration that aims to advance sulfur battery technology and drive innovation for a more sustainable future.
- [Rigaku Opens New Tech Center in Taiwan](https://aei.dempa.net/archives/34088) - Rigaku Holdings has opened Rigaku Technology Taiwan, advancing regional growth through engineering and collaboration in Taiwan and beyond.
- [TDK Develops Sample Analog Reservoir AI Chip](https://aei.dempa.net/archives/34078) - TDK Corporation has jointly developed a prototype of a reservoir AI chip using an analog electronic circuit that mimics the cerebellum with Hokkaido University.
- [SK Hynix, DuPont’s Qnity Seal New CMP Pad Deal](https://aei.dempa.net/archives/34074) - SK Hynix and Qnity have entered a supply agreement collaboration that will foster advanced semiconductor manufacturing with high-performance materials.
- [Fujifilm to Reinforce Belgian Line in New Investments](https://aei.dempa.net/archives/32654) - FUJIFILM will install new production facilities of CMP slurries, advanced semiconductor materials, and enhance existing facilities at its Belgian site.
- [Chip Materials Market Takes a Soar With HPC Surge](https://aei.dempa.net/archives/33055) - Global industry association SEMI said the semiconductor materials market revenue in 2024 increased 3.8 percent to US$67.5 billion.
- [SK Hynix to Use Infinitesima’s New Metrology Tool](https://aei.dempa.net/archives/33519) - Infinitesima from Britain has released its Metron3D in-line wafer metrology system and goes online for advanced DRAM manufacturing at SK Hynix in Korea.
- [FUJIFILM Rolls New Facility for CMP Slurry in Japan](https://aei.dempa.net/archives/23382) - FUJIFILM Corporation announces that its new production facility for Chemical Mechanical Polishing (CMP) slurries at its Kumamoto site has begun full-scale operation. CMP slurries are basic materials used in semiconductor manufacturing process. FUJIFILM Electronic Materials Co., Ltd. (FFEM), the core company that leads Fujifilm’s Electronic Materials business installed the new facility. It involves an investment of
- [More Tech Firms Join imec’s Automotive Chiplet Program](https://aei.dempa.net/archives/34065) - GlobalFoundries, the first foundry partner of imec for its Automotive Chiplet Program, is leading new batch of companies who would join the program to accelerate chiplet adoption in the automotive industry.
- [Tokyo Electron Completes New IC Tool Development Line](https://aei.dempa.net/archives/34062) - Tokyo Electron has completed the construction of a new development building for its manufacturing and development subsidiary, Tokyo Electron Kyushu in Koshi-shi, Kumamoto, Japan.
- [Intel to Surge AI Grit with New GPU](https://aei.dempa.net/archives/34057) - Intel announces future inference optimized data center GPU code-named Crescent Island, designed to meet the growing demands of AI inference workloads.
- [Yamaha’s New Software to Lift SMT Efficiency](https://aei.dempa.net/archives/34051) - Yamaha Robotics SMT Section has introduced software tools to accelerate new product introduction (NPI) using YSUP-PG for mounters and inspection systems.
- [NVIDIA, MediaTek Co-Design Superchip in DGX Spark](https://aei.dempa.net/archives/34043) - MediaTek has teamed with NVIDIA on the design of the GB10 Grace Blackwell Superchip in NVIDIA DGX Spark, a personal AI supercomputer.
- [NVIDIA Paves the Way for Smallest AI Super Chip](https://aei.dempa.net/archives/34040) - NVIDIA and its partners are shipping DGX Spark, the world’s smallest AI supercomputer, delivering NVIDIA’s AI stack in a compact desktop form factor.
- [ABB’s NVIDIA Tie up to Soar Grit in AI Data Center](https://aei.dempa.net/archives/34035) - ABB has stepped up its development of gigawatt-scale data centers as it sealed partnership with NVIDIA to serve the growing power needs of AI workloads.
- [Epson Completes New Inkjet Printhead Line](https://aei.dempa.net/archives/34026) - Seiko Epson has completed the construction of its new factory line in inside Tohoku Epson in Japan's Yamagata that will quadruple its production capacity.
- [SEMI Says 300mm Fab Equipment Spending to Grow Further](https://aei.dempa.net/archives/34023) - SEMI said global 300mm fab equipment spending is likely to reach US$374 billion from 2026 to 2028 at the back of surging AI chip demand for data centers and edge devices.
- [Applied Materials’ New Tools to Edge Better AI Chips](https://aei.dempa.net/archives/34018) - Applied Materials has introduced three new chip manufacturing systems that will scale advanced logic and memory chips to foundational AI computing.
- [SoftBank to Buy ABB’s Robotics Arm in US$5.4B Deal](https://aei.dempa.net/archives/34014) - SoftBank is strengthening further its AI robotics business as it moved to acquire the robotics business of ABB at US$5.375 billion.
- [Qualcomm to Soar Grit in AI With Arduino Buyout](https://aei.dempa.net/archives/34004) - Qualcomm Technologies has acquired Arduino to boost further its prowess in leading edge computing and artificial intelligence.
- [Amkor Breaks Ground on New Chip Packaging, Test Line](https://aei.dempa.net/archives/34000) - Amkor Technology has broken the ground for its new semiconductor advanced packaging and test facility in Peoria in Arizona, expanding its investments to US$7 billion across two phases.
- [Imec’s New 300mm GAN Track to Soar Novel Power Devices](https://aei.dempa.net/archives/33997) - Imec has launched a new program that aims on 300mm GaN technology development for low and high voltage power electronics applications, paving the way to 300mm transition.
- [Fujitsu, NVIDIA Expand Alliance on Full-Stack AI](https://aei.dempa.net/archives/33992) - The alliance of Fujitsu and NVIDIA aims to deliver integrated AI agents and high-performance infrastructure to accelerate AI and drive industrial transformation.
- [TI's Latest Tech to Surge Digital Lithography](https://aei.dempa.net/archives/33987) - TI's new digital micromirror device enables equipment manufacturers to achieve high-resolution printing at scale, maximizing throughput and yield.
- [ST, Tobii See Wider Industry Use of New Sensing Tech](https://aei.dempa.net/archives/33983) - STMicroelectronics and Tobii have started mass producing an innovative in-car camera sensing technology ready for adoption across automotive industry.
- [Kioxia, Sandisk New IC Fab to Meet Demand in AI](https://aei.dempa.net/archives/33979) - Kioxia nd Sandisk have announced the start of operation of an advanced chip fabrication facility located in Kitakami, in Iwate, Japan.
- [ABB to Boost New Robot Suite With Generative AI](https://aei.dempa.net/archives/33974) - ABB Robotics has enhanced its RobotStudio suite with more intelligent generative Al interface to create faster and easier commissioning for better productivity.
- [NTT Data’s Private 5G to Soar Industrial Edge](https://aei.dempa.net/archives/33969) - NTT Data delivers full-stack private 5G network solution for manufacturing that enhances operational efficiency to realize the promises of Industry 4.0.
- [ROHM, Infineon to Collaborate on SiC Power IC Packages](https://aei.dempa.net/archives/33962) - ROHM and Infineon will collaborate on packages for SiC power chips used for on-board chargers, PVs, energy storage systems, and AI data centers.
- [UVJP to Scale Manufacturing Tech to New Heights](https://aei.dempa.net/archives/33927) - In this interview, Chandran Nair, CEO of UVJC, discusses how the UVJP technology will revolutionize manufacturing processes across OLED displays, electronics and semiconductors, and beyond.
- [ST-LED Bloc to Soar Europe Grit in 300mm Si Photonics](https://aei.dempa.net/archives/33951) - Twenty-four tech companies led by STMicroelectronics are joining efforts to establish Europe as a technology leader in 300mm silicon photonics.
- [Applied Materials, GF to Grow Photonics Role in AI](https://aei.dempa.net/archives/33920) - GlobalFoundries and Applied Materials will build an advanced waveguide fabrication line at GF’s Singapore facility to accelerate the emerging photonics inflection driven by AI.
- [NVIDIA’s New £2B Funding to Propel U.K. Grit in AI](https://aei.dempa.net/archives/33907) - NVIDIA commits £2 billion to catalyze the U.K.’s AI startup ecosystem and accelerate the creation of new globally transformative AI businesses.
- [New Trends to Soar Breakthroughs in AI, IoT](https://aei.dempa.net/archives/33879) - TAITRONICS & AIoT Taiwan will once again put on spotlight the latest innovations and solutions in the artificial intelligence of things (AIoT) ecosystem.
- [STMicroelectronics to Surge Chip Fab With New PLP Line](https://aei.dempa.net/archives/33903) - STMicroelectronics has announced investing about US$60 million to boost its pilot line in Tours, France for next-generation PLP technology.
- [OMRON’s New Controller to Boost DX in Manufacturing](https://aei.dempa.net/archives/33893) - OMRON will introduce its DX1 Data Flow Controller, which can collect and analyze operation data of sensors, controllers, and other factory automation devices.
- [Tech Firms Partner to Back Chipmakers’ Needs in AI Era](https://aei.dempa.net/archives/33873) - JSR and Inpria have entered a cross-licensing and collaboration agreement with Lam Research to advance semiconductor manufacturing and meet demands of AI.
- [Mitutoyo Unveils New Bold Compact QM-Fit System](https://aei.dempa.net/archives/33867) - Mitutoyo has introduced the QM-Fit Smart Vision System, which delivers rapid and accurate results in a compact automated vision system.
- [SK Hynix to Brace for Mass Production of HBM4](https://aei.dempa.net/archives/33864) - SK Hynix has concluded the development and is now readying for the mass production of HBM4, which will be critical in overcoming challenges of the AI era.
- [PsiQuantum’s New Funding to Build Quantum Computers](https://aei.dempa.net/archives/33858) - PsiQuantum has raised US$1 billion to build the world’s first commercially useful, fault-tolerant quantum computers.
- [NVIDIA, Partners to Soar New Vision for AI Factories](https://aei.dempa.net/archives/33852) - NVIDIA Corporation has announced that it is expanding its partnerships with artificial intelligence (AI) infrastructure ecosystem to transform traditional data centers into fully integrated AI factories. According to NVIDIA’s VP of Accelerated Computing Ian Buck, the company is developing reference designs to be shared with partners and enterprises worldwide. Therefore, offering an NVIDIA Omniverse Blueprint
- [Chip Industry to Chart AI Grit at SEMICON Taiwan](https://aei.dempa.net/archives/33830) - SEMICON Taiwan puts on spotlight the global AI chip boom, which is reshaping the industry and pushing for cross-domain collaboration.
- [Advantest’s New CD-SEM to Meet Needs of 2nm and Beyond](https://aei.dempa.net/archives/33834) - Advantest’s new CD-SEM is a 2nm-node-ready system that has innovative features necessary in cutting-edge semiconductor manufacturing.
- [New NVIDIA Rubin GPU to Power AI Systems](https://aei.dempa.net/archives/33840) - NVIDIA has announced NVIDIA Rubin CPX, a new class of GPU purpose-built for massive-context processing.
- [ASML to Soar AI Grit With Mistral AI Alliance](https://aei.dempa.net/archives/33825) - ASML is investing €1.3 billion in Mistral AI and explore the use of AI models across ASML’s product portfolio for the benefit of its customers.
- [Tokyo Electron to Establish New Site in India](https://aei.dempa.net/archives/33816) - Tokyo Electron (TEL) establishment of a new development site in Bengaluru, Karnataka, India. In India, the semiconductor industry ecosystem is developing fast due to the country's recent rapid economic growth. To further expand our business by contributing to technological innovation in semiconductors, TEL has established a new development site in Bengaluru, Karnataka, India. In addition
- [Synopsys, GF to Start IC Design Program in Academes](https://aei.dempa.net/archives/33819) - Synopsys, Inc. and GlobalFoundries (GF) have collaborated to bring chip design tapeout program to universities worldwide. The partnership aligns with their respective GFLabs program of GF and the Synopsys Academic & Research Alliances (SARA) initiative of Synopsys, which both advance semiconductor innovation through R&D and academic collaboration. Particularly, the pilot initiative gives researchers, professors and
- [Asahi Kasei to Double Material for Chip Production](https://aei.dempa.net/archives/33812) - Asahi Kasei will pour ¥16 billion in investment to expand its PIMEL™ plant to complement the growing demand in semiconductor applications
- [New Alliance to Boost Next-Gen Chip Packaging](https://aei.dempa.net/archives/33807) - Major industry players led by Resonac Corporation has established JOINT3, a new consortium led by Resonac and 26 other companies from the semiconductor supply chain. Specifically, the new alliance will jointly develop materials, equipment, and design tools optimized for panel-level organic interposers, that is semiconductor packaging technology. Accordingly, they group will utilize organic materials to
- [Infineon to Power Humanoid Robots With NVIDIA Tech](https://aei.dempa.net/archives/33800) - Technology from Infineon enables NVIDIA’s developer platform to deliver high-end motor control solutions for humanoid robotics.
- [Alliance to Make New Mark in IC Inspection, Metrology](https://aei.dempa.net/archives/33796) - Kioxia will evaluate the GaN-based e-Beam Inspection and Metrology for chip manufacturing which Photo electron Soul Inc. and Nagoya University have developed.
- [Koh Young to Soar High in Taiwan With New Office](https://aei.dempa.net/archives/33792) - Koh Young expands its global footprint with its new Taiwan office to further drive innovation and process optimization.
- [SK Hynix to Employ New Tech for More Efficient DRAM](https://aei.dempa.net/archives/33787) - SK Hynix to lead next-generation DRAM for mobile device by adopting High-K EMC, which improves thermal conductivity by 3.5 times and resistance by 47%.
- [Industrial Robot Line Taps Maxell Battery Modules](https://aei.dempa.net/archives/33784) - Power modules using ceramic-packaged all-solid-state batteries by Maxell have been installed as power sources in the industrial robots of Subaru.
- [Socionext to Lift 3DIC in New Packaging Line](https://aei.dempa.net/archives/33775) - Socionext, the Solution SoC company, has made the 3DIC support available in its portfolio for the delivery of complete solutions for consumer, AI, and HPC data center applications. These include chiplets, 2.5D, 3D, and 5.5D packaging. For that reason, Socionext empowers customers with a proven development process and unmatched expertise delivering high-performance, high-quality solutions that
- [Singapore’s Frencken to Invest in New Tech Line](https://aei.dempa.net/archives/33772) - Globally integrated technology solutions company Frencken Group Limited has announced investing S$63 million (¥7.20 billion) for a new manufacturing facility in Singapore. Specifically, the site aims to expand and consolidate the group’s mechatronics operations in Singapore to cater demands from semiconductors and sciences sectors as well as aerospace business segment. Dennis Au, President at Frencken
- [More Players Grow Compute Power With NVIDIA Servers](https://aei.dempa.net/archives/33768) - Industry Leaders Transform Enterprise Data Centers for the AI Era With NVIDIA RTX PRO Servers
- [NexAIoT’s Latest AI, IIoT Solutions Take Spotlight](https://aei.dempa.net/archives/33764) - NexAIoT Co., Ltd., a NEXCOM Group subsidiary, culminated its presence at the annual Automation Taipei 2025 with its sophisticated artificial intelligence (AI)-powered Industrial IoT (IIoT) monitoring solutions. Dedicated to supporting enterprises in digital transformation, NexAIoT offers one-stop Industry 4.0 services. These include IIoT and automation products, industrial PCs, gateways, and customized system integration projects. Its
- [Solomon Unveils NVIDIA-Powered Humanoid Robot](https://aei.dempa.net/archives/33759) - Solomon Technology Corporation has integrated NVIDIA’s Jetson Thor, Isaac GR00T VLA model, and Isaac Sim to develop a humanoid robot simulation system driven by natural language. The system was presented for the first time at Automation Taipei 2025, which ran from August 20 to 23, highlighting a major leap in AI-driven robotics. Breaking Technical BarriersUnlike
- [Thailand to Surge Grit as ASEAN Chip, PCB Hub](https://aei.dempa.net/archives/33754) - Amid changes in the landscape of global trade rules and supply chain realignments, Thailand wants to position itself as a regional hub for advanced electronics. For that reason, the Thai government has recently announced policies that aim to attract semiconductor and printed circuit board (PCB) investments. Electronics Projects Surge The Thailand Board of Investment (BOI)
- [Cirrus Logic, GF to Surge U.S. Chipmaking in New Pact](https://aei.dempa.net/archives/33747) - Cirrus Logic has expanded its collaboration with GlobalFoundries that aims to accelerate advanced chipmaking in the United States.
- [New OKI Tech Allows Optical Devices Mounting on 300mm](https://aei.dempa.net/archives/33741) - Oki has developed tiling crystal film bonding technology that enables heterogeneous integration of small optical IC wafers on 300mm wafers.
- [SoftBank to Soar Grit in AI With Intel Investment](https://aei.dempa.net/archives/33737) - The investment comes as both Intel and SoftBank deepen their commitment to advanced technology and semiconductor innovation in the United States.
- [SEMICON Taiwan to Track Growth in Chip Packaging](https://aei.dempa.net/archives/33716) - SEMICON Taiwan 2025 to present the world's most comprehensive advanced packaging technology platforms as AI and HPC accelerates further.
- [Xanadu, DISCO to Surge Wafer Processing in New Alliance](https://aei.dempa.net/archives/33728) - Xanadu, the leading photonic quantum computing company, and DISCO Corporation, renowned precision machine and processing tool manufacturer, have agreed to collaboration. Specifically, they are developing advanced wafer processing techniques for ultra-low loss photonic integrated chips. This partnership focuses on enhancing wafer dicing processes, specialized wafer preparation for heterogeneous integration and assembly, as well as achieving
- [ASMPT’s New Tool to Soar Chip Bonding to New High](https://aei.dempa.net/archives/33724) - ASMPT SEMI has introduced its new MEGA multi-chip bonding platform, which the company said sets the standard in precision and speed with.
- [Rigaku's New Solution to Surge Next-Gen Chips](https://aei.dempa.net/archives/33710) - Rigaku has launched full-fledged commercial production of XTRAIA XD-3300, a high-resolution microspot X-ray diffraction system.
- [Apple, Applied Materials Flex More Muscle in U.S.-Made Chips](https://aei.dempa.net/archives/33704) - Apple has increased to US$600 billion its U.S. plants while Applied Materials will boost its capacity to provide support to Apple and Texas Instruments alliance.
- [Toyota Drives Production Value With Stratsys’ 3D Tech](https://aei.dempa.net/archives/33701) - Toyota and Stratasys continue to drive value on the role of 3D printing technology in the manufacturing process as they further strengthen their collaboration.
- [Foxconn-TECO Alliance to Soar Grit in AI Data Center](https://aei.dempa.net/archives/33698) - Foxconn and TECO have formed a strategic alliance that will strengthen their AI infrastructure capabilities and propel entry into super computing race.
- [Ushio to Step up Line With New 1.5μm Stepper](https://aei.dempa.net/archives/33684) - Ushio Inc. has announced the development outlook for the UX-59113, a stepper for advanced packaging that achieves a resolution of L/S=1.5μm.
- [Innovative System Boosts Optimized Display Production](https://aei.dempa.net/archives/33650) - Aerotech’s tightly integrated systems enable display manufacturers drive quality, throughput, and control cost per display altogether.
- [New Incentives to Soar Thai EV at Full Throttle](https://aei.dempa.net/archives/33669) - Thailand has intensified its campaign to make the country an export base of electric vehicles amid strong investments and registrations.
- [Micron Unveils New Line of SSDs to Power AI Era](https://aei.dempa.net/archives/33666) - Micron has introduced a new portfolio of innovative memory solutions to complement the data needs of the AI-driven data centers.
- [Delta’s New Hub to Surge AI-Based Smart Factories](https://aei.dempa.net/archives/33638) - Delta Electronics has opened its Smart Manufacturing Innovation Center in Taiwan that will offer equipment validation and talent training.
- [Ushio to Boost Chip Market Clout in New ams-OSRAM Deal](https://aei.dempa.net/archives/33629) - Ushio Inc. has resolved to acquire the industrial lamps business of ams-OSRAM AG mainly for semiconductor market and entertainment lamps business.
- [Parts Makers Aim for Power Value to Suit AI Use](https://aei.dempa.net/archives/33622) - Japanese electronic component manufacturers are actively developing power supply-related products to meet next-generation trends.
- [SK keyfoundry, LB Semicon Partner on New IC Packaging Tech](https://aei.dempa.net/archives/33616) - SK keyfoundry, in collaboration with LB Semicon, co-develops Direct RDL semiconductor packaging to strengthen high performance semiconductors.
- [ST to Surge Sensor Line With NXP’s MEMS Sensor Deal](https://aei.dempa.net/archives/33612) - STMicroelectronics is strengthening its sensor business with plans to acquire the MEMS sensor business of NXP for a purchase price of up to US$950 million.
- [Infinitesima to Join imec-ASML Innovative Chip R&D](https://aei.dempa.net/archives/33608) - Infinitesima will be joining a project with research institute imec and ASML Holding that aims to develop solutions to advance the semiconductor industry.
- [SEMI: AI to Drive Chip Tool Sales to New Highs](https://aei.dempa.net/archives/33603) - SEMI said global sales of total chip manufacturing equipment by OEMs are forecast to set a new industry record in 2025.
- [Nikon Unveils First Back-End Process Lithography](https://aei.dempa.net/archives/33591) - Nikon Corporation will begin accepting orders for the Digital Lithography System DSP-100, designed for back-end semiconductor manufacturing processes.
- [Rapidus Achieves New Milestone With 2nm Prototype](https://aei.dempa.net/archives/33583) - Rapidus Corporation has announced the start of prototyping for its 2nm gate-all-around (GAA) transistor structure at its Japan foundry.
- [Advantech, UltraSense Tie up to Soar Automation](https://aei.dempa.net/archives/33580) - Advantech and UltraSense Systems have partnered to fuel innovation in industrial applications at the Edge.
- [Microchip, Delta To Surge SiC Solutions in New Collab](https://aei.dempa.net/archives/33573) - The agreement leverages Microchip’s mSiC technology and Delta Electronics’ smart energy-saving solutions to accelerate sustainable applications.
- [Intel, Weizmann to Speed up AI Further With New Method](https://aei.dempa.net/archives/33570) - Intel Labs and the Weizmann Institute of Science introduced a major advance in speculative decoding that reduces compute cycle time.
- [Fraunhofer, DIVE to Soar Efficient Chip Making](https://aei.dempa.net/archives/33561) - Fraunhofer IPMS and DIVE imaging systems GmbH have achieved a major milestone for a more resource-efficient semiconductor manufacturing.
- [New Siemens-SK foundry Alliance to Surge 130nm Process](https://aei.dempa.net/archives/33557) - Korea Siemens EDA and SK keyfoundry have launched a 130nm automotive PDK designed for use in Siemens Calibre® PERC™ software.
- [Stratasys, Shin-Etsu to Offer New 3D Printing Material](https://aei.dempa.net/archives/33550) - Stratasys Ltd. and Shin-Etsu Chemical have sealed a partnership that paved the way for the development a new high-performance material.
- [Advantech Taps Qualcomm Portfolio in New AI Solutions](https://aei.dempa.net/archives/33543) - Advantech has introduced its edge AI compute solutions powered by Qualcomm's Snapdragon platform and will complement the needs of industrial applications.
- [DNP to Soar R&D With First Overseas Site](https://aei.dempa.net/archives/33528) - DNP will open its first overseas R&D Center in the Netherlands in September 2025 and will promote R&D into Co-Packaged Optics.
- [Epson to Soar Capacity With First Inkjet Line in India](https://aei.dempa.net/archives/33538) - Seiko Epson Corporation has opened a manufacturing facility for Epson's first high-capacity ink tank inkjet printers in India.
- [ST, Metalenz New Deal to Surge Metasurface Optics Push](https://aei.dempa.net/archives/33535) - STMicroelectronics and Metalenz have signed a new license accelerating metasurface optics adoption across consumer, automotive, and industrial markets.
- [Renesas’ New MCU for AI Use Sets the Bar High](https://aei.dempa.net/archives/33522) - Renesas has introduced the RA8P1 MCU Group targeted at Artificial Intelligence (AI) and Machine Learning (ML) applications, as well as real-time analytics.
- [Rigaku’s New Tool to Offer Innovative Thermal Analysis](https://aei.dempa.net/archives/33513) - Rigaku’s new STAvesta thermal analyzer supports a wide range of users from novices to experts, serving a wide variety of needs in material development.
- [TDK to Lift Clean Hydrogen Tech in New Investment](https://aei.dempa.net/archives/33507) - TDK Corporation through its subsidiary TDK Ventures, Inc. has co-led the US$27 million seed round of Tulum Energy.
- [LG Innotek Unveils New Chip Substrate Tech for Mobiles](https://aei.dempa.net/archives/33502) - LG Innotek has developed a copper post technology that employs copper and devises a new approach in connecting a semiconductor substrate and a mainboard.
- [Malaysia Upholds Grit With New Investments](https://aei.dempa.net/archives/33497) - Malaysia’s approved investments for Q1 of 2025 grew 3.7 percent year-on-year, with total value of 89.8 billion Malaysian ringgit.
- [FANUC’s New Robot Software to Offer Better Performance](https://aei.dempa.net/archives/33492) - FANUC’s ROBOGUIDE V10 offers the future of robot simulation with the most advanced iteration of offline robot programming and simulation.
- [Universal Robot's New Tool to Offer Novel Simulation](https://aei.dempa.net/archives/33487) - With Universal Robot's UR Studio, users can test robot movements and calculate cycle time to maximize return on investment before deployment even starts.
- [Rigaku to Surge Capacities With Latest Expansions](https://aei.dempa.net/archives/33483) - Rigaku has been expanding its production facilities to propel by up to 50 percent its manufacturing capacities for the chip market.
- [KUKA to Expand Presence in Malaysia With New Office](https://aei.dempa.net/archives/33480) - KUKA Robotics has expanded its presence in Malaysia with a new Penang branch office in Bandar Cassia in Malaysia’s Batu Kawan.
- [Thai Digital Infra to Boost Grit With New Funding](https://aei.dempa.net/archives/33472) - Thailand BOI has approved US$870 million in digital services investments and new incentives for local EV and electronics manufacturing.
- [SEMI Sees AI to Soar Chipmaking Growth Thru 2028](https://aei.dempa.net/archives/33469) - SEMI said AI is driving expansion of advanced chip manufacturing capacity across the semiconductor industry, growing 69% by 2028.
- [ST’s New Tech Pools ToF, AI to Boost Device Features](https://aei.dempa.net/archives/33462) - STMicroelectronics has employed its ToF sensors to a new technology for use in notebook computers, desktop computers, among others.
- [Trimble, TDK to Bring Navigation to New Heights](https://aei.dempa.net/archives/33456) - Trimble and TDK Join forces to accelerate precision navigation with a new solution that delivers high-level accuracy for automotive and IoT applications.
- [Festo Solutions to Soar Process Automation Line of RS](https://aei.dempa.net/archives/33453) - RS offers an extensive selection of Festo process automation products engineered to improve efficiency, safety, and productivity.
- [Murata's New 3-Axis Accelerometer Has High Stability](https://aei.dempa.net/archives/33449) - Murata Manufacturing has introduced a 3-axis accelerometer for the industrial market, combining high offset stability and excellent robustness.
- [Continental to Soar Grit With New Fabless Chip Unit](https://aei.dempa.net/archives/33442) - Continental's automotive sector is increasing its supply chain resilience as it established its own semiconductor unit within the organization.
- [Rapidus, Siemens Seal New Deal for 2nm Chip Design](https://aei.dempa.net/archives/33434) - Rapidus and Siemens have agreed to collaborate on semiconductor design and manufacturing processes for the 2nm generation.
- [Marvell’s First 2nm SRAM to Surge AI, Cloud](https://aei.dempa.net/archives/33430) - Marvell Technology has expanded its custom technology platform with the launch of the industry’s first 2nm custom SRAM.
- [Tata, Infineon Join Forces to Surge India’s EV Market](https://aei.dempa.net/archives/33426) - Tata Elxsi and Infineon Technologies have forged a collaboration to develop application-ready electric vehicle (EV) solutions tailored to the Indian market.
- [TI to Soar U.S. Chip Fabs in New US$60B Funding](https://aei.dempa.net/archives/33423) - Texas Instruments has announced plans to invest more than US$60 billion across its seven semiconductor fabs in the United States.
- [Toshiba's New SCiB Tech to Soar at Asia Energy Week](https://aei.dempa.net/archives/33419) - Toshiba’s new SCiB will take center stage at Thailand’s ASIA Sustainable Energy Week. The SCiB supports decarbonization across many sectors.
- [RECIF's New Software to Boost Wafer Management](https://aei.dempa.net/archives/33409) - RECIF Technologies has introduced R.PACK, its next-generation software suite designed for RECIF sorters.
- [ULVAC to Boost PiezoMEMS Deal With ST, A*Star](https://aei.dempa.net/archives/33404) - ULVAC, Inc. said the joint project "Lab-in-Fab" for piezoMEMS with ST and A*Star is entering a new phase.
- [TDK to Edge Grit in AI With SoftEye Deal](https://aei.dempa.net/archives/33401) - TDK acquires SoftEye to enable artificial intelligence within smart glasses and grow its AI ecosystem business.
- [Yaskawa's Latest Investments to Surge U.S. Presence](https://aei.dempa.net/archives/33391) - Yaskawa to pour up to US$180 million investments in the United States, which will include creating of a campus and relocation of U.S. headquarters.
- [Mitsubishi Electric's New AI Tech Suits Manufacturing](https://aei.dempa.net/archives/33396) - Mitsubishi Electric has developed a language model for manufacturing processes that will operate on edge devices.
- [Jabil to Boost AI, Cloud Grit With New U.S. Investment](https://aei.dempa.net/archives/33387) - Jabil has announced plans to invest US$500 million to expand its footprint in the United States and support cloud and AI data center needs of customers.
- [Japan Parts Makers Set Sights on Advanced Mobility](https://aei.dempa.net/archives/33379) - Japanese parts manufacturers are stepping up the development of automotive electronic components and modules for next-generation mobility.
- [Applied, CEA-Leti to Soar Chip Tech for AI](https://aei.dempa.net/archives/33373) - Applied Materials, Inc. and CEA-Leti have announced the next phase of their longstanding collaboration to accelerate innovation in specialty semiconductors.
- [imec, TEL Seal New Pact to Surge 2nm Nodes](https://aei.dempa.net/archives/33369) - Imec and Tokyo Electron have agreed to extend their long-standing alliance to five more years and deepen efforts on R&D on next-generation memory development.
- [Mitsubishi Makes Breakthrough for 5G-Advanced Station](https://aei.dempa.net/archives/33362) - Mitsubishi Electric has developed a world’s first compact 7GHz band GaN power amplifier module (PAM) with the world’s highest power efficiency.
- [Micron to Soar U.S. Investment Plans to US$200 Billion](https://aei.dempa.net/archives/33355) - Micron has expanded even further its investments in the United States, now reaching about US$200 billion, enabling the company to boost domestic production.
- [Qualcomm to Surge Grit in AI With New Alphawave Deal](https://aei.dempa.net/archives/33338) - AI growth is driving Qualcomm’s high-performance compute solutions and the Alphawave Semi buyout will boost their presence in the data center market.
- [NVIDIA to Build First Industrial AI Cloud for Europe](https://aei.dempa.net/archives/33349) - NVIDIA CEO Jensen Huang said NVIDIA will help build industrial AI cloud in Germany, a first in the world, to accelerate industrial manufacturing applications.
- [TSMC to Soar IC R&D in Japan With New UTokyo Joint Lab](https://aei.dempa.net/archives/33346) - TSMC and UTokyo have opened a joint lab that will further advance semiconductor research. This is TSMC's first joint lab with a university outside Taiwan.
- [LG Innotek to Roll Out First 5G Automotive Module](https://aei.dempa.net/archives/33334) - LG Innotek has introduced the world’s first Third Generation Automotive 5G Communication Module that supports satellite communication over 5G NR-NTN.
- [ZASCHE Paves the Way for Innovative Handling System](https://aei.dempa.net/archives/33328) - The vision-enabled big bin picking solution from Zasche blends ergonomic manual control with smart semi-automation for a more scalable system.
- [Sony Semiconductor’s New Sensor to Surge Vehicle LiDAR](https://aei.dempa.net/archives/33324) - Sony Semiconductor Solutions has announced the release of the IMX479 direct Time of Flight SPAD depth sensor for automotive LiDAR systems.
- [SK hynix Eyes New Platform for Future DRAM Tech](https://aei.dempa.net/archives/33318) - SK hynix considers shifting to use its latest 4F² VG platform technology to address the scaling challenges for its sub-10 nanometer.
- [Epson to Tap Tech Grit to Power New Cobots](https://aei.dempa.net/archives/33312) - Seiko Epson is building up on its expertise in industrial robotics in developing its first collaborative robot solution this 2025.
- [Soitec, PSMC Seal New Deal on Innovative Chip Tech](https://aei.dempa.net/archives/33304) - The Soitec-PMSC deal will pave the way for more powerful but compact and energy-efficient chips to meet demands of AIs.
- [GF to Boost US Chip Ecosystem With New Funding](https://aei.dempa.net/archives/33301) - GlobalFoundries is investing US$16 billion to support reshoring of chip manufacturing to U.S. and growing demand amid AI surge.
- [ROHM Develops Breakthrough AI-Equipped MCU](https://aei.dempa.net/archives/33295) - ROHM Semiconductor has developed an AI-equipped microcontroller units (MCUs) that enable fault prediction and degradation forecasting using sensing data. Accordingly, the latest MCUs can suit wide range of devices, including industrial equipment such as motors. These MCUs, ML63Q253x-NNNxx / ML63Q255x-NNNxx, are the industry’s first to independently execute both learning and inference without relying on a
- [Alps Alpine, Pegasus Tech Seal Breakthrough Deal](https://aei.dempa.net/archives/33288) - Pegasus Tech Ventures and Alps Alpine have entered a strategic business alliance that will accelerate global expansion.
- [Malaysia to Soar Japan Pitch With New Investments](https://aei.dempa.net/archives/33281) - Malaysia is making headway at the ongoing Osaka Expo as the country aims to sustain its record-breaking investment wins in 2024.
- [NVIDIA AI Yields Breakthrough in New MLPerf Result](https://aei.dempa.net/archives/33273) - NVIDIA said its AI platform delivered the highest performance at scale on every benchmark in the latest round of MLPerf Training.
- [JAE to Soar Grit of Overseas Businesses](https://aei.dempa.net/archives/33270) - JAE is expanding its overseas business in the automotive market, specifically promoting to harness new growth drivers in India, North America, and China.
- [TDK to Offer 3-Terminal Filter for Automotive Use](https://aei.dempa.net/archives/33263) - TDK Corporation has expanded its YFF series of 3-terminal filters for automotive applications to include higher voltages up to 35 V and higher capacitances up to 4.7 µF. Such components are used to suppress voltage variation and high-frequency noise, which can cause system malfunctions. Mass production of the product series began in June 2025. With
- [OKI to Boost Photonics Tech With New R&D in Berlin](https://aei.dempa.net/archives/33257) - OKI Electric Industry Co. Ltd. has established the OKI Berlin Lab research and development center in Berlin, Germany. The establishment of this new center is intended to strengthen photonics technology, one of OKI's core technologies, to a world-class level as part of OKI's Technology Strategy, while helping to resolve emerging social issues through its global
- [ASE’s New Chip Package Tech Suits AI, HPC Demands](https://aei.dempa.net/archives/33246) - Artificial intelligence and high performance computing (HPC) are making headway across many industries. In fact, the convergence of AI and HPC has brought huge impact as well on the manufacture of semiconductors. Semiconductors are critical to the enablement of AI and HPC, which are crucial to applications from autonomous vehicles and even in medical field.
- [TSMC to Propel Europe Grit With New Design Center](https://aei.dempa.net/archives/33239) - Taiwan Semiconductor Manufacturing Company Limited (TSMC) has announced that it will establish the TSMC European Design Center (EUDC) in Munich, Germany. Accordingly, the move aims to strengthen further the company’s presence in the region. At the TSMC 2025 Technology Symposium in Amsterdam, The Netherlands, Paul de Bot, President of TSMC Europe, said the new center
- [Asahi Kasei’s New Dry Film to Meet Surge in AI Server ](https://aei.dempa.net/archives/33232) - Asahi Kasei has developed a dry film photoresist to meet the growing demand in semiconductor packaging for applications such as AI servers.
- [ST, A*STAR and ULVAC R&D Lab to Hit New Phase](https://aei.dempa.net/archives/33225) - STMicroelectronics, along with the A*STAR Institute of Microelectronics (A*STAR IME) and ULVAC, has announced the expansion of its R&D Lab in Singapore.
- [New Alliance to Boost Material for Battery Tech in EVs](https://aei.dempa.net/archives/33222) - Zeon and Sino Applied Technology have partnered to support expansion of single-walled carbon nanotube conductive paste for EV batteries.
- [MediaTek to Drive Grit in AI With 2nm Chips](https://aei.dempa.net/archives/33177) - At COMPUTEX 2025, MediaTek CEO Rick Tsai said it will soon start taping out its first 2nm-processed chip.
- [AEI Coverage: Global Tech Players Chart Future of AI at COMPUTEX](https://aei.dempa.net/archives/33152) - COMPUTEX 2025 has started with global tech players charting the future of AI and other mega trends that will shape industry landscape in the years to come.
- [Singapore’s A*STAR to Make Way for New 200MM SiC R&D](https://aei.dempa.net/archives/33212) - To propel and accelerate further innovation in silicon carbide (SiC), A*Star Institute of Microelectronics (A*STAR IME) of Singapore has introduced the first industry-grade 200mm SiC Open R&D Line. The said initiative will enable and accelerate SiC innovation from materials growth and defect analysist to device fabrication and testing. The Open R&D Line aims to addresses
- [Aerotech New Systems Lift Drilling to New Heights](https://aei.dempa.net/archives/33209) - Aerotech Inc. has announced the release of its groundbreaking DrillOptimizer, an advanced AeroScriptPlus feature for galvo scanner systems.
- [GF, Singapore’s A*Star Seal New Deal on Chip Packaging](https://aei.dempa.net/archives/33202) - Singapore's Agency for Science, Technology and Research (A*STAR) and GlobalFoundries (GF) have agreed to collaborate in advanced semiconductor packaging.
- [For NXP, Rapid AI Growth to Make More Impact at Edge](https://aei.dempa.net/archives/33194) - At Computex 2025, NXP cited the importance of AI for an autonomous future and stressed a more sustainable AI needs to be in the edge.
- [Foxconn Says Humans Remain Crucial Role in AI Era](https://aei.dempa.net/archives/33174) - Foxconn said at COMPUTEX 2025 that human participation in generative AI era will remain crucial in manufacturing processes.
- [Intel Unveils New GPUs for AI and Workstations](https://aei.dempa.net/archives/33167) - At Computex 2025, Intel has unveiled a new lineup of graphics processing units (GPUs) and AI accelerators designed for professionals and developers. Intel’s announcements include: New Intel Arc Pro B-Series GPUs: Intel announces Intel® Arc™ Pro B60 and Intel® Arc™ Pro B50 GPUs, expanding the Intel® Arc™ Pro family with configurations tailored for AI inference and professional workstations. Intel Gaudi 3
- [NVIDIA's NVLink Fusion to Soar AI Infrastructure](https://aei.dempa.net/archives/33156) - NVIDIA NVLink Fusion lets industries create semi-custom AI infrastructure with a vast ecosystem of partners building with NVIDIA NVLink.
- [Koh Young’s Novel Tech Soars Inspection to New Heights](https://aei.dempa.net/archives/33131) - In this interview, Koh Young's Brent Fischthal outlines the trends in PCB assemblies and how sophisticated technologies are shaping the landscape.
- [Saudi Arabia Taps NVIDIA to Surge Grit in AI](https://aei.dempa.net/archives/33120) - Saudi Arabia has partnered with NVIDIA to propel the country into a global powerhouse in AI, computing, digital twins, and robotics.
- [Trymax Makes New Installation Milestone in Asia](https://aei.dempa.net/archives/33115) - Trymax Semiconductor Equipment has reached a new milestone as it installed its 500th process chamber in Asia.
- [Universal Robots to Make Way for its Fastest Cobot](https://aei.dempa.net/archives/33108) - Universal Robots has launched its fastest collaborative robot yet that features unparalleled motion capability for increased productivity.
- [Murata to Boost Capacity With New Vietnam Plant](https://aei.dempa.net/archives/33105) - Murata Manufacturing Vietnam Co., Ltd. has started the construction of a new production building at its Ho Chi Minh plant slated to conclude next year.
- [Siemens’ New AI Agents to Make Better Automation](https://aei.dempa.net/archives/33102) - Siemens has expanded its industrial AI offerings with advanced AI agents designed to work seamlessly across its established Industrial Copilot ecosystem.
- [DENSO, ROHM to Surge Chip Business in New Alliance](https://aei.dempa.net/archives/33096) - DENSO and ROHM have agreed to establish a strategic partnership in the semiconductor field and strengthen their capital collaboration.
- [NXP’s New Radar Processors to Surge ADAS More](https://aei.dempa.net/archives/33093) - NXP Semiconductors has unveiled its new S32R47 imaging radar processors in 16nm FinFET technology, building on its expertise in the imaging radar space.
- [Imec Spinoff’s New Tech to Make Better Camera Sensors](https://aei.dempa.net/archives/33088) - eyeo, an imec spinoff, has raised €15 million in funding to propel its breakthrough sensors that will give cameras perfect eyesight.
- [IBM’s New Funding to Boost Tech Might in AI, Quantum](https://aei.dempa.net/archives/33078) - IBM has recently announced its plans to invest US$150 billion that will further propel the company in the global arena of computing.
- [BASF to Invest in New Chip-Grade Sulfuric Acid Plant](https://aei.dempa.net/archives/33071) - BASF will expand its production capacity for semiconductor-grade sulfuric acid (H2SO4), which is an essential ultra-pure chemical. Accordingly, the new production facility at its Ludwigshafen site in Germany will feature cutting-edge purity capabilities. Thus, expanding to serve the growing demand for advanced semiconductor chip manufacturing across Europe. Operations are likely to start by 2027, coinciding
- [Intel Tracks Chip Tech in New Roadmap Update](https://aei.dempa.net/archives/33066) - Intel Chief Executive Officer Lip-Bu Tan took the stage April 29 (Calif., U.S. time) for the first ever Intel Foundry Direct Connect as he outlined the company’s progress in core processes and advanced packaging technologies. During his speech, Tan drew the company’s priorities and drives for the next phase of its foundry strategy. Specifically, Tan
- [ROHM's New SiC MOSFET Integrates in Semikron Module](https://aei.dempa.net/archives/33059) - ROHM Semiconductor has announced that SMA Solar Technology AG, a leading global specialist in photovoltaic and storage system technology, has adopted Semikron Danfoss’ Module featuring ROHM’s latest 2kV SiC MOSFETs for its new large-scale power conversion solution “Sunny Central FLEX.” This modular platform is designed to streamline and enhance grid connections for photovoltaic installations, battery storage
- [Bosch to Surge Tech Lead in Quantum Sensors](https://aei.dempa.net/archives/33050) - To solidify further Bosch’s prowess in this field, it is expanding its technological lead and the company is expanding its collaboration with Element Six.
- [OKI to Soar AI Grit With New PCB Tech Test](https://aei.dempa.net/archives/33044) - OKI has developed a 124-Layer PCB technology for wafer inspection designed next-generation AI chip testing equipment.
- [Microchip’s New Power Module to Boost Edge AI](https://aei.dempa.net/archives/33039) - The trend towards edge artificial intelligence (AI) has been growing of late. Essentially, edge AI refers to the deployment of AI algorithms and AI models on local edge devices. Among them are sensors or IoT devices. Thus, enabling processing of data in real-time without the need for any cloud solutions. However, AI at the edge
- [Tokyo Electron Completes New Building in Miyagi](https://aei.dempa.net/archives/33035) - Tokyo Electron has announced that its development and manufacturing subsidiary, Tokyo Electron Miyagi (Taiwa-cho, Miyagi), has completed its new development building (Development Building No. 3). The company held completion ceremony Thursday (Apr. 24). As the transition to a digital society accelerates, the demand for semiconductors is likely to grow significantly. Thus, the increasing complexity and
- [TSMC’s New 1.4nm Tech Process to Start 2028](https://aei.dempa.net/archives/33029) - TSMC has announced its next cutting-edge logic process technology, A14 (1.4nm), at the company’s North America Technology Symposium. Accordingly, the forthcoming 1.4nm-class technology will make significant advancements from the N2 (or 2nm) process. TSMC Chairman and CEO Dr. C.C. Wei said the A14 will form part of the company’s cutting-edge solutions that will connect physical
- [Intel, Nexalus to Deliver Cooling Tech in Edge, Data Center](https://aei.dempa.net/archives/33024) - As artificial intelligence (AI) usage grows across numerous devices powering a new AI-centric era, so too does the demand for computing. Moreover, that demand takes power to run the central processing units (CPUs), graphics processing units (GPUs), and network cards. Point in case are communications boxes that are located on telecommunications transmission towers. These towers
- [OMRON, Cognizant to Boost Unique IT-OT in Factories](https://aei.dempa.net/archives/33018) - OMRON Corporation and Cognizant have signed a strategic partnership to integrate Information Technology (IT) and Operational Technology (OT) in the manufacturing industry. The collaboration includes Cognizant being chosen as the engineering partner for OMRON's Industrial Automation Business (IAB) products. OMRON, known for its advanced automation technology, and Cognizant, with expertise in IT-OT convergence, will offer
- [MinebeaMitsumi to Boost Capacity With New Cebu Line](https://aei.dempa.net/archives/33015) - MinebeaMitsumi Inc. has broke the ground for its new building No. 14 of its Cebu Mitsumi Danao Plant. Located in Danao City in the central Philippine province of Cebu, the new building is part of MinebeaMitsumi’s effort to expand the Cebu Plant’s production capacity. Since its establishment in January 1989, the Cebu Plant has continued
- [Intel to Sell Majority Stake in Altera to Silver Lake](https://aei.dempa.net/archives/33006) - Intel Corporation has entered into a definitive agreement to sell 51% of its Altera business to Silver Lake, a global leader in technology investing. Accordingly, the transaction, which values Altera at US$8.75 billion, establishes Altera’s operational independence. Thus, this makes it the largest pure-play field programmable gate array (FPGA) semiconductor solutions company. Altera offers a
- [ASMPT Boosts Precision SMT Grit to Meet Needs in AI](https://aei.dempa.net/archives/33002) - Because of the rapid development of artificial intelligence, demand for processors have been growing. Consequently, this unprecedented demand for processors also place great pressure on electronics manufacturing. Specifically, in the placement and assembly phase. Processors are becoming ever larger and more powerful. Over the last three years, the size of processors has grown at an
- [Global Chip Equipment Billings Surge to Record High](https://aei.dempa.net/archives/32997) - Global industry association SEMI said worldwide sales of semiconductor manufacturing equipment increased 10 percent to US$117.1 billion in 2024. According to SEMI, citing data from its Worldwide Semiconductor Equipment Market Statistics (WWSEMS) report, the 2024 figure is higher than the US$106.3 billion in 2023. In 2024, the global front-end semiconductor equipment market experienced notable growth,
- [New Quantum Mission to Propel India’s Tech Dominance](https://aei.dempa.net/archives/32986) - Two years ago on April 19, the Indian government has approved the creation of the National Quantum Mission (NQM) and allocated a Rs. 6,003.65 crore (about 60 billion Indian rupees) over the next eight years. Accordingly, the main goal is to nurture and scale up the country’s quantum technology ecosystem. Heading the gigantic task is
- [New Center to Lift Kokusai Electric's U.S. Market Grit](https://aei.dempa.net/archives/32976) - KOKUSAI ELECTRIC will soon establish a new new demo center in Oregon, United States. Specifically, the new center will aim to strengthen its demo evaluation function and support system for U.S. semiconductor device manufacturers. Aiming to start operation in September 2026, the center will accelerate the development of semiconductor manufacturing technologies that are becoming increasingly
- [ST to Surge Operation Footprint With More Investments](https://aei.dempa.net/archives/32973) - STMicroelectronics will reinforce its program that aims to reshape its global manufacturing footprint and solidify its position as a global chip leader.
- [ROHM to Soar High Power MOSFETs for AI Servers](https://aei.dempa.net/archives/32964) - ROHM Semiconductor has developed N-channel power MOSFETs featuring industry-leading* low ON-resistance and wide SOA capability. They are designed for power supplies inside high-performance enterprise and AI servers. The advancement of high-level data processing technologies and the acceleration of digital transformation have increased the demand for data center servers. At the same time, the number of servers
- [Infineon to Boost Automotive Grit in New Marvell Deal](https://aei.dempa.net/archives/32961) - Automotive field is one of the major growth drivers for the electronics and related industries. In fact, several chip and component makers are beefing up their capabilities to meet the growing demand in the said field. Infineon Technologies AG has been accelerating the build-up of its system capabilities for software-defined vehicles. Thus, it has moved
- [Mabuchi Motor to Boost India Line With New Sales Base](https://aei.dempa.net/archives/32958) - Mabuchi Motor Co., Ltd. has established a sales company in India to propel sales of products in the automotive and industrial fields.
- [AMD to Boost Grit in AI Data Center With New Buyout](https://aei.dempa.net/archives/32953) - AMD forecasted last year that the data center AI accelerator market will grow to US$500 billion by 2028. For that reason, the company has been pushing through its commitment to deliver open innovation at scale through its expanded silicon, software, network, and cluster-level solutions. To make this possible, AMD has announced to have completed the
- [Stratasys’ New Deal to Cut Production Cost, Lead Time](https://aei.dempa.net/archives/32949) - Stratasys Ltd. has partnered with German-based software company, trinckle 3D GmbH, to integrate its fixturemate™ software into Stratasys’ industry-leading GrabCAD Print™ Pro software package. This integration will complete Stratasys’ tooling workflow. It allows for simplified fixtures design by non-CAD-designers and broaden the range of users who can benefit from the capabilities of GrabCAD® software, expanding the
- [Philippines Creates Body to Boost Electronics Industry](https://aei.dempa.net/archives/32943) - Philippine President Ferdinand Marcos Jr. has created the Semiconductor and Electronics Industry (SEI) Advisory Council. Accordingly, the new body will aim to strengthen the country’s semiconductor and electronics industry and ensure global competitiveness. In the administrative order, the council will serve as the President’s primary advisory body on the semiconductor and electronics industry’s development, promotion,
- [UMC to Soar 22nm Grit in New Fab Growth in Singapore](https://aei.dempa.net/archives/32936) - United Microelectronics Corporation (UMC) unveiled Tuesday (April 1) its new fab facility in Singapore. Accordingly, the first phase of the new facility will start volume production in 2026. Thus, bringing UMC’s total production capacity in Singapore to more than 1 million wafers annually. It will also be one of the most advanced semiconductor foundries in
- [TSMC Marks New Milestone in 2nm Expansion](https://aei.dempa.net/archives/32921) - TSMC held Monday the expansion ceremony of its 2nm capacity at its construction site of Fab 22 in the Southern Taiwan Science Park (STSP). Moreover, it brought together representatives from government as well as construction and supplier partners to mark an important milestone in the expansion of the company's advanced process capacity. TSMC is developing
- [Hitachi High-Tech to Boost Key Tech in New Business Integration](https://aei.dempa.net/archives/32928) - Hitachi High-Tech Corporation is strengthening its analytical business by integrating and jointly operating its Hitachi High-Tech Analytical Science Ltd. and Hitachi High-Tech Science Corporation businesses. As of April 1, 2025, Hitachi High-Tech Science will become Hitachi High-Tech Analysis Corporation as part of this re-structure. Hitachi High-Tech said integrating the core technologies of the two companies
- [TORAY to Soar IC Packaging With New Tool](https://aei.dempa.net/archives/32915) - Toray Engineering Co., Ltd. has developed the UC5000, a high-accuracy semiconductor packaging equipment (bonder) for panel level packaging (PLP). PLP is an advanced semiconductor packaging technology, for which there is growing demand particularly from AI servers. Sales of the UC5000 will commence in April 2025.This system is capable of packaging chips with a high accuracy
- [Mitsubishi To Build New FA Line in China](https://aei.dempa.net/archives/32903) - Mitsubishi Electric Corporation will establish on April 1 Mitsubishi Electric Intelligent Manufacturing Technology (China) Group Co., Ltd. in Suzhou, China. Specifically, this will become a key region for its factory automation (FA) systems business. The new company will oversee product planning, development, manufacturing, and sales, aiming to establish autonomous business operations to raise competitiveness by
- [Demonstrating Flexible, Powerful 5-axis Laser Micromachining](https://aei.dempa.net/archives/32874) - Five-axis scan heads offer fast and flexible solutions for generating precise holes, contoured slots and other geometries with fully defined cross sections. With a suitable system, it is possible to control the entire micro-machining process – the laser, scan head and workpiece positioning – to produce macro-sized components to sub-micrometer dimensional tolerances.This paper outlines the
- [SEMI Sees Fab Equipment Spending to Grow More in 2025](https://aei.dempa.net/archives/32909) - Global industry association SEMI forecasted that fab equipment spending for front-end facilities in 2025 will likely increase by 2 percent year-over-year to US$110 billion. Accordingly, this will mark the sixth consecutive year of growth since 2020.SEMI, in its latest quarterly World Fab Forecast report, said fab equipment spending is projected to rise by 18 percent
- [Philippine Electronics to Soar Grit Amid Trying Times](https://aei.dempa.net/archives/32898) - Recent geopolitical tensions have changed global economic landscapes, prompting companies to expand and collaborate beyond their traditional borders. For that reason, Southeast Asia has not only emerged as a viable alternative, but its semiconductor industry has also scored remarkable growth. The Philippines is one of the countries in the region that has continuously expanded its
- [New Industry Alliances to Surge NVIDIA Grit in AI](https://aei.dempa.net/archives/32859) - At the GTC 2025, which runs until March 21, NVIDIA Corporation announced several collaborations with industry players in an effort to innovate further the applications of artificial intelligence (AI). https://aei.dempa.net/archives/tag/NVIDIADuring his keynote, NVIDIA founder and CEO Jensen Huang said NVIDIA will work with General Motors (GM) on next-generation vehicles, factories, and robots using AI, simulation,
- [NVIDIA Tracks its Next Evolution in AI Platform](https://aei.dempa.net/archives/32847) - NVIDIA has announced at the annual GTC the next evolution of its NVIDIA Blackwell AI factory platform, the NVIDIA Blackwell Ultra. Accordingly, this will pave the way for "the age of AI reasoning". Moreover, Jensen Huang, founder and CEO of NVIDIA, also unveiled the timeline of the company's next-generation GPUs until 2028 that will complement
- [Fuji Electric to Surge Grit in AI With New Funding](https://aei.dempa.net/archives/32844) - Fuji Electric Co., Ltd. has announced investing in Hutzper Inc., a start-up company that provides AI services for the manufacturing industry. The introduction of smart factories that improve productivity and save energy is progressing in the manufacturing industry. For that reason, Fuji Electric wants to boost its own conversion of its factories into smart factories.
- [Sunwoda to Surge With New US$1B Line in Thailand](https://aei.dempa.net/archives/32841) - The Thailand government has approved an investment by a unit of China’s Sunwoda Electronic Co., Ltd. worth more than US$1 billion for the production of electric vehicle (EV) and energy storage system batteries at the cell level. In a separate event, Thai Prime Minister Paetongtarn Shinawatra emphasized the government's dedication to bolstering investor confidence to
- [TSMC, MediaTek Eye Innovative Wireless Connectivity](https://aei.dempa.net/archives/32836) - MediaTek and TSMC have jointly demonstrated Wednesday (March 12) the first silicon-proven power management unit (PMU) and integrated power amplifier (iPA) on TSMC’s N6RF+ process. What makes this feat significant is because it has become possible to integrate these two essential components into a system-on-chip (SoC) on an advanced RF process for wireless connectivity products.
- [New Renesas-Altium Solution to Make Better Systems](https://aei.dempa.net/archives/32829) - Renesas Electronics Corporation and Altium have introduced Renesas 365, Powered by Altium, the first-of-its-kind industry solution. Specifically, designed to streamline electronics system development from silicon selection to system lifecycle management. This transformative solution will be demonstrated at embedded world, Booth 5-371, March 11-13, in Nuremberg, Germany, and is expected to be available in early 2026.
- [New Hub to Surge Malaysia’s Clout in IC Design](https://aei.dempa.net/archives/32823) - The Malaysian government has been scoring significant milestones recently, boosting further its strategic shift in the global semiconductor ecosystem.
- [NVIDIA to Make First Keynote Debut at COMPUTEX](https://aei.dempa.net/archives/32817) - Organizers of the annual COMPUTEX confirmed Tuesday that NVIDIA founder and Chief Executive Officer Jensen Huang will make his first keynote appearance at the forthcoming COMPUTEX 2025. Specifically, Taiwan External Trade Development Council (TAITRA), which is one of the organizers of COMPUTEX, said Huang will outline the company’s latest advancements and breakthroughs in AI and
- [ASML, imec to Boost Innovative Chip Research in Europe](https://aei.dempa.net/archives/32812) - ASML Holding N.V. (ASML) and imec, a leading research and innovation hub in nanoelectronics and digital technologies, have agreed Tuesday (March 11) to collaborate on new strategic partnership focusing on research and sustainability.The agreement will run for five years and aims to deliver valuable solutions in two areas.Accordingly, the agreement aims to bring together the
- [Toray's to Reinforce Tech, R&D in Latest Taiwan Line](https://aei.dempa.net/archives/32806) - Toray Industries, Inc., has opened the Toray Taiwan Technical Center. The new facility will reinforce R&D in advanced semiconductor technologies and materials and provide technical services in the Taiwan market, which is becoming increasingly important in the global semiconductor supply chain. The Toray Group operates globally, providing a range of semiconductor, electronic component, and display
- [SK keyfoundry’s New Sensor to Offer Better Features](https://aei.dempa.net/archives/32803) - Korean 8-inch pure-play foundry SK keyfoundry has introduced its latest 3D Hall-effect sensor with more precise speed and direction.
- [Murata Taps ROHM Tech to Lift AI Server Power Supplies](https://aei.dempa.net/archives/32799) - ROHM said its EcoGaN series of 650V GaN HEMTs in the TOLL package has been adopted for AI server power supplies by Murata Power Solutions.
- [Malaysia to Boost IC Design Might in New Arm Deal](https://aei.dempa.net/archives/32792) - The Malaysian government has confirmed striking a deal with Arm, the chip design company of the Japan-headquartered Softbank. In an exclusive interview aired over Bloomberg, Malaysian Economic Minister Rafizi Ramli said the deal with Arm involves Malaysia investing US$250 million to Arm over a period of 10 years for the access of chip IP designs.
- [FUJI’s Innovative SMT Line to Realize Smart Factory](https://aei.dempa.net/archives/32786) - FUJI Smart Factory Platform NXTR A model The NXTR A model, part of the FUJI Smart Factory Platform, is a revolutionary pick-and-place machine that is redefining the standards of automation in the manufacturing industry. This model is designed to enhance productivity, maintain high-quality standards, and reduce the need for manual intervention, thereby streamlining the production
- [Apple to Surge Manufacturing With New US$500M Funding](https://aei.dempa.net/archives/32760) - Apple has announced what it called its largest-ever investment commitment of US$500 billion in the United States over the next four years. Specifically, the pledge includes builds on Apple’s long history of investing in American innovation and advanced high-skilled manufacturing. At the same time, it will support a wide range of initiatives that focus on
- [TSMC to Soar Grit in AI With New US$100B U.S. Funding](https://aei.dempa.net/archives/32770) - TSMC will increase its U.S. investment in advanced chip manufacturing with 3 new fabs, two packaging lines, and an R&D center.
- [Breakthrough Intel Xeon 6 to Offer Better Power Saving](https://aei.dempa.net/archives/32765) - With the prevalence of 5G core networks, infrastructure efficiency, power savings, and performance have been crucial for communication service providers. Processors play role in achieving these criteria. For that reason, Intel Corporation has announced that its Intel Xeon 6 processors with Efficient-cores (E-cores) have accelerated time-to-market adoption for the company's solutions in collaboration with the
- [Taiwan’s TEEMA, India’s EPIC Seal Economic Ties](https://aei.dempa.net/archives/32755) - In a strategic bid to bolster trade partnerships between India and Taiwan, EPIC Foundation, a non-profit organization founded by HCL co-founders Dr. Ajai Chowdhry and Arjun Malhotra, has signed a Memorandum of Cooperation (MOC) with Taiwan Electrical and Electronic Manufacturers' Association (TEEMA). Moreover, the partnership aims to transform India into a self-reliant electronics product nation.
- [Western Digital Spins Off Flash Memory Business](https://aei.dempa.net/archives/32750) - Western Digital has announced separating its Flash business. In a statement, Irving Tan, Chief Executive Officer of Western Digital, said, "Today marks a new milestone for Western Digital – with our company separation now complete, we are once again fully focused on our pioneering hard disk drive (HDD) business.” In addition, Tan said, “Our rich
- [Shindengen's New Power MOSFTET to Suit Automotive Need](https://aei.dempa.net/archives/32741) - Shindengen Electric Manufacturing has launched its next-generation power MOSFET “TOLL Package Series” for automotive applications. With the rapid spread of electrified mobility in recent years, there is a demand for components that can withstand voltages of 100 to 200V and handle high currents. Specifically, in line with the installation of high-voltage batteries. In addition, to
- [TDK to Show Latest Novel Tech at Embedded World](https://aei.dempa.net/archives/32735) - TDK Corporation is set to present its latest tech advancements at embedded world 2025 from March 11 to 13 in Nuremberg, Germany.
- [ASMPT’s New LED Die Bonder to Suit Production Needs](https://aei.dempa.net/archives/32732) - ASMPT, which supplies hardware and software for semiconductor and electronics manufacturing, presents Vortex II, a high-performance die bonder. Specifically, the machine plays a crucial role in producing mini LED displays, such as those used in the automotive industry.According to Jonathan Ku, Senior Director of Business Development at ASMPT, high-resolution, ergonomic LED displays in modern cars
- [Elevation to Offer New Automotive-Grade LED Driver Solutions](https://aei.dempa.net/archives/32728) - Elevation Microsystems has announced the launch of three advanced automotive-grade (AEC-Q100 Qualified) LED driver solutions: the EV5400, EV5441Q, and EV5491Q, designed to meet the evolving needs of automotive lighting systems. Thus, the company reinforces its aim of delivering energy-efficient high-voltage power management solutions for sustainable electrification. All four devices combine cutting-edge thermal management, diagnostic features,
- [ASE to Surge IC Packaging, Test With New Penang Line](https://aei.dempa.net/archives/32721) - Advanced Semiconductor Engineering, Inc. (ASE), a provider of semiconductor manufacturing services in packaging and test, has officially launched its fifth plant in Penang, Malaysia. Accordingly, this will further strengthen the company’s packaging and testing capabilities with the new plant in the Bayan Lepas Free Industrial Zone.The new plant is part of a strategic expansion plan
- [Yamaha to Boost Robotics Line in Latest Reorg](https://aei.dempa.net/archives/32718) - Yamaha Motor Co., Ltd. has recently bared its new medium-term management plan for the next three years from 2025 to 2027. Specifically, the company will give weight to its robotics business and announced the reorganization of its wholly owned subsidiary, Yamaha Robotics Holdings. The company plans to further promote one-stop smart solutions. The new medium-term
- [IC Packaging Group Boosts Might, Adds 3M as New Member](https://aei.dempa.net/archives/32713) - Resonac Corporation has welcomed the addition of 3M Company (ST. PAUL, Minn. United States) as a new member of the US-Joint consortium. Accordingly, with this addition, US-JOINT now comprises 12 companies from Japan and the United States. Resonac took the lead in the establishment of the US-JOINT consortium*1 for next-generation semiconductor packaging. "As the demands
- [Silitech Moves to Soar Battery Grit in FDK Deal](https://aei.dempa.net/archives/32710) - Silitech Technology Corporation has moved to launch a public tender offer for the common shares of FDK Corporation, which manufactures and sells various types of batteries and electronic devices. Accordingly, Silitech's move aims to keep the company at pace with the advancements of AI technology, which would require devices to have durable batteries.The planned number
- [Hitachi's New Process to Offer Better Production Yield](https://aei.dempa.net/archives/32683) - Hitachi, Ltd. and Hitachi High-Tech Corporation are developing a Manufacturing Process Improvement Solution to help find optimal manufacturing processes.
- [ULVAC to Make Way for New Li Deposition System](https://aei.dempa.net/archives/32698) - ULVAC, Inc. has announced the EWK-030, a state-of-the-art roll-to-roll deposition system designed for lithium coating applications.
- [Infineon to Soar 200mm SiC Grit With First Release](https://aei.dempa.net/archives/32701) - Infineon Technologies AG has made significant progress on its 200mm silicon carbide (SiC) roadmap. Specifically, the company will already release the first products based on the advanced 200 mm SiC technology to customers in Q1 2025.Manufactured in Villach, Austria, the products provide SiC power technology for high-voltage applications, including renewable energies, trains, and electric vehicles.
- [ROHM' New Resistor Line to Offer Better Performance](https://aei.dempa.net/archives/32695) - ROHM's new chip resistor portfolio aims to achieve greater miniaturization and enhanced performance across a variety of applications.
- [Mitsubishi's New Foray to Boost Tech for Power Modules](https://aei.dempa.net/archives/32680) - Mitsubishi Electric Corporation said it will develop a prototype to demonstrate junction-temperature estimation technology for power modules.
- [NXP to Soar NPU, AI Grit With Kinara Buyout](https://aei.dempa.net/archives/32671) - With Kinara’s acquisition, NXP will fortify its portfolio with cutting-edge NPUs and AI software.
- [ASMPT’s New Tech to Advance Smarter Factories](https://aei.dempa.net/archives/32667) - Recently, product change in the surface mount line manual downloading at each machine. Thus, exposing the SMT line to more tedious processes and the possibility of errors. For that reason, ASMPT has made further advancements in implementing automation in product changeovers on the surface mount technology (SMT) line. Specifically, the company has introduced the Automated
- [Xnergy Develops Wireless Charging Tool for AMRs, AGVs](https://aei.dempa.net/archives/32662) - Xnergy Autonomous Power Technologies (Xnergy), a leading provider of high-power wireless charging solutions for autonomous electrified mobility, has developed the Phoenix­—a compact high-power contactless charger. Specifically, it is dedicated for smaller applications such as delivery and service robots, smaller AMRs, and AGVs. With its high-power density, Phoenix offers global mobile robot and mobility OEMs the
- [Infineon Boosts Footprint With New Thai Backend Fab](https://aei.dempa.net/archives/32651) - Infineon has broken ground for a new semiconductor backend site in Samut Prakan, south of Bangkok, optimizing its footprint.
- [HORIBA's New Controller to Offer Better Mass Flow](https://aei.dempa.net/archives/32647) - HORIBA STEC, Co., Ltd. announced the release of the DZ-107 as the latest model in its series of ultra-thin mass flow controllers.This product increases full-scale flow*1 by approximately seven times that of previous models and achieves a maximum mass flow of 20 SLM*2, the highest in its class*3, while maintaining an ultra-thin 10 mm width. The
- [DNP to Surge Photomask Pitch for More Innovative ICs](https://aei.dempa.net/archives/32642) - Semiconductor manufacturing involves complex process and semiconductor equipment play crucial roles.A semiconductor process has two major processes. First, the front-end process enables the film to form on the surface of a wafer made of silicon or other raw material and a circuit is drawn on it. Second, the back-end process in which the wafer is
- [Teradyne to Soar Robotics Grit in ADI Collab](https://aei.dempa.net/archives/32633) - Teradyne Robotics and Analog Devices have sealed a strategic partnership aiming to accelerate advanced robotics usage.
- [ASMPT’s New Tech to Advance Smarter Factories](https://aei.dempa.net/archives/32629) - ASMPT has made further advancements in implementing automation in product changeovers on the SMT line through its WORKS Operations Suite.
- [New Singapore Facility to Boost Micron’s HBM Grit](https://aei.dempa.net/archives/32625) - Micron Technology has recently broken the ground for its new HBM advanced packaging facility in Singapore, expanding its presence in the region.
- [DX, Manufacturing Soar Thai Investments to New Heights](https://aei.dempa.net/archives/32618) - The Thailand Board of Investment (BOI) announced that applications for investment promotion in 2024 soared 35% in value to 1.14 trillion baht.
- [More Investments to Soar India’s Electronics Ecosystem](https://aei.dempa.net/archives/32607) - Dr Veerappan, Chairman of IESA, said the country will likely witness drastic improvements in its electronics and semiconductor ecosystem in the next ten years.
- [New Malaysia-Singapore Zone to Lift Region's Might](https://aei.dempa.net/archives/32601) - The recent meeting of Malaysian Prime Minister Dat' Seri Anwar Ibrahim and Singapore Prime Minister Lawrence Wong at the Malaysia-Singapore Leaders' Retreat in early January has sealed the ambitious cross-border Johor-Singapore Special Economic Zone (JS-SEZ). Accordingly, the JS-SEZ marks a key milestone in Malaysia and Singapore's bilateral relationship, which will mark its 60th year this
- [GF to Unveil New High Tech Facility in New York](https://aei.dempa.net/archives/32594) - GlobalFoundries has announced plans to create a new center for advanced packaging and testing of U.S.-made chips in its New York facility.
- [Aerotech’s New 6DoF System to Offer Better Accuracy](https://aei.dempa.net/archives/32590) - Aerotech Inc. has introduced the HexGen HEX150-125HL Miniature Hexapod, a six-degree-of-freedom (DOF) precision positioning system.
- [Demand Surge to Aim IC Fab Constructs to New Heights](https://aei.dempa.net/archives/32584) - Several chipmakers have already started or are about to begin new fab construction to meet the demand growth for semiconductors.
- [NVIDIA’s Novel AI to Further Soar Self Driving Cars](https://aei.dempa.net/archives/32576) - NVIDIA Corporation has used the CES 2025 stage to nail its mark in the industry further as the leader in artificial intelligence (AI)-powered technology.
- [Novel In-Car Tech to Make More Room for Lelon’s Growth](https://aei.dempa.net/archives/32573) - Lelon said the weakened car market would prompt carmakers to innovate further in-car technologies in a bid to boost sales.
- [JUKI Platform to Set New Standard in Post Mounting](https://aei.dempa.net/archives/32570) - JUKI has introduced its JM-E01 multitask platform that enables insertion of large, irregular-shape components into a single unit.
- [Latest ASMPT Suite to Offer Better Production](https://aei.dempa.net/archives/32565) - To enable a continuous planning and optimization process, ASMPT's WORKS software suite works together in a backchannel loop.
- [GAC Honda to Kick Off New EV Line in Guangzhou](https://aei.dempa.net/archives/32558) - Honda Motor (China) has started the operation of its newly-constructed plant for new energy vehicle production in Guangzhou in China.
- [Toyoda Gosei to Lift Industrial LED Lights in New Deal](https://aei.dempa.net/archives/32553) - Toyoda Gosei Co., Ltd. has invested* in Pi Photonics, Inc., which develops and sells LED lighting equipment for industrial use
- [Rapidus to Soar 2nm With Japan's First EUV Line](https://aei.dempa.net/archives/32548) - Rapidus Corporation said it has delivered and started the installation of an EUV exposure tool manufactured by ASML of the Netherlands.
- [NVIDIA's New Platform to Make Gen AI More Affordable](https://aei.dempa.net/archives/32544) - NVIDIA Corporation has introduced Wednesday its new compact generative AI supercomputer that offers superior performance at lower price.
- [India to Soar Grit as Global Chip Hub](https://aei.dempa.net/archives/32541) - India has been mustering efforts to become a global chip hub and the recent move by Tata Electronics to establish a wafer fab will further fuel this endeavor.
- [Mitsubishi to Eye New Heat Pump Factory in U.S.](https://aei.dempa.net/archives/32525) - Mitsubishi Electric Corporation said it will invest U.S.$ 143.5 million to retrofit a U.S.-based factory. Specifically, it will make variable-speed compressors that are key components of high-efficiency heat pumps. As part of Mitsubishi Electric US Holdings, Inc., the Maysville, Kentucky-based factory of Mitsubishi Electric Automotive America, Inc. currently manufactures and sells automotive electrical equipment. Meets Growing
- [Foxconn Subsidiary Gets Go Signal for New Thai Line](https://aei.dempa.net/archives/32529) - Taiwanese semiconductor manufacturer Foxsemicon Integrated Technology (FITI) has secured privileges from Thailand Board of Investment (BOI) for an investment budget of 10.5 billion baht (around US$306 million). Accordingly, the company will build a factory to produce critical components and modules and systems for semiconductor equipment. UniEQ Integrated Technology Ltd. applied the investment privileges on behalf
- [ROHM, TSMC to Expand Automotive Grit in New Deal](https://aei.dempa.net/archives/32522) - ROHM and TSMC have entered a strategic partnership on development and volume production of gallium nitride (GaN) power devices. Accordingly, this product will target electric vehicle applications. The partnership will integrate ROHM's device development technology with TSMC's industry-leading GaN-on-silicon process technology. Thus, aiming to meet the growing demand for superior high-voltage and high-frequency properties over
- [Yokogawa to Soar OpreX Tech in Subsea Power Cable](https://aei.dempa.net/archives/32516) - Yokogawa Electric nnounces the release of OpreX™ Subsea Power Cable Monitoring to monitor the conditions of monitoring cables in wind power facilities.
- [TEL to Offer New High Tech Tool for Memory Devices](https://aei.dempa.net/archives/32513) - TEL has expanded its line of sputtering systems with the release of LEXIA™-EX, which builds on technologies developed for memory devices.
- [Apic Yamada to Surge IC Packaging With High Tech Tool](https://aei.dempa.net/archives/32508) - Apic Yamada Co., Ltd. has developed the MS-R series, a molding machine that is ideal for packaging a wide variety of semiconductors.
- [NXP-Led Tech Firms to Surge Grit With New Plant](https://aei.dempa.net/archives/32503) - VisionPower Semiconductor Manufacturing Company Pte Ltd (VSMC), the joint venture formed in September, 2024 by Vanguard International Semiconductor Corporation (VIS) and NXP Semiconductors N.V. (NXP), has celebrated breaking ground at the site of the joint venture’s new 300mm wafer manufacturing facility in Tampines, Singapore. The groundbreaking ceremony was attended by customers, suppliers, partners, association representatives,
- [FANUC America Releases New Heavyweight Robot](https://aei.dempa.net/archives/32496) - FANUC, a world leader in Robotics, Factory Automation and ROBOMACHINEs introduces the M-950iA heavyweight industrial robot. Particularly, to new robot can lift 500kg—including automotive components, construction materials and EV battery packs. Fitting perfectly between FANUC’s M-900iB and M-1000iA families, the serial-link structured M-950iA/500 offers a much wider range of motion than standard parallel-link robots, offering
- [Tamura to Build New Facility for Solder Powder](https://aei.dempa.net/archives/32489) - Tamura Corporation has decided to construct new production facility in Sayama site in Saitama Prefecture, Japan. Particularly, this is one of the production sites of Electronic Chemicals/FA Systems Business Sector. Mainly, the Electronic Chemicals and FA Systems business involves solder pastes, reactors and soldering equipment. Primarily, the major business activities of Electronic Chemicals/FA Systems Business
- [Hitachi High-Tech Launches New DCR Etch System](https://aei.dempa.net/archives/32483) - Hitachi High-Tech Corporation has announced the launch of its DCR*1 Etch System 9060 Series. Primarily, this system leverages Hitachi High-Tech's plasma etching*2 technology and expertise. It has been developed to achieve precise control over the horizontal (isotropic) etching process in dry environments. Mainly, it is aimed at applications such as the high-aspect*3 three-dimensional structures used
- [Renesas New Quad-Core MPU Lifts Industrial Control](https://aei.dempa.net/archives/32477) - Renesas Electronics Corporation has launched the RZ/T2H, the highest performance microprocessor (MPU) offered for industrial equipment. Thanks to its powerful application processing and real-time performance, the RZ/T2H is capable of high-speed, high-precision control of industrial robot motors for up to 9 axes. Also, it supports a variety of network communications including Industrial Ethernet on a
- [Valeo and ROHM Co-Develop New Power Modules](https://aei.dempa.net/archives/32467) - Valeo Group, a leading automotive parts manufacturer, and ROHM Co., Ltd., a major semiconductor and electronic components manufacturer, aim to develop next-generation power modules for traction inverters. To this end, they are bringing together their know-how in power electronics management. Mainly, the two companies will combine their expertise in the field of power electronics to
- [Advantech’s New Computer Fits in the Age of AI × IoT](https://aei.dempa.net/archives/32461) - Advantech Co., Ltd. has announced the release of the latest AI industrial computer IPC-730. Particularly, this product has a high-power power supply, excellent heat dissipation performance, and a front I/O interface compatible with ATX/mATX motherboards. In addition, the CPU/GPU hybrid computing performance and precision-optimized mechanical structure make the IPC-730 an ideal solution for machine vision
- [Taiwan to Jump into Quantum with New IQM Computer](https://aei.dempa.net/archives/32456) - The Taiwan Semiconductor Research Institute (TSRI) under the National Applied Research Laboratories has procured of its first full-stack quantum computer from IQM Quantum Computers (IQM), a global leader in designing, building, and selling superconducting quantum computers. The delivery and installation of the system at TSRI’s premises will take place in the second quarter of 2025.
- [3D Printing to Get Boost in New Consortium](https://aei.dempa.net/archives/32452) - At Formnext 2024, a new consortium has been announced to address key challenges related to the adoption and scale-up of 3D printing technology in industrial applications. The consortium "Leading Minds" includes Ansys, EOS, HP, Materialise, Nikon SLM, Renishaw, Stratasys and TRUMPF. Particularly, the consortium aims to overcome the many barriers that prevent the adoption of
- [Yamaha Brings New Innovations to electronica](https://aei.dempa.net/archives/32446) - Yamaha Robotics SMT section presented innovations in high-speed surface-mount inspection at electronica 2024. Primarily, it demonstrated the latest AI skills and special features for applications, including LED lighting, e-mobility, and mechatronics. YRi-V 2D/3D AOI System Particularly, Yamaha’s YRi-V 2D/3D automatic optical inspection (AOI) systems now come with special features. They simplify checking the alignment and
- [Applied to Scale OLED Manufacturing with New Solution](https://aei.dempa.net/archives/32440) - Applied Materials, Inc. has introduced the MAX OLED™ solution, a patented OLED pixel architecture and revolutionary display manufacturing technology. Primarily, MAX OLED is designed to bring the superior OLED displays found in high-end smartphones to tablets, PCs, and eventually, TVs. OLED is the display technology of choice for the world’s leading smartphone manufacturers. Mainly, it
- [MCG Puts up New Japan Plant for Chip Cleaning](https://aei.dempa.net/archives/32437) - Shinryo Corporation, a member of the Mitsubishi Chemical Group (MCG), will strengthen its semiconductor precision cleaning business in Japan. Particularly, it will establish a new plant in Fukushima Prefecture and expand its Iwate Plant for semiconductor precision cleaning. This initiative aims to increase Shinryo’s capacity for cleaning parts, including those used in semiconductor manufacturing equipment.
- [Mitsui Chemicals Completes New R&D Site in Nagoya](https://aei.dempa.net/archives/32429) - Mitsui Chemicals, Inc. has celebrated the completion of construction work on the Creative Integration Lab.™ (CIL), a new R&D site located within the company’s Nagoya Works in Nagoya, Aichi. The company held a completion ceremony on Oct. 30. Primarily, the CIL is intended to enhance Mitsui Chemicals’ capabilities for offering solutions via co-creation with customers.
- [Resonac Turns to AI in New Material Exploration Tool](https://aei.dempa.net/archives/32423) - Resonac Corporation has developed a proprietary technology that utilizes artificial intelligence (AI) to explore the optimum composition of materials in one-fifth the time of exploring with conventional methods. Applying this technology, Resonac has successfully identified a polymer that serves as a raw material for photosensitive resins used in semiconductor packaging resists. Following this proof of
- [MiR Cobot to Drive Automation to New Heights](https://aei.dempa.net/archives/32412) - Mobile Industrial Robots (MiR) has announced the MC600 mobile collaborative robot (cobot), the latest addition to its growing list of MiR Go Approved products. Particularly, MC600 is capable of handling payloads up to 600kg. Also, it combines the MiR600 mobile robot base with the UR20/UR30 collaborative robot arms from Universal Robots (UR) to automate complex
- [China Outpaces Japan, Germany in New Robot Adoption](https://aei.dempa.net/archives/32409) - Robot adoption in factories around the world continues at high speed. Particularly, the new global average robot density reaches a record 162 units per 10,000 employees in 2023 - more than double the number measured only seven years ago (74 units). This is according to the World Robotics 2024 report, presented by the International Federation
- [SK hynix Brings New 321-High NAND to Mass Production](https://aei.dempa.net/archives/32398) - SK hynix Inc. has started mass production of the world's first triple level cell1-based 321-high 4D NAND Flash with 1Tb capacity. SK hynix was the first supplier of the NAND with more than 300 layers through a technological breakthrough for stacking. This follows its previous record as the industry's first provider of the world's highest
- [SCREEN Launches New 200mm Wafer Cleaning System](https://aei.dempa.net/archives/32392) - SCREEN Semiconductor Solutions Co., Ltd. (SCREEN SPE) has finalized the development of the SS-3200 cleaning system for 200mm wafers. Particularly, this new model for 200mm wafers, in its single wafer cleaning systems lineup, uses the scrubber method1 (spin scrubbers). Due to these systems’ outstanding cleaning performance, stability, and reliability, SCREEN SPE boasts the top global
- [Samsung Reaches Key Milestone at New Chip R&D Complex](https://aei.dempa.net/archives/32387) - Samsung Electronics Co., Ltd. has held a tool-in ceremony for its new semiconductor research and development complex (NRD-K) at its Giheung campus. Accordingly, it marks a significant leap into the future. About 100 guests, including those from suppliers and customers, were in attendance to celebrate the milestone. As a state-of-the-art facility, NRD-K broke ground in
- [Mitsubishi Electric Invests in New Power IC Plant](https://aei.dempa.net/archives/32381) - Mitsubishi Electric Corporation will invest approximately 10 billion yen (US$64.9 million) to construct a new facility at its Power Device Works in Fukuoka Prefecture, Japan. Mainly, the new facility will be for the assembly and inspection of power semiconductor modules. Originally, the construction of the plant was announced on March 14, 2023. Now, the new
- [ASMPT Offers New Hybrid Bonding for Data Highways](https://aei.dempa.net/archives/32375) - The high-precision AMICRA NANO die and flip-chip bonder from ASMPT has been specially developed for the production of co-packaged optics. Here, optical and electronic components are integrated in a common housing. With its exceptional process stability and a placement accuracy of ±0.2μm @ 3σ, this innovative bonding system is ideally equipped for the communication technology
- [Advantest to Optimize SoC Tests with New Power MUX](https://aei.dempa.net/archives/32369) - Leading semiconductor test equipment supplier Advantest Corporation announces a new power multiplexer (MUX) developed specifically for use on the V93000 EXA Scale SoC test platform. Primarily, the PMUX02 Power MUX offers unprecedented capabilities for multi-site testing of power and analog devices, including battery management systems (BMS), automotive, and power management ICs. With 22 switches—nearly double
- [Asahi Kasei Breaks Ground on New Plant in Niagara](https://aei.dempa.net/archives/32366) - Asahi Kasei Battery Separator Corp. marked a significant step in its commitment to supporting the North American electric vehicle (EV) market. Recently, it has broken ground on its new lithium-ion battery separator manufacturing facility in Port Colborne, Ontario, Canada. The plant is expected to begin commercial production in 2027, subject to obtaining permits and approvals
- [Takaya Pitches New High-Precision Flying Probe Tester](https://aei.dempa.net/archives/32354) - Takaya Corporation is pleased to announce the launch of the APT-2400F/APT-2600FD Series flying probe tester. Particularly, this is a new model of flying probe tester that reliably detects all defects in mounting boards with ultra-high-speed inspection. Primarily, the new model boasts the industry's highest class of probing accuracy for inspection of high-density mounting boards. Moreover,
- [Yamaha Motor Launches New Cell Picking, Imaging System](https://aei.dempa.net/archives/32348) - Yamaha Motor Co., Ltd. has announced the upcoming release of the new CELL HANDLER(TM) 2 cell picking and imaging system in March 2025. Primarily, this advanced system aims to enhance the efficiency and refinement of research and experiments focused on new drug development. Mainly, CELL HANDLER(TM) 2 is the successor to the CELL HANDLER(TM). Specifically,
- [Rigaku Develops New 3D Visualization of Amorphous Carbon](https://aei.dempa.net/archives/32337) - The X-ray Laboratory of Rigaku Corporation, a Rigaku Holdings Group company and a global solution partner for X-ray analysis has developed the Total X-ray Scattering and RMC Modeling Method (TXS-RMC). Primarily, TXS-RMC is a powerful technology that clarifies the atomic-scale 3D structure of amorphous carbon1. Particularly, TXS-RMC facilitates the deeper understanding of the structure and
- [OKI Tech to Surge New Ultracompact Photonic IC](https://aei.dempa.net/archives/32327) - Using silicon photonics technology for semiconductor optical circuits, OKI has successfully developed an ultracompact photonic integrated circuit chip.
- [Siemens to Soar in AI With its NVIDIA-Powered PCs](https://aei.dempa.net/archives/32321) - Siemens’ Industrial Operations X portfolio and NVIDIA GPUs integrated in Siemens IPCs enable advanced AI applications across industries.
- [New Solution From Esmo to Set New IC Test Standard](https://aei.dempa.net/archives/32333) - esmo group launches Apollo Quad Handler to revolutionize IC testing, providing higher throughput and energy efficiency for chipmakers and OSAT providers.
- [Renesas Unveils New 3nm Multi-Domain SoC for Car](https://aei.dempa.net/archives/32316) - Renesas Electronics Corporation has launched the new generation of automotive fusion system-on-chips (SoCs), serving multiple automotive domains including Advanced Driver Assistance Systems (ADAS), in-vehicle infotainment (IVI), and gateway applications on a single chip. Built using the latest 3nm automotive process technology, the highly anticipated R-Car X5H SoC, the first device in the R-Car X5 series,
- [New Innodisk Server SSD Suits Future Edge Computing](https://aei.dempa.net/archives/32311) - Innodisk has introduced its new E1.S SSD designed to meet the demands of growing edge computing applications. The E1.S edge server SSD offers exceptional performance, reliability, and thermal management capabilities. Particularly, it will address the critical needs of modern data-intensive environments and bridge the gap between traditional industrial SSDs and data center SSDs. As AI
- [Mitsubishi Launches New Robot in Low-Cost Series](https://aei.dempa.net/archives/32304) - Mitsubishi Electric Automation, Inc. has launched the MELFA RV-12CRL vertically articulated robot. Particularly, the new robot has the largest reach of any robot in Mitsubishi Electric's low-cost robot series at 1,504mm. Additionally, it features a 12kg payload capacity, making it a candidate for machine tending, case packing, and pick-and-place applications. Mitsubishi Electric Automation is reputable
- [Rockwell to Offer Better FA Tool With NVIDIA Omniverse](https://aei.dempa.net/archives/32292) - Industry powerhouses Rockwell Automation and NVIDIA will drive advanced manufacturing at scale with innovative AI and digital twins.
- [Toray, PTT GC to Soar New Tech for Biomass Nylon](https://aei.dempa.net/archives/32297) - Toray Industries and PTT Global Chemical have agreed to explore mass production technology for adipic acid made from non-edible biomass.
- [BASF to Soar 3D Tech Capacity With More Investments](https://aei.dempa.net/archives/32280) - BASF’s X3D® technology produces catalysts with optimal shapes to maximize performance and efficiency while minimizing energy consumption.
- [Murata Sets a New Standard for Automotive 6DoF Sensor](https://aei.dempa.net/archives/32285) - Murata Manufacturing Co., Ltd. is expanding its range of innovative Six Degrees-of-Freedom devices with the introduction of the SCH1633-D01. Particularly, the micro-electromechanical system (MEMS)-based sensor moves the benchmark for performance, system integration, and total cost optimization. It is designed for various automotive applications. Among them include autonomous driving (AD), advanced driver-assistance systems (ADAS), inertial navigation,
- [New NXP MCUs to Surge Industrial, Mobility Edge](https://aei.dempa.net/archives/32265) - NXP's i.MX 94 family complements industrial control, PLCs, telematics, industrial and automotive gateways, and building and energy control.
- [UL Solutions Expands Mexico Lab for Better Service](https://aei.dempa.net/archives/32274) - UL Solutions Inc. has expanded its Mexico laboratory capacity and capabilities. Primarily, this aims to meet the growing demand of manufacturers in Latin America for product safety and performance testing. Mainly, the expansion of UL Solutions’ laboratory in Mexico adds testing capabilities for consumer technology, automotive, and wire and cable products. Thus, it broadens testing
- [New Emerson Tool to Surge Energy Efficiency in Plants](https://aei.dempa.net/archives/32223) - Emerson has launched its new Energy Manager solution that simplifies industrial electricity monitoring for better insights in energy and CO2 consumption.
- [Schaeffler to Boost Research With its Innovative R&D](https://aei.dempa.net/archives/32214) - Schaeffler AG has opened a cutting-edge technology center at its headquarters in Herzogenaurach with investments of 90 million euros.
- [Toyobo to Lift Manufacturing Grit With New Facility](https://aei.dempa.net/archives/32249) - Toyobo has completed a new production facilities for films for multilayer ceramic capacitors at its Utsunomiya Plant in Tochigi prefecture.
- [Mitsubishi's New SiC Die to Surge More Superior xEVs](https://aei.dempa.net/archives/32236) - Mitsubishi Electric Corporation will begin shipping samples of a silicon carbide (SiC) metal-oxide-semiconductor field-effect transistor (MOSFET) bare die.
- [ROHM Offers Better Insulation Resistance in SiC SBD](https://aei.dempa.net/archives/32245) - ROHM Co., Ltd. has developed a surface-mount SiC Schottky barrier diode (SBD). Primarily, it extends the creepage distance(*1) between terminals to increase insulation resistance. Particularly, the lineup includes eight SCS2xxxNHR models for automotive devices such as on-board chargers (OBCs). Additionally, eight SCS2xxxN models for industrial equipment such as FA equipment and PV inverters will also
- [TDK Enhances Car Safety with New 2Gen 6-Axis IMUs](https://aei.dempa.net/archives/32228) - TDK Corporation further extends its InvenSense SmartAutomotive™ MEMS sensor family with the IAM-20685HP and IAM-20689 second-generation 6-axis IMUs for automotive safety applications. Both devices deliver reliable motion data for decision-making algorithms. Also, they accurately detect vehicle dynamics in real time to enhance advanced driver assistance (ADAS) and safety applications. Particularly, they require higher levels of
- [SEMIFIVE Boosts Play in HPC Chiplet with New Partner](https://aei.dempa.net/archives/32215) - SEMIFIVE, a leading design solution provider and pioneer of platform-based custom silicon solutions, has announced a collaboration with Synopsys to develop a cutting-edge high-performance computing (HPC) platform. Particularly, the new platform integrates SEMIFIVE’s CPU chiplet with a third-party I/O chiplet into a unified package. Primarily, SEMIFIVE’s HPC chiplet platform will offer notable advantages over traditional
- [Schaeffler to Boost Research With its Innovative R&D](https://aei.dempa.net/archives/32211)
- [Siemens' New Buyout to Surge Grit in AI, Industrial](https://aei.dempa.net/archives/32200) - Siemens has moved to acquire Altair Engineering in a bid to strengthen its position as a leading technology company through leadership in industrial software.
- [ST to Soar Carbon Neutrality High in its Latest Deal](https://aei.dempa.net/archives/32192) - STMicroelectronics has announced a 21-year power deal with BKH Solar that will facilitate the supply of about 50GWh of renewable energy.
- [Form Factor, Advantest Ally on New Si Photonics Test](https://aei.dempa.net/archives/32188) - FormFactor, Inc. and Advantest Corporation had announced a strategic partnership to develop a novel test cell and measurement system designed for high-volume production of silicon photonics (SiPh) and co-packaged optics (CPO) devices. Primarily, this collaboration is driven by the revolution in AI data center architectures, which require ever-increasing bandwidth while reducing power consumption. Mainly, silicon
- [KEL Puts up New Production Base in Guangdong, China](https://aei.dempa.net/archives/32181) - KEL Co., Ltd. is a Japanese manufacturer founded in 1962 specializing in industrial connectors. Primarily, KEL’s connectors are used as key parts of electronic devices in a wide range of markets, from industrial equipment to automotive, imaging, medical, and gaming equipment. These connectors are being applied in a growing number of fields. Since its founding,
- [LG Display’s New Stretchable Panel Expands by 50%](https://aei.dempa.net/archives/32177) - LG Display has unveiled the first stretchable display capable of expanding up to 50%. This is the highest rate of elongation in the industry. At LG Science Park in Seoul on Nov. 8, the company demonstrated the panel at a meeting of more than 100 South Korean industry, academia, and research stakeholders involved in a
- [Hioki's New Tool to Surge R&D of EV Batteries](https://aei.dempa.net/archives/32169) - Hioko has launched its Powder Impedance Measurement System that will complement the needs of electric vehicle (EV) solid-state battery R&D market.
- [Renesas to Offer More Performance in New Processor](https://aei.dempa.net/archives/32164) - Renesas' RA8E1 and RA8E2 Deliver Unmatched Scalar and Vector Compute Performance with Best-in-Class Feature Set to Address Value-Oriented Markets
- [Dexerials, MRI Create New Visualization System with AI](https://aei.dempa.net/archives/32156) - Dexerials Corporation and Mitsubishi Research Institute, Inc. have commenced an automated visualization system for technological fields based on generative artificial intelligence (AI). Particularly, it enables users to search for new businesses quickly and develop prospective products before others. At Dexerials, the staff in charge of the project have closely read a vast amount of technical
- [Delta to Sustain Innovation in New Indonesian Base](https://aei.dempa.net/archives/32148) - Delta Electronics, a global leader in power management and IoT-based smart green solutions, has announced business expansion in Indonesia. Building on its strong partnerships with local distributors and system integrators, PT Delta Electronics Indonesia will continue collaboration with these partners while extending its engagement with government agencies and key customers. Further, Delta aims to provide
- [Stratasys Tool to Offer Better Workflow, Labor Cost](https://aei.dempa.net/archives/32144) - Stratasys Ltd. is collaborating with AM Solutions – 3D post processing technology, a brand of the Rösler Group, to launch Stratasys PowderEase™ TI. The innovative 3-in-1 post-processing solution complements for the Stratasys H350® SAF® powder bed printer. Specifically, this new post-processing system drives towards important customer milestones. That is, including shorter time to finished parts, more efficient
- [Hitachi, UTokyo to Soar Research on Res Laser-PEEM](https://aei.dempa.net/archives/32141) - Hitachi High-Tech Corporation and The University of Tokyo (UTokyo) have been conducting joint research into practical applications of high-resolution Laser-PEEM
- [Rockwell to Surge Better Automation in New Updates](https://aei.dempa.net/archives/32135) - Rockwell Automation introduces FactoryTalk® DataMosaix™ App Builder, a low/no code application development builder to fit most business needs.
- [Carlyle Enters New Strategic Partnership with Kyoden](https://aei.dempa.net/archives/32130) - Global investment firm Carlyle has acquired Kyoden Co., Ltd., a leading Japanese manufacturer of printed circuit boards (PCBs). Founded in 1983 and headquartered in Nagano Prefecture, Kyoden is a leader in the design and manufacture of PCBs and board assembly for electronic devices. It focuses on small-lot and high-variety products delivered in short turnaround times.
- [NEDO Adopts Kioxia’s New Memory Technology Post 5G](https://aei.dempa.net/archives/32123) - Kioxia Corporation, a world leader in memory solutions, has been adopted by Japan's national research and development agency, New Energy and Industrial Technology Development Organization (NEDO), for its groundbreaking proposal on the Development of Manufacturing Technology for Innovative Memory to enhance the post-5G information and communication system infrastructure. Generally, in the post-5G information and communication
- [New ROHM 4-Gen IGBT Drives Inverter Efficiency](https://aei.dempa.net/archives/32119) - ROHM Co., Ltd. has developed a fourth-generation insulated-gate bipolar transistor (IGBT)(*1) that meets the AEC-Q101(*3) automotive reliability standard. Primarily, it achieves industry-leading low-loss characteristics and high short-circuit tolerance(*2) at a withstand voltage of 1200V. The product was designed for electric compressors and HV heaters for automotive applications and inverters for industrial equipment. The products to
- [IC Making to Surge More With TRUMPF New 3D Printers](https://aei.dempa.net/archives/32091) - The additive manufacturing technology of TRUMPF will make semiconductor manufacturing systems more precise and efficient.
- [Yokogawa to Soar T&M More in Latest High Accuracy Tool](https://aei.dempa.net/archives/32110) - Yokogawa Test & Measurement releases WT1800R Series that supports an extensive variety of power measurement applications, including automotive.
- [Nidec to Offer Better Productivity With Latest Tool](https://aei.dempa.net/archives/32105) - Nidec Machine Tool has developed a five-axis control machining head that can perform additive fabrication of large, complex-shaped components and surfaces.
- [Toyoda Gosei to Soar Recycling Grit in its Japan Line](https://aei.dempa.net/archives/32088) - Toyoda Gosei is doubling its rubber recycling capacity at the Morimachi Plant to accelerate recycling of rubber used in automotive.
- [TASMIT Levels up Chip Inspection with Mainstay Tools](https://aei.dempa.net/archives/32079) - TASMIT, Inc., a group company of Toray Engineering Co., Ltd., is expanding its semiconductor inspection equipment business. Particularly, TASMIT will establish priority markets for each of its product lineups, including the NGR electron beam wafer inspection and measurement system and the INSPECTRA optical wafer visual inspection system. The company plans to expand its business based
- [Sodick Releases New Wire Electrical Discharge Machine](https://aei.dempa.net/archives/32072) - Sodick Co., Ltd. has released the AX350L i Groove + Edition linear motor drive ultra-precision wire electrical discharge machine. Primarily, the new EDM is equipped with a wire rotation mechanism and energy-saving functions to meet a variety of high-precision machining needs. AX350L iG+E is scheduled to be exhibited at "JIMTOF2024" (Nov. 5 to 10 at
- [ASTEELFLASH Widens Footprint with New Poland Facility](https://aei.dempa.net/archives/32068) - On 29th Oct., ASTEELFLASH celebrated the grand opening of its newly constructed production facility in Biskupice Podgórne, near Wrocław, Poland. Primarily, this latest investment of US$19 million further strengthens USI and ASTEELFLASH capabilities in Europe. Thus, it enhances production for box build lines and high-level assembly specifically in the high-volume manufacturing in automotive and industrial
- [New Capacitor Boosts Immersion Cooling of Servers](https://aei.dempa.net/archives/32062) - To contribute to the high performance of the expanding IT infrastructure, Nippon Chemi-Con Corp. has been promoting the enhancement of the functionality of aluminum electrolytic capacitors used in servers. Thus, the company announces the development of the industry's first product that supports Liquid Immersion Cooling, a highly efficient server cooling method. It has also started
- [FUJI Accepts Orders for New Multi-Function Lathe](https://aei.dempa.net/archives/32058) - FUJI Corporation has started accepting orders for the newly developed product ACUFLEX 400S (Accuflex). Particularly, Acuflex is a single-turret type multi-lathe with a Y-axis. Primarily, this product was developed by utilizing FUJI's expertise in the development of lathes for automotive parts processing, which has been FUJI's mainstay. Also, it combines a high degree of flexibility,
- [Yamaha to Reveal Breakthrough Tool in its New AOI Line](https://aei.dempa.net/archives/32045) - Yamaha Robotics Europe has introduced the YRi-V HS AOI system for faster performance at high resolution and greater accuracy inspecting surface-mounted LEDs.
- [Yokogawa Paves Way for High Tech Tool in Unique MES](https://aei.dempa.net/archives/32040) - Yokogawa Electric has announced the global release of OpreX Batch MES that suit the MES needs and demands for specialty and fine chemicals.
- [Asahi Kasei, Honda to Surge LiB Line in New Deal](https://aei.dempa.net/archives/32035) - Asahi Kasei and Honda have agreed to convert an existing subsidiary in Canada as their joint venture for lithium-ion battery separators.
- [SCIVAX, Shin-Etsu Ally in New Light Source Module](https://aei.dempa.net/archives/32030) - SCIVAX Corporation and Shin-Etsu Chemical Co., Ltd. have jointly developed Amtelus®, a light source device for 3D sensors and technology for its mass production. The delivery of evaluation samples of Amtelus® will start in November 2024. Meanwhile, Shin-Etsu Chemical will handle sales of the products. So far, SCIVAX has sold Platanus®, an optical lens that
- [AEI November 2024 Special Issue - Digital Edition](https://aei.dempa.net/archives/32013) - The AEI November 2024 special digital edition will dig deep into the latest megatrends shaping global electronics technologies and manufacturing techniques. All these and other expected trends in electronica 2024 and NEPCON Asia 2024 are in this special English-Chinese bilingual digital edition magazine. READ HERE
- [Amprius Opens New Si Anode Battery Line for Partner](https://aei.dempa.net/archives/32004) - Amprius Technologies, Inc., a leader in next-generation lithium-ion batteries with its Silicon Anode Platform, has announced that one of its contract manufacturing partners has opened new lines to support increased SiCore™ production. Primarily, the newly installed lines provide Amprius with a manufacturing capacity of up to 800MWh for its SiCore pouch cells. This expansion marks
- [Advantech Unveils New Advanced AMR Solution](https://aei.dempa.net/archives/31996) - Advantech, a global leader in AIoT and Edge Computing, introduces the AFE-R360, a powerful solution for the Autonomous Mobile Robot (AMR) and robot markets. Primarily, it is designed to meet the evolving demands for vision sensors and performance. In a move that underscores its commitment to cutting-edge technology, Advantech successfully integrates MIPI-CSI and GMSL sensor
- [Yamaha Motor to Launch New High-Speed Dispenser](https://aei.dempa.net/archives/31987) - Yamaha Motor Co., Ltd. has announced it will launch the new high-speed dispenser YRM-D on December 1 this year. Primarily, the new high-speed dispenser achieved industry-leading dispensing performance while being easy to handle and compact, considering area productivity. Particularly, the YRM-D has been developed as a dispenser for the next-generation platform YR Series, which embodies
- [Mitutoyo America Boosts Vision System with New Tool](https://aei.dempa.net/archives/31982) - Mitutoyo America Corp. has announced the integration of the powerful Metlogix M3 software into the Mitutoyo Quick Image (QI) 2D Vision Measuring System. This latest enhancement promises to elevate the precision and efficiency of non-contact measurements. Thus, it further solidifies Mitutoyo’s commitment to providing innovative technology solutions to meet modern quality control needs. Unmatched Efficiency
- [ULVAC Puts up New Chip Equipment Center in South Korea](https://aei.dempa.net/archives/31977) - ULVAC, Inc., the world's leading comprehensive vacuum manufacturer, has established Technology Center PYEONGTAEK in Pyeongtaek, Gyeonggi-do, South Korea. Primarily, the Center aims to advance the development of next-generation semiconductor manufacturing equipment and processes in collaboration with customers in South Korea, while also establishing mass production technologies. The Center commenced operations in August 2024 [1] and
- [Toray to Boost Si Photonics with New Mounting Tech](https://aei.dempa.net/archives/31967) - Toray Industries, Inc., has developed materials and technologies for mounting indium phosphide (Note 1) and other optical semiconductors (Note 2) used in silicon photonics (Note 3) on silicon substrates. Mainly, the demand for high-speed communications driven by artificial intelligence is fueling the construction of more data centers. This raises concerns about their heavy power demands.
- [MMC Develops New High-Strength Cu Alloy for xEVs](https://aei.dempa.net/archives/31960) - Mitsubishi Materials Corporation (MMC) has developed MZC®1 SH+, a new chromium zirconium-based copper (Cu-Cr-Zr) alloy product that boasts both a high level of mechanical strength and electrical conductivity. In line with the growth of next-generation vehicles such as xEVs in recent years, demand has increased for automotive electronic and electrical equipment for high voltage and
- [Maxell Powers New iXAM Smart Vision Engine](https://aei.dempa.net/archives/31952) - Maxell, Ltd. has announced that its ceramic-packaged all-solid-state battery PSB401010H has been adopted for the intelligent image recognition unit iXAM Vision Engine*1 (iXAM-VE120A-DIO) developed by its subsidiary, Maxell Frontier Co., Ltd. Particularly, it will serve as a backup power supply for the real-time clock*2 (RTC). Mainly, Maxell and Maxell Frontier have long cooperated in the
- [TAITRONICS Showcases New Breakthroughs in AI and IoT](https://aei.dempa.net/archives/31945) - The 50th Taipei International Electronics Show (TAITRONICS) and the 7th Taiwan International AIoT Show (AIoT Taiwan) opened at the Taipei Nangang Exhibition Center in Taipei from October 23 to 25. Both trade events brought together key players in Taiwan’s electronics manufacturing and related fields. Together, the shows gathered more than 300 of Taiwan's leading electronics
- [Mitsubishi Power to Build New Factory in Pennsylvania](https://aei.dempa.net/archives/31942) - Mitsubishi Electric Power Products, Inc. (MEPPI), in collaboration with its parent company Mitsubishi Electric Corporation (MELCO) in Japan, announced an $86 million investment in advanced switchgear production and power electronics in the U.S. Primarily, this investment is driven by the increasing demand for transmission and distribution grid products as the U.S. moves toward renewable energy
- [Polyplastics Promotes Green Society in New Material](https://aei.dempa.net/archives/31933) - Polyplastics Co., Ltd., a leading Japanese provider of engineering plastics and polymers, has been advancing the research and development (R&D) of products that reduce environmental impact while maintaining the performance demanded by the market to create a recycling-based society. Primarily, the company's new DURACON® POM short cellulose fiber reinforced grades currently in development are products
- [GF, NXP in New Deal to Surge Better Solutions](https://aei.dempa.net/archives/31928) - GlobalFoundries and NXP Semiconductors have agreed to drive next-generation solutions across a range of end markets, such as consumer and industrial.
- [Smart Robotics Releases New PLC-Enabled Robots](https://aei.dempa.net/archives/31922) - Tokyo-based Robotics Inc. (hereinafter Smart Robotics), a robot development venture, has developed two autonomous transport robot models. Specifically, the SR-AMR-SWD300 is capable of transporting 300kg loads, while the SR-AMR-SWD650 is capable of transporting 650kg loads. Smart Robotics will sell them customized with features such as automatic lift-up and towing to meet customer needs. This time,
- [SAKI to Surge India Grit With its Latest Sales Ally](https://aei.dempa.net/archives/31846) - Saki Corporation has forged a sales partnership with Blue Star Engineering in a bid to further expand its presence in India.
- [New Cincoze PCs Offer HMI for Smart Manufacturing](https://aei.dempa.net/archives/31916) - Taiwanese rugged computer brand Cincoze has released the Display Computing - CRYSTAL product line designed for human-machine interface (HMI) applications in harsh environments. Mainly, the CRYSTAL product line includes three series: industrial panel PCs for harsh indoor environments; sunlight-readable panel PCs for outdoor high-brightness conditions; and open-frame industrial panel PCs for seamless integration with machines.
- [New Thermal Diode Sensor Boasts Wider Field of View](https://aei.dempa.net/archives/31909) - Mitsubishi Electric Corporation has announced the upcoming launch of a new MelDIR-brand 80×60-pixel thermal-diode infrared sensor (MIR8060C1) with a 100°×73° field of view (FOV). Specifically, this is more than double that of the company's existing thermal-diode infrared sensors*. Accordingly, it accurately and efficiently identifies people and objects. Moreover, the expanded FOV will reduce the number
- [SK Keyfoundry Launches New High-Voltage IC Process](https://aei.dempa.net/archives/31905) - SK keyfoundry, an 8-inch pure-play foundry in Korea, expands and enhances its high-voltage foundry services portfolio with the launch of HVIC (High Voltage Integrated Circuit) process technologies. Mainly, SK keyfoundry's HVIC process is characterized by implementing 5V logic, 25V high-voltage devices, 650V+ nLDMOS (Lateral Double diffused MOS), and 650V+ Bootstrap diode in one process. Thus,
- [TIER IV, ADI’s Module to Drive New Automation Value](https://aei.dempa.net/archives/31901) - TIER IV, the pioneering force behind the world's first open-source software for autonomous driving, is thrilled to announce the launch of the GMSL2™ (Gigabit Multimedia Serial Link generation 2) -10GbE conversion module. Primarily, the new module was developed together with global semiconductor leader, Analog Devices (ADI). Particularly, this innovative module expands the product lineup of
- [Mitsubishi Electric to Reinvent Automation in New Deal](https://aei.dempa.net/archives/31896) - Mitsubishi Electric Corporation has announced that its ME Innovation Fund has invested in Formic Technologies Inc. Primarily, Formic is a U.S.-based startup company that designs, develops, and maintains industrial robots, offered through a subscription-based sales model. Particularly, this is the eighth investment that the fund has made to date. In the manufacturing and logistics sectors,
- [New Method Lets 3D Integration of Thin-Film Analog IC](https://aei.dempa.net/archives/31890) - OKI Electric Co., Ltd., in collaboration with Nisshinbo Micro Devices Co., Ltd., has successfully adopted CFB® (Crystal Film Bonding) technology (Note 1) to integrate thin-film analog ICs (Note 2) three-dimensionally (Note 3). Primarily, this technology can be applied to heterogeneous integration (Note 4), which integrates various semiconductor devices such as analog ICs. Both companies will
- [UR AI Accelerator Allows New Wave of Cobot Innovations](https://aei.dempa.net/archives/31879) - Universal Robots (UR), the Danish collaborative robot (cobot) company, has presented for the first time the UR AI Accelerator. Primarily, the AI Accelerator is a ready-to-use hardware and software toolkit created to further enable the development of AI-powered cobot applications. The UR AI Accelerator is mainly designed for commercial and research applications. Accordingly, it provides
- [New Nikon UV Camera Lens Zooms in on IC Wafer](https://aei.dempa.net/archives/31858) - Nikon Corporation has released the new C-mount industrial lens Rayfact UV25mm F2.8, designed for use with ultraviolet cameras. Primarily, this Rayfact UV lens series is ideal for visual inspections of semiconductor wafers and electronic components. Mainly, it detects microscopic scratches and surface irregularities. Also, it can identify materials that are difficult to distinguish under visible
- [HORIBA Develops New Thin-Film Inspection System](https://aei.dempa.net/archives/31863) - HORIBA STEC, Co., Ltd. has released the “Xtrology” fully automated thin-film inspection system. In recent years, the number of inspection items in the manufacturing process has increased. Mainly, this is due to technological advances in the semiconductor industry. Also, the level of inspection requirements continues to rise. Particularly, the new product, "Xtrology," is a highly
- [Mitsubishi Chem to Boost Yield With New High Tech Site](https://aei.dempa.net/archives/31843) - The Mitsubishi Chemical Group has decided to expand its production facility for OPL Film™ products, optical polyvinyl alcohol (PVOH) film.
- [New Tanaka Pd Alloy Suits Semi Test Equipment](https://aei.dempa.net/archives/31818) - TANAKA Kikinzoku Kogyo K.K. has developed TK-SK, a palladium alloy designed for probe pins used in the final testing stage (post-processing) of semiconductor packages. TANAKA Kikinzoku develops industrial precious metal products as one of the core companies of TANAKA Precious Metals. This new product will be showcased via a panel display at SWTest Asia 2024
- [AOI to Surge Better in AI With Yamaha Tech](https://aei.dempa.net/archives/31828) - AI suits image recognition and classification skills and is a great fit with the objectives of AOI for performance improvement.
- [Delta Showcases New Smart Solutions at CEATEC](https://aei.dempa.net/archives/31853) - Delta, a global leader in power management and a provider of IoT-based smart green solutions, demonstrated its unique capabilities to enhance energy efficiency across the AI realm and its prowess in smart manufacturing at CEATEC 2024. Primarily, the key highlights of the company’s technology exhibits include its newest 20ft-container prefabricated all-in-one data center solution for
- [TDK Sets New Course in Age of AI at electronica](https://aei.dempa.net/archives/31839) - TDK Corporation will showcase its solution portfolio for the entire spectrum of electronics applications at electronica 2024. It will happen in Munich, Germany – from November 12 to 15, 2024. The Tokyo-based TDK, one of the world leaders in electronic solutions for the smart society, is positioning itself for the age of artificial intelligence (AI).
- [Schneider to Boost Compute Grit in New Motivair Deal](https://aei.dempa.net/archives/31823) - Schneider Electric has signed an agreement to acquire a controlling interest in Motivair to boost the company’s grit in computing and generative AI.
- [OMRON to Boost Automation Grit With New Controller](https://aei.dempa.net/archives/31774) - OMRON Corporation has introduced Automation Playback, a standard but unique feature on its NX5 automation controller that lifts factory automation.
- [Rockwell To Offer Better Solution for Labor Challenges](https://aei.dempa.net/archives/31721) - Plex by Rockwell Automation offers new capabilities to represent a paradigm shift in the execution of assembly and maintenance procedures.
- [KLA Unveils New Solutions in Advanced IC Packaging Era](https://aei.dempa.net/archives/31809) - KLA Corporation introduces the industry's widest breadth of process control and process-enabling solutions for IC substrate (ICS) manufacturing. Primarily, KLA's combined expertise in front-end semiconductors, packaging, and IC substrates will help customers achieve breakthroughs in packaging interconnect density for chips targeting high-performance applications. Advanced packaging continues to adopt heterogeneous integration methods to bring together multiple
- [Rockwell to Edge Automation Grit With its Taurob Deal](https://aei.dempa.net/archives/31804) - Rockwell Automation has signed an agreement with Taurob to provide a holistic robotic automation solution, helping move towards autonomous operations.
- [SHI to Beef up IC Business with New Acquisition](https://aei.dempa.net/archives/31799) - Sumitomo Heavy Industries, Ltd. (SHI) has announced the acquisition of a leading European semiconductor business. This aims to strengthen its presence in the rapidly growing semiconductor market. Particularly, SHI has entered into a share purchase agreement with SCREEN Semiconductor Solutions Co., Ltd. (SCREEN SPE) to acquire 100% of shares in Laser Systems & Solutions of
- [TRUMPF to Surge Site Uptime With Better System Tool](https://aei.dempa.net/archives/31786) - With machine diagnostics, TRUMPF detects abnormalities in the machine before they can cause a breakdown for higher productivity.
- [Formlabs Releases New 3D Printer, Developer Platform](https://aei.dempa.net/archives/31792) - Formlabs, a leader in 3D printing, has announced its new blazing-fast, large-format Form 4L and Form 4BL 3D printers. Also, it revealed the much-anticipated opening of its SLS and SLA platforms to enable users to bring their ideas to life regardless of scale, application, or complexity. Additionally, Formlabs introduced new printer accessories, two new SLS
- [New PCB Material from AGC Speeds up Communication](https://aei.dempa.net/archives/31781) - AGC, a leading manufacturer of glass, chemicals, and other high-tech materials, has launched the METEORWAVE® ELL Series of Multilayer Printed Circuit Board (PCB) Materials. Primarily, these materials achieve one of the industry's highest levels*1 of low transmission loss and high thermal resistance for high-speed communication applications. Particularly, the METEORWAVE® ELL Series will contribute to higher
- [Murata Paves Way for Growth With Latest France Line](https://aei.dempa.net/archives/31766) - Murata Manufacturing has broadened its integrated passive solutions facility with the opening of its new production line in Caen, France.
- [Yamaha to Soar Factory Grit With Better Japan Facility](https://aei.dempa.net/archives/31758) - Yamaha Robotics has announced the completion of the renovation and expansion work at its Hamamatsu Robotics Office in Japan.
- [ASMPT to Lift its Innovative Bonding in AI, Mobility](https://aei.dempa.net/archives/31751) - ASMPT will present its technical innovations in bonding for co-packaged optics components and power modules at the forthcoming electronica 2024.
- [New ABB Venture to Tackle e-Waste at Data Centers](https://aei.dempa.net/archives/31741) - ABB Robotics is collaborating with American start-up Molg to create robotic microfactories. This aims to recover and recycle data center operators’ disused electronic equipment, commonly known as e-waste. Mainly, with global e-waste projected to rise to 75 million tons by 2030[1], microfactories will play a vital role in reducing e-waste. Thus, it can help the
- [FUJI to Improve Service with New Dongguan Base](https://aei.dempa.net/archives/31734) - FUJI Co., Ltd. has announced that FUJI MACHINE CHINA CO., LTD. has relocated its Dongguan office, which is its core base in the South China region. At the same time, it has expanded its showroom. On September 25, 2024, a completion ceremony was held with the participation of over 100 people. In the future, this
- [ROHM Controller to Lift Industry Need to New High](https://aei.dempa.net/archives/31726) - ROHM’s new PWM controller supports a wide range of power transistors with built-in high accuracy undervoltage prevention malfunction.
- [Aerotech's New Drives to Surge Automation More](https://aei.dempa.net/archives/31715) - Aerotech has launched the compact, economical single- and multi-axis servo drives, offering premier precision motion control for less.
- [Kokusai Electric Tops Off New Chip Equipment Fab](https://aei.dempa.net/archives/31704) - KOKUSAI ELECTRIC CORPORATION has completed the construction of its TONAMI MANUFACTURING CENTER, a new factory for semiconductor manufacturing equipment in Tonami City, Toyama Prefecture. A completion ceremony was held on September 18. Primarily, the TONAMI MANUFACTURING CENTER will be Kokusai Electric’s second Japanese production base after the Toyama Technology & Manufacturing Center in the Yatsuo
- [KLA Completes First Phase of New Singapore Facility](https://aei.dempa.net/archives/31697) - KLA Corporation, a world leader in developing industry-leading equipment and services that advance innovation throughout the electronics industry, has celebrated the completion of Phase 1 of its newest manufacturing facility. Primarily, this Phase 1 building of the new facility is part of a US$200 million investment by KLA to grow its presence in Singapore, which
- [Thinker and Kawada to Automate Kitting with New Robot](https://aei.dempa.net/archives/31690) - Osaka-based Thinker Co., Ltd. announces the development of a robot system prototype that enables the automation of kitting tasks, in collaboration with Kawada Robotics Co., Ltd. Thinker, the manufacturer of Proximity Sensors, is working to innovate manufacturing sites with "robot hands that think with their fingertips". Mainly, kitting is "making something ready for immediate use".
- [New NTT Company to Optimize Supply Chain with AI](https://aei.dempa.net/archives/31684) - NTT Corporation established a new company, NTT AI-CIX (AI-Cross Industry transformation) Inc., aiming to optimize the entire supply chain by utilizing business and cross-industry data through artificial intelligence (AI). Thus, by focusing on “Linked AI,” in which various AIs are linked with each other across businesses and industries, the company will provide a full range
- [DIC and Unitika's New PPS Film Suits mmWave PCBs](https://aei.dempa.net/archives/31679) - DIC Corporation has developed a new specialty polyphenylene sulfide (PPS) film in collaboration with Japanese firm Unitika Ltd. that suppresses transmission loss at high frequencies. Particularly, this product’s low dielectric properties make it suitable for use in a key for millimeter-wave printed circuit boards (PCBs) compatible with next-generation communications devices and for millimeter-wave radar. Also,
- [Asahi Kasei, Aquafil Ally on New 3D Printing Material](https://aei.dempa.net/archives/31674) - Asahi Kasei Corporation, a Japanese technology company, recently signed a memorandum of understanding (MOU) with Aquafil S.p.A., an Italian manufacturer of polyamide 6 (PA6). Primarily, the two companies agreed to develop a novel material for 3D printing (3DP) applications utilizing Aquafil’s ECONYL® Polymer chemically recycled PA6 and Asahi Kasei’s cellulose nanofiber (CNF), with the support
- [OKI Develops New Ultra-Small Optical IC Chip](https://aei.dempa.net/archives/31655) - OKI Electric Industry Co., Ltd. has developed an ultra-compact optical integrated circuit chip that can be applied to a variety of applications, such as optical fiber sensors, laser vibrometers, and optical biosensors, using silicon photonics technology, which is a semiconductor for optical circuits. With the new optical chip, it is possible to achieve ultra-miniaturization and
- [New Keysight Wafer Test System Boosts Power IC Output](https://aei.dempa.net/archives/31644) - Keysight Technologies, Inc. introduces a 4881HV High Voltage Wafer Test System expanding its semiconductor test portfolio. Primarily, the solution improves the productivity of power semiconductor manufacturers by enabling parametric tests up to 3kV supporting high and low-voltage in one-pass test. Generally, manufacturers have traditionally measured wafers using separate testers for high and low voltages. However,
- [DuPont Completes New Line at Sasakami Site in Japan](https://aei.dempa.net/archives/31639) - DuPont has completed the significant expansion of photoresist manufacturing capacity at the DuPont Sasakami Site in Agano-shi, Niigata, Japan. The team and guests celebrated the project on Oct. 3, with a traditional Japanese Tamagushi Houten Ceremony, symbolizing wishes for continued success, prosperity and peace. Global DuPont leaders and distinguished guests, including Hiroyuki Kato, Mayor, Agano
- [FUJI to Tap AM for Innovative Product Offerings](https://aei.dempa.net/archives/31627) - FUJI Corporation will focus on proposing products that apply additive manufacturing (AM) technology, which involves layering and molding materials. Particularly, AM technology is attracting attention as a new manufacturing method. However, its recognition and industrial use are still low in Japan compared to other markets. Therefore, FUJI will develop new markets and accelerate proposals to
- [NSK Launches New Low-Friction Ball Screw](https://aei.dempa.net/archives/31616) - NSK Ltd. has developed the "MT-Frix™" *1low-friction ball screw. Particularly, NSK's analysis technology accurately clarified the contact state between the balls and grooves inside the ball screw. Accordingly, it optimized the internal specifications and reduced dynamic friction torque*3 while maintaining the same dimensions and rigidity*2. As a result, the company has achieved a significant reduction
- [Japanese Firms Set Sights on New Power Supplies](https://aei.dempa.net/archives/31650) - Japanese electronic component makers are actively developing technologies for power supply-related products. Mainly, they are developing new products such as power electronic components and next-generation rechargeable batteries in response to the shift to xEVs in automobiles and the increased current capacity of industrial equipment and renewable energy devices. Primarily, they aim to contribute to higher
- [AI Drives LG Innotek’s New Material Inspection System](https://aei.dempa.net/archives/31631) - LG Innotek announced the development and application of the industry's first "Artificial Intelligence (AI)-based inspection system for incoming raw materials". Primarily, it is designed to detect defects at the point of receipt and prevent the use of substandard raw materials in the process. Mainly, LG Innotek applied its AI-based inspection technology, developed by combining material
- [Maxell Puts All-Solid-State Battery at Core of New Plan](https://aei.dempa.net/archives/31622) - Maxell, Ltd. has announced in its new medium-term management plan “MEX26” (Maximum Excellence 2026) to accelerate the development of all-solid-state batteries as the core of new business. Maxell, whose name derives from the phrase “Maximum Capacity Dry Cell”, started business as a manufacturer of battery and magnetic tape in 1961. Today, it is renowned for
- [OMNIVISION Launches New 3.45-µm BSI GS Sensors](https://aei.dempa.net/archives/31608) - OMNIVISION has announced three new back-side illuminated (BSI) global shutter (GS) image sensors for machine vision applications. Primarily, they suit applications in industrial automation, robotics, logistics barcode scanners, and intelligent transportation systems (ITS). Particularly, the new GS image sensors feature a 3.45-µm BSI pixel for high sensitivity, industry-leading shutter efficiency, and excellent low-light performance. Their
- [New Panasonic Connect MES to Drive U.S. EV Production](https://aei.dempa.net/archives/31602) - Panasonic Connect North America has launched Syncora Digital Manufacturing Platform (SyncoraDMP). Primarily, SyncoraDMP is an end-to-end manufacturing execution system (MES) solution designed to accelerate the digital transformation of electric vehicle (EV) battery manufacturing in the U.S. It is modular, scalable, and adaptable to enable manufacturers to keep up with the requirements of EV battery manufacturing.
- [Jabil Heats up Liquid Cooling Line in New Buyout](https://aei.dempa.net/archives/31598) - Jabil Inc. has completed the acquisition of Mikros Technologies LLC, a leader in the engineering and manufacturing of liquid cooling solutions for thermal management. Generally, the adoption of artificial intelligence, energy storage, and electric vehicles continues. These trends drive higher-power density systems across consumer and commercial industries. Thus, liquid cooling has emerged as a more
- [Rapidus Unveils New State-of-the-Art R&D Center](https://aei.dempa.net/archives/31592) - Rapidus Corporation has announced that it will set up a clean room within Seiko Epson Corporation’s facility in Chitose, Hokkaido. At the same time, it will open a research-and-development (R&D) center for semiconductor post-processing called Rapidus Chiplet Solutions (RCS). Primarily, the Seiko Epson Chitose Plant is adjacent to the Rapidus Innovative Integration for Manufacturing (IIM)
- [New TDK Spin-memristor to Make Ultralow-Power AI Device](https://aei.dempa.net/archives/31586) - TDK Corporation has announced the development of a neuromorphic element called a “spin-memristor” featuring a very low power consumption. Primarily, this element mimics the energy-efficient operation of the human brain. Thus, it could cut the power consumption of AI applications down to 1/100th of traditional devices. Collaborating with the French research organization CEA (Alternative Energies
- [Tata to Soar First Fab Grit, Seals Deal With PSMC](https://aei.dempa.net/archives/31581) - TATA Group secured Indian government’s nod to build the country's first semiconductor fabrication facility in partnership with Taiwan's PSMC.
- [Sumitomo Bakelite Grows its Yield With New China Line](https://aei.dempa.net/archives/31577) - Sumitomo Bakelite Co., Ltd. has announced the completion of its new factory in China, which will manufacture semiconductor encapsulation.
- [LG Chem Discovers New Solution to Thermal Runaway](https://aei.dempa.net/archives/31573) - LG Chem has announced that its Platform Technology R&D team has developed a temperature-responsive Safety Reinforced Layer (SRL), a material designed to suppress thermal runaway. In collaboration with Professor Lee Minah's team from the Department of Battery Engineering at POSTECH, the material was analyzed. Meanwhile, safety verification was conducted in partnership with LG Energy Solution.
- [Qualcomm, ST to Surge Wireless IoT in Latest Deal](https://aei.dempa.net/archives/31567) - The strategic collaboration will pair STMicroelectronics’ STM32 microcontroller ecosystem and Qualcomm’s wireless connectivity solutions.
- [FUJIFILM to Expand IC Material Business with New Funds](https://aei.dempa.net/archives/31563) - FUJIFILM Corporation has announced an investment of 20 billion yen (US$139 million) in its semiconductor materials business. Primarily, the investment aims to further strengthen its facilities for the development, production and quality evaluation of advanced semiconductor materials in Shizuoka and Oita, Japan. Driven by high-speed, high-capacity communications through 5G/6G, the expansion of autonomous driving, and
- [ASM to Boost SiC Grit with New PE2O8 Line](https://aei.dempa.net/archives/31555) - The new system extends ASM’s portfolio of industry benchmark single wafer silicon carbide epitaxy systems, the 6” PE1O6 and 8” PE1O8 systems.
- [Toyoda Gosei to Soar Robotic Grit With Latest Funding](https://aei.dempa.net/archives/31550) - Toyoda Gosei Co., Ltd. has invested in TriOrb Inc., a startup got its start out of Kyushu Institute of Technology and has been certified as AISol.
- [MinebeaMitsumi Beefs up Grit With New Cambodia Line](https://aei.dempa.net/archives/31513) - MinebeaMitsumi Inc. has held a groundbreaking ceremony for the MinebeaMitsumi Cambodia Pursat Plant in Krakor District, Pursat Province in Cambodia.
- [Mitsubishi to Soar Power ICs from its 12in Wafer Line](https://aei.dempa.net/archives/31524) - Mitsubishi Electric Corporation has announced that its Power Device Works' Fukuyama Factory has begun large-scale supply of power semiconductor chips.
- [Hitachi Poises Lead in Robotic SI with New Acquisition](https://aei.dempa.net/archives/31532) - Hitachi Ltd. has completed the acquisition of MA micro automation GmbH, a leading provider of robotic and automation technology. Accordingly, MA micro automation will be under the operation of JR Automation Technologies, LLC to grow the company's reach in the global advanced automation market, such as Europe, North America, and Southeast Asia. Hitachi and MAX
- [DENSO, ROHM to Surge Chip Business in New Alliance](https://aei.dempa.net/archives/31540) - DENSO CORPORATION and ROHM Co., Ltd. have agreed to start consideration of a strategic partnership in the semiconductor field.
- [Mouser Electronics: 60 Years of Leading Innovation, Delivering Cutting-Edge Products for Future Designs](https://aei.dempa.net/archives/31496)
- [THK Boosts Machine Productivity with New LM Guide](https://aei.dempa.net/archives/31508) - THK Co., Ltd. has started accepting orders for the Miniature LM Guide (model number: AHR) with high acceleration and deceleration and low sliding. Primarily, the Miniature LM Guide is a linear motion (LM) guide with high acceleration and deceleration performance that helps improve the production capacity of semiconductor chips. It combines the durability and low
- [ABB Launches New Accuracy Feature for GoFa Cobots](https://aei.dempa.net/archives/31492) - ABB Robotics has launched Ultra Accuracy, a new industry-leading feature for its GoFa cobot family that delivers the highest level of precision available in cobots. Particularly, it enables over 10 times greater path accuracy relative to other cobots on the market. “As industries look to automation to enhance product quality and achieve tighter tolerances -
- [Nippon Chemi-Con Tops Off New Smart Factory Building](https://aei.dempa.net/archives/31485) - Nippon Chemi-Con Corporation has announced the completion of a new manufacturing building on the premises of Chemi-Con East Japan Co., Ltd.'s Miyagi Plant in June this year. Mainly, the new manufacturing building will operate as a dedicated plant for conductive polymer hybrid aluminum electrolytic capacitors (hybrid capacitors). The company plans to make the first shipment
- [Kioxia, MoDeCH Create New 3D Probing System](https://aei.dempa.net/archives/31477) - Kioxia Corporation, a leader in memory solutions, and MoDeCH Inc., a leading developer of modeling and design technology, have jointly developed an industry-first three-dimensional (3D) probing system. Specifically, the new system is for the high-frequency characteristic measurement for 3D objects up to 110GHz. This time, the new system was announced at The European Microwave Conference
- [Dexerial to Boost Capacity Grit With New Smart Factory](https://aei.dempa.net/archives/31460) - Dexerials Corporation has announced the construction of a new factory with advanced facilities in a new area in Kanuma City in Japan’s Tochigi Prefecture.
- [SK hynix Brings New 12-Layer HBM3E to Mass Production](https://aei.dempa.net/archives/31465) - SK hynix Inc. has begun mass production of the first 12-layer HBM3E product with 36GB[1], the largest capacity of existing High Bandwidth Memory (HBM[2]) to date. Accordingly, the company plans to supply mass-produced products to customers within the year, proving its overwhelming technology once again six months after delivering the HBM3E 8-layer product to customers
- [Resonac, Soitec to Soar Power ICs With Better Material](https://aei.dempa.net/archives/31425) - Resonac Corporation and Soitec have agreed to jointly develop 200mm (8-inch) SiC bonded substrates that will serve as material.
- [New Robot Installations in 2023 Sustain Momentum](https://aei.dempa.net/archives/31454) - The International Federation of Robotics (IFR) has released the World Robotics 2024 Report. Specifically, the report recorded 4,281,585 units operating in factories worldwide - an increase of 10%. Meanwhile, annual installations exceeded half a million units for the third consecutive year. By region, 70% of all newly deployed robots in 2023 were installed in Asia,
- [Universal Robots Offers New Cobot Upgrades](https://aei.dempa.net/archives/31451) - Universal Robots, the Danish collaborative robot (cobot) company, is now increasing the payload capacity on its new-generation, high-payload cobots UR20 and UR30. Accordingly, this enables customers to lift more at no additional cost. The updates raise the total payload, including end-effector, to 25 and 35 kgs, respectively when utilizing the cobot in top lift position.
- [Teledyne to Soar Automation More in AI-Powered Camera](https://aei.dempa.net/archives/31440) - Teledyne DALSA introduces its next-generation AI-powered BOA™3 smart camera, combining new sensor and AI inspection for industrial automation.
- [EDP Adds New Low-Resistance Diamond Substrate](https://aei.dempa.net/archives/31431) - EDP Corporation, a Japanese manufacturer of synthetic diamonds, has announced that it increased the size of the low-resistance substrates released last year and now, is introducing it as a new product. Primarily, the new product has a size of up to 13×13mm. Specifically, the “Large Low Resistance PCB” features self-supporting single-crystal substrate containing high concentration
- [ASMPT to Offer Innovative SMT Line With its New System](https://aei.dempa.net/archives/31418) - The Factory Equipment Center of ASMPT offers a unique approach to asset and maintenance management in the Intelligent Factory.
- [DigiKey to Surge Better Automation in New Video Series](https://aei.dempa.net/archives/31412) - DigiKey has announced the debut of Season 4 of the Factory Tomorrow video series sponsored by Siemens and Banner Engineering.
- [Teledyne Brings Innovative Tech in its Latest Module](https://aei.dempa.net/archives/31364) - Teledyne's new imaging module features the recently announced Topaz5D™ image sensor, a compact board, standard connector, and a pre-assembled lens.
- [TSMC, Cadence to Surge Innovative 3DICs in AI](https://aei.dempa.net/archives/31380) - Cadence is collaborating with TSMC to enhance productivity and optimize product performance for AI-driven advanced-node designs and 3D-ICs.
- [TRI’s New 3D AOI Tool Meets Smart Factory Standards](https://aei.dempa.net/archives/31391) - Test Research, Inc. (TRI) has introduced the TR7700QC SII Core Features 3D AOI equipped with essential inspection functionalities tailored for the electronics manufacturing industry. Mainly, the Core Features 3D AOI showcases a user-friendly programming for easy setup. It features flexible IPC-610 inspection algorithms, optional AI-powered solutions, and highlights compliance with the latest Smart Factory standards.
- [Canon Ships NIL System to TIE, Spurs New Chip R&D](https://aei.dempa.net/archives/31398) - Canon Inc. ships its most advanced lithography platform, the FPA-1200NZ2C nanoimprint lithography (NIL) system for semiconductor manufacturing, to the Texas Institute for Electronics (TIE), a Texas-based semiconductor consortium. Basically, Canon became the first in the world to commercialize a semiconductor manufacturing system that uses NIL technology. It was during the FPA-1200NZ2C's release on October 13,
- [OKI’s New Service Ensures Reliability of SiC Power IC](https://aei.dempa.net/archives/31387) - OKI Engineering Co., Ltd. (OEG), a provider of reliability evaluation and environmental protection technical services for the OKI Group, will launch the AC-BTI (Note 1) Test Service. Primarily, this service aims to evaluate the degradation modes inherent in silicon carbide (SiC) power semiconductors (Note 2) installed in automotive and industrial equipment. Mainly, OEG provides services
- [Taiyo Nippon Sanso Aims Growth With its 3D Print Tech](https://aei.dempa.net/archives/31367) - Taiyo Nippon Sanso Corporation has developed a dedicated torch for 3D printing processes and metal additive manufacturing (metal AM).
- [Renesas to Surge ADAS Growth With its New SoC](https://aei.dempa.net/archives/31358) - Renesas Electronics Corporation has expanded its popular R-Car Family of system-on-chips (SoCs) for entry-level Advanced Driver Assistance Systems (ADAS).
- [Toshiba Drives Power Efficiency in New 1200V SiC SBDs](https://aei.dempa.net/archives/31349) - Toshiba Electronic Devices & Storage Corporation has added the TRSxxx120Hx Series of 1200V products to its lineup of third-generation silicon carbide (SiC) Schottky barrier diodes (SBD) for industrial equipment, such as photovoltaic inverters, EV charging stations, and switching power supplies. Accordingly, Toshiba starts shipments of 10 new products in the series. This comprise five in
- [Lasertec Boosts SiC Wafer Inspection with New System](https://aei.dempa.net/archives/31339) - Lasertec Corporation has announced the release of SICA108, the latest model of its SiC wafer inspection and review systems. Specifically, SICA108 features both surface and photoluminescence (PL) inspection capabilities in one body. Thus, it enables customers to concurrently perform high-speed inspection and high-accuracy classification of surface defects as well as crystallographic defects. Offers Higher Throughput,
- [Brother’s New Deburring Center Suits Die-Cast Parts](https://aei.dempa.net/archives/31331) - Brother Industries, Ltd. has announced the release of the SPEEDIO DG-1 Deburring Center, which specializes in deburring die-cast parts. This new model will be demonstrated at the JIMTOF2024 (32nd Japan International Machine Tool Fair) in November 2024. It will also be exhibited at J-DEC2024 (Japan Die Casting Conference and Exhibition). SPEEDIO DG-1 Deburring Center Particularly,
- [POET, Mitsubishi Ally on New Optical Engine for AI](https://aei.dempa.net/archives/31288) - POET Technologies Inc. has collaborated with Mitsubishi Electric Corporation to co-develop integrated optical engine chipsets for 3.2T pluggable transceivers. Primarily, they are a highly sought-after product for optical connectivity in the rapidly growing artificial intelligence (AI) networking market. Mainly, the two companies will jointly support product demonstrations with major customers. POET is a designer and
- [New Canon i-Line Stepper Caters to Small Wafers](https://aei.dempa.net/archives/31293) - Canon Inc. releases the FPA-3030i6 i-line1 stepper, a new semiconductor lithography system for processing wafers with a diameter of 8 inches (200mm) or smaller. Primarily, the FPA-3030i6 employs a newly developed projection lens that boasts high transmittance and high durability. The system reduces lens aberration for high-exposure dose processes and improves productivity by shortening exposure
- [ST to Lift SiC Power With its Latest Line](https://aei.dempa.net/archives/31312) - STMicroelectronics is introducing its latest STPOWER SiC MOSFET, bringing new power efficiency and performance benchmarks.
- [Micropsi Makes New Strategic Shift to U.S. Market](https://aei.dempa.net/archives/31316) - Micropsi Industries, provider of the MIRAI AI-vision software for industrial robots, has announced its transition to a U.S.-based company. Previously a German company, this strategic shift aligns with its growth objectives. Specifically, it becomes closer to its North American customers and provides a more robust infrastructure to support the regional market. Strategic Shift to Leverage
- [Partners to Surge Quantum Computer in New Project](https://aei.dempa.net/archives/31306) - Infineon Technologies AG and its technology partner Oxford Ionics Ltd. will build a mobile quantum computer as one of three consortia by Agentur für Innovation in der Cybersicherheit GmbH “Innovation for Cybersecurity” (Cyberagentur). Specifically, the Cyberagentur, supported by the German Federal Ministries of the Interior and Defence, aims to obtain three functioning mobile quantum computers
- [Festo to Lift Clean Energy Drive in its Ohio Line](https://aei.dempa.net/archives/31302) - Festo has launched its clean energy project at its North American Regional Service Center in Ohio, enough to supply 2.6 million kWh of energy needs.
- [Advantech to Lift ASEAN Grit With New Singapore Site](https://aei.dempa.net/archives/31272) - Advantech has expanded its regional office in Singapore that will fortify further its presence in Southeast Asia and propel IIoT and AIoT.
- [Jabil to Boost Photonics Line in New Investment](https://aei.dempa.net/archives/31281) - Jabil Inc. has announced its continued investment in silicon photonics-based products and capabilities. Primarily, it aims to support the increasing demands of hyperscalers and next-wave cloud and AI data center growth. Along this line, Jabil will roll out additional capabilities at its Ottawa, Canada site in the fourth quarter of CY2024. Primarily, it aims to
- [Samsung to Support On-Device AI in Cars with New SSD](https://aei.dempa.net/archives/31277) - Samsung Electronics Co., Ltd. has successfully developed the industry’s first PCIe 4.0 automotive SSD based on eighth-generation vertical NAND (V-NAND). Primarily, it offers industry-leading speeds and enhanced reliability. Thus, the new auto SSD, AM9C1 is an optimal solution for on-device AI capabilities in automotive applications. Specifically, the AM991 features about 50% improved power efficiency compared
- [SK hynix to Boost CXL with New Linux Addition](https://aei.dempa.net/archives/31267) - SK hynix Inc. has announced that the key features of its Heterogeneous Memory Software Development Kit (HMSDK)1 are now available on Linux2, the world's largest open-source operating system. Primarily, HMSDK is SK hynix's proprietary software for optimizing the operation of Compute Express Link (CXL)3. Specifically, CXL is gaining attention as a next-generation AI memory technology
- [Asahi Kasei Fuels EV Battery Safety with New Material](https://aei.dempa.net/archives/31237) - The Japanese technology company Asahi Kasei Corp. introduces a new material solution for enhanced electric vehicle (EV) battery safety. A flame-retardant and highly flexible nonwoven fabric, LASTAN™ is an outstanding alternative to conventional materials for thermal runaway protection. It can be utilized in top covers, busbar protection sleeves, and other applications within the EV battery
- [New Perovskites Exhibit Unique Ferroelectric Behavior](https://aei.dempa.net/archives/31261) - A group of researchers from Nagoya University in Japan has synthesized 4- and 5-layered versions of the electrical material perovskite. Analyzing the mechanism of ferroelectricity in the material, they found it has a unique function. Particularly, the material switches its ferroelectric mechanisms depending on whether the number of layers is odd or even. Researchers expect
- [NSK, CHITOSE to Surge Business in New Alliance](https://aei.dempa.net/archives/31257) - NSK Ltd. has been collaborating with CHITOSE Group, and the partnership aims to undertake business creation activities focused on biomass recycling.
- [ASMPT's New Laser Dicing Line Results in Better Yield](https://aei.dempa.net/archives/31198) - The multi-beam laser dicing platform of ASMPT offers greater yields and improved quality in wafer separation, setting new standards in performance.
- [Resonac Develops New Temporary Bonding Film](https://aei.dempa.net/archives/31220) - Resonac Corporation has developed a temporary bonding film to support a wafer on a glass carrier temporarily in the semiconductor device fabrication process (front-end process) and semiconductor packaging process (back-end process). Additionally, it developed the debonding process for the temporary bonding film. Specifically, this debonding process uses xenon (Xe) flash light irradiation to debond the
- [Keysight to Surge Software Line in New Synopsys Deal](https://aei.dempa.net/archives/31221) - Keysight has moved to acquire Synopsys’ Optical Solutions Group, which will broaden the company’s optical analysis software tools for design and simulation.
- [JSR to Expand its Photoresists With New Korea Line](https://aei.dempa.net/archives/31241) - JSR Corporation has decided to establish a new photoresist development base in Japan and Korea in order to expand its R&D activities.
- [KOITO to Sustain Grit in Americas With New Expansions](https://aei.dempa.net/archives/31232) - KOITO MANUFACTURING has announced its plans to increase its production capacity in Mexico and Brazil to meet growing demand.
- [Sumitomo Chemical Tech Results in Better Displays](https://aei.dempa.net/archives/31210) - The Sumitomo Chemical Group has commercialized its transparent glass LED display, a product for next-generation communication, at Dongwoo Fine-Chem Co., Ltd.
- [Toyoda Gosei to Boost Grit in India With New Line](https://aei.dempa.net/archives/31203) - Toyoda Gosei Co., Ltd. will open a new plant in Harohalli in the state of Karnataka in 2026 to meet the growing demand in the country’s automotive field.
- [Tata, Analog to Surge Better IC Production in New Deal](https://aei.dempa.net/archives/31185) - Tata Group and Analog Devices, Inc. have agreed to partner and explore potential cooperative semiconductor manufacturing opportunities in India.
- [ABB Robotics to Boost MassRobotics in New Support](https://aei.dempa.net/archives/31193) - ABB Robotics has announced its sponsorship of MassRobotics, the leading innovation hub and startup accelerator for robotics in the United States. As part of this sponsorship, ABB Robotics will donate several of its versatile GoFa™ 5kg collaborative robots (cobots). Also, it will provide licenses to its RobotStudio® simulation programming software to MassRobotics. With these, they
- [Brother Completes New Machine Tool Plant in India](https://aei.dempa.net/archives/31180) - Brother Machinery (India), a subsidiary of Brother Industries, Ltd., has completed the construction of a new machine tool plant near Bengaluru City in southern India. Mainly, this is the third machine tool production site after Japan and China. Operations at the new plant are set to start in December 2024. Under the Group Vision "At
- [New Block Copolymer Achieves 7.6nm Line Width Patterns](https://aei.dempa.net/archives/31169) - A recently developed block copolymer could help push the limits of integration and miniaturization in semiconductor manufacturing. This, according to a report by scientists from Tokyo Institute of Technology (Tokyo Tech) and Tokyo Ohka Kogyo Co., Ltd. (TOK). Chemically tailored for reliable directed self-assembly, the proposed compound can arrange itself into perpendicular lamellar structures whose
- [Teradyne, Siemens to Surge Tech for Better Automation](https://aei.dempa.net/archives/31163) - Teradyne Robotics is jointly developing a robotics showcase at MxD (Manufacturing x Digital) with Siemens, a leading provider of industrial automation.
- [Faraday Factory's New Feat Powers Fusion Energy  Supply Chain](https://aei.dempa.net/archives/31152) - Faraday Factory Japan LLC has passed a milestone of 5,000km, or 1 Giga-Ampere-meter, cumulative deliveries of high-temperature superconductor (HTS) to fusion companies. The users of this enabling superconductor material are spread over four continents and pursue different fusion concepts – tokamak, stellarator, levitating dipole, and magnetic mirror. Primarily, superconductors by Faraday Factory Japan are available
- [Schneider to Boost Automation Grit With Latest SCARA](https://aei.dempa.net/archives/31139) - Schneider Electric has launched its new ultra-compact Lexium Scara industrial and will assume a key role in its automation portfolio.
- [New Toyo Technica Hall System Takes Wider Temperature](https://aei.dempa.net/archives/31142) - Toyo Technica Co., Ltd. will introduce the M91 FastHal Station equipped with a resistivity/Hall measurement system manufactured by U.S. company Lake Shore Cryotronics, Inc. Primarily, the new system can handle an expanded evaluation range of temperature characteristics. Specifically, the M91 FastHall Station uses Lake Shore's patented technology to perform resistivity/Hall effect measurements at high speed
- [Siemens, Merk to Soar More Production Tech in New Deal](https://aei.dempa.net/archives/31136) - Merck and Siemens have entered a strategic partnership on digital transformation technology and bring next-level automation in manufacturing.
- [Panasonic, Univ. of Kansas Ally on New Battery Tech](https://aei.dempa.net/archives/31130) - Panasonic Energy Co., Ltd. and the University of Kansas have signed an agreement aimed at promoting the development of next-generation technologies and the cultivation of specialist expertise in the field of lithium-ion batteries. Construction of 2nd Factory in North America Specifically, the University of Kansas is a flagship university in the U.S. state of Kansas.
- [Emerson to Surge Industrial Edge in New Alliance](https://aei.dempa.net/archives/31109) - Emerson has joined Linux Foundation’s Margo, a new open-standard body that will enable more flexible and scalable automation for customers.
- [Unique Rockwell Tool To Offer Better Industrial Safety](https://aei.dempa.net/archives/31084) - Rockwell Automation has introduced the Logix SIS, a cutting-edge safety instrumented system to meet needs of modern industrial environments.
- [Festo's Unique Tech Results in Better Wafer Protection](https://aei.dempa.net/archives/31073) - Mass flow controller VEFC from Festo comes with piezo technology and has been especially suitable for use in electronics manufacturing and food production.
- [Yokogawa's Latest Test Tool to Offer Better Workflow](https://aei.dempa.net/archives/31069) - Yokogawa's DLM3000HD series high-definition oscilloscope delivers higher resolution for more accurate waveform analysis and improved usability.
- [Nidec OKK to Soar Grit in Automation With New Machine](https://aei.dempa.net/archives/31006) - Nidec OKK has launched a stereoscopic pallet stocker that features a best-in-class space efficiency and installed in five-axis stereoscopic machining center.
- [Yamaha to Surge First JGreeX Green Tech in Latest SMTs](https://aei.dempa.net/archives/30928) - Yamaha Motor Co., Ltd. has decided to utilize JFE Steel Corporation's green steel JGreeX for some of the exterior parts of its surface mounters.
- [Intel, AWS to Surge Better Chip Production in New Deal](https://aei.dempa.net/archives/31102) - Intel Corp. and Amazon Web Services. Inc. (AWS) have entered a co-investment in custom chip designs under a multi-year, multi-billion-dollar framework.
- [New Process by AGC Tweaks Fluoropolymer Manufacturing](https://aei.dempa.net/archives/31100) - AGC Inc. has developed an innovative process to manufacture fluoropolymers without the use of surfactants*1. Using the technology, AGC aims to achieve a continuous and stable supply of fluoropolymers. Primarily, these materials are indispensable for the realization of a carbon-neutral and digital society. Some fluoropolymers have been conventionally manufactured through a method called emulsion polymerization
- [EBARA to Build New Hydrogen Equipment Center](https://aei.dempa.net/archives/31093) - EBARA Corporation will establish a new equipment testing and development center for hydrogen infrastructure-related equipment in Futtsu City, Chiba Prefecture, Japan. Mainly, the establishment of Ebara Hydrogen Equipment Test and Development Center (E-HYETEC) aims to realize a hydrogen society. The company will invest approximately 16 billion yen (US$114 million) for the center's construction. Background Amid
- [Sodick to Market New Femtosecond Laser Machine](https://aei.dempa.net/archives/31058) - Sodick Co., Ltd. has developed the LSP4040 linear motor-driven femtosecond laser processing machine and will start accepting orders beginning Nov. 2024. Primarily, LSP4040 is a precision microfabrication machine for difficult-to-process materials such as high-performance, high-hardness, and brittle materials. Specifically, the development was based on the fundamental research on femtosecond lasers for more than a dozen
- [Delta Toughens Grit in India With New HQ, R&D Site](https://aei.dempa.net/archives/31046) - Delta Electronics has inaugurated its new LEED Gold-certified India headquarters green building and its new research & development (R&D) center in Bengaluru.
- [Bosch Rexroth Tech to Offer More in Energy Savings](https://aei.dempa.net/archives/31052) - With its servo-hydraulic drive solution, Bosch Rexroth is increasing efficiency in sheet metal forming, simplifying installation for machine manufacturer.
- [Benchmark Opens New Facility in Penang, 4th in Asia](https://aei.dempa.net/archives/31041) - Benchmark Electronics, Inc., a global provider of engineering, design, and manufacturing services, has opened a new facility in Penang, Malaysia. This will be Benchmark's fourth facility in the region and will become a critical addition to existing facilities. Also, it will allow for vertical integration of key capabilities. Primarily, the new facility will focus on
- [Maxell to Invest ¥5B in New Line at Ono Works](https://aei.dempa.net/archives/31021) - Maxell Ltd. will invest approximately 5 billion yen to strengthen the production facilities and expand the building at Ono Works to increase the production capacity of primary batteries for medical devices. The goal is to double the current production capacity*1 of primary batteries for medical devices by the end of FY2027. Specifically, the Ono Works
- [Siemens Partners to Soar DX Offer for Better Machines](https://aei.dempa.net/archives/31024) - Siemens and partners DMG MORI and Renishaw are working as innovation partners and expanding digital offers for machine tools.
- [Hitachi Energy to Surge Capacity With More Funding](https://aei.dempa.net/archives/31009) - Hitachi Energy has invested over US$200 million to enhance its operations in Brazil and is part of global efforts to ramp up transformer capacity.
- [PSA ELNA Opens New PCB Plant in Penang](https://aei.dempa.net/archives/31005) - ELNA PCB(M) SDN. BHD., a global supplier of printed circuit boards (PCBs) and a subsidiary of Global Brands Manufacture under the PSA Group, has announced the opening of its second state-of-the-art plant in Penang, Malaysia. Representing an investment exceeding RM1 billion, the five-story PCB manufacturing facility is adjacent to ELNA’s existing plant. Also, it is
- [MEK Offers 3D Desktop AOI System with New Chassis](https://aei.dempa.net/archives/30976) - Marantz Electronics Ltd. (MEK), a key player in the Automated Optical Inspection (AOI) and Solder Paste Inspection (SPI) technology arena, has launched its latest product, the PowerSpector JSAz 550. Primarily, this new selective 3D desktop AOI system is a larger L-size model, accommodating PCBs up to 550 × 550mm. New Chassis Accommodates Larger PCB Particularly,
- [Resonac to Soar High With New SiC Line in Japan](https://aei.dempa.net/archives/30984) - Resonac has started the construction of a new factory for SiC wafers for power semiconductors, which will be crucial to the growth of the company.
- [TRUMPF to Spur Growth With New High Tech Site](https://aei.dempa.net/archives/30967) - TRUMPF has invested €40 million in its expanded site in Pasching in Austria, which the company will utilize as a growth strategy for bending technology.
- [New Cooling Tech to Pave Way for Non-Flammable Battery](https://aei.dempa.net/archives/30954) - Hanwha Aerospace, in collaboration with SK Enmove, has unveiled the world's first immersion cooling Energy Storage System (ESS). Primarily, this development marks a significant step towards non-flammable battery technology. The companies made the announcement at a technology briefing held at the Hanwha Building in Seoul. At the event, they showcased the breakthrough technology that promises
- [ABB, EVE Energy to Offer Better, Greener Battery Sites](https://aei.dempa.net/archives/30918) - ABB and Eve Energy will partner to enhance battery production operations and deliver energy-efficient solutions in line with lithium battery demand.
- [Samsung Mass Produces New QLC 9th-Gen V-NAND](https://aei.dempa.net/archives/30938) - Samsung Electronics Co., Ltd. has begun mass production of its one-terabit (Tb) quad-level cell (QLC) 9th-generation vertical NAND (V-NAND). Mainly, Samsung started the industry’s first mass production of QLC 9th-generation V-NAND following the industry’s first triple-level cell (TLC) 9th-generation V-NAND production in April this year. With this, Samsung is solidifying its leadership in the high-capacity,
- [Innovative Yamaha Tech to Make Way in New SCARA Robot](https://aei.dempa.net/archives/30933) - Yamaha Motor Co., Ltd. is its SCARA robot YK-XG series with the addition of the YK1200XG model, which will launch alongside the RCX341 dedicated controller.
- [Infineon to Soar Power GaN With First 300mm Offer](https://aei.dempa.net/archives/30915) - Infineon will shape the rapidly growing GaN market with this groundbreaking GaN 300mm technology to maximize capital efficiency in GaN production.
- [New Battery Line in New York to Meet More Demands](https://aei.dempa.net/archives/30812) - Raymond Corporation and Toyota Material Handling have opened the Energy Solutions Manufacturing Center of Excellence in Broome County, New York.
- [Protolabs to Boost 3D Options With New Hybrid Tech](https://aei.dempa.net/archives/30906) - Digital manufacturing leader Protolabs has expanded its 3D printing capabilities with the launch of an advanced photopolymers technology.
- [Schneider to Surge Green Factory in New U.K. Funding](https://aei.dempa.net/archives/30891) - Schneider Electric is investing £42 million in a new manufacturing facility in Scarborough, North Yorkshire that will drive U.K.’s move to cleaner energy.
- [DENSO Eyes Innovative Smart Factory at its Zenmyo Line](https://aei.dempa.net/archives/30899) - DENSO will build a new plant by expanding the site of the Zenmyo Plant in Nishio City and will invest ¥69 billion for the fully-automated smart factory.
- [Hirose, AIO to Seal Connector Grit in New JV](https://aei.dempa.net/archives/30821) - Hirose Electric and AIO Core have entered into capital and business alliance that will jointly develop high performance active optical connectors.
- [Honda's Latest SiLC Funding To Get More Grip In AI](https://aei.dempa.net/archives/30886) - SiLC Technologies has received an investment from Honda to develop next-generation FMCW LiDAR solutions for more advanced AI-based machine vision.
- [SK hynix's New Robust SSD Caters to Data Centers](https://aei.dempa.net/archives/30871) - SK hynix Inc. has developed PEB110 E1.S (PEB110), a high-performance solid-state drive (SSD) for data centers. With the advent of the AI era, customer demand for high-performance NAND solutions such as SSDs for data centers, as well as ultra-fast DRAM chips including high bandwidth memory (HBM), is growing. In line with this trend, the company
- [TDK Pitches New Automotive-Grade MLCC with Metal Frame](https://aei.dempa.net/archives/30863) - TDK Corporation has extended the automotive-grade CA Series of its MEGACAP MLCCs with metal frame. Mass production of the product series began in September 2024. In recent years, the development of automobiles with electric powertrains, such as hybrid- (HEVs) and battery-electric vehicles (BEVs), and highly efficient charging technologies, has significantly progressed. Mainly, both help to
- [Tata to Boost Grit in India With New ASPMT Deal](https://aei.dempa.net/archives/30850) - Tata Electronics is boosting further its efforts in establishing chip assembly equipment infrastructure in India with a new deal with ASMPT.
- [NXP Chip to Offer Better Autonomy in Industrial, IoT](https://aei.dempa.net/archives/30853) - NXP has announced the Trimension® SR250, the industry’s first single-chip solution that will propel various autonomous industrial and IoT applications.
- [Jabil to Support India's Growth with New Expansion](https://aei.dempa.net/archives/30841) - Jabil Inc. has signed a Memorandum of Understanding (MoU) with the Tamil Nadu state government. Particularly, this is part of the company’s expansion plans in Tiruchirappalli, Tamil Nadu, India. The signing took place in Chicago and was attended by M K Stalin, Chief Minister, and Dr. T R B Rajaa, Minister for Industries of the
- [Stratasys' Tool to Surge More Reliable 3D Printing](https://aei.dempa.net/archives/30829) - In collaboration with Materialise, Stratasys Ltd. has announced the launch of the Stratasys Neo® Build Processor for Investment Casting.
- [TEL, TATA to Surge India’s Chip Infra in New Deal](https://aei.dempa.net/archives/30785) - Tokyo Electron and Tata Electronics have agreed to collaborate and accelerate the semiconductor equipment infrastructure for India.
- [Bosch Invests €270M in New State-of-the-Art Japan HQ](https://aei.dempa.net/archives/30806) - Bosch has reaffirmed its commitment to Japan with a total investment of 270 million euros in the new headquarters in Yokohama. A state-of-the-art new Japanese headquarters brings under one roof development capacity for the mobility sector that was spread across several locations. In addition, as part of the construction project, a new municipal cultural center
- [New Inspection Observes OLEDs at Ultra-low Brightness](https://aei.dempa.net/archives/30796) - Toyo Technica Co., Ltd. announces it has developed a new inspection technology to investigate the behavior of OLED devices at ultra-low brightness. Mainly, this development was made with TOYOTech LLC, its subsidiary in the U.S., Sharp Display Technology Co., Ltd., and the Japan Advanced Institute of Science and Technology. Primarily, this technology quantifies the difference
- [Omron to Surge in Taiwan With More Innovative Tools](https://aei.dempa.net/archives/30765) - OMRON showcases its cutting edge semiconductor technology machines at SEMICON Taiwan as it propels its presence in one of the world’s major semiconductor hubs.
- [ZF-Foxconn JV to Boost Edge With New Plants](https://aei.dempa.net/archives/30779) - ZF Foxconn Chassis Modules expects to double its annual sales from actual US$4.4 billion to US$8.8 billion until 2029 with volume production growing as well.
- [Kawasaki Robotics to Pitch New Cobots with Partners](https://aei.dempa.net/archives/30770) - Kawasaki Robotics will demonstrate new additions to its extensive robotics portfolio at IMTS in Chicago Sept. 9 to 14. This includes the new CL Series of intelligent collaborative robots (cobots) and new industrial robotic solutions. Mainly, the CL Series cobots are available for order in multiple payloads. Moreover, the new industrial robotic solutions suit welding,
- [SCHUNK Opens New Base in Mexico to Support Growth](https://aei.dempa.net/archives/30761) - SCHUNK has officially opened its new location in Santiago de Querétaro, Mexico. Primarily, the new manufacturing location gears towards future growth. This allows the company to respond to the increasing market demands with high flexibility and efficiency. The building has its own assembly and manufacturing capabilities. Also, it has a CoLab application center for automation
- [Azbil Boosts Production Grit With New Site in Vietnam](https://aei.dempa.net/archives/30740) - Azbil Corporation will establish its new manufacturing subsidiary in Vietnam, which the company aims to augment its total production capacities.
- [TM Robotics Touts New Automated Parts Feeding](https://aei.dempa.net/archives/30749) - TM Robotics offers a revolutionary new robotic feeding system — the Infinifeed™, an automated feeding system that addresses the common challenges of parts feeding and sorting. Shibaura Machine’s advanced THE Series of industrial robots power the Infinifeed™ system. DOMA Automation designed the Infinifeed and integrated by Tera Automation. It uses a unique parallel belt conveyor
- [Denso to Soar Inverter Capacity in New Production Line](https://aei.dempa.net/archives/30674) - Denso will start production of its inverters at its Fukushima site in Japan to expand electrification market and meet needs of mobility suppliers.
- [Delta to Surge Automation With Innovative Tech Tools](https://aei.dempa.net/archives/30735) - Industrial automation solutions provider Delta Universal Instruments have unveiled various industrial solutions at SEMICON Taiwan 2024.
- [ROHM, UAES to Make Way for Rich Pact in Latest Deal](https://aei.dempa.net/archives/30671) - ROHM and United Automotive Electronic Systems Co., Ltd., have recently entered a long-term supply agreement for SiC power devices.
- [Hitachi's Latest Line to Make Green, Smarter Buildings](https://aei.dempa.net/archives/30592) - Hitachi, Ltd. and Hitachi Building Systems, Co., Ltd. have developed a new model of BuilMirai building IoT solution for small and medium-sized buildings.
- [Shin-Etsu Boosts GaN Growth With New 300mm Tech](https://aei.dempa.net/archives/30637) - Shin-Etsu Chemical has created a 300mm (12-inch) QSTTM substrate that the company thinks will further contribute to the further growth of GaN epitaxial.
- [Yokogawa to Offer New Production Tool for Better DX](https://aei.dempa.net/archives/30653) - Yokogawa Co., Ltd. announced the global release of the OpreX™ Intelligent Manufacturing Hub that will utilize robotic process automation (RPA)
- [Siemens Tool to Offer Better Silicon Growth in Cars](https://aei.dempa.net/archives/30719) - SiliconAuto has adopted the PAVE360 software of Siemens Digital Industries Software to reduce development time of semiconductors for automotive.
- [New Cloud-Based CAE Solution Predicts Polymer Behavior](https://aei.dempa.net/archives/30679) - Asahi Kasei Engineering Corp. (AEC) has launched a cloud-based computer-aided engineering (CAE) solution platform that offers highly precise apps to predict crash and impact behavior of polymers. Generally, the adoption of polymer materials in automobiles and other products has been increasing. Thus, precise simulation of material behavior will contribute to enhanced product design. Also, it
- [Visban Bonds RF-on-Glass, AI for New V-Mesh Technology](https://aei.dempa.net/archives/30714) - Visban Co., Ltd. announces its groundbreaking V-Mesh technology for high-frequency millimeter wave (mmWave) networks, designed to slash network deployment costs while boosting reliability. V-Mesh combines the company's RF-on-Glass technology with artificial intelligence (AI). Accordingly, it creates subnetworks that extend the range of mmWave signals and eliminate dead spots. While the benefits of mmWave wireless networks
- [GelSight, Flexxbotics Ally on New Automated Inspection](https://aei.dempa.net/archives/30664) - GelSight, a pioneer in tactile intelligence technology, has partnered with Flexxbotics, a company delivering digital solutions for robot-driven manufacturing at scale. Primarily, the partnership aims to provide a joint solution for robot-enabled nondestructive testing (NDT) with autonomous process control. Mainly, the joint solution incorporates GelSight’s tactile sensing technology into Flexxbotics for advanced robotic machine tending
- [Kyocera Breaks Ground on New Nagasaki Plant](https://aei.dempa.net/archives/30633) - Kyocera Corporation held a groundbreaking ceremony to commence construction of a new production facility in Japan. Primarily, Kyocera Corporation Nagasaki Isahaya Plant is located at the Minami Isahaya Industrial Park in Isahaya City, Nagasaki Prefecture. The company will invest about 68 billion yen (US$469 million) by the end of March 2028 to the plant. Groundbreaking
- [Toyo Technica Pitches New AI-Equipped FIB-SEM](https://aei.dempa.net/archives/30616) - Toyo Technica Co., Ltd., a Japanese trading company specializing in measuring equipment, has released of the new Xe plasma FIB-SEM "AMBER X 2" manufactured by TESCAN GROUP, a.s. (Headquarters: Brno, Czech Republic). Mainly, the new AMBER X 2 highlights the integration of AI technology. As a result, it fully automates the preparation of transmission electron
- [Panasonic to Launch New Impact Wrench for Robots](https://aei.dempa.net/archives/30613) - Panasonic Corporation Electric Works will launch the Robotic Impact, an impact wrench for collaborative robots that supports assembly work in factories, in Dec. 2024. In recent years, the manufacturing industry has to respond to changes in the business environment. Among them include "labor shortages," "carbon neutrality," and "energy and material shortages." The labor shortage problem
- [Stratasys' New Print Line to Offer Better Production](https://aei.dempa.net/archives/30605) - Stratasys has announced the availability of the Origin® Two DLP printer in tandem with its own post-processing system, the Origin Cure™.
- [NXP, VIS New JV to Make Way for 300mm Line](https://aei.dempa.net/archives/30597) - NXP and VIS have formed a joint venture that will pave the way for VSMC’s first 300mm wafer with investments of approximately US$7.8 billion.
- [ATI to Propel Smart Production With New Module](https://aei.dempa.net/archives/30527) - ATI Industrial Automation's GBX Tool Changer module unlocks hyperfast 10Gbit Ethernet for reliable transmission of high-speed data for Industry 4.0 utilities.
- [Nissan Chemical to Boost Tech Grit With New NPT Deal](https://aei.dempa.net/archives/30531) - Nissan Chemical Corporation has agreed to acquire all outstanding shares in Nippon Polytech, strengthening its portfolio in the display field and know how.
- [Sumitomo Bakelite to Pull Start-ups in New Investment](https://aei.dempa.net/archives/30667) - Sumitomo Bakelite Co., Ltd. has announced it decided to invest in UMI No. 3 Investment Limited Partnership. Specifically, UMI is a fund formed by Universal Materials Incubator Co., Ltd., a venture capital firm specializing in investments in the materials and chemical industries. In recent years, with the increasing complexity of the external environment, the needs
- [Nokia Makes Way for Largest R&D Lab in India](https://aei.dempa.net/archives/30648) - Nokia expands its R&D footprint in India with Fixed Networks’ R&D lab in Chennai, Tamil Nadu, the largest globally for the company.
- [Yamaha Machines to Soar New High in Novel Car Lighting](https://aei.dempa.net/archives/30620) - Europe’s automotive lighting makers are moving from traditional electrical production techniques to high-speed, precision electronic assemblers.
- [Sekisui Chemical’s Thai Office Opens New Base in India](https://aei.dempa.net/archives/30576) - Urban Infrastructure and Environmental Products Company of SEKISUI CHEMICAL CO., LTD. has established an India branch of its overseas group company, SEKISUI SPECIALTY CHEMICALS (THAILAND) CO., LTD. (SSCT). SSCT manufactures and distributes Chlorinated Polyvinyl Chloride (CPVC) Compound under the "Durastream" brand. Mainly, SSCT has been selling mainly raw materials for heat-resistant piping materials to meet
- [Toshiba to Fortify Quantum Grit in New Alliances](https://aei.dempa.net/archives/30572) - Toshiba Digital Solutions Corporation and its partner SpeQtral have struck an agreement with ST Engineering to boost strategy for quantum-secure solutions.
- [JEOL Enhances New SEM Polisher with IoT Feature](https://aei.dempa.net/archives/30562) - JEOL Ltd. announces the release of the new CROSS SECTION POLISHER™ IB-19540CP/COOLING CROSS SECTION POLISHER™ IB-19550CCP for electron microscopes. Mainly, CROSS SECTION POLISHER™ (CP) is widely utilized in the fields of electronic parts, ceramics, life science, metal, battery, and polymer. Thus, it can easily prepare the mechanical high-quality uniform cross section for complex materials and
- [Digital Lithography Offers Novel Chip Patterning Approach](https://aei.dempa.net/archives/30555) - For years, increases in semiconductor performance were achieved by shrinking device features using masked-based optical photolithography with shorter and shorter wavelengths, and then packing more and more of the smaller printed features into 2D monolithic chips. As lithographic scaling has slowed down due to technical and cost challenges, the semiconductor industry has turned to heterogeneous
- [Research to Edge Quantum Tech in Automated Robots](https://aei.dempa.net/archives/30545) - Sharp and Tohoku University have developed a simultaneous control engine for multiple automated transport robots using quantum annealing.
- [Industry to Harness Better IC Growth in AI Era](https://aei.dempa.net/archives/30539) - Stakeholders are joining forces at SEMICON Taiwan to drive further growth in the semiconductor industry prospects of AI contributing to that growth.
- [Mabuchi to Boost Grit in AGVs With New CuboRex Deal](https://aei.dempa.net/archives/30373) - Mabuchi Motor has invested in CuboRex in the development of crawler-type automated guided vehicle (AGV) and making use its brushless motor technology.
- [Beckhoff to Expand U.S. Grit With Latest Atlanta Site](https://aei.dempa.net/archives/30518) - Located in Alpharetta, Georgia, Beckhoff’s new facility will serve as a home base for local sales and support engineers and enhance training and R&D support.
- [Mouser to Offer Engineers With Better IIoT Line](https://aei.dempa.net/archives/30515) - Mouser Electronics, Inc. is empowering innovations by providing more benefits from its product line, with its comprehensive IIoT lineup.
- [AGC Aims for Better R&D Results With New Taiwan Center](https://aei.dempa.net/archives/30499) - AGC Inc. has announced the opening of the AGC Chemicals Technical Center in Taiwan, which will provide technical services.
- [E&R to Propel Glass Substrate Use in New Alliance](https://aei.dempa.net/archives/30508) - Taiwanese manufacturer, E&R Engineering Corp., launched the E-Core System, an initiative that led to the creation of the Glass Substrate Supplier E-Core System Alliance. Primarily, the alliance aims to combine expertise to promote comprehensive solutions, providing equipment and materials for next-generation advanced packaging with glass substrates to both domestic and international customers. E-Core System combines
- [Fujitsu to Put up New Open APN Lab in Europe](https://aei.dempa.net/archives/30494) - Fujitsu has announced plans to establish an Open All-Photonics Network (APN) (1) Lab in Düsseldorf, Germany from November 2024 to March 2025. The aim is to popularize APNs and promote the global expansion of the Innovative Optical and Wireless Network (IOWN) (2). The lab is the first of its kind outside of Japan (3). Mainly,
- [Taiwan to Surge New Opportunities for Drone Industry](https://aei.dempa.net/archives/30468) - TAITRA recently hosted a media networking in Taipei to help Taiwanese drone companies expand their international market presence.
- [Delta to Soar Power Inductor Line With New Alps Deal](https://aei.dempa.net/archives/30454) - Delta Acquires Alps Alpine's Power Inductor Business Assets to Enhance its Capabilities in Next-Generation Passive Components.
- [AEI September 2024 Special Issue - Digital Edition](https://aei.dempa.net/archives/30458) - Get a peek at the technologies that are to unfold at SEMICON Taiwan 2024 and electronica and productronica India 2024. Get to know the latest electronics production and manufacturing trends in the September 2024 digital edition of AEI. READ HERE
- [Siemens Bats for Better Battery With New Alliance](https://aei.dempa.net/archives/30481) - Siemens Digital Industries Software has joined the Global Battery Alliance, a collaboration to drive change in the entire battery manufacturing value chain.
- [TE's Tech Tools to Touts Better and Innovative Robots](https://aei.dempa.net/archives/30478) - With its extensive engineering proficiency, TE Connectivity has built a strategic portfolio for the field of service robots to meet customers' diverse demands.
- [Keysight to Showcase New Wire Bond Inspection Solution](https://aei.dempa.net/archives/30444) - Keysight Technologies, Inc. introduces the Electrical Structural Tester (EST), a wire bond inspection solution for semiconductor manufacturing. Primarily, it ensures the integrity and reliability of electronic components. Generally, the semiconductor industry faces constant testing challenges. Mainly, it is due to the increasing density of chips in mission-critical applications such as medical devices and automotive systems.
- [New Toshiba Automotive Photorelay Handles 900V](https://aei.dempa.net/archives/30437) - Toshiba Electronic Devices & Storage Corp. has launched TLX9152M, an automotive photorelay[1] with an output withstand voltage of 900V(min). Specifically, this feature makes it highly suitable for application in high-voltage automotive batteries. The new photorelay is housed in an SO16L-T package. The company starts volume shipments of the photorelay. Improved charge times and a longer
- [Yaskawa to Meet High Demand in New Ohio HQ Expansion](https://aei.dempa.net/archives/30432) - Yaskawa America Inc., Motoman Robotics Division (Yaskawa Motoman) has completed the expansion of its headquarters in Miamisburg, Ohio. The 185,000 square foot state-of-the-art addition will nearly double the size of the company’s current production space. Accordingly, it would optimize operational capacity to meet the growing demand of the automation industry. Primarily, the additional manufacturing space
- [JUKI Earns Top Prize for its Innovative SMT Line](https://aei.dempa.net/archives/30427) - JUKI Corporation has bagged the top prize of the 54th Machine Design Award (IDEA) for its LX-8 high-speed flexible mounter.
- [Saki to Make Growth With High Tech Inspection Line](https://aei.dempa.net/archives/30414) - Amid Strong Market Demand , Saki Will Showcase its Full Cutting-Edge Total Inspection Line Solutions at Productronica India 2024.
- [New FANUC Controller Tightens Robot Cybersecurity](https://aei.dempa.net/archives/30405) - FANUC America, a global industrial automation leader, introduces R-50iA, the first robot controller to offer cybersecurity. Additionally, it offers a wide range of enhancements and new intelligent features to maximize robot performance. Intelligent and compact, the new R-50iA controller is available in three cabinet sizes: the R-50iA Mate-Cabinet, R-50iA A-Cabinet, and the R-50iA B-Cabinet, which
- [Huawei to Offer Best Tech for Malaysia's Big DX Surge](https://aei.dempa.net/archives/30388) - Huawei Accelerates Digital Transformation Throughout Malaysia's Automotive, Smart Manufacturing Value Chain Through Formidable Solutions.
- [Nordson Paves Way for High Tech Tools in IC Packaging](https://aei.dempa.net/archives/30354) - Nordson Electronics Solutions to feature high-throughput fluid dispensing technologies for wafer-level and panel-level packaging at SEMICON Taiwan 2024
- [EV Group to Float Innovative IC Process at Taiwan Expo](https://aei.dempa.net/archives/30382) - At SEMICON Taiwan 2024, EV Group (EVG) will highlight key advances in hybrid and fusion wafer bonding, infrared (IR) laser layer release technology, and lithography for advanced semiconductor and micro-electronics manufacturing and packaging. SEMICON Taiwan 2024 expo will be held in Taipei on Sept. 4 to 6. Mainly, EVG’s innovative high-volume-manufacturing (HVM) ready process
- [Brother to Offer Better Supply Chain in Latest Deal](https://aei.dempa.net/archives/30313) - Japanese multinational manufacturer Brother selected supply chain management solution provider Kinaxis for accurate and agile scenario planning.
- [ABB to Offer Better Emission Monitoring in New Buyout](https://aei.dempa.net/archives/30337) - The acquisition on Födisch Group will expand ABB’s position in industrial emission measurement, addressing the world’s energy and sustainability challenges.
- [New FANUC ROBODRILL Plus Offers More, Better Features](https://aei.dempa.net/archives/30342) - FANUC America unveils the latest addition to FANUC’s ROBODRILL vertical machining center (VMC) lineup, the new α-D28LiB5ADV Plus Y500. This new VMC offers more advantages to any production machine shop. Specifically, it features a larger table, shorter drilling, and tapping cycles, and more tools coupled with faster tool changes. Designed for Peak Performance Primarily, the
- [Cincoze's New Computer Eyes Machine Vision](https://aei.dempa.net/archives/30351) - Cincoze recently launched the new DV-1100 industrial computer series for edge computing. Primarily, the series provides an ideal blend of high-performance computing with essential I/O that has garnered attention from large-scale edge computing projects worldwide since its launch. Particularly, DV-1100 suits applications that require real-time large-scale image processing, data computing, and high-speed transmission, like machine
- [LEM to Boost Tech Growth With More R&D Sites](https://aei.dempa.net/archives/30329) - Continually investing in the future, electrical measurement technology specialist LEM opens new offices in Munich and Shanghai to be closer to major customers.
- [LG Innotek to Drive Digital Twin in Latest Ansys Tie-up](https://aei.dempa.net/archives/30316) - LG Innotek is accelerating its digital transformation to enhance business competitiveness. On August 22, LG Innotek announced that it will partner with Ansys, a top engineering simulation company, to expand the application of digital twin technology to all its processes. Particularly, digital twin is a technology that replicates objects in a virtual space to predict
- [Advantech to Beat Standard with New Wi-Fi 7 Solutions](https://aei.dempa.net/archives/30309) - Advantech is enhancing its support services to offer a comprehensive suite of wireless solutions that surpass industry standards. Committed to technical excellence, it recognizes the crucial role of technical expertise in wireless integration. Along this line, Advantech Industrial Wireless Solutions (AIW) provides developers with exceptional support throughout the entire product lifecycle. Jerry Chiang, Advantech Director,
- [Hitachi High-Tech Zooms in on Quality in New SEMs](https://aei.dempa.net/archives/30255) - Hitachi High-Tech Corporation has launched TM4000PlusIII and TM4000III Tabletop Microscopes for the global market. Primarily, these tools are equipped with support features for automation and stable operation, critical to manufacturing environments. Mainly, the TM Series shrinks the electron microscope to a size capable of being mounted on a tabletop. Thanks to their compact size and
- [ASMPT to Make Way for High Tech Line at Semicon Taiwan](https://aei.dempa.net/archives/30183) - ASMPT Limited will be exhibiting at SEMICON Taiwan 2024 to showcase its advanced automation solutions for production lines and factories.
- [Hitachi-Singtel Latest Alliance to Surge Better DX](https://aei.dempa.net/archives/30284) - Singtel and Hitachi, Ltd. have agreed to collaborate on next-generation data centers and GPU Cloud in Japan and potentially the wider Asia Pacific region.
- [TI to Surge 300mm Fab Grit With New U.S. Pledge](https://aei.dempa.net/archives/30172) - Texas Instruments (TI) and the U.S. Department of Commerce have signed a non-binding agreement for up to US$1.6 billion in proposed direct funding.
- [ROHM Sets Sights on Power Field with New Controller IC](https://aei.dempa.net/archives/30229) - ROHM Co., Ltd. has developed a general-purpose controller IC with an external pulse width modulator (PWM) control method (*1) field-effect transistor (FET) that is ideal for AC-DC power supplies for industrial equipment. A wide range of models are available, including the BD28C55FJ-LB for driving low-voltage MOSFETs, the BD28C54FJ-LB for driving medium- and high-voltage MOSFETs, the
- [TMEIC Paves Way for US Growth With New Factory Line](https://aei.dempa.net/archives/30236) - Japan’s TMEIC Corporation is expanding its presence in the United States through its subsidiary, TMEIC Corporation Americas.
- [ESMC to Soar FinFET Grit, Breaks Ground New 300mm Site](https://aei.dempa.net/archives/30222) - ESMC, a company put up by TSMC, Bosch, Infineon and NXP, has held a groundbreaking for its first semiconductor fab in Dresden, Germany.
- [OKI to Surge More Capacity With Improved PCB Line](https://aei.dempa.net/archives/30191) - OKI has set up new PCB manufacturing line for semiconductor manufacturing and testing equipment at its Joetsu plant in Yamagata, Japan.
- [MANA Touts New Computing Paradigm with Reconfigurable Logic Circuits](https://aei.dempa.net/archives/30283) - Scientists from the Research Center for Materials Nanoarchitectonics (MANA) developed a reconfigurable logic circuit that switches functions with constant input voltages. Mainly, this innovation opens doors to novel computing architectures. Today, most computers are based on the von Neumann architecture, where memory and processing are handled separately. However, the transfer of data between these two
- [Taiyo Yuden’s ELNA to Surge Grit With New Site](https://aei.dempa.net/archives/30276) - Taiyo Yuden Co., Ltd., through its subsidiary ELNA Co., Ltd., has initiated the acquisition of Tenma Co., Ltd.’s factory in Hirosaki in Aomori, Japan.
- [Aerotech to Surge Better Platform in New Updates](https://aei.dempa.net/archives/30271) - Aerotech Inc., a global leader in precision motion control and automation, continues to develop its powerful, user-friendly Automation1 platform.
- [DigiKey Touts Unique Ways to Surge Past Market Slack](https://aei.dempa.net/archives/30268) - In this interview with AEI, Tony Ng, Vice President, APAC at DigiKey shares the innovative strategies the company employs in the face of market challenges.
- [Alliance to Surge 5G Value in Smart Manufacturing](https://aei.dempa.net/archives/30261) - microSHIFT has started deploying 5G smart production lines in its sites in Taiwan to drive future growth momentum and harness advanced manufacturing.
- [FUJI Renews Pitch for Novel Products to Meet New Needs](https://aei.dempa.net/archives/18878) - The new management team of FUJI will implement swift actions to meet the rapidly changing business and market landscape, focusing on innovations and automation.
- [Panasonic Energy to Tap CAMX’s New Cathode Platform](https://aei.dempa.net/archives/30250) - CAMX Power LLC and Panasonic Energy Co., Ltd. announce that Panasonic Energy has taken a license from CAMX to the latest GEMX® platform of cathode active material for lithium-ion batteries. Mainly, the GEMX® platform is based on fundamental inventions of CAMX. (Accordingly), the company has granted 30 patents globally, including the U.S., EU, Korea, Japan
- [Emerson's New Tool to Offer Improved Control of Assets](https://aei.dempa.net/archives/30243) - Emerson has announced the release of the Rosemount™ 802 Wireless Multi-Discrete Input or Output Transmitter allowing remote monitoring of assets.
- [Natron to Offer Better Battery Capacity With New Site](https://aei.dempa.net/archives/30218) - Natron Energy, Inc. has announced plans to build the first sodium-ion battery gigafactory in the United States. Accordingly, the facility will rise in Edgecombe County, NC, and will produce 24GW of Natron’s revolutionary sodium-ion batteries annually at full capacity. Natron’s sodium-ion batteries offer higher power density, more cycles, and a domestic U.S. supply chain. Most importantly,
- [Mitsubishi Electric to Ship New Ultrafast Receiver IC](https://aei.dempa.net/archives/30203) - Mitsubishi Electric Corporation will begin shipping samples of the 200Gbps PIN-photodiode (PD) chip for use in next-generation optical transceivers from October 1 this year. Primarily, the new PIN-PD chip, model PD7CP47, will support 800Gbps and 1.6Tbps fiber communication. Specifically, the addition of the new receiver chip to Mitsubishi Electric’s optical device lineup will enable existing
- [Silicon Technology Creates New Magneto-Optical Crystal](https://aei.dempa.net/archives/30192) - Tokyo-based Carlit Co., Ltd. announced that its consolidated subsidiary Silicon Technology Corp. has established a stable technology to produce high-purity, high-quality yttrium iron garnet (Y3Fe5O12, hereinafter "YIG") single crystals. Accordingly, it entered the magneto-optical material business. Silicon Technology was established in 1995 in Saku City, Nagano Prefecture, Japan. Since then, it has been engaged in
- [SICK and Endress+Hauser to Soar Better Automation](https://aei.dempa.net/archives/30177) - SICK and Endress+Hauser will combine their process automation offerings at the turn of the year and establish a joint venture
- [Nachi-Fujikoshi Expands CMZ Series with New Model](https://aei.dempa.net/archives/30123) - More recently, Japanese robot manufacturer Nachi-Fujikoshi Corp. has launched the CMZ12 collaborative robot model under the CMZ Series. Industry Background Against the backdrop of the declining global workforce and increasing labor costs, the introduction of collaborative robots that can work with people and promote space-saving and flexible production lines is rapidly progressing in the manufacturing
- [Nichicon, Marubeni Lead New Funding to Fusion Startup](https://aei.dempa.net/archives/30146) - Japanese engineering firm Kyoto Fusioneering (KF) has secured a total of 1.07 billion yen from new investors, including Nichicon and Marubeni.
- [HSG Laser to Drive New Laser Tech in R&D Center](https://aei.dempa.net/archives/30156) - HSG Laser, a leading provider of metal shaping equipment and solutions, marks the fourth anniversary of its Global R&D Center in Tokyo, Japan. This significant milestone underscores the company's unwavering commitment to innovation. Also, it showcases its strategic focus on expanding its global footprint while advancing metal shaping technology. At the Core of Global Expansion
- [New Device Trends Thread on Modern Power Electronics](https://aei.dempa.net/archives/30150) - Japanese electronic component makers have been intensifying the technological development of their respective power supply-related products. Primarily, they are promoting the development of new products such as power electronic components and next-generation rechargeable batteries. Basically, they aim to respond to the shift to xEVs in automobiles. Also, they target the increasing current capacity of industrial
- [Emerson's GenAI to Result in Powerful New Tools](https://aei.dempa.net/archives/30141) - Emerson's Ovation Automation Platform with GenAI will empower workforce and optimize operations with its improved and resilient performance.
- [IBM to Adopt New Wet Processing System by Veeco](https://aei.dempa.net/archives/30134) - Veeco Instruments Inc. has announced that IBM selected its WaferStorm® Wet Processing System for advanced packaging applications. In relation, it has entered into a joint development agreement with Veeco. Specifically, it will explore advanced packaging applications using Veeco's multiple wet processing technologies. Under the agreement, the Waferstorm Wet Processing System will be installed in the
- [Fraunhofer, GF to Make Way for Innovative Memory Tech](https://aei.dempa.net/archives/30125) - Fraunhofer IPMS remains important research partner for GlobalFoundries Dresden in several research projects on innovative memory concepts.
- [Siemens to Offer Better Sinumerik 828D in New Upgrade](https://aei.dempa.net/archives/30111) - Siemens is presenting new hardware and software for the Sinumerik 828D CNC controller that can suit the compact and mid-range machines.
- [DNP to Double Capacity With New Investment](https://aei.dempa.net/archives/30106) - Dai Nippon Printing will double its production capacity for encapsulating materials, which protect solar cell electrodes and cells.
- [Resonac to Boost Innovative Tech for Best IC Materials](https://aei.dempa.net/archives/30103) - Resonac Corporation has introduced a new simulation technology, a neural network potential (NNP) for material development.
- [Meiko to Strengthen ASEAN Clout in New Alliance](https://aei.dempa.net/archives/30096) - Meiko Electronics Co., Ltd. announced that its Board of Directors has resolved to enter a business alliance with Aoshikang Technology Co., Ltd. (ASK) for printed circuit board (PCB) business. Mainly, Meiko is expanding its production capacity in Vietnam. Particularly, this aims to meet the growing demand for printed circuit boards in the ASEAN region. As
- [Yokogawa Paves the Way for New Oprex Automation Tools](https://aei.dempa.net/archives/30082) - Yokogawa launches OpreX Open Automation SI Kit and OpreX OPC UA Management Package for open process automation, making industrial process highly interoperable.
- [Toshiba Pushes New Power ICs to Reshape Key Industries](https://aei.dempa.net/archives/30046) - Power semiconductors are essential components that function as efficient switches and rectifiers in electrical circuits. Specifically, they control and convert power with minimal losses. Their importance has grown significantly due to the global push for energy efficiency and carbon neutrality. Toshiba is leading the charge in power semiconductor technology, playing a vital role in the
- [Kawasaki, Hurco Ally on New Robotic CNC Tools Solution](https://aei.dempa.net/archives/30063) - Hurco Companies, Inc., a premier computer numerical control (CNC) machine and controls industrial technology company has partnered with Kawasaki Robotics (USA), Inc., a leading manufacturer of industrial robotics and automation systems. Primarily, the strategic collaboration aims at enhancing innovation and delivering industrial-grade robotic CNC machine solutions to their customers. Mainly, the collaboration will leverage the
- [Kuraray to Boost ASEAN Grit With New Resin Plant](https://aei.dempa.net/archives/30031) - Kuraray will increase its EVAL EVOH resin production as it announced expansion plans in its facility in Singapore to meet growing global demand.
- [FPT Pitches for New Partnership with Korean IC Firms](https://aei.dempa.net/archives/30015) - Mr. Tran Dang Hoa, Chairman of FPT IS and Chairman of FPT Semiconductor, both subsidiaries of FPT Corporation, shared initiatives to promote semiconductor cooperation between Vietnam and South Korea at the Vietnam-Korea Semiconductor Cooperation Conference held in Hanoi on August 6, 2024. Mainly, Mr. Hoa highlighted the burgeoning opportunities in Vietnam's semiconductor industry. FPT firmly
- [Infineon to Soar Power IC Grit With New 200mm Site](https://aei.dempa.net/archives/30003) - Infineon has opened the first phase of a new fab in Kulim, Malaysia, which will rise as one of the world’s largest 200mm SiC power IC fab.
- [Imec-ASML Innovative Lab Results in Better High-NA EUV](https://aei.dempa.net/archives/29980) - Research and innovation hub in nanoelectronics imec has presented the patterned structures obtained after exposure with the 0.55NA EUV scanner. Specifically, the breakthrough happened at the joint ASML-imec High NA EUV Lithography Lab in Veldhoven, the Netherlands. Accordingly, random logic structures down to 9.5nm (19nm pitch), random vias with 30nm center-to-center distance, 2D features at
- [New Samsung Ultra-Thin DRAM Suits On-Device AI](https://aei.dempa.net/archives/29951) - Samsung Electronics Co., Ltd. has begun mass production for the industry’s thinnest 12 nanometer (nm)-class, 12-gigabyte (GB) and 16GB LPDDR5X DRAM packages. As a result, this solidifies its leadership in the low-power DRAM market. Leveraging its extensive expertise in chip packaging, Samsung delivers ultra-slim LPDDR5X DRAM packages. They create additional space within mobile devices, facilitating
- [Epson Lifts Automation to New Heights with New Robots](https://aei.dempa.net/archives/29955) - Epson Robots expands its 6-axis robot lineup with the new C-B Series SCARA robot powered by the RC700E controller with integrated SafeSenseTM technology. Particularly, the series includes the C4B, C4LB, C8LB, C8XLB, and C12XLB. Designed for precision and efficiency, these models cater to a wide range of automation needs. Further, they ensure top performance in
- [NEO to Boost HBM Performance with New 3D X-AI Chip](https://aei.dempa.net/archives/29946) - NEO Semiconductor, a leading developer of innovative technologies for 3D NAND flash memory and 3D DRAM, has developed the 3D X-AI™ chip technology. Primarily, this technology is targeted to replace the current DRAM chips inside high bandwidth memory (HBM). It aims to solve data bus bottlenecks by enabling AI processing in 3D DRAM. Additionally, 3D
- [ABB to Offer Better Energy Savings With New Solution](https://aei.dempa.net/archives/30057) - To help motor operators understand the benefits of upgrading industrial electric motors, ABB has developed its NEMA motors Energy Savings Calculator.
- [AMD to Surge AI Line Growth With Silo AI Buyout](https://aei.dempa.net/archives/30034) - AMD has announced completion of Silo AI acquisition, the largest private AI lab in Europe with transaction value of US$665 million.
- [FUJI to Boost Automation in Asia in New Thai Showroom](https://aei.dempa.net/archives/30022) - FUJI Co., Ltd. has announced that Fuji Machine (Thailand) Co., Ltd. (FMT), the subsidiary of FUJI MACHINE ASIA PTE. LTD. (FMA), a group company of FUJI, has completed the construction of a new building in Thailand. Particularly, the newly expanded showroom, Fuji Machine Asia Innovation Center, opened in August. Accordingly, the company will begin earnest
- [LG Chem Offers New PFAS-Free Flame-Retardant Material](https://aei.dempa.net/archives/30011) - LG Chem has developed a PFAS-free flame-retardant PC/ABS material made of recycled plastics. Also, this material has received the V-0 rating in the UL94, a U.S. standard flame retardancy test. LG Chem is the first to be certified for V-0 flame retardancy performance with PFAS-free PC/ABS material. Mainly, the V-0 rating is the highest level
- [UL to Boost Battery Test With Latest High Tech Lab](https://aei.dempa.net/archives/29991) - The UL Solutions North America Advanced Battery Laboratory provides testing and certification services for battery safety and performance.
- [Nanotronics' New Platform to Spur AI-Driven Manufacturing](https://aei.dempa.net/archives/29988) - Nanotronics, a global leader in advanced manufacturing technology, announces the launch of its groundbreaking artificial intelligence (AI) platform, nSpec Copilot™. Primarily, nSpec Copilot™ is designed to enhance production efficiency and quality. Accordingly, it revolutionizes how process engineers manage manufacturing lines with cutting-edge real-time monitoring and analysis capabilities. nSpec Copilot™ leverages the latest advancements in AI
- [DENSO, JERA to Offer Better Green Tech in New Deal](https://aei.dempa.net/archives/29970) - DENSO Corporation and JERA Co., Inc. will jointly develop high-efficiency hydrogen generation technology. Specifically, combining Solid Oxide Electrolysis Cell (SOEC)*1 with waste heat utilization and conduct joint demonstration testing at a JERA thermal power station. DENSO for years has pursued initiatives in the three areas of "Monozukuri (manufacturing)," "mobility products" and "energy use" to achieve carbon
- [Infineon to Offer Better MCUs With Innovative Features](https://aei.dempa.net/archives/29967) - Infineon Technologies AG has introduced a new series of microcontrollers, targeting industrial and consumer motor control.
- [Japan University Touts Better EUV Lithography](https://aei.dempa.net/archives/29962) - Professor Tsumoru Shintake of Okinawa Institute of Science and Technology (OIST) has proposed an extreme ultraviolet (EUV) lithography technology that surpasses the standard in semiconductor manufacturing. EUV lithography based on this design can work with smaller EUV light sources, reducing costs and dramatically improving reliability and lifetime of the machines. It also consumes less than
- [Advantech to Surge Industrial Security With New System](https://aei.dempa.net/archives/29939) - Advantech has announced the launch of Ubuntu Pro for Devices, now available with the Advantech Edge Computing Platform for unparalleled benefits.
- [New Gas Detection Unit Ensures Safety of Chip Fabs](https://aei.dempa.net/archives/29906) - NEW COSMOS ELECTRIC CO., LTD., a Japanese gas alarm and detector manufacturer, has launched its new gas detection unit PS-8 Series for use in semiconductor factories. The Osaka-headquartered company sets an ambitious goal of "Eliminating gas accidents around the world". Development History Generally, semiconductor manufacturing plants handle a wide variety of gases toxic to humans
- [Sekisui to Soar Capacity, Sets up New R&D Base](https://aei.dempa.net/archives/29919) - Sekisui Chemical will increase its domestic production capacity of advanced chip manufacturing process materials and will establish new R&D base in Taiwan.
- [Siemens Tech to Give Panasonic Better DX in New Deal](https://aei.dempa.net/archives/29914) - Siemens Digital Industries Software said Panasonic Corporation has started to adopt its Teamcenter® X software, a Software-as-a-Service (SaaS) cloud product lifecycle management (PLM) solution. Accordingly, the Japanese conglomerate will use the Siemens solution, based from the Siemens Xcelerator portfolio, to accelerate its digitalization in product development and design. Through this large-scale implementation of Siemens Xcelerator
- [FPT to Expand Digital Services in Japan with New HQ](https://aei.dempa.net/archives/29924) - FPT Japan, the Japanese subsidiary of global IT corporation FPT, celebrated the grand opening of its new headquarters in Tokyo. This move is part of the company’s expansion strategy in response to increasing customer demand for digital services and solutions. FPT’s new Japan headquarters is located in Mita district, one of Tokyo’s most prestigious and
- [Lam Research to Scale 3D NAND with New Etch Technology](https://aei.dempa.net/archives/29894) - Lam Research Corp. has extended its leadership in 3D NAND flash memory etching with the introduction of Lam Cryo™ 3.0. Specifically, Lam Cryo 3.0 is the third generation of the company's production-proven cryogenic dielectric etch technology. The proliferation of generative artificial intelligence (AI) continues to propel the demand for memory with higher capacity and performance.
- [MinebeaMitsumi Lifts Green Edge in New Energy Deal](https://aei.dempa.net/archives/29863) - MinebeaMitsumi's NMB-Minebea Thai Ltd. and Super Energy Corporation have agreed to establish a joint venture agreement in Thailand.
- [Endress+Hauser Bats for More Growth in Latest Line](https://aei.dempa.net/archives/29883) - Endress+Hauser kicks off its largest construction project with 100 million euro investment in the Maulburg production site in Germany.
- [FPT to Edge its DX Grit in Fan, Motor Production](https://aei.dempa.net/archives/29879) - FPT Software and ebm-papst have fortified their partnership by driving commitment to digital transformation and co-innovating to enhance industry standards.
- [Kioxia to Commence Operations of New Fab Line](https://aei.dempa.net/archives/29871) - Japanese memory solutions company Kioxia Corporation has announced the completion of its new Fab2 (K2) building in Kitatami, Japan.
- [Renesas to Boost Better Portfolio With Altium Deal](https://aei.dempa.net/archives/29874) - Renesas Electronics Corporation and Altium Limited have announced the successful completion of the acquisition of Altium by Renesas. Renesas announced the definitive agreement to acquire Altium on February 15, 2024. Accordingly, the combination sets the foundation for Renesas and Altium to create an innovative electronics system design and lifecycle management platform. Moreover, the platform will deliver integration and standardization
- [Nordson to Boost Europe Grit With New High Tech Site](https://aei.dempa.net/archives/29866) - Nordson Electronics Solutions announced that their Nordson B.V. division, has consolidated their offices into one site. Specifically, the new office located in Valkenswaard in The Netherlands will cover Europe, the Middle East, and Africa. Moreover, the relocation aims to meet rising European customer demand for Nordson’s complete range of solutions. Advanced Building Features The facility
- [ASMPT Deals with Power Module in New Sintering Tool](https://aei.dempa.net/archives/29849) - ASMPT, the world’s leading provider of hardware and software for semiconductor and electronics production, presents an innovative die and module bonding platform that can be used in a variety of ways for producing power modules. “Whether for electromobility, renewable energies or industrial automation and motor control systems – in the course of the energy transition,
- [Benchmark Expands in Romania with New Facility](https://aei.dempa.net/archives/29853) - Benchmark Electronics, Inc., a global provider of engineering, design, and manufacturing services, has celebrated the opening of its significantly expanded presence in Brasov, Romania, continuing the company's investment in the region. Mainly, this aims to support customer-driven demand for access to high-technology manufacturing solutions and localized and global supply chains. Also, it aims to support
- [New Toyo Technica Sensor Boosts Dynamic Strain Sensing](https://aei.dempa.net/archives/29822) - Toyo Technica Co., Ltd. has signed an exclusive distributor agreement with Wormsensing SAS (Worms) in Japan and began selling the piezoelectric dynamic strain sensor "Dragonfly" on July 1, 2024. Although this product is 0.2mm thick, it can detect minute strains with high accuracy. Also, since it can be attached to curved surfaces, it is possible
- [New Cincoze Intelligent PC Powers IIoT Gateways](https://aei.dempa.net/archives/29845) - Rugged embedded computer brand Cincoze has recently launched the compact and power-efficient DA-1200 industrial computer. Primarily, its palm-sized design, powerful processing (Intel Alder Lake-N), and competitive pricing make it the preferred choice for IIoT gateways in modern industrial applications. Additionally, Cincoze's DA-1200 is quick and easy to deploy in harsh environments. Thus, the new PC
- [HIOKI to Put up New Technical Centers in Japan](https://aei.dempa.net/archives/29836) - HIOKI Electric Co., Ltd. has announced it will establish new technical centers in Yokohama and Osaka sales offices from August 2024 in stages. Primarily, the establishment of the new technical centers aims to realize innovative measurement solutions. As part of the company’s growth strategy, it is working on "product development with the indispensability of HIOKI"
- [JEOL Unveils New Field Emission SEM](https://aei.dempa.net/archives/29806) - JEOL Ltd. has released the JSM-IT810 Schottky Field Emission Scanning Electron Microscope. Generally, Field Emission Scanning Electron Microscopes (FESEM) are widely used in science and technology fields such as research institutes, universities, and industry. There is a growing demand for an instrument that can support easy, accurate, quick, and efficient observation to analysis. Primarily, JSM-IT810
- [NUS Study on New 3D Circuit to Meet Modern Electronics](https://aei.dempa.net/archives/29814) - Unlike traditional printed circuit boards, which are flat, 3D circuitry enables components to be stacked and integrated vertically. As a result, it dramatically reduced the footprint required for devices. Advancing the frontiers of 3D printed circuits, a team of researchers from the National University of Singapore (NUS) has developed a state-of-the-art technique - known as
- [Orbray to Put up New Factory Amid Business Growth](https://aei.dempa.net/archives/29797) - Japanese manufacturer Orbray Co., Ltd. has drawn up a new medium-term management plan, highlighting the construction of a new headquarters and new factory. Moreover, the plan includes the company’s conduct of an initial public offering in 2029. Orbray integrates state-of-the-art technologies within its core competencies of cutting, grinding, and polishing industrial jewels. It anticipates market
- [Nikon Unveils New AM Technology Center in California](https://aei.dempa.net/archives/29789) - Nikon Corporation and Nikon Advanced Manufacturing Inc., the global headquarters of Advanced Manufacturing business unit located in California, U.S., have inaugurated the Nikon AM Technology Center in Long Beach, California. This cutting-edge, 90,000-square-foot facility marks the next critical step in the Nikon Vision 2030 plan. Specifically, it aims to revolutionize manufacturing and establish digital manufacturing
- [Sekisui to Surge Production Grit With New Thai Line](https://aei.dempa.net/archives/29780) - Sekisui Chemical will establish a new plant that will expand production capacity of interlayer film for laminated glass in Thailand.
- [ASMPT and IBM to Innovate New Chiplet Packages for AI](https://aei.dempa.net/archives/29774) - ASMPT and IBM extended their collaboration on the joint development of the next advancement of chiplet packaging technologies. Through this agreement, the two companies will work together to advance thermocompression and hybrid bonding technology for chiplet packages. Along this line, they will use ASMPT’s next generation of Firebird TCB and Lithobolt hybrid bonding tools. Generally,
- [Hitachi High-Tech Puts up New R&D Center with Taiwan University](https://aei.dempa.net/archives/29766) - Hitachi High-Tech Corp., together with National Taiwan University, has established the Advanced Application Innovation Center for Focused Ion Beam System in Taiwan University. Mainly, the center will research and develop semiconductors, green materials and other advanced materials. Moreover, it will function as a facility where a wide range of users, particularly those affiliated with Taiwan
- [Ansys, NVIDIA, Supermicro to Offer Better Simulation](https://aei.dempa.net/archives/29646) - Ansys is collaborating with Supermicro and NVIDIA to deliver turnkey hardware. Thus, enabling unmatched acceleration for Ansys multiphysics simulation solutions. Accordingly, by leveraging the combined power of industry-leading hardware and software, Ansys customers can solve larger, more complex models up to 1,600x faster. When running on Supermicro and NVIDIA technology, Ansys solutions reduce time-to-market. Moreover, it
- [Nidec Technology to Offer Better Simulation of xEVs](https://aei.dempa.net/archives/29662) - Nidec Advance Technology Develops E-Transport Simulator, a New xEV Modeling Simulator to Optimize xEV Device’s Components
- [Sumitomo Bakelite New Sintering Paste Lifts Power ICs](https://aei.dempa.net/archives/29681) - Sumitomo Bakelite Co., Ltd. has begun shipping samples of 150 W/m・K high thermal conductivity sintering silver (Ag) paste for next-generation power semiconductors. The company targets mass production for the said product within this year. Primarily, this product can replace lead solder (37% lead content), which has a large impact on the environment. Applying it to
- [Toshiba to Surge Capacity in India With New Funding](https://aei.dempa.net/archives/29668) - Toshiba will increase its manufacturing capacity of power transformers and distribution transformers in India to meet growing global demand.
- [ABB's Brazil Line to Soar for More Green Site](https://aei.dempa.net/archives/29750) - ABB has achieved annual energy savings of 530MWh and a reduction of 160 tons in CO2e emissions1 at its Belo manufacturing facility in Brazil.
- [NEG's New Tech Results in Breakthrough GC Core](https://aei.dempa.net/archives/29731) - Nippon Electric Glass has employed high-speed, crack-free and economical micro through-hole (via) processing that resulted in a glass-ceramic core substrate.
- [Fujitsu to Offer Better, More Reliable Business Gen AI](https://aei.dempa.net/archives/29743) - Fujitsu to provide the world’s first enterprise-wide generative AI framework technology to meet changing needs of companies.
- [Japan Firms to Offer Ways for Innovative Logistics](https://aei.dempa.net/archives/29740) - ITOCHU has partnered with KDDI, Toyota Industries, Mitsui Fudosan, and Mitsubishi Estate for a more sustainable logistics approach in Japan.
- [Vinfast Boosts Grit In ASEAN With New Plant, Sales](https://aei.dempa.net/archives/29737) - VinFast is expanding its presence in Southeast Asia as it broke the ground for a new EV assembly facility in Indonesia and dealerships in the Philippines.
- [ASMPT to Offer Latest Features for its Print Tools](https://aei.dempa.net/archives/29728) - ASMPT has added new features to its DEK printing platforms that automate solder paste transfers and simplify squeegee changes.
- [Vitesco to Surge EV Battery Grit With New China Site](https://aei.dempa.net/archives/29723) - Vitesco Technologies has started its first large-scale serial production of its battery management electronics in Changchun, China
- [SICK's New Tech Makes Big Leap in 3D Applications](https://aei.dempa.net/archives/29718) - SICK is now making fast, precise high-end 3D vision applications, enabling users to deploy custom applications within minutes.
- [Renesas to Boost Better AI/ML Dev't With New Software](https://aei.dempa.net/archives/29704) - Renesas Electronics Corporation has introduced Reality AI Explorer Tier, a free version of the popular Reality AI Tools® software.
- [New JV to Focus on AI Robot Solutions in Japan](https://aei.dempa.net/archives/29692) - Sumitomo Corporation and Dexterity Inc. have announced the creation of Dexterity-SC Japan, a new joint venture that will focus on accelerating the adoption of AI-powered intelligent robotic solutions for warehouse, supply chain, logistics, and other labor-intensive industrial operations. The newly formed Dexterity-SC Japan builds on the successful distribution agreement between the two companies in 2022.
- [SEMCO to Boost AMD’s Data Centers with Unique Boards](https://aei.dempa.net/archives/29686) - Samsung Electro-Mechanics (SEMCO) has announced a collaboration with AMD to supply high-performance substrates for hyperscale data center compute applications. Primarily, these substrates are made in SEMCO's key technology hub in Busan and the newly built state-of-the-art factory in Vietnam. Market research firm Prismark predicts that the semiconductor substrate market will grow at an average annual
- [Azbil Boosts R&D Grit in New MoU With Malaysia's UTM](https://aei.dempa.net/archives/29673) - Azbil Corporation has sealed a cooperation agreement with the Malaysia-Japan International Institute of Technology (MJIIT) of Universiti Teknologi Malaysia* (UTM).
- [SCREEN and Osaka Univ to Reinforce R&D in New Techs](https://aei.dempa.net/archives/29645) - SCREEN Holdings Co., Ltd. and the Osaka University Graduate School of Engineering established the SCREEN MIRAI Laboratory on July 1, 2024. The creation of the institute is intended to reinforce R&D related to semiconductors and new fields over the long term. Also, it aims to collaboratively foster innovation that will contribute to business growth. As
- [onsemi to Offer the Best SiC to Soar Energy Efficiency](https://aei.dempa.net/archives/29610) - onsemi latest generation EliteSiC M3e MOSFETs that significantly improve energy efficiency for automotive and industrial applications.
- [Keysight's New Suite to Surge Innovative Simulation](https://aei.dempa.net/archives/29615) - Keysight's new tools improve PCIe design productivity using a smarter and streamlined workflow with simulation-driven virtual compliance test solutions.
- [FPT to Support Malaysia’s Digital Economy with New Office](https://aei.dempa.net/archives/29627) - Global IT corporation FPT Software recently cut ribbons on its second office in Kuala Lumpur, Malaysia. The new office will address the heightened demand for digital technologies and solutions. Also, it aims to enhance FPT's delivery and consulting capabilities on regional and global scales. The new office is located in Malaysia's Special Economic Zone and
- [New TAIYO YUDEN Power Inductor for Cars Tops 165°C](https://aei.dempa.net/archives/29632) - TAIYO YUDEN CO., LTD. has commercialized four LACN Series MCOIL™ multilayer metal power inductors. Among them is LACNF2012KKTR24MAB (2.0×1.25×1.0mm), which complies with the AEC-Q200 reliability qualification test standard for passive automotive components. Particularly, this model achieved an upper operating temperature limit of 165°C for a multilayer metal power inductor, a first*1. TAIYO YUDEN attributes this
- [Comau Unveils New End-to-End Hairpin Stator Solutions](https://aei.dempa.net/archives/29621) - Comau has launched a comprehensive hairpin stator technology portfolio covering the entire stator manufacturing process. It covers hairpin wire forming, insertion to wire widening, twisting, and from laser welding to quality testing and control checks. The expanded offer underscores Comau’s commitment to innovation within e-Mobility. Further, it reinforces its ability to provide powerful turnkey solutions
- [New Amkor-Infineon Deal to Surge Green in Supply Chain](https://aei.dempa.net/archives/29606) - Amkor Technology and Infineon have agreed to stimulate decarbonization and sustainability strategies across the supply chain.
- [Mitutoyo’s New Sensor to Upgrade Surface Measurement](https://aei.dempa.net/archives/29595) - Mitutoyo America Corporation, a leading manufacturer of precision metrology instruments and solutions, is proud to announce the release of its innovative SM1008S, the first non-contact line-laser sensor in the Mitutoyo Surface Measure product line. The Surface Measure 1008S aims to disrupt the surface measurement processes across a wide range of industries. Primarily, it can offer
- [LG to Dive Deep in Smart Factory with Full Solutions](https://aei.dempa.net/archives/29589) - LG Electronics is advancing its smart factory solutions business by integrating artificial intelligence (AI) and digital transformation (DX) with its extensive 66-year history of manufacturing and production expertise. The Ultimate Fusion of AI and Manufacturing Capabilities Earlier this year, LG officially entered the smart factory solutions market. The Production engineering Research Institute (PRI) has been
- [Cisco, Splunk Deal to Offer Better Security in AI Era](https://aei.dempa.net/archives/29582) - In a recent press briefing, Cisco and Splunk shared their strategic vision and integration plans and how the deal will further a more secure AI era.
- [Henkel Completes New Phase of Largest Plant in India](https://aei.dempa.net/archives/29564) - Henkel Adhesives Technologies India Private Limited has completed Phase III of its manufacturing facility in Kurkumbh, near Pune, Maharashtra. Particularly, the Kurkumbh site, launched in 2020, serves the growing demand of Indian industries for high-performance solutions in adhesives, sealants, and surface treatment products. Mark Dorn, Executive Vice President, Henkel Adhesive Technologies inaugurated the new Loctite
- [Indium Adopts Gold in New Die-Attach Preform](https://aei.dempa.net/archives/29568) - Indium Corporation introduces the new, high-reliability Au-based Precision Die-Attach (PDA) Preforms. Compared to standard preforms, these gold-based PDA preforms offer a higher level of precision to reduce defects, control bondline thickness (BLT), and deliver high-yield performance and reliability in critical die-attach applications. To Lessen Solder Defects Mainly, semiconductor laser die-attach applications require the highest quality,
- [Mouser's Latest Series to Focus on Best of HMIs](https://aei.dempa.net/archives/29573) - Mouser Electronics, Inc., has released the latest installment of its Empowering Innovation Together (EIT) technology series.
- [Toshiba, ITRI to Surge Renewable Energy in New Pact](https://aei.dempa.net/archives/29559) - Toshiba and Taiwan’s ITRI have agreed to explore a collaboration that leverages Toshiba’s Virtual Power Plant (VPP) into the Taiwan energy market.
- [Harting to Surge More Investments in New Pitch](https://aei.dempa.net/archives/29544) - Harting Group is drawing more investments and is solidifying its position as a global player as it establishes its headquarters in Switzerland. Harting Group is drawing more investments and is solidifying its position as a global player as it establishes its headquarters in Switzerland.
- [USI Aims for More Growth With Latest Mexico Line](https://aei.dempa.net/archives/29551) - USI has opened its new Tonala Site in Mexico, highlighting the company's strategic vision and commitment to growth in the region.
- [Movella to Advance Mobile Robotics with New IMUs](https://aei.dempa.net/archives/29520) - Movella, a leading provider of full-stack solutions for digitizing movement, has announced it has enhanced its Xsens MTi™ inertial sensor modules for autonomous machines and edge AI applications. More importantly, the Xsens MTi sensors can be easily integrated with the NVIDIA Jetson™ platform for edge AI and robotics. As a result, they offer full compatibility
- [Jacobi Robotics to Set New Standard in Robot Operation](https://aei.dempa.net/archives/29525) - Jacobi Robotics' AI-powered motion planning technology to significantly cut programming time of robotic arms.
- [3D Systems Offers New Compact Model of Leading Printer](https://aei.dempa.net/archives/29532) - 3D Systems, Inc. has announced the addition of the EXT 800 Titan Pellet to its industry-leading portfolio of EXT Titan Pellet systems. Mainly, the new pellet extrusion system accommodates build sizes of 800×600×800mm. Also, it delivers the speed, reliability, and efficiency of 3D Systems' large EXT Titan Pellet systems (EXT 1070 Titan Pellet and EXT
- [Schneider to Surge Better Results With Enhanced Suite](https://aei.dempa.net/archives/29502) - Schneider Electric has announced major enhancements to EcoStruxure™ Resource Advisor offering integrated and multifaceted suite.
- [Danfoss to Boost Tech Grit in Brazil With New Funding](https://aei.dempa.net/archives/29515) - Danfoss is investing more than 80 million Brazilian real in new technologies and improved facilities to further know-how and innovations in Brazil.
- [SK Telecom Immerses in AI with New Investments in SGH](https://aei.dempa.net/archives/29488) - SK Telecom, an affiliate of SK Group, is making a US$200 million preferred equity investment in SMART Global Holdings (SGH), a leading designer and developer of high-performance, high-availability enterprise solutions. Primarily, SGH plans to use the capital to enhance its capabilities and add to the Company’s financial flexibility as SGH further expands the scope and
- [TRUMPF to Surge Better Lasers With AI in Latest Deal](https://aei.dempa.net/archives/29492) - TRUMPF and SiMa.ai are developing AI chips and software to improve welding and cutting for more efficient laser applications in production.
- [Shibaura Machine Unveils Latest Facility in India](https://aei.dempa.net/archives/29478) - Shibaura Machine India Pvt. Ltd. (SMI) is proud to present its new manufacturing facility, Unit-II, at a grand ceremony graced by its customers, suppliers and colleagues from the plastic industry, ex-colleagues, and other esteemed well-wishers. The event was officially inaugurated by Mr. Shigetomo Sakamoto, President, CEO, and COO of Shibaura Machine Co. Ltd., Japan, in
- [OMRON's Innovative Upgrade to Offer Better Automation](https://aei.dempa.net/archives/29474) - OMRON has announced a software update for its FH Vision System and FHV7 Smart Camera, enhancing the machine vision series capabilities.
- [Shindengen Addresses Noise in New SiC Power Module](https://aei.dempa.net/archives/29467) - Japanese manufacturer, Shindengen Electric Manufacturing Co., Ltd. will start sample shipment of silicon carbide (SiC) power module pursuing low noise. Primarily, the SiC power module MG074 suits bridgeless PFC circuits for consumer devices and full-bridge converters for industrial equipment. For such applications, power devices with high efficiency and low loss are necessary from the perspective
- [AEM to Offer Better IC Test With Latest Test Tool](https://aei.dempa.net/archives/29368) - AEM has introduced the next generation of automated burn-in systems for AI and high-performance compute chip testing for fully automated burn-in system.
- [Siemens Platform to Offer Better IC Analysis at 5nm](https://aei.dempa.net/archives/29328) - Siemens has introduced Tessent Hi-Res Chain software that addresses IC design and manufacturing challenges in advanced technology nodes.
- [Sakuu and SK On Usher in New EV Battery Tech](https://aei.dempa.net/archives/29383) - Sakuu®, a leading American provider of commercial-scale equipment and technologies to the battery manufacturing industry, has entered into a joint development agreement (JDA) with global manufacturer SK On, one of the leading suppliers of batteries for electric vehicles (EVs). Particularly, this partnership marks a significant milestone in their continuous efforts to advance next-generation battery manufacturing
- [AMD to Surge New High in AI With Silo Buyout](https://aei.dempa.net/archives/29390) - AMD has announced the signing of a definitive agreement to acquire Silo AI, the largest private AI lab in Europe with transaction value of US$665 million.
- [ROHM Fuses Analog and Digital in New Power Supply](https://aei.dempa.net/archives/29400) - ROHM Semiconductor has announced LogiCoA™, the industry's first analog-digital fusion power supply solution[1]. Particularly, it suits small- to medium-power industrial and consumer equipment that ranges from 30W to 1kW class. Also, it provides the same functionality as fully digital control power supplies at low power consumption and cost equivalent to analog power types. Analog-controlled power
- [SCREEN Pitches New Direct Imaging System for PCBs](https://aei.dempa.net/archives/29408) - SCREEN PE Solutions Co., Ltd. has released Ledia Qs, a newly developed high-definition direct imaging system that supports package boards. Demand for semiconductor devices, particularly at datacenters, has grown globally in recent years. Particularly, the widespread adoption of 5G and IoT infrastructure and the development of new technological domains like generative AI propel this trend.
- [SoftBank to Join AI Chip Race with Graphcore Buyout](https://aei.dempa.net/archives/29414) - SoftBank Group Corp. has acquired AI chip manufacturer Graphcore. Under the deal, Graphcore becomes a wholly owned subsidiary of SoftBank and will continue to operate under the Graphcore name. “This is a tremendous endorsement of our team and their ability to build truly transformative AI technologies at scale, as well as a great outcome for
- [AESC Builds Gigafactory for LFP Batteries in Spain](https://aei.dempa.net/archives/29422) - AESC Group has celebrated the groundbreaking of AESC's future gigafactory for batteries in Navalmoral de la Mata, Cáceres in Spain. Primarily, the plant is poised to be among the first facilities to develop and manufacture advanced Lithium Iron Phosphate (LFP) batteries at scale throughout Europe. It is scheduled to begin production in 2026. AESC’s newly
- [ASE's ISE Labs to Double Capacity With New Lab Space](https://aei.dempa.net/archives/29425) - ISE Lab's new San Jose facility houses reliability and qualification processes while the Fremont site broadens focus on test functions.
- [Danfoss to Surge Capacity With New Regional Site](https://aei.dempa.net/archives/29433) - Danfoss extends its manufacturing footprint in Mexico to further strengthen its position and increase supply chain resilience.
- [Shimadzu Touts Firsts in New Blue Direct Diode Laser](https://aei.dempa.net/archives/29449) - Shimadzu Corporation has announced it is the first to achieve the highest output of 6kW for BLUE IMPACT blue direct diode laser. Additionally, the blue laser diode is equipped with an “on-demand profile control technology,” a first for a blue diode. Specifically, an on-demand profile control technology allows adjusting the shape of irradiation beam according
- [Emerson Grows DeltaV to Offer More Reliable Automation](https://aei.dempa.net/archives/29393) - DeltaV distributed control system update features expanded connectivity via Ethernet-based protocols and streamlined state-based control execution
- [Siemens to Boost Data Center Grit With Innovative Hub](https://aei.dempa.net/archives/29439) - Siemens has inaugurated a new Center of Competence for Data Centers at the Global Infocity Park in Chennai, India and will also serve as regional hub.
- [AEI July 2024 Chinese Special Issue - Digital Edition](https://aei.dempa.net/archives/29312) - Get to know the latest trends that are changing the landscape of semiconductors and electronic components in China. Chart the innovations and other cutting-edge systems taking place in production processes. Find out all these and more in the latest special digital edition of AEI Chinese. READ HERE
- [FANUC to Boost Growth With New High Tech U.S. Site](https://aei.dempa.net/archives/29350) - FANUC America has expanded its footprint in the United States and boost its robotics and industrial automation clout in the region.
- [Aetina, Solomon to Make Way for Better AI, 3D Vision](https://aei.dempa.net/archives/29374) - Aetina and Solomon Technology have partnered to empower organizations to boost productivity across manufacturing, semiconductor, retail, and other verticals.
- [Kyocera New Peltier Module Has Better Cooling Rate](https://aei.dempa.net/archives/29360) - Kyocera Corporation has introduced a new Peltier (thermoelectric) module with improved heat absorption. Particularly, the new Peltier module has a maximum heat absorption rate*1 21% higher than Kyocera's conventional products. Accordingly, this enables dramatically enhanced cooling performance. Primarily, Kyocera's Peltier modules apply to temperature control of automotive batteries and seats. Thus, this improvement in cooling
- [Melexis Opens Largest Wafer Test Site in Malaysia](https://aei.dempa.net/archives/29349) - Melexis, a global microelectronics engineering company, has opened its largest wafer testing site worldwide in Kuching, Sarawak, Malaysia. Primarily, this expansion signals the company’s commitment to meeting the increasing demand for semiconductors and strengthening its presence in the Asia-Pacific region. Also, the expansion in Malaysia marks a significant milestone in the company’s 35-year journey to
- [Yamaha to Tap Hydrogen Gas in New Test Facility](https://aei.dempa.net/archives/29341) - Yamaha Motor Co., Ltd. has announced plans to build a new verification testing facility at its Morimachi Factory in Japan’s Shizuoka prefecture.
- [Japan, Taiwan Groups Collaborate to Harness Grit in AI](https://aei.dempa.net/archives/29229) - The Japan Computer System Seller Association (JCSSA) is exploring ways to harness industrial digital transformation as recently sent a delegation in Taiwan.
- [Applied Materials to Offer New Approach in Chip Wiring](https://aei.dempa.net/archives/29263) - Applied Materials, Inc. has introduced materials engineering innovations designed to increase the performance-per-watt of computer systems.
- [Aoi to Build New Chip Line at Sharp Mie Plant](https://aei.dempa.net/archives/29304) - Aoi Electronics Co., Ltd., Sharp Corporation, and Sharp Display Technology Co., Ltd. have signed a basic agreement to pave way for the construction of a semiconductor back-end process (1) production line by Aoi Electronics, utilizing the buildings and facilities of Sharp's LCD panel plant. Particularly, the new plant will manufacture Aoi Electronics’ Fan-out Laminate Package
- [Beck to Offer Better Automation With New Swiss Line](https://aei.dempa.net/archives/29297) - Beck Automation AG has opened a new facility in Dällikon in Switzerland that will enable them to respond to the needs of the medical sector.
- [MEK Pitches New 5D SPI Systems with Unmatched Value](https://aei.dempa.net/archives/29324) - Marantz Electronics Ltd. (MEK) has released the new ISO-Spector S3 Series 5D Solder Paste Inspection systems. These technology-rich SPI systems offer a comprehensive suite of advanced features at a very low cost. Marantz Electronics is leading innovator in automated optical inspection (AOI) and solder paste inspection (SPI) systems for electronics manufacturing, Key SPI Features Primarily,
- [Innodisk to Boost Tech in AI With New Facility](https://aei.dempa.net/archives/29288) - Global AI solution provider Innodisk has officially inaugurated Phase II of its R&D and production center in Yilan in Taiwan.
- [Samsung to Offer Turnkey Solution to Japan AI Leader](https://aei.dempa.net/archives/29283) - Samsung Electronics Co., Ltd. has announced it will provide turnkey semiconductor solutions to Preferred Networks, a leading Japanese AI company. Primarily, it will use its 2-nm foundry process and the advanced 2.5D packaging technology Interposer-Cube S (I-Cube S). By leveraging Samsung’s leading-edge foundry and advanced packaging products, Preferred Networks aims to develop powerful AI accelerators
- [Kioxia Adds New Solar-Powered Line in Yokkaichi](https://aei.dempa.net/archives/29270) - Kioxia Corporation has installed a self-consumption solar power generation system at its Yokkaichi Plant No. 5, with operation has just started.
- [Resonac to Lead New R&D Consortium on Chip Packaging](https://aei.dempa.net/archives/29241) - Resonac Corporation has unveiled a new consortium, called US-JOINT, for its semiconductor back-end process R&D in Silicon Valley. Specifically, the consortium consists of ten American and Japanese semiconductor materials and equipment companies; Azimuth; KLA; Kulicke & Soffa; Moses Lake Industries; MEC; ULVAC; NAMICS; Tokyo Ohka Kogyo (TOK); TOWA; and Resonac. Expands Activities of JOINT and
- [FUJI Launches New Atmospheric Pressure Plasma Unit  ](https://aei.dempa.net/archives/29191) - FUJI Corporation has developed an atmospheric pressure plasma unit ATOM that can generate plasma with air. Unlike conventional models, ATOM does not require a nitrogen generator. Thus, it can be used in a wide range of industries by reducing equipment costs, which was an issue for introduction. FUJI will begin to accept orders for the
- [OKI, Mabuchi to Surge Small Motor Line With New Deal](https://aei.dempa.net/archives/29223) - OKI Electric has agreed to transfer OKI Group's precision small motor business to MABUCHI Motor in a bid to further strengthen the two companies’ grit.
- [TEL to Soar Grit in IC Making With New Solutions](https://aei.dempa.net/archives/29218) - Tokyo Electron has launched its latest solutions that will reinforce the company’s might as an innovative company for semiconductor production equipment.
- [Techman Robot Launches New AI Cobot in Japan](https://aei.dempa.net/archives/29237) - At the Robot Technology Japan exhibition in Nagoya, Japan, Techman Robot introduced its latest product, the TM30S. This collaborative robot (cobot) redefines the next generation of automation with built-in AI technology and industry-leading high payload capacity. High Payload Capacity Leading the pack with 30kg payload capacity, the TM30S boasts an impressive 35kg payload capacity and
- [ROHM's SiCrystal to Expand With New High Tech Plant](https://aei.dempa.net/archives/29208) - ROHM’s group company SiCrystal GmbH has broken the ground for its new building to expand the production area for silicon carbide (SiC) substrates.
- [New JX Metals and Mitsubishi JV Commences Operation](https://aei.dempa.net/archives/29205) - JX Metals Circular Solutions Co., Ltd. (JXCS*), a new joint venture between JX Advanced Metals Corp. and Mitsubishi Corp., began operations on July 1. JXCS will handle the resource circulation of waste home appliances, electronic equipment, and automotive lithium-ion batteries. Mainly, JX Advanced Metals owns 80% of the joint venture, while Mitsubishi Corporation holds 20%
- [Hirose to Start Operation of New Koriyama Plant](https://aei.dempa.net/archives/29202) - Following the completion of the new Koriyama Plant last June, Hirose Electric Co., Ltd. starts full-scale operation of the said plant this month. In relation, a completion ceremony for the new plant was also held. The Deputy Director Sakaino of the Fukushima Prefectural Regional Promotion Bureau and the Mayor of Shinagawa from Koriyama City attended
- [Toray Improves X-ray Inspections with New Scintillator Panel](https://aei.dempa.net/archives/29181) - Toray Industries, Inc. has developed a highly durable short-afterglow scintillator panel1 that accelerates non-destructive X-ray inspections 2 and enhances their operational efficiency. It launched this product in Japan and abroad in June 2024. Generally, companies frequently use non-destructive X-ray inspections to ensure the quality of such critical products. Among them are semiconductors, electronic components, and
- [HIOKI to Surge Capacity with New 2nd Ueda Line](https://aei.dempa.net/archives/29171) - HIOKI E.E. Corporation will transfer part of its production to the Ueda Second Factory, which highlight cutting-edge facilities and sustainable features.
- [Nano, Desktop Metal Deal to Soar Better 3D Print Tech](https://aei.dempa.net/archives/29085) - Nano Dimension Ltd. will acquire all outstanding shares of Desktop Metal, Inc. in a bid to boost Nano's step to become a leader in digital manufacturing.
- [onsemi to Surge Sensing Line More in Latest Buyout](https://aei.dempa.net/archives/29079) - onsemi has announced the acquisition of SWIR Vision Systems to further drive cutting-edge technologies for intelligent image sensing.
- [New PP Material to Lift Efficiency of 3D Printing](https://aei.dempa.net/archives/29089) - Stratasys Ltd. has announced the commercial availability of its groundbreaking new material, SAF™ Polypropylene (PP) for use on the Stratasys H350™ printer, set to launch in fourth quarter of 2024. Mainly, Stratasys SAF™ PP, offered in partnership with BASF Forward AM, aims to provide greater cost efficiency and superior part quality in Powder Bed Fusion
- [New Study Taps Hitachi Tech to Lift Carbon Neutrality](https://aei.dempa.net/archives/29119) - A study by Hitachi, Ltd., Kyushu University, RIKEN, and HREM Research Inc. paved the way for the first use of energy-saving devices for a carbon-neutral
- [Panasonic Doubles Output of New Pure Hydrogen Fuel Cell](https://aei.dempa.net/archives/29133) - Panasonic Electric Works Co., Ltd. is set to launch a new pure hydrogen fuel cell PH3 (three-phase three-wire type) H2 KIBOU (*1) in Dec. 2024. Specifically, the fuel cell generates electricity through a chemical reaction between high-purity hydrogen and oxygen in the air. In Oct. 2021, Panasonic launched the PH1 (single-phase three-wire type), a 5kW
- [NGK to Advance Hybrid Substrates in New Alliance](https://aei.dempa.net/archives/29138) - NGK INSULATORS, LTD. has announced investments in PanelSemi Corporation, a Taiwan-based startup engaged in the development and sale of flat-panel flexible LED displays and substrates for semiconductor modules. PanelSemi develops and sells ultra-thin and lightweight flexible LED displays with low power consumption and high brightness, leveraging its thin-film transistor (TFT) circuit fabrication technology. Furthermore, PanelSemi
- [Danfoss Compressor to Offer Better CO2 Reduction](https://aei.dempa.net/archives/29144) - Danfoss provides manufacturers support in comfort and industrial applications, from system design to machine simplification.
- [New Emerson Valves to Offer Plants Great Automation](https://aei.dempa.net/archives/29149) - Emerson has launched its AVENTICS™ Series XV pneumatic valves that are interoperable and can provide machine builders factory automation process.
- [Sumitomo Bakelite's New Resin Suits SiC Power Modules](https://aei.dempa.net/archives/29128) - Sumitomo Bakelite Co., Ltd. has developed an epoxy encapsulating material featuring high glass transition temperature (Tg) for next-generation silicon carbide (SiC) power modules. Primarily, the company's resin improves the heat resistance of power modules. Thus, it contributes to the miniaturization and improvement of functionality of power modules. Also, the company aims to make it the
- [TDK to Soar High in China With Novel Technologies](https://aei.dempa.net/archives/28977) - TDK Corporation returns to electronica China 2024 to highlight its cutting-edge components and systems in China and the Asia Pacific Region.
- [Panasonic Connect Pursues Smart Factory in New Platform](https://aei.dempa.net/archives/29115) - At JISSO PROTEC 2024, the displays at Panasonic Connect Co., Ltd.’s booth focus on realizing the "Autonomous Factory". Particularly, the company highlighted a new platform for mounting systems, as well as a device for parts supply automation. Specifically, this new product captured the interest of visitors. The Autonomous Factory independently controls the 5Ms (Men, Methods,
- [ST's Sensor Line to Surge Better Products for FA](https://aei.dempa.net/archives/29105) - STMicroelectronics new kit enables smarter designs of products for factory automation, robotics, AR/VR, and medical applications.
- [C-DAC to Make India's HPC SoC with Socionext, MosChip](https://aei.dempa.net/archives/29095) - The Centre for Development of Advanced Computing (C-DAC) has partnered with MosChip® Technologies and Socionext for the design and development of a High-Performance Computing (HPC) processor SoC. Specifically, the SoC is based on the Arm® architecture and built on TSMC 5nm technology node. Deploy Supercomputing Technology in India C-DAC is the premier R&D organization of
- [Solomon to Build Next Wave of Robotics Solutions](https://aei.dempa.net/archives/28963) - Solomon Technology Corp., a leader in advanced vision and robotics solutions, announced a collaboration with NVIDIA at COMPUTEX 2024. Primarily, this collaboration focuses on integrating Solomon's product offerings with the NVIDIA Isaac robotics platform. As a result, it will enhance Solomon's 3D robotics vision and augmented intelligence solutions. "We are thrilled to integrate the NVIDIA
- [Softbank, Enpower Hurdle Energy Rate in New Battery](https://aei.dempa.net/archives/29062) - SoftBank Corp. and Enpower Japan Corp. succeeded in developing all-solid-state battery technology with higher energy density. Primarily, it includes increasing the active material ratio by homogenizing the solid electrolyte and thinning the solid electrolyte layer. Additionally, they successfully verified a specific energy of 350Wh/kg in an all-solid-state battery cell with lithium metal anode. Research of
- [Tokyo Robotics to Offer Customized Robot Solutions](https://aei.dempa.net/archives/29069) - Tokyo Robotics Co., Ltd., which develops cutting-edge robot technology, provides remote-controlled robot solutions that make use of the dual-arm robot and mobile manipulator technologies it has cultivated over the years. Primarily, the company will offer customized robots and remote-controlled devices according to the customer's requirements, and propose an optimal system. To date, it has developed
- [GF Boosts Grit GaN Manufacturing With New Buyout](https://aei.dempa.net/archives/29046) - GlobalFoundries (GF) has acquired Tagore Technology’s proprietary and production-proven Power Gallium Nitride (GaN) IP portfolio.
- [Intel Grit in AI to Offer Better Results in Production](https://aei.dempa.net/archives/28957) - Eigen Innovations uses Intel’s AI chips to help factories detect defects earlier and control product quality, thereby saving costs during production.
- [Daeduck Makes Technology Leap with New FCBGA Substrate](https://aei.dempa.net/archives/28674) - Daeduck Electronics Co., Ltd. has announced the successful development of a large-body FCBGA substrate for AI servers and data centers. Established in 1965, Daeduck Electronics holds the distinction of being Korea's pioneering mass producer of printed circuit boards (PCBs). Thus, it has been contributing significantly to the advancement of the nation's electronics sector for over
- [TED to Pitch Smart Factory Solutions at Robot Event](https://aei.dempa.net/archives/28647) - Tokyo Electron Device Corp. (TED) has announced it will exhibit a system that automates manual work at factories and logistics sites at ROBOT TECHNOLOGY JAPAN 2024 under the theme “Automating Human-Dependent Processes". ROBOT TECHNOLOGY JAPAN 2024 will happen at Aichi Sky Expo (Aichi International Exhibition Center) from July 4 (Thu) ~ July 6 (Sat) 2024.
- [Formic to Expand U.S. Automation with New Funding](https://aei.dempa.net/archives/28731) - Formic, a provider of Robots-as-a-Service (RaaS) automation for U.S. manufacturers, has raised another US$27.4 million in Series A financing. The new financing was led by Blackhorn Ventures with participation from Translink Capital, Alumni Ventures, FJ Labs, Lux Capital, Initialized Capital and Lorimer Ventures. Additionally, Japanese-owned capitalists like Mitsubishi HC Capital America and NEC were among
- [Altair to Rely on HP for Better 3D Printing Designs](https://aei.dempa.net/archives/28740) - Altair, a global leader in computational intelligence, has signed a partnership agreement with HP Inc. on 3D material information. Particularly, HP will provide Altair with proprietary material information that will bolster the Altair® Material Data Center™. It will enable designers, engineers, and scientists to browse, search, and compare materials in a standalone application or through
- [Keysight Tools Offer Better 5G Test to Samsung India](https://aei.dempa.net/archives/28711) - Keysight Technologies, Inc. said Samsung Semiconductor India Research (SSIR) has selected its solution to automate its 5G tests.
- [Hitachi, Sekisui to Surge New System for Recycling](https://aei.dempa.net/archives/28745) - Hitachi and Sekisui Chemical have developed a new system that will promote circular economy through advanced digital technologies.
- [New FANUC 3D Laser Scanner to Optimize Robot Welding](https://aei.dempa.net/archives/28779) - FANUC Corporation has released the new LASER SCANNER LS3Di-A as a single unit. Primarily, the 3D galvano-type LASER SCANNER LS3Di-A was developed based on FANUC servo motor control technology. Key Features of LS3Di-A The LASER SCANNER LS3Di-A can focus laser beams over a wide irradiation range from a long distance. Also, it can scan various
- [Denka to Hook up with CARBON FLY in New Investment](https://aei.dempa.net/archives/28787) - Denka Company Limited has infused investments in CARBON FLY, Inc., a Japanese startup company developing carbon nanotubes (CNT). The investment was made through a Corporate Venture Capital (CVC) fund jointly managed with Pegasus Tech Ventures. CARBON FLY manufactures nanocarbon materials and their related products, mainly carbon nanotubes, using acetylene as a raw material. As a
- [UL Solutions to Build New EV Testing Center in Korea](https://aei.dempa.net/archives/28801) - UL Solutions Inc. has announced plans to construct a new Advanced Automotive and Battery Testing Center in Pyeongtaek, Gyeonggi-do, Korea. Primarily, this step expands the current battery testing capacity in the region. Also, it adds electric vehicle (EV) charger testing and other capabilities. To Strengthen Korea’s EV Industry The center is expected to open in
- [SK hynix Steps Ahead of NAND Game with New SSD](https://aei.dempa.net/archives/28807) - SK hynix Inc. has developed PCB01, an SSD product with the industry’s best specifications, for on-device artificial intelligence (AI)1 PCs. The product marks the first case where the industry adopts the fifth generation of the 8-channel2 PCIe3 technology. Also, it brings innovation to performance including the data processing speed. The company expects the latest advancement
- [FANUC Advances Automation with New Machines](https://aei.dempa.net/archives/28840) - FANUC Corporation has released two new ROBOMACHINE products - FANUC ROBOSHOT α-S15iB electric injection molding machine and FANUC ROBOCUT α-C800iC wire electrical discharge machine. FANUC ROBOSHOT α-S15iB Mainly, the ROBOSHOT α-S15iB features a clamping force of 15 tons. This is an addition to the ROBOSHOT α-SiB Series, which is FANUC's latest electric injection molding machine.
- [SMC to Quadruple Output with New Power Discrete Fab](https://aei.dempa.net/archives/28848) - SMC Diode Solutions, an American-led semiconductor design and manufacturing company, celebrated the opening of its second power discrete fab in Nanjing, China. The new facility realized volume production only 21 months after ground-breaking in Sept. 2022. Accordingly, it will begin shipments to customers in Q4 2024 for high power and high voltage rectifiers and MOSFET
- [Japan 3D Printer Pitches New Upgrade of Flagship Unit](https://aei.dempa.net/archives/28854) - Japan 3D Printer Co., Ltd. has launched new products under Raise3D, a trusted brand that provides 3D printers with excellent quality and repeatability. Specifically, the new high-end models of the Raise3D Pro3 Series, Raise3D Pro3 HS and Raise3D Pro3 Plus HS, are now available beginning July 1. Promotes Greater Stability, Productivity Mainly, the Pro3 HS
- [Multibeam Debuts First Multicolumn E-Beam Lithography](https://aei.dempa.net/archives/28861) - Multibeam Corp. has introduced the MB platform, a first-of-a-kind Multicolumn E-Beam Lithography (MEBL) system built for mass production. This development is a milestone for the global semiconductor industry. Particularly, the fully automated precision-patterning system suits rapid prototyping, advanced packaging, high-mix production, chip ID, compound semiconductors, and other applications. SkyWater Technology will use the system for
- [Mitsubishi Gas to Offer More Reliable India Network](https://aei.dempa.net/archives/28868) - Mitsubishi Gas Chemical will expand its presence in the Indian market by establishing a trading company to meet demands from various industries.
- [Singtel, Hitachi Show Grit in AI With New Alliance](https://aei.dempa.net/archives/28873) - The collaboration aims to accelerate enterprise digital transformation and integrate Hitachi’s industrial applications with Singtel’s Paragon ecosystem
- [Nexperia to Surge Hamburg Line Grit With New Funding](https://aei.dempa.net/archives/28881) - Nexperia has announced plans to invest USD200 million to develop the next generation of wide bandgap semiconductors (WBG).
- [Sumitomo Chemical to Merge Eco-Business in New Center](https://aei.dempa.net/archives/28884) - Sumitomo Chemical Co., Ltd. held a completion ceremony for a new research facility, the Innovation Center MEGURU, at its Chiba site on June 26. The new research center located in Sodegaura City in Chiba Prefecture, Japan started operations on the same day. This opening of the research facility aims to consolidate and strengthen the Company’s
- [Hitachi Sets up New Automation Co-Creation Facilities in Japan](https://aei.dempa.net/archives/28894) - Hitachi, Ltd. and Hitachi Automation Co., Ltd. have announced that they will open Automation Square*1 HANEDA. It is a co-creation facility for automation and optimization centered on line building (robotics SI) using robots in the manufacturing and logistics fields. Meanwhile, Automation Square KYOTO was opened at the Kyoto Research Park (Kyoto City, Kyoto Prefecture). To
- [Mitsubishi Electric Accelerates Automotive Electrification with SiC Power IC Modules](https://aei.dempa.net/archives/28748) - To contribute to the further acceleration of electrification and realization of a carbon-neutral society, Mit­subishi Electric has been developing and commercializing further elemental technologies for Si and SiC power semiconductor chip and packaging technologies. In these articles originally published in the AEI June 2024 Special Issue - Digital Edition, Mitsubishi Electric discussed its wide range
- [Axcelis Puts up Two New Service Bases in Japan](https://aei.dempa.net/archives/28795) - Axcelis Technologies, Inc., a leading supplier of enabling ion implantation solutions for the semiconductor industry, announced the establishment of new service offices in Japan. Specifically, the new service bases are in Chitose, Hokkaido and Kumamoto, Kyushu. They aim to support the Company's expanding customer base in Japan. Both service office locations opened in June 2024.
- [Yamaha to Boost Grit in Czech With New Partner](https://aei.dempa.net/archives/28726) - Yamaha Robotics has appointed Raveo as distributor for its industrial robots and automation products in the Czech Republic.
- [Nordic Adopts Recycled Plastic for Component Reels](https://aei.dempa.net/archives/28721) - Nordic Semiconductor has announced it has achieved another important step in its sustainability strategy by becoming one of the first semiconductor companies to use component reels made from recycled plastic. The leader in low-power wireless IoT connectivity solutions said the switch to recycled plastic will reduce plastic waste by almost 15,000 kilograms per year. "We’re
- [TRI Expands with New Office in Guadalajara, Mexico](https://aei.dempa.net/archives/28710) - Test Research, Inc. (TRI) recently opened a new office in Guadalajara, Mexico named Test Research Innovation Mexico. Mainly, the establishment of the new office aims to accommodate the industry's rapid growth. TRI is a leading test and inspection systems provider for the electronics manufacturing industry. Primarily, the company's expansion in Mexico emphasizes its commitment to
- [ABB to Open New High Tech Factory Line in U.K.](https://aei.dempa.net/archives/28701) - ABB will invest US$35 million in a new greenfield factory for earthing and lightning protection in Nottingham in United Kingdom.
- [Hon Hai to Lead New Research JV for AI, Semiconductor](https://aei.dempa.net/archives/28693) - City University of Hong Kong (CityUHK) and the Hon Hai Research Institute have agreed to collaborate through research on industry endeavors.
- [proteanTecs System to Shield Car ICs for Better Safety](https://aei.dempa.net/archives/28689) - proteanTecs has launched RTSM™ (Real-Time Safety Monitoring), a deep data application for fault detection and failure prevention in mission-critical automotive applications. proteanTecs is a global leader for health and performance monitoring solutions for advanced electronics. Mainly, rapid advancements in automotive architectures, particularly with the rise of software-defined, electric, and autonomous vehicles, have introduced advanced electronic
- [Chip Makers to Reach New Design High With Siemens Tool](https://aei.dempa.net/archives/28680) - Siemens has announced Innovator3D IC, the new software that delivers a fast predictable path planning for heterogeneous integration of ASICs and chiplets.
- [Rockwell Lifts iTRAK Line With Better Features](https://aei.dempa.net/archives/28670) - Rockwell Automation’s iTRAK® 5750 Intelligent Track System provides companies the opportunity to redefine machine productivity.

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- [AGV](https://aei.dempa.net/archives/tag/agv)
- [Nexim](https://aei.dempa.net/archives/tag/nexim)
- [Welding Robot](https://aei.dempa.net/archives/tag/welding-robot)
- [Welding](https://aei.dempa.net/archives/tag/welding)
- [Robot](https://aei.dempa.net/archives/tag/robot)
- [Japan Unix](https://aei.dempa.net/archives/tag/japan-unix)
- [NEPCON China](https://aei.dempa.net/archives/tag/nepcon-china)
- [Laser Soldering](https://aei.dempa.net/archives/tag/laser-soldering)
- [Soldering](https://aei.dempa.net/archives/tag/soldering)
- [IIOT](https://aei.dempa.net/archives/tag/iiot)
- [Solder](https://aei.dempa.net/archives/tag/solder)
- [Nitrogen](https://aei.dempa.net/archives/tag/nitrogen)
- [Reflow Oven](https://aei.dempa.net/archives/tag/reflow-oven)
- [COMPUTEX](https://aei.dempa.net/archives/tag/computex)
- [TAITRA](https://aei.dempa.net/archives/tag/taitra)
- [Display Week](https://aei.dempa.net/archives/tag/display-week)
- [SID](https://aei.dempa.net/archives/tag/sid)
- [OLED](https://aei.dempa.net/archives/tag/oled)
- [Cyber Physical System](https://aei.dempa.net/archives/tag/cyber-physical-system)
- [PanaCIMc](https://aei.dempa.net/archives/tag/panacimc)
- [Manufacturing Execution System](https://aei.dempa.net/archives/tag/manufacturing-execution-system)
- [JUKI Smart Solution](https://aei.dempa.net/archives/tag/juki-smart-solution)
- [Industrial Robots](https://aei.dempa.net/archives/tag/industrial-robots)
- [IFR](https://aei.dempa.net/archives/tag/ifr)
- [China](https://aei.dempa.net/archives/tag/china)
- [NTT Data](https://aei.dempa.net/archives/tag/ntt-data)
- [Taiwan](https://aei.dempa.net/archives/tag/taiwan)
- [EAP](https://aei.dempa.net/archives/tag/eap)
- [MES](https://aei.dempa.net/archives/tag/mes)
- [Tokin](https://aei.dempa.net/archives/tag/tokin)
- [EMC](https://aei.dempa.net/archives/tag/emc)
- [5G](https://aei.dempa.net/archives/tag/5g)
- [Samsung](https://aei.dempa.net/archives/tag/samsung)
- [4nm](https://aei.dempa.net/archives/tag/4nm)
- [3nm](https://aei.dempa.net/archives/tag/3nm)
- [MBCFET](https://aei.dempa.net/archives/tag/mbcfet)
- [GAAFET](https://aei.dempa.net/archives/tag/gaafet)
- [FinFET](https://aei.dempa.net/archives/tag/finfet)
- [HIOKI](https://aei.dempa.net/archives/tag/hioki)
- [In-Circuit Tester](https://aei.dempa.net/archives/tag/in-circuit-tester)
- [Automation](https://aei.dempa.net/archives/tag/automation)
- [productronica China](https://aei.dempa.net/archives/tag/productronica-china)
- [NSK](https://aei.dempa.net/archives/tag/nsk)
- [ball screw](https://aei.dempa.net/archives/tag/ball-screw)
- [quadrant glitches](https://aei.dempa.net/archives/tag/quadrant-glitches)
- [ASM](https://aei.dempa.net/archives/tag/asm)
- [LED](https://aei.dempa.net/archives/tag/led)
- [CMOS](https://aei.dempa.net/archives/tag/cmos)
- [PCBA](https://aei.dempa.net/archives/tag/pcba)
- [EMS](https://aei.dempa.net/archives/tag/ems)
- [GYROFLEX](https://aei.dempa.net/archives/tag/gyroflex)
- [Multitasking Machine](https://aei.dempa.net/archives/tag/multitasking-machine)
- [Robonity](https://aei.dempa.net/archives/tag/robonity)
- [Delivery locker](https://aei.dempa.net/archives/tag/delivery-locker)
- [WIN Semiconductors](https://aei.dempa.net/archives/tag/win-semiconductors)
- [6G](https://aei.dempa.net/archives/tag/6g)
- [NXP](https://aei.dempa.net/archives/tag/nxp)
- [TSMC](https://aei.dempa.net/archives/tag/tsmc)
- [SoC](https://aei.dempa.net/archives/tag/soc)
- [Micron](https://aei.dempa.net/archives/tag/micron)
- [DDR5](https://aei.dempa.net/archives/tag/ddr5)
- [DRAM](https://aei.dempa.net/archives/tag/dram)
- [NVIDIA](https://aei.dempa.net/archives/tag/nvidia)
- [GeForce](https://aei.dempa.net/archives/tag/geforce)
- [AMD](https://aei.dempa.net/archives/tag/amd)
- [3D Chiplet](https://aei.dempa.net/archives/tag/3d-chiplet)
- [Arm](https://aei.dempa.net/archives/tag/arm)
- [Armv9](https://aei.dempa.net/archives/tag/armv9)
- [Intel](https://aei.dempa.net/archives/tag/intel)
- [Market Outlook](https://aei.dempa.net/archives/tag/market-outlook)
- [ICT](https://aei.dempa.net/archives/tag/ict)
- [Korean ICT Exports](https://aei.dempa.net/archives/tag/korean-ict-exports)
- [Semiconductor](https://aei.dempa.net/archives/tag/semiconductor)
- [System IC](https://aei.dempa.net/archives/tag/system-ic)
- [NAND](https://aei.dempa.net/archives/tag/nand)
- [eMMC](https://aei.dempa.net/archives/tag/emmc)
- [UFS](https://aei.dempa.net/archives/tag/ufs)
- [ABB](https://aei.dempa.net/archives/tag/abb)
- [data centers](https://aei.dempa.net/archives/tag/data-centers)
- [machine learning](https://aei.dempa.net/archives/tag/machine-learning)
- [UT Aim](https://aei.dempa.net/archives/tag/ut-aim)
- [SK hynix](https://aei.dempa.net/archives/tag/sk-hynix)
- [LPDDR4](https://aei.dempa.net/archives/tag/lpddr4)
- [EUV](https://aei.dempa.net/archives/tag/euv)
- [Extreme Ultra Violet](https://aei.dempa.net/archives/tag/extreme-ultra-violet)
- [MASS](https://aei.dempa.net/archives/tag/mass)
- [Mounters](https://aei.dempa.net/archives/tag/mounters)
- [solder past inspection](https://aei.dempa.net/archives/tag/solder-past-inspection)
- [TAKIGEN](https://aei.dempa.net/archives/tag/takigen)
- [KUKA](https://aei.dempa.net/archives/tag/kuka)
- [3D MID](https://aei.dempa.net/archives/tag/3d-mid)
- [RX-8](https://aei.dempa.net/archives/tag/rx-8)
- [IC](https://aei.dempa.net/archives/tag/ic)
- [Litography](https://aei.dempa.net/archives/tag/litography)
- [Samsung Display](https://aei.dempa.net/archives/tag/samsung-display)
- [LG Dislay](https://aei.dempa.net/archives/tag/lg-dislay)
- [LTPO](https://aei.dempa.net/archives/tag/ltpo)
- [LTPS](https://aei.dempa.net/archives/tag/ltps)
- [OLEDs](https://aei.dempa.net/archives/tag/oleds)
- [Note20 Ultra](https://aei.dempa.net/archives/tag/note20-ultra)
- [low temperature polysilicon](https://aei.dempa.net/archives/tag/low-temperature-polysilicon)
- [SCARA](https://aei.dempa.net/archives/tag/scara)
- [Collaborative Robots](https://aei.dempa.net/archives/tag/collaborative-robots)
- [AMR](https://aei.dempa.net/archives/tag/amr)
- [TOF](https://aei.dempa.net/archives/tag/tof)
- [LiDAR](https://aei.dempa.net/archives/tag/lidar)
- [VCSEL](https://aei.dempa.net/archives/tag/vcsel)
- [i³-Mechatronics](https://aei.dempa.net/archives/tag/i³-mechatronics)
- [Academe](https://aei.dempa.net/archives/tag/academe)
- [Industrial Infrastructure](https://aei.dempa.net/archives/tag/industrial-infrastructure)
- [Sensor](https://aei.dempa.net/archives/tag/sensor)
- [Jabil Circuit](https://aei.dempa.net/archives/tag/jabil-circuit)
- [actuators](https://aei.dempa.net/archives/tag/actuators)
- [THK](https://aei.dempa.net/archives/tag/thk)
- [linear motion guides](https://aei.dempa.net/archives/tag/linear-motion-guides)
- [GlobalFoundries](https://aei.dempa.net/archives/tag/globalfoundries)
- [Wafer Fab](https://aei.dempa.net/archives/tag/wafer-fab)
- [chip shortage](https://aei.dempa.net/archives/tag/chip-shortage)
- [Hamamatsu Photonics](https://aei.dempa.net/archives/tag/hamamatsu-photonics)
- [terahertz spectrometer](https://aei.dempa.net/archives/tag/terahertz-spectrometer)
- [terahertz waves](https://aei.dempa.net/archives/tag/terahertz-waves)
- [Rockwell Automation](https://aei.dempa.net/archives/tag/rockwell-automation)
- [Kezzler](https://aei.dempa.net/archives/tag/kezzler)
- [supply chain](https://aei.dempa.net/archives/tag/supply-chain)
- [asset monitoring](https://aei.dempa.net/archives/tag/asset-monitoring)
- [SDN](https://aei.dempa.net/archives/tag/sdn)
- [software-defined network](https://aei.dempa.net/archives/tag/software-defined-network)
- [EUVs](https://aei.dempa.net/archives/tag/euvs)
- [128 layer NAND DN](https://aei.dempa.net/archives/tag/128-layer-nand-dn)
- [176-layer NAND](https://aei.dempa.net/archives/tag/176-layer-nand)
- [inventory management](https://aei.dempa.net/archives/tag/inventory-management)
- [RibbonFET](https://aei.dempa.net/archives/tag/ribbonfet)
- [PowerVia](https://aei.dempa.net/archives/tag/powervia)
- [Samsung SDI](https://aei.dempa.net/archives/tag/samsung-sdi)
- [Cathode](https://aei.dempa.net/archives/tag/cathode)
- [EUVL](https://aei.dempa.net/archives/tag/euvl)
- [imec](https://aei.dempa.net/archives/tag/imec)
- [ASML](https://aei.dempa.net/archives/tag/asml)
- [Coater/Developer](https://aei.dempa.net/archives/tag/coater-developer)
- [Nippon Thomson](https://aei.dempa.net/archives/tag/nippon-thomson)
- [Rotary stage](https://aei.dempa.net/archives/tag/rotary-stage)
- [Mechatronics](https://aei.dempa.net/archives/tag/mechatronics)
- [Positioning Table](https://aei.dempa.net/archives/tag/positioning-table)
- [ON Semiconductor](https://aei.dempa.net/archives/tag/on-semiconductor)
- [factory automation](https://aei.dempa.net/archives/tag/factory-automation)
- [Industry 4.0](https://aei.dempa.net/archives/tag/industry-4-0)
- [FAMs](https://aei.dempa.net/archives/tag/fams)
- [IAS4.0](https://aei.dempa.net/archives/tag/ias4-0)
- [Fuji Electric](https://aei.dempa.net/archives/tag/fuji-electric)
- [power electronics](https://aei.dempa.net/archives/tag/power-electronics)
- [IGBTs](https://aei.dempa.net/archives/tag/igbts)
- [Tier IV](https://aei.dempa.net/archives/tag/tier-iv)
- [eve autonomy](https://aei.dempa.net/archives/tag/eve-autonomy)
- [autonomous vehicles](https://aei.dempa.net/archives/tag/autonomous-vehicles)
- [TE Connectivity](https://aei.dempa.net/archives/tag/te-connectivity)
- [ERNI Group](https://aei.dempa.net/archives/tag/erni-group)
- [Connectors](https://aei.dempa.net/archives/tag/connectors)
- [LG Display](https://aei.dempa.net/archives/tag/lg-display)
- [POLEDs](https://aei.dempa.net/archives/tag/poleds)
- [Samsung Electronics](https://aei.dempa.net/archives/tag/samsung-electronics)
- [NAND Flash MMemory Chips](https://aei.dempa.net/archives/tag/nand-flash-mmemory-chips)
- [HIROSE](https://aei.dempa.net/archives/tag/hirose)
- [OMNIedge](https://aei.dempa.net/archives/tag/omniedge)
- [Yamaha Motors](https://aei.dempa.net/archives/tag/yamaha-motors)
- [Smart Agriculture](https://aei.dempa.net/archives/tag/smart-agriculture)
- [The Yield](https://aei.dempa.net/archives/tag/the-yield)
- [Surface Mount Equipment](https://aei.dempa.net/archives/tag/surface-mount-equipment)
- [Robot statistics](https://aei.dempa.net/archives/tag/robot-statistics)
- [Cobots](https://aei.dempa.net/archives/tag/cobots)
- [Yaskawa Electric](https://aei.dempa.net/archives/tag/yaskawa-electric)
- [MOTOMAN-MPO40](https://aei.dempa.net/archives/tag/motoman-mpo40)
- [Rigaku](https://aei.dempa.net/archives/tag/rigaku)
- [wafer film measurement](https://aei.dempa.net/archives/tag/wafer-film-measurement)
- [XTRAIA MF-3000](https://aei.dempa.net/archives/tag/xtraia-mf-3000)
- [Denka](https://aei.dempa.net/archives/tag/denka)
- [IC parts and materials](https://aei.dempa.net/archives/tag/ic-parts-and-materials)
- [Oriental Motor](https://aei.dempa.net/archives/tag/oriental-motor)
- [EH Series Electric Gripper](https://aei.dempa.net/archives/tag/eh-series-electric-gripper)
- [SmartWing](https://aei.dempa.net/archives/tag/smartwing)
- [Ryoyo Electro](https://aei.dempa.net/archives/tag/ryoyo-electro)
- [Jetson AGX Xavier](https://aei.dempa.net/archives/tag/jetson-agx-xavier)
- [Anritsu](https://aei.dempa.net/archives/tag/anritsu)
- [5G Lab](https://aei.dempa.net/archives/tag/5g-lab)
- [Local 5G](https://aei.dempa.net/archives/tag/local-5g)
- [LTE](https://aei.dempa.net/archives/tag/lte)
- [mmWave](https://aei.dempa.net/archives/tag/mmwave)
- [200mm](https://aei.dempa.net/archives/tag/200mm)
- [STMicroelectronics](https://aei.dempa.net/archives/tag/stmicroelectronics)
- [SiC](https://aei.dempa.net/archives/tag/sic)
- [Mask Edge Inspection System](https://aei.dempa.net/archives/tag/mask-edge-inspection-system)
- [Lasertec](https://aei.dempa.net/archives/tag/lasertec)
- [Photomasks](https://aei.dempa.net/archives/tag/photomasks)
- [productronica](https://aei.dempa.net/archives/tag/productronica)
- [electronics producton](https://aei.dempa.net/archives/tag/electronics-producton)
- [Munich](https://aei.dempa.net/archives/tag/munich)
- [electronics production](https://aei.dempa.net/archives/tag/electronics-production)
- [Toray](https://aei.dempa.net/archives/tag/toray)
- [Semiconductor Wafer Inspection System](https://aei.dempa.net/archives/tag/semiconductor-wafer-inspection-system)
- [INSPECTRA Series](https://aei.dempa.net/archives/tag/inspectra-series)
- [INtel. RinbonFET](https://aei.dempa.net/archives/tag/intel-rinbonfet)
- [MCBFET](https://aei.dempa.net/archives/tag/mcbfet)
- [KOKI](https://aei.dempa.net/archives/tag/koki)
- [Tokyo Electron Device](https://aei.dempa.net/archives/tag/tokyo-electron-device)
- [Robot Center](https://aei.dempa.net/archives/tag/robot-center)
- [TriMath Vision](https://aei.dempa.net/archives/tag/trimath-vision)
- [NITTAOMEGA](https://aei.dempa.net/archives/tag/nittaomega)
- [Nitta](https://aei.dempa.net/archives/tag/nitta)
- [automatic tool changer](https://aei.dempa.net/archives/tag/automatic-tool-changer)
- [iCube 10 Hybrid Placer](https://aei.dempa.net/archives/tag/icube-10-hybrid-placer)
- [Surface Mounting Machine](https://aei.dempa.net/archives/tag/surface-mounting-machine)
- [Smart Solutions](https://aei.dempa.net/archives/tag/smart-solutions)
- [process automation](https://aei.dempa.net/archives/tag/process-automation)
- [edge equipment](https://aei.dempa.net/archives/tag/edge-equipment)
- [Radiation Thermometers](https://aei.dempa.net/archives/tag/radiation-thermometers)
- [Chino](https://aei.dempa.net/archives/tag/chino)
- [Wafer Temperature Measurement](https://aei.dempa.net/archives/tag/wafer-temperature-measurement)
- [NEPCON Asia 2021](https://aei.dempa.net/archives/tag/nepcon-asia-2021)
- [3D SPI](https://aei.dempa.net/archives/tag/3d-spi)
- [3D AOI](https://aei.dempa.net/archives/tag/3d-aoi)
- [OMRON](https://aei.dempa.net/archives/tag/omron)
- [VT-S10 Series](https://aei.dempa.net/archives/tag/vt-s10-series)
- [Delta](https://aei.dempa.net/archives/tag/delta)
- [Industrial Automation](https://aei.dempa.net/archives/tag/industrial-automation)
- [Korea](https://aei.dempa.net/archives/tag/korea)
- [EUV Ecosystem](https://aei.dempa.net/archives/tag/euv-ecosystem)
- [semiconductor manufacturing](https://aei.dempa.net/archives/tag/semiconductor-manufacturing)
- [equipment and materials](https://aei.dempa.net/archives/tag/equipment-and-materials)
- [measuring and analysis](https://aei.dempa.net/archives/tag/measuring-and-analysis)
- [Signal quality analyzer](https://aei.dempa.net/archives/tag/signal-quality-analyzer)
- [Keysight](https://aei.dempa.net/archives/tag/keysight)
- [IOWN](https://aei.dempa.net/archives/tag/iown)
- [Optical component analyzer](https://aei.dempa.net/archives/tag/optical-component-analyzer)
- [Foxconn](https://aei.dempa.net/archives/tag/foxconn)
- [Macronix](https://aei.dempa.net/archives/tag/macronix)
- [Wide Band Gap ICs](https://aei.dempa.net/archives/tag/wide-band-gap-ics)
- [Mitsubishi Electric](https://aei.dempa.net/archives/tag/mitsubishi-electric)
- [Electric discharge machine](https://aei.dempa.net/archives/tag/electric-discharge-machine)
- [Maisart](https://aei.dempa.net/archives/tag/maisart)
- [Teledyne](https://aei.dempa.net/archives/tag/teledyne)
- [Sapera Vision Software](https://aei.dempa.net/archives/tag/sapera-vision-software)
- [manufacturing investments](https://aei.dempa.net/archives/tag/manufacturing-investments)
- [capital investments](https://aei.dempa.net/archives/tag/capital-investments)
- [SK Telecom](https://aei.dempa.net/archives/tag/sk-telecom)
- [LG U+](https://aei.dempa.net/archives/tag/lg-u)
- [KT](https://aei.dempa.net/archives/tag/kt)
- [Hanwha Precision Machinery](https://aei.dempa.net/archives/tag/hanwha-precision-machinery)
- [Techman Robot](https://aei.dempa.net/archives/tag/techman-robot)
- [TM AI+ Robot](https://aei.dempa.net/archives/tag/tm-ai-robot)
- [AI Online Learning](https://aei.dempa.net/archives/tag/ai-online-learning)
- [Mitutoyo](https://aei.dempa.net/archives/tag/mitutoyo)
- [vision measuring system](https://aei.dempa.net/archives/tag/vision-measuring-system)
- [Quick Vision Pro](https://aei.dempa.net/archives/tag/quick-vision-pro)
- [CNC](https://aei.dempa.net/archives/tag/cnc)
- [Aeva](https://aei.dempa.net/archives/tag/aeva)
- [FM LiDAR](https://aei.dempa.net/archives/tag/fm-lidar)
- [AM LiDAR](https://aei.dempa.net/archives/tag/am-lidar)
- [Nikon](https://aei.dempa.net/archives/tag/nikon)
- [Autonomous](https://aei.dempa.net/archives/tag/autonomous)
- [Autonomous Driving](https://aei.dempa.net/archives/tag/autonomous-driving)
- [Collaborative Robot Center](https://aei.dempa.net/archives/tag/collaborative-robot-center)
- [BYNAS](https://aei.dempa.net/archives/tag/bynas)
- [Tachiban](https://aei.dempa.net/archives/tag/tachiban)
- [ORIX Rentec](https://aei.dempa.net/archives/tag/orix-rentec)
- [Verizon](https://aei.dempa.net/archives/tag/verizon)
- [IBM](https://aei.dempa.net/archives/tag/ibm)
- [TDK](https://aei.dempa.net/archives/tag/tdk)
- [Power Inductors](https://aei.dempa.net/archives/tag/power-inductors)
- [factory equipment](https://aei.dempa.net/archives/tag/factory-equipment)
- [Webasto](https://aei.dempa.net/archives/tag/webasto)
- [Bosh](https://aei.dempa.net/archives/tag/bosh)
- [battery production](https://aei.dempa.net/archives/tag/battery-production)
- [automated assembly lines](https://aei.dempa.net/archives/tag/automated-assembly-lines)
- [Polarizer](https://aei.dempa.net/archives/tag/polarizer)
- [Polarizer-less](https://aei.dempa.net/archives/tag/polarizer-less)
- [LG Energy Solution](https://aei.dempa.net/archives/tag/lg-energy-solution)
- [Proterra](https://aei.dempa.net/archives/tag/proterra)
- [RX-8 high-speed mounter](https://aei.dempa.net/archives/tag/rx-8-high-speed-mounter)
- [International Federation of Robotics](https://aei.dempa.net/archives/tag/international-federation-of-robotics)
- [POLED](https://aei.dempa.net/archives/tag/poled)
- [Apple](https://aei.dempa.net/archives/tag/apple)
- [QD OLEDs](https://aei.dempa.net/archives/tag/qd-oleds)
- [Predictive Maintenance](https://aei.dempa.net/archives/tag/predictive-maintenance)
- [Black & Veatch](https://aei.dempa.net/archives/tag/black-veatch)
- [Comau](https://aei.dempa.net/archives/tag/comau)
- [Siemens](https://aei.dempa.net/archives/tag/siemens)
- [BASF 3D Printing](https://aei.dempa.net/archives/tag/basf-3d-printing)
- [Forward AM](https://aei.dempa.net/archives/tag/forward-am)
- [Xuberance](https://aei.dempa.net/archives/tag/xuberance)
- [Additive Manufacturing](https://aei.dempa.net/archives/tag/additive-manufacturing)
- [Nepes](https://aei.dempa.net/archives/tag/nepes)
- [Mentor](https://aei.dempa.net/archives/tag/mentor)
- [FO WLP](https://aei.dempa.net/archives/tag/fo-wlp)
- [Fan-out Wafer-Level Packaging](https://aei.dempa.net/archives/tag/fan-out-wafer-level-packaging)
- [Xpedition](https://aei.dempa.net/archives/tag/xpedition)
- [6G Mobile Radio Technology](https://aei.dempa.net/archives/tag/6g-mobile-radio-technology)
- [LG Electronics](https://aei.dempa.net/archives/tag/lg-electronics)
- [Beamfoaming](https://aei.dempa.net/archives/tag/beamfoaming)
- [Ulta-gain Antenna](https://aei.dempa.net/archives/tag/ulta-gain-antenna)
- [KAIST](https://aei.dempa.net/archives/tag/kaist)
- [ZEN-NOH](https://aei.dempa.net/archives/tag/zen-noh)
- [i3-Mechatronics](https://aei.dempa.net/archives/tag/i3-mechatronics)
- [Intel. Alchemist](https://aei.dempa.net/archives/tag/intel-alchemist)
- [Ponte Vecchio](https://aei.dempa.net/archives/tag/ponte-vecchio)
- [Meteor Lake](https://aei.dempa.net/archives/tag/meteor-lake)
- [Elexcon & Embedded Expo](https://aei.dempa.net/archives/tag/elexcon-embedded-expo)
- [Seoul Viosys](https://aei.dempa.net/archives/tag/seoul-viosys)
- [micro-LEDs](https://aei.dempa.net/archives/tag/micro-leds)
- [Shuji Nakamura](https://aei.dempa.net/archives/tag/shuji-nakamura)
- [Digital Twins](https://aei.dempa.net/archives/tag/digital-twins)
- [TrendForce](https://aei.dempa.net/archives/tag/trendforce)
- [pick and place](https://aei.dempa.net/archives/tag/pick-and-place)
- [Mycronic](https://aei.dempa.net/archives/tag/mycronic)
- [screen printers](https://aei.dempa.net/archives/tag/screen-printers)
- [HBM-PIM](https://aei.dempa.net/archives/tag/hbm-pim)
- [AXDIMM](https://aei.dempa.net/archives/tag/axdimm)
- [LPDDR5-PIM](https://aei.dempa.net/archives/tag/lpddr5-pim)
- [Aquabolt-XL](https://aei.dempa.net/archives/tag/aquabolt-xl)
- [Ilika](https://aei.dempa.net/archives/tag/ilika)
- [Solid-State Battery](https://aei.dempa.net/archives/tag/solid-state-battery)
- [3D-SPI](https://aei.dempa.net/archives/tag/3d-spi-2)
- [IPC](https://aei.dempa.net/archives/tag/ipc)
- [IPC Forum](https://aei.dempa.net/archives/tag/ipc-forum)
- [IPC-9797](https://aei.dempa.net/archives/tag/ipc-9797)
- [Telum](https://aei.dempa.net/archives/tag/telum)
- [AI Accelerator](https://aei.dempa.net/archives/tag/ai-accelerator)
- [Blue Lake](https://aei.dempa.net/archives/tag/blue-lake)
- [LITs](https://aei.dempa.net/archives/tag/lits)
- [FPC](https://aei.dempa.net/archives/tag/fpc)
- [FFC](https://aei.dempa.net/archives/tag/ffc)
- [Titan Haptics](https://aei.dempa.net/archives/tag/titan-haptics)
- [Immersion](https://aei.dempa.net/archives/tag/immersion)
- [Thailand 4.0](https://aei.dempa.net/archives/tag/thailand-4-0)
- [Digital Economy](https://aei.dempa.net/archives/tag/digital-economy)
- [ABB Robotics](https://aei.dempa.net/archives/tag/abb-robotics)
- [DfAM](https://aei.dempa.net/archives/tag/dfam)
- [3D-CAD](https://aei.dempa.net/archives/tag/3d-cad)
- [Enabling Technologies](https://aei.dempa.net/archives/tag/enabling-technologies)
- [AIoT](https://aei.dempa.net/archives/tag/aiot)
- [Innodisk](https://aei.dempa.net/archives/tag/innodisk)
- [Ritsumeikan University](https://aei.dempa.net/archives/tag/ritsumeikan-university)
- [KANDO](https://aei.dempa.net/archives/tag/kando)
- [Xilinx](https://aei.dempa.net/archives/tag/xilinx)
- [Motovis](https://aei.dempa.net/archives/tag/motovis)
- [XA Zynq](https://aei.dempa.net/archives/tag/xa-zynq)
- [ACC](https://aei.dempa.net/archives/tag/acc)
- [aEB](https://aei.dempa.net/archives/tag/aeb)
- [Adaptive Cruise Control](https://aei.dempa.net/archives/tag/adaptive-cruise-control)
- [Automatic Emergency Braking](https://aei.dempa.net/archives/tag/automatic-emergency-braking)
- [Convolutional Neural Network](https://aei.dempa.net/archives/tag/convolutional-neural-network)
- [NACP](https://aei.dempa.net/archives/tag/nacp)
- [SIIX](https://aei.dempa.net/archives/tag/siix)
- [AMR robots](https://aei.dempa.net/archives/tag/amr-robots)
- [SF Supply Chain](https://aei.dempa.net/archives/tag/sf-supply-chain)
- [Geek+](https://aei.dempa.net/archives/tag/geek)
- [logistics](https://aei.dempa.net/archives/tag/logistics)
- [Yokogawa](https://aei.dempa.net/archives/tag/yokogawa)
- [Oprex](https://aei.dempa.net/archives/tag/oprex)
- [condition-based monitoring](https://aei.dempa.net/archives/tag/condition-based-monitoring)
- [Mobileye](https://aei.dempa.net/archives/tag/mobileye)
- [ZEEKR](https://aei.dempa.net/archives/tag/zeekr)
- [Geely](https://aei.dempa.net/archives/tag/geely)
- [ISPs](https://aei.dempa.net/archives/tag/isps)
- [power distribution](https://aei.dempa.net/archives/tag/power-distribution)
- [spring clamp method](https://aei.dempa.net/archives/tag/spring-clamp-method)
- [control devices](https://aei.dempa.net/archives/tag/control-devices)
- [screw](https://aei.dempa.net/archives/tag/screw)
- [All About Photonics](https://aei.dempa.net/archives/tag/all-about-photonics)
- [JPCA](https://aei.dempa.net/archives/tag/jpca)
- [Cree](https://aei.dempa.net/archives/tag/cree)
- [150mm wafer](https://aei.dempa.net/archives/tag/150mm-wafer)
- [SK Innovation](https://aei.dempa.net/archives/tag/sk-innovation)
- [EV](https://aei.dempa.net/archives/tag/ev)
- [CMOS Image Sensor ChipS](https://aei.dempa.net/archives/tag/cmos-image-sensor-chips)
- [ISOCELL](https://aei.dempa.net/archives/tag/isocell)
- [ChameleonCell](https://aei.dempa.net/archives/tag/chameleoncell)
- [Dual Pixel Pro](https://aei.dempa.net/archives/tag/dual-pixel-pro)
- [eve auto service](https://aei.dempa.net/archives/tag/eve-auto-service)
- [Yaskawa Technology Center](https://aei.dempa.net/archives/tag/yaskawa-technology-center)
- [digital data management](https://aei.dempa.net/archives/tag/digital-data-management)
- [LT Series Linear Motor Table](https://aei.dempa.net/archives/tag/lt-series-linear-motor-table)
- [digital transformation](https://aei.dempa.net/archives/tag/digital-transformation)
- [construction](https://aei.dempa.net/archives/tag/construction)
- [3D surveying](https://aei.dempa.net/archives/tag/3d-surveying)
- [NTU](https://aei.dempa.net/archives/tag/ntu)
- [Hyundai Motor](https://aei.dempa.net/archives/tag/hyundai-motor)
- [Nanyang Technological University](https://aei.dempa.net/archives/tag/nanyang-technological-university)
- [3D Additive Manufacturing](https://aei.dempa.net/archives/tag/3d-additive-manufacturing)
- [NEC](https://aei.dempa.net/archives/tag/nec)
- [autonomous robot](https://aei.dempa.net/archives/tag/autonomous-robot)
- [collaborative robot](https://aei.dempa.net/archives/tag/collaborative-robot)
- [ASM Impact](https://aei.dempa.net/archives/tag/asm-impact)
- [production](https://aei.dempa.net/archives/tag/production)
- [Qualcomm](https://aei.dempa.net/archives/tag/qualcomm)
- [Snapdragon](https://aei.dempa.net/archives/tag/snapdragon)
- [Snapdragon Automotive Cockpit Platform](https://aei.dempa.net/archives/tag/snapdragon-automotive-cockpit-platform)
- [Ag-Free Solder](https://aei.dempa.net/archives/tag/ag-free-solder)
- [Nihon Almit](https://aei.dempa.net/archives/tag/nihon-almit)
- [Low-Ag Solder](https://aei.dempa.net/archives/tag/low-ag-solder)
- [Nihon Superior](https://aei.dempa.net/archives/tag/nihon-superior)
- [KeiganMotor](https://aei.dempa.net/archives/tag/keiganmotor)
- [Keigan ALI](https://aei.dempa.net/archives/tag/keigan-ali)
- [Smart Factory & Automation World 2021](https://aei.dempa.net/archives/tag/smart-factory-automation-world-2021)
- [Hexagon Manufacturing Intelligence](https://aei.dempa.net/archives/tag/hexagon-manufacturing-intelligence)
- ["Zynq RF SoC](https://aei.dempa.net/archives/tag/zynq-rf-soc)
- [Kria](https://aei.dempa.net/archives/tag/kria)
- [Alveo accelerator cars](https://aei.dempa.net/archives/tag/alveo-accelerator-cars)
- [Microsoft Azure](https://aei.dempa.net/archives/tag/microsoft-azure)
- [manufacturing equipment](https://aei.dempa.net/archives/tag/manufacturing-equipment)
- [DENSO](https://aei.dempa.net/archives/tag/denso)
- [3D-AOI](https://aei.dempa.net/archives/tag/3d-aoi-2)
- [Pat Gelsinger](https://aei.dempa.net/archives/tag/pat-gelsinger)
- [Ireland](https://aei.dempa.net/archives/tag/ireland)
- [Future Factory Hub](https://aei.dempa.net/archives/tag/future-factory-hub)
- [Deutsche Telekom](https://aei.dempa.net/archives/tag/deutsche-telekom)
- [Werner-von-Siemens](https://aei.dempa.net/archives/tag/werner-von-siemens)
- [Nano Dimension](https://aei.dempa.net/archives/tag/nano-dimension)
- [Fraunhofer](https://aei.dempa.net/archives/tag/fraunhofer)
- [3D printing](https://aei.dempa.net/archives/tag/3d-printing)
- [MOV.AI](https://aei.dempa.net/archives/tag/mov-ai)
- [Velodyne](https://aei.dempa.net/archives/tag/velodyne)
- [autonomous mobile robots](https://aei.dempa.net/archives/tag/autonomous-mobile-robots)
- [HAi Robotics](https://aei.dempa.net/archives/tag/hai-robotics)
- [HAIPICK](https://aei.dempa.net/archives/tag/haipick)
- [Emerson](https://aei.dempa.net/archives/tag/emerson)
- [Rosemount XE10](https://aei.dempa.net/archives/tag/rosemount-xe10)
- [Environment](https://aei.dempa.net/archives/tag/environment)
- [Emissions Monitoring](https://aei.dempa.net/archives/tag/emissions-monitoring)
- [Applied Materials](https://aei.dempa.net/archives/tag/applied-materials)
- [heterogeneous chip design](https://aei.dempa.net/archives/tag/heterogeneous-chip-design)
- [chip integration](https://aei.dempa.net/archives/tag/chip-integration)
- [advanced packaging](https://aei.dempa.net/archives/tag/advanced-packaging)
- [Google](https://aei.dempa.net/archives/tag/google)
- [Korea Fair Trade Commission](https://aei.dempa.net/archives/tag/korea-fair-trade-commission)
- [Android OS](https://aei.dempa.net/archives/tag/android-os)
- [forked Android OS](https://aei.dempa.net/archives/tag/forked-android-os)
- [smart phones](https://aei.dempa.net/archives/tag/smart-phones)
- [USI](https://aei.dempa.net/archives/tag/usi)
- [Antenna-on-Package](https://aei.dempa.net/archives/tag/antenna-on-package)
- [Bluetooth 5.0](https://aei.dempa.net/archives/tag/bluetooth-5-0)
- [Orient Technology](https://aei.dempa.net/archives/tag/orient-technology)
- [Joint Venture](https://aei.dempa.net/archives/tag/joint-venture)
- [3D Print](https://aei.dempa.net/archives/tag/3d-print)
- [iiQoT Software](https://aei.dempa.net/archives/tag/iiqot-software)
- [Fleet Management Software](https://aei.dempa.net/archives/tag/fleet-management-software)
- [Flow Core 2.1](https://aei.dempa.net/archives/tag/flow-core-2-1)
- [Toshiba](https://aei.dempa.net/archives/tag/toshiba)
- [VQA](https://aei.dempa.net/archives/tag/vqa)
- [Condition Monitoring](https://aei.dempa.net/archives/tag/condition-monitoring)
- [Creative Technology](https://aei.dempa.net/archives/tag/creative-technology)
- [LH Innotek](https://aei.dempa.net/archives/tag/lh-innotek)
- [HRE](https://aei.dempa.net/archives/tag/hre)
- [Magnets](https://aei.dempa.net/archives/tag/magnets)
- [Sumitomo Bakelite](https://aei.dempa.net/archives/tag/sumitomo-bakelite)
- [Roll Core](https://aei.dempa.net/archives/tag/roll-core)
- [Flexible Circuit Boards](https://aei.dempa.net/archives/tag/flexible-circuit-boards)
- [Reel-to-Reel](https://aei.dempa.net/archives/tag/reel-to-reel)
- [China Robot Market](https://aei.dempa.net/archives/tag/china-robot-market)
- [Infineon](https://aei.dempa.net/archives/tag/infineon)
- [300mm](https://aei.dempa.net/archives/tag/300mm)
- [DXQ Analytics Software](https://aei.dempa.net/archives/tag/dxq-analytics-software)
- [Advanced Analytics Module](https://aei.dempa.net/archives/tag/advanced-analytics-module)
- [Dürr Systems](https://aei.dempa.net/archives/tag/durr-systems)
- [Apple iPhone 13 series](https://aei.dempa.net/archives/tag/apple-iphone-13-series)
- [LG Innotek](https://aei.dempa.net/archives/tag/lg-innotek)
- [ITM Semiconductor](https://aei.dempa.net/archives/tag/itm-semiconductor)
- [Samsung Electro-Mechanics](https://aei.dempa.net/archives/tag/samsung-electro-mechanics)
- [BH](https://aei.dempa.net/archives/tag/bh)
- [Young Poong](https://aei.dempa.net/archives/tag/young-poong)
- [Anysys](https://aei.dempa.net/archives/tag/anysys)
- [Simulation](https://aei.dempa.net/archives/tag/simulation)
- [Kia Motor](https://aei.dempa.net/archives/tag/kia-motor)
- [Boston Robotics](https://aei.dempa.net/archives/tag/boston-robotics)
- [Spot](https://aei.dempa.net/archives/tag/spot)
- [Computing Payload](https://aei.dempa.net/archives/tag/computing-payload)
- [IAA Mobility 2021](https://aei.dempa.net/archives/tag/iaa-mobility-2021)
- [SUPWAT](https://aei.dempa.net/archives/tag/supwat)
- [fuel cells](https://aei.dempa.net/archives/tag/fuel-cells)
- [Siemens Digital Industries Software](https://aei.dempa.net/archives/tag/siemens-digital-industries-software)
- [LG Smart Park](https://aei.dempa.net/archives/tag/lg-smart-park)
- [Electronics Distributors](https://aei.dempa.net/archives/tag/electronics-distributors)
- [Ryoden](https://aei.dempa.net/archives/tag/ryoden)
- [Kanaden](https://aei.dempa.net/archives/tag/kanaden)
- [Iida Electronics](https://aei.dempa.net/archives/tag/iida-electronics)
- [3DFabric](https://aei.dempa.net/archives/tag/3dfabric)
- [3D IC packaging](https://aei.dempa.net/archives/tag/3d-ic-packaging)
- [Semicon Taiwan](https://aei.dempa.net/archives/tag/semicon-taiwan)
- [Rainbow Robotics](https://aei.dempa.net/archives/tag/rainbow-robotics)
- [RB Series](https://aei.dempa.net/archives/tag/rb-series)
- [Hubo](https://aei.dempa.net/archives/tag/hubo)
- [Neuromeka](https://aei.dempa.net/archives/tag/neuromeka)
- [Indy](https://aei.dempa.net/archives/tag/indy)
- [Moby](https://aei.dempa.net/archives/tag/moby)
- [Intel CEONtek](https://aei.dempa.net/archives/tag/intel-ceontek)
- [Neuromorphic ICs](https://aei.dempa.net/archives/tag/neuromorphic-ics)
- [Neurons](https://aei.dempa.net/archives/tag/neurons)
- [Neural Connection Map](https://aei.dempa.net/archives/tag/neural-connection-map)
- [Harvard University](https://aei.dempa.net/archives/tag/harvard-university)
- [events](https://aei.dempa.net/archives/tag/events)
- [LM Guides](https://aei.dempa.net/archives/tag/lm-guides)
- [Ford Motors](https://aei.dempa.net/archives/tag/ford-motors)
- [EV Battery](https://aei.dempa.net/archives/tag/ev-battery)
- [power supply](https://aei.dempa.net/archives/tag/power-supply)
- [IRISO](https://aei.dempa.net/archives/tag/iriso)
- [Philippines](https://aei.dempa.net/archives/tag/philippines)
- [SMIC](https://aei.dempa.net/archives/tag/smic)
- [Low-Temperature Solder](https://aei.dempa.net/archives/tag/low-temperature-solder)
- [Flow Soldering](https://aei.dempa.net/archives/tag/flow-soldering)
- [Carbon Neutrality](https://aei.dempa.net/archives/tag/carbon-neutrality)
- [Loihi 2 Neuromorphic Chip](https://aei.dempa.net/archives/tag/loihi-2-neuromorphic-chip)
- [Lava](https://aei.dempa.net/archives/tag/lava)
- [Hailo](https://aei.dempa.net/archives/tag/hailo)
- [MicroSys](https://aei.dempa.net/archives/tag/microsys)
- [edge computing](https://aei.dempa.net/archives/tag/edge-computing)
- [AI Embedded Platform](https://aei.dempa.net/archives/tag/ai-embedded-platform)
- [edge device](https://aei.dempa.net/archives/tag/edge-device)
- [machine tools](https://aei.dempa.net/archives/tag/machine-tools)
- [industrial edge](https://aei.dempa.net/archives/tag/industrial-edge)
- [CEO Peter Wennink](https://aei.dempa.net/archives/tag/ceo-peter-wennink)
- [DUV](https://aei.dempa.net/archives/tag/duv)
- [Lithography Equipment](https://aei.dempa.net/archives/tag/lithography-equipment)
- [Universal Robots](https://aei.dempa.net/archives/tag/universal-robots)
- [Robo Uni](https://aei.dempa.net/archives/tag/robo-uni)
- [Rubic Project](https://aei.dempa.net/archives/tag/rubic-project)
- [Whirlpool](https://aei.dempa.net/archives/tag/whirlpool)
- [Tata Steel](https://aei.dempa.net/archives/tag/tata-steel)
- [electromagnetic brake systems](https://aei.dempa.net/archives/tag/electromagnetic-brake-systems)
- [slab casting](https://aei.dempa.net/archives/tag/slab-casting)
- [Maxell](https://aei.dempa.net/archives/tag/maxell)
- [electromagnetic wave](https://aei.dempa.net/archives/tag/electromagnetic-wave)
- [GAA](https://aei.dempa.net/archives/tag/gaa)
- [Hon Hai](https://aei.dempa.net/archives/tag/hon-hai)
- [Lordstown Motors](https://aei.dempa.net/archives/tag/lordstown-motors)
- [Union Tool](https://aei.dempa.net/archives/tag/union-tool)
- [lubricant film coating](https://aei.dempa.net/archives/tag/lubricant-film-coating)
- [NXTR Mounters](https://aei.dempa.net/archives/tag/nxtr-mounters)
- [AOI System](https://aei.dempa.net/archives/tag/aoi-system)
- [production bases](https://aei.dempa.net/archives/tag/production-bases)
- [14nm node](https://aei.dempa.net/archives/tag/14nm-node)
- [Nokia](https://aei.dempa.net/archives/tag/nokia)
- [Nokia MX Industrial Edge](https://aei.dempa.net/archives/tag/nokia-mx-industrial-edge)
- [Ansys](https://aei.dempa.net/archives/tag/ansys)
- [Autodesk](https://aei.dempa.net/archives/tag/autodesk)
- [Autodesk Fusion 360](https://aei.dempa.net/archives/tag/autodesk-fusion-360)
- [SEMI](https://aei.dempa.net/archives/tag/semi)
- [Flex](https://aei.dempa.net/archives/tag/flex)
- [WEF Global Lighthouse Network](https://aei.dempa.net/archives/tag/wef-global-lighthouse-network)
- [Device-Under-Test](https://aei.dempa.net/archives/tag/device-under-test)
- [Connected Medical Devices](https://aei.dempa.net/archives/tag/connected-medical-devices)
- [Jabil](https://aei.dempa.net/archives/tag/jabil)
- [Best Sensor](https://aei.dempa.net/archives/tag/best-sensor)
- [Sysmac Studio 3D](https://aei.dempa.net/archives/tag/sysmac-studio-3d)
- [Dual Boost Technology](https://aei.dempa.net/archives/tag/dual-boost-technology)
- [Quick Boost Technology](https://aei.dempa.net/archives/tag/quick-boost-technology)
- [PCB Direct Imaging System](https://aei.dempa.net/archives/tag/pcb-direct-imaging-system)
- [Screen](https://aei.dempa.net/archives/tag/screen)
- [Ledia Series](https://aei.dempa.net/archives/tag/ledia-series)
- [NEXTY Electronics](https://aei.dempa.net/archives/tag/nexty-electronics)
- [robotics](https://aei.dempa.net/archives/tag/robotics)
- [BayoTech](https://aei.dempa.net/archives/tag/bayotech)
- [Celestica](https://aei.dempa.net/archives/tag/celestica)
- [PCI](https://aei.dempa.net/archives/tag/pci)
- [CLOi](https://aei.dempa.net/archives/tag/cloi)
- [Bespoke JetBot AI](https://aei.dempa.net/archives/tag/bespoke-jetbot-ai)
- [GEMS](https://aei.dempa.net/archives/tag/gems)
- [Movidius](https://aei.dempa.net/archives/tag/movidius)
- [device test](https://aei.dempa.net/archives/tag/device-test)
- [Oki Engineering](https://aei.dempa.net/archives/tag/oki-engineering)
- [IC test](https://aei.dempa.net/archives/tag/ic-test)
- [optical microscope](https://aei.dempa.net/archives/tag/optical-microscope)
- [FPGA](https://aei.dempa.net/archives/tag/fpga)
- [Visual Inspection System](https://aei.dempa.net/archives/tag/visual-inspection-system)
- [Hitachi Metals](https://aei.dempa.net/archives/tag/hitachi-metals)
- [Nandemo Inspector](https://aei.dempa.net/archives/tag/nandemo-inspector)
- [inverter](https://aei.dempa.net/archives/tag/inverter)
- [converter](https://aei.dempa.net/archives/tag/converter)
- [EV battery cell](https://aei.dempa.net/archives/tag/ev-battery-cell)
- [Stellantis](https://aei.dempa.net/archives/tag/stellantis)
- [Peugeot SA](https://aei.dempa.net/archives/tag/peugeot-sa)
- [Samsung SDIA](https://aei.dempa.net/archives/tag/samsung-sdia)
- [Mechatronics Series](https://aei.dempa.net/archives/tag/mechatronics-series)
- [IKO](https://aei.dempa.net/archives/tag/iko)
- [Panaconic](https://aei.dempa.net/archives/tag/panaconic)
- [smooth collision avoidance](https://aei.dempa.net/archives/tag/smooth-collision-avoidance)
- [Volkswagen Group](https://aei.dempa.net/archives/tag/volkswagen-group)
- [Transparent Factory](https://aei.dempa.net/archives/tag/transparent-factory)
- [data analytics](https://aei.dempa.net/archives/tag/data-analytics)
- [ABB Ability Genix Datalyzer](https://aei.dempa.net/archives/tag/abb-ability-genix-datalyzer)
- [Aspina](https://aei.dempa.net/archives/tag/aspina)
- [AiRY JACKET](https://aei.dempa.net/archives/tag/airy-jacket)
- [Robosuit](https://aei.dempa.net/archives/tag/robosuit)
- [Alibaba](https://aei.dempa.net/archives/tag/alibaba)
- [Yitian 719](https://aei.dempa.net/archives/tag/yitian-719)
- [Alibaba Cloud](https://aei.dempa.net/archives/tag/alibaba-cloud)
- [Panju](https://aei.dempa.net/archives/tag/panju)
- [ZC Rubber](https://aei.dempa.net/archives/tag/zc-rubber)
- [Machine Vision](https://aei.dempa.net/archives/tag/machine-vision)
- [Smart Factory Platform](https://aei.dempa.net/archives/tag/smart-factory-platform)
- [silver](https://aei.dempa.net/archives/tag/silver)
- [JEITA](https://aei.dempa.net/archives/tag/jeita)
- [tin](https://aei.dempa.net/archives/tag/tin)
- [copper](https://aei.dempa.net/archives/tag/copper)
- [Ford](https://aei.dempa.net/archives/tag/ford)
- [predictive headlight](https://aei.dempa.net/archives/tag/predictive-headlight)
- [Lee Jung Bae](https://aei.dempa.net/archives/tag/lee-jung-bae)
- [SEDEX 2021](https://aei.dempa.net/archives/tag/sedex-2021)
- [metaverse](https://aei.dempa.net/archives/tag/metaverse)
- [smart monitoring](https://aei.dempa.net/archives/tag/smart-monitoring)
- [Vodafone](https://aei.dempa.net/archives/tag/vodafone)
- [Athonet](https://aei.dempa.net/archives/tag/athonet)
- [BASF](https://aei.dempa.net/archives/tag/basf)
- [SVOLT](https://aei.dempa.net/archives/tag/svolt)
- [cathode active materials](https://aei.dempa.net/archives/tag/cathode-active-materials)
- [battery](https://aei.dempa.net/archives/tag/battery)
- [Matter](https://aei.dempa.net/archives/tag/matter)
- [Cross-device connectivity standard](https://aei.dempa.net/archives/tag/cross-device-connectivity-standard)
- [SmartThings](https://aei.dempa.net/archives/tag/smartthings)
- [AT&T](https://aei.dempa.net/archives/tag/att)
- [EV Assembly](https://aei.dempa.net/archives/tag/ev-assembly)
- [F-150 Lightning](https://aei.dempa.net/archives/tag/f-150-lightning)
- [Sanmina](https://aei.dempa.net/archives/tag/sanmina)
- [Placement machine](https://aei.dempa.net/archives/tag/placement-machine)
- [Placement](https://aei.dempa.net/archives/tag/placement)
- [Printing](https://aei.dempa.net/archives/tag/printing)
- [Canon ITS](https://aei.dempa.net/archives/tag/canon-its)
- [Kay Foundry](https://aei.dempa.net/archives/tag/kay-foundry)
- [Magnachip](https://aei.dempa.net/archives/tag/magnachip)
- [Techman](https://aei.dempa.net/archives/tag/techman)
- [TM Series](https://aei.dempa.net/archives/tag/tm-series)
- [Samsung g](https://aei.dempa.net/archives/tag/samsung-g)
- [Ciena](https://aei.dempa.net/archives/tag/ciena)
- [Merck](https://aei.dempa.net/archives/tag/merck)
- [RECOM](https://aei.dempa.net/archives/tag/recom)
- [PMBus](https://aei.dempa.net/archives/tag/pmbus)
- [Robot Systems](https://aei.dempa.net/archives/tag/robot-systems)
- [Omron Automation](https://aei.dempa.net/archives/tag/omron-automation)
- [Omron Automation Systems](https://aei.dempa.net/archives/tag/omron-automation-systems)
- [Industrial Control Systems](https://aei.dempa.net/archives/tag/industrial-control-systems)
- [Metatron Grandview](https://aei.dempa.net/archives/tag/metatron-grandview)
- [Senju Metal](https://aei.dempa.net/archives/tag/senju-metal)
- [Essemtec](https://aei.dempa.net/archives/tag/essemtec)
- [pick-and-place](https://aei.dempa.net/archives/tag/pick-and-place-2)
- [Sony](https://aei.dempa.net/archives/tag/sony)
- [Fondazione REI](https://aei.dempa.net/archives/tag/fondazione-rei)
- [Digital Automation Lab](https://aei.dempa.net/archives/tag/digital-automation-lab)
- [H-Cube](https://aei.dempa.net/archives/tag/h-cube)
- [2.5D packaging](https://aei.dempa.net/archives/tag/2-5d-packaging)
- [Fan Out](https://aei.dempa.net/archives/tag/fan-out)
- [Integrated Fab-Out](https://aei.dempa.net/archives/tag/integrated-fab-out)
- [Remote Monitoring](https://aei.dempa.net/archives/tag/remote-monitoring)
- [Kotron](https://aei.dempa.net/archives/tag/kotron)
- [Hailo-8 AI accelerator](https://aei.dempa.net/archives/tag/hailo-8-ai-accelerator)
- [Hitachi High-Tech](https://aei.dempa.net/archives/tag/hitachi-high-tech)
- [Atomic Force Microscope](https://aei.dempa.net/archives/tag/atomic-force-microscope)
- [AFM100 Series](https://aei.dempa.net/archives/tag/afm100-series)
- [Riken Keiki](https://aei.dempa.net/archives/tag/riken-keiki)
- [gas sensor](https://aei.dempa.net/archives/tag/gas-sensor)
- [JSR](https://aei.dempa.net/archives/tag/jsr)
- [Photoresist](https://aei.dempa.net/archives/tag/photoresist)
- [water analyzer](https://aei.dempa.net/archives/tag/water-analyzer)
- [Sumitomo Chemical](https://aei.dempa.net/archives/tag/sumitomo-chemical)
- [Photoresists](https://aei.dempa.net/archives/tag/photoresists)
- [TI](https://aei.dempa.net/archives/tag/ti)
- [Texas Instruments](https://aei.dempa.net/archives/tag/texas-instruments)
- [Rich Templeton](https://aei.dempa.net/archives/tag/rich-templeton)
- [Toray Engineering](https://aei.dempa.net/archives/tag/toray-engineering)
- [Water Analyzers](https://aei.dempa.net/archives/tag/water-analyzers)
- [Holon](https://aei.dempa.net/archives/tag/holon)
- [Scanning Electron Microscope](https://aei.dempa.net/archives/tag/scanning-electron-microscope)
- [JASCO](https://aei.dempa.net/archives/tag/jasco)
- [wafer evaluaction](https://aei.dempa.net/archives/tag/wafer-evaluaction)
- [wafer measurement](https://aei.dempa.net/archives/tag/wafer-measurement)
- [Agilent Technologies](https://aei.dempa.net/archives/tag/agilent-technologies)
- [QD-OLED](https://aei.dempa.net/archives/tag/qd-oled)
- [BM50 Series](https://aei.dempa.net/archives/tag/bm50-series)
- [CES Innovation Awards](https://aei.dempa.net/archives/tag/ces-innovation-awards)
- [Film](https://aei.dempa.net/archives/tag/film)
- [Nippon Electric Glass](https://aei.dempa.net/archives/tag/nippon-electric-glass)
- [LTCC Material](https://aei.dempa.net/archives/tag/ltcc-material)
- [power semiconductor](https://aei.dempa.net/archives/tag/power-semiconductor)
- [laser diode](https://aei.dempa.net/archives/tag/laser-diode)
- [data center](https://aei.dempa.net/archives/tag/data-center)
- [Automotive Chips](https://aei.dempa.net/archives/tag/automotive-chips)
- [Exynos Auto T5123](https://aei.dempa.net/archives/tag/exynos-auto-t5123)
- [Exynos Auto V7](https://aei.dempa.net/archives/tag/exynos-auto-v7)
- [Advantest](https://aei.dempa.net/archives/tag/advantest)
- [Link Scale](https://aei.dempa.net/archives/tag/link-scale)
- [V93000 Platform](https://aei.dempa.net/archives/tag/v93000-platform)
- [Lumirror](https://aei.dempa.net/archives/tag/lumirror)
- [Polyester Film](https://aei.dempa.net/archives/tag/polyester-film)
- [NHK Spring](https://aei.dempa.net/archives/tag/nhk-spring)
- [Investment](https://aei.dempa.net/archives/tag/investment)
- [Japan](https://aei.dempa.net/archives/tag/japan)
- [2nm](https://aei.dempa.net/archives/tag/2nm)
- [Panasonic Industry](https://aei.dempa.net/archives/tag/panasonic-industry)
- [Nagano Keiki](https://aei.dempa.net/archives/tag/nagano-keiki)
- [Laser Irradiation](https://aei.dempa.net/archives/tag/laser-irradiation)
- [Digikey](https://aei.dempa.net/archives/tag/digikey)
- [India](https://aei.dempa.net/archives/tag/india)
- [Nichicon](https://aei.dempa.net/archives/tag/nichicon)
- [RICOH Electronic Devices](https://aei.dempa.net/archives/tag/ricoh-electronic-devices)
- [Citizen Electronics](https://aei.dempa.net/archives/tag/citizen-electronics)
- [3D Tactile Sensor](https://aei.dempa.net/archives/tag/3d-tactile-sensor)
- [Snapdragon 8 Gen1](https://aei.dempa.net/archives/tag/snapdragon-8-gen1)
- [Solders](https://aei.dempa.net/archives/tag/solders)
- [Capacitors](https://aei.dempa.net/archives/tag/capacitors)
- [Nippon Chemi-con](https://aei.dempa.net/archives/tag/nippon-chemi-con)
- [LX Semicon](https://aei.dempa.net/archives/tag/lx-semicon)
- [SiC chip](https://aei.dempa.net/archives/tag/sic-chip)
- [Silicon](https://aei.dempa.net/archives/tag/silicon)
- [0603 Chips](https://aei.dempa.net/archives/tag/0603-chips)
- [Reflow mounting](https://aei.dempa.net/archives/tag/reflow-mounting)
- [Green semiconductors](https://aei.dempa.net/archives/tag/green-semiconductors)
- [Tokyo Institute of Technology](https://aei.dempa.net/archives/tag/tokyo-institute-of-technology)
- [Amotech](https://aei.dempa.net/archives/tag/amotech)
- [MLCCs](https://aei.dempa.net/archives/tag/mlccs)
- [PME type MLCC](https://aei.dempa.net/archives/tag/pme-type-mlcc)
- [JY Lee](https://aei.dempa.net/archives/tag/jy-lee)
- [Han Jong Hee](https://aei.dempa.net/archives/tag/han-jong-hee)
- [Carbon-Neutral Society](https://aei.dempa.net/archives/tag/carbon-neutral-society)
- [Solar Cell](https://aei.dempa.net/archives/tag/solar-cell)
- [Renewable](https://aei.dempa.net/archives/tag/renewable)
- [Nepes Laweh](https://aei.dempa.net/archives/tag/nepes-laweh)
- [FOPLP](https://aei.dempa.net/archives/tag/foplp)
- [FOWLP](https://aei.dempa.net/archives/tag/fowlp)
- [Nomura Research Institute](https://aei.dempa.net/archives/tag/nomura-research-institute)
- [Semiconductor Encapsulation Material](https://aei.dempa.net/archives/tag/semiconductor-encapsulation-material)
- [smart building](https://aei.dempa.net/archives/tag/smart-building)
- [Nippon Thompson](https://aei.dempa.net/archives/tag/nippon-thompson)
- [X-ray Diffractometer](https://aei.dempa.net/archives/tag/x-ray-diffractometer)
- [Sevensense](https://aei.dempa.net/archives/tag/sevensense)
- [Automated Mobile Robots](https://aei.dempa.net/archives/tag/automated-mobile-robots)
- [Photoneo](https://aei.dempa.net/archives/tag/photoneo)
- [industrial machine vision](https://aei.dempa.net/archives/tag/industrial-machine-vision)
- [MotionCam 3D](https://aei.dempa.net/archives/tag/motioncam-3d)
- [3D camera](https://aei.dempa.net/archives/tag/3d-camera)
- [AIST](https://aei.dempa.net/archives/tag/aist)
- [Taiyo Yuden](https://aei.dempa.net/archives/tag/taiyo-yuden)
- [DX](https://aei.dempa.net/archives/tag/dx)
- [Japan Science Engineering](https://aei.dempa.net/archives/tag/japan-science-engineering)
- [FINETECH](https://aei.dempa.net/archives/tag/finetech)
- [Display](https://aei.dempa.net/archives/tag/display)
- [FPD](https://aei.dempa.net/archives/tag/fpd)
- [electron beam area inspection](https://aei.dempa.net/archives/tag/electron-beam-area-inspection)
- [Politecnico di Bari](https://aei.dempa.net/archives/tag/politecnico-di-bari)
- [AEC-Q100.](https://aei.dempa.net/archives/tag/aec-q100)
- [AI Module](https://aei.dempa.net/archives/tag/ai-module)
- [AR/VR](https://aei.dempa.net/archives/tag/ar-vr)
- [Neural Network](https://aei.dempa.net/archives/tag/neural-network)
- [Showa Denko](https://aei.dempa.net/archives/tag/showa-denko)
- [NXP Semiconductors](https://aei.dempa.net/archives/tag/nxp-semiconductors)
- [QUBIC SiGe](https://aei.dempa.net/archives/tag/qubic-sige)
- [GaN](https://aei.dempa.net/archives/tag/gan)
- [GaAs](https://aei.dempa.net/archives/tag/gaas)
- [RF CMOS](https://aei.dempa.net/archives/tag/rf-cmos)
- [Foxconn Industrial Internet](https://aei.dempa.net/archives/tag/foxconn-industrial-internet)
- [University of Tokyo](https://aei.dempa.net/archives/tag/university-of-tokyo)
- [Amorphous Glass](https://aei.dempa.net/archives/tag/amorphous-glass)
- [microLED](https://aei.dempa.net/archives/tag/microled)
- [bonding](https://aei.dempa.net/archives/tag/bonding)
- [Blue-Laser Processing Machine](https://aei.dempa.net/archives/tag/blue-laser-processing-machine)
- [Fluke Networks](https://aei.dempa.net/archives/tag/fluke-networks)
- [Tester](https://aei.dempa.net/archives/tag/tester)
- [EV Charging System](https://aei.dempa.net/archives/tag/ev-charging-system)
- [IMI](https://aei.dempa.net/archives/tag/imi)
- [electric vehicle](https://aei.dempa.net/archives/tag/electric-vehicle)
- [EV system](https://aei.dempa.net/archives/tag/ev-system)
- [Protection IC](https://aei.dempa.net/archives/tag/protection-ic)
- [Mitsumi Electric](https://aei.dempa.net/archives/tag/mitsumi-electric)
- [Lithium Ion Battery](https://aei.dempa.net/archives/tag/lithium-ion-battery)
- [Semiconductor Test](https://aei.dempa.net/archives/tag/semiconductor-test)
- [Current Collectors](https://aei.dempa.net/archives/tag/current-collectors)
- [Energy Harvesting](https://aei.dempa.net/archives/tag/energy-harvesting)
- [Tripod Design](https://aei.dempa.net/archives/tag/tripod-design)
- [Solomon Technology](https://aei.dempa.net/archives/tag/solomon-technology)
- [Cluster Equipment](https://aei.dempa.net/archives/tag/cluster-equipment)
- [Etching Process](https://aei.dempa.net/archives/tag/etching-process)
- [Finetech Japan](https://aei.dempa.net/archives/tag/finetech-japan)
- [Robonity Series](https://aei.dempa.net/archives/tag/robonity-series)
- [Code Reader](https://aei.dempa.net/archives/tag/code-reader)
- [traceability](https://aei.dempa.net/archives/tag/traceability)
- [Canon](https://aei.dempa.net/archives/tag/canon)
- [TM Series Peripheral Robots](https://aei.dempa.net/archives/tag/tm-series-peripheral-robots)
- [Vision Edition-T image](https://aei.dempa.net/archives/tag/vision-edition-t-image)
- [HORIBA](https://aei.dempa.net/archives/tag/horiba)
- [Mass Flow Controllers](https://aei.dempa.net/archives/tag/mass-flow-controllers)
- [Shimadzu](https://aei.dempa.net/archives/tag/shimadzu)
- [Kobe University](https://aei.dempa.net/archives/tag/kobe-university)
- [autonomous laboratory](https://aei.dempa.net/archives/tag/autonomous-laboratory)
- [SMAC](https://aei.dempa.net/archives/tag/smac)
- [Pick and Place Unit](https://aei.dempa.net/archives/tag/pick-and-place-unit)
- [CPU](https://aei.dempa.net/archives/tag/cpu)
- [controller](https://aei.dempa.net/archives/tag/controller)
- [Electronic traders](https://aei.dempa.net/archives/tag/electronic-traders)
- [Electronic Ditributors](https://aei.dempa.net/archives/tag/electronic-ditributors)
- [Digital Compass 2030](https://aei.dempa.net/archives/tag/digital-compass-2030)
- [Made-in-India](https://aei.dempa.net/archives/tag/made-in-india)
- [Xian Fab](https://aei.dempa.net/archives/tag/xian-fab)
- [Softbank](https://aei.dempa.net/archives/tag/softbank)
- [i-RooBO](https://aei.dempa.net/archives/tag/i-roobo)
- [e-F@ctory](https://aei.dempa.net/archives/tag/e-fctory)
- [GENESIS64](https://aei.dempa.net/archives/tag/genesis64)
- [Solidigm](https://aei.dempa.net/archives/tag/solidigm)
- [ETRI](https://aei.dempa.net/archives/tag/etri)
- [LOw-Temperature Photo-resist](https://aei.dempa.net/archives/tag/low-temperature-photo-resist)
- [PDL](https://aei.dempa.net/archives/tag/pdl)
- [Pixel Define Layer](https://aei.dempa.net/archives/tag/pixel-define-layer)
- [T&M](https://aei.dempa.net/archives/tag/tm)
- [Toyo](https://aei.dempa.net/archives/tag/toyo)
- [SKT](https://aei.dempa.net/archives/tag/skt)
- [SapeSapeon X220 AI chip](https://aei.dempa.net/archives/tag/sapesapeon-x220-ai-chip)
- [MEC](https://aei.dempa.net/archives/tag/mec)
- [Mobile Edge Computing](https://aei.dempa.net/archives/tag/mobile-edge-computing)
- [Delta Electronics](https://aei.dempa.net/archives/tag/delta-electronics)
- [Universal Instruments](https://aei.dempa.net/archives/tag/universal-instruments)
- [WOLED](https://aei.dempa.net/archives/tag/woled)
- [Power Semiconductors](https://aei.dempa.net/archives/tag/power-semiconductors)
- [Hitachi Power Semiconductors](https://aei.dempa.net/archives/tag/hitachi-power-semiconductors)
- [Full-SiC Module](https://aei.dempa.net/archives/tag/full-sic-module)
- [SBD](https://aei.dempa.net/archives/tag/sbd)
- [Novel Crystal Technology](https://aei.dempa.net/archives/tag/novel-crystal-technology)
- [CES2022](https://aei.dempa.net/archives/tag/ces2022)
- [SmartThings HubUa](https://aei.dempa.net/archives/tag/smartthings-hubua)
- [Samsung Home Hub](https://aei.dempa.net/archives/tag/samsung-home-hub)
- [OLED EVO](https://aei.dempa.net/archives/tag/oled-evo)
- [Plug & Drive module](https://aei.dempa.net/archives/tag/plug-drive-module)
- [PnD](https://aei.dempa.net/archives/tag/pnd)
- [Mobility of Things](https://aei.dempa.net/archives/tag/mobility-of-things)
- [MetaMobility](https://aei.dempa.net/archives/tag/metamobility)
- [Atlas](https://aei.dempa.net/archives/tag/atlas)
- [Thailand](https://aei.dempa.net/archives/tag/thailand)
- [Hitachi Zosen](https://aei.dempa.net/archives/tag/hitachi-zosen)
- [Films](https://aei.dempa.net/archives/tag/films)
- [Filmtech Japan](https://aei.dempa.net/archives/tag/filmtech-japan)
- [Hyundai Motor Group](https://aei.dempa.net/archives/tag/hyundai-motor-group)
- [Unity](https://aei.dempa.net/archives/tag/unity)
- [Hyundai Motor Group Innovation Center](https://aei.dempa.net/archives/tag/hyundai-motor-group-innovation-center)
- [Meta Factory otry](https://aei.dempa.net/archives/tag/meta-factory-otry)
- [Photonix](https://aei.dempa.net/archives/tag/photonix)
- [Bolite](https://aei.dempa.net/archives/tag/bolite)
- [solder robots](https://aei.dempa.net/archives/tag/solder-robots)
- [SmartRobotics](https://aei.dempa.net/archives/tag/smartrobotics)
- [Eecomid](https://aei.dempa.net/archives/tag/eecomid)
- [Mitsui Chemical](https://aei.dempa.net/archives/tag/mitsui-chemical)
- [Embedding technology](https://aei.dempa.net/archives/tag/embedding-technology)
- [Doosan Robotics](https://aei.dempa.net/archives/tag/doosan-robotics)
- [Dr. Presso](https://aei.dempa.net/archives/tag/dr-presso)
- [Modular Cafe Robots](https://aei.dempa.net/archives/tag/modular-cafe-robots)
- [SmartMotion](https://aei.dempa.net/archives/tag/smartmotion)
- [BalancedGyro](https://aei.dempa.net/archives/tag/balancedgyro)
- [Visual Inspection](https://aei.dempa.net/archives/tag/visual-inspection)
- [JUKI Smart Solutions](https://aei.dempa.net/archives/tag/juki-smart-solutions)
- [Bearing](https://aei.dempa.net/archives/tag/bearing)
- [Lintec Adwill](https://aei.dempa.net/archives/tag/lintec-adwill)
- [Semiconductor Packaging](https://aei.dempa.net/archives/tag/semiconductor-packaging)
- [Tape Solution](https://aei.dempa.net/archives/tag/tape-solution)
- [Invensense](https://aei.dempa.net/archives/tag/invensense)
- [Sensors](https://aei.dempa.net/archives/tag/sensors)
- [ToF Sensors](https://aei.dempa.net/archives/tag/tof-sensors)
- [SmartSonic](https://aei.dempa.net/archives/tag/smartsonic)
- [In-Memory Computing](https://aei.dempa.net/archives/tag/in-memory-computing)
- [AI Neural Networking](https://aei.dempa.net/archives/tag/ai-neural-networking)
- [MRAM](https://aei.dempa.net/archives/tag/mram)
- [Lelon](https://aei.dempa.net/archives/tag/lelon)
- [CJ Logistics](https://aei.dempa.net/archives/tag/cj-logistics)
- [Bollore Logistics](https://aei.dempa.net/archives/tag/bollore-logistics)
- [Ariat](https://aei.dempa.net/archives/tag/ariat)
- [HASCO](https://aei.dempa.net/archives/tag/hasco)
- [Automotive Parts](https://aei.dempa.net/archives/tag/automotive-parts)
- [investments](https://aei.dempa.net/archives/tag/investments)
- [TOWA](https://aei.dempa.net/archives/tag/towa)
- [Molding Equipment](https://aei.dempa.net/archives/tag/molding-equipment)
- [Power Modules](https://aei.dempa.net/archives/tag/power-modules)
- [OmniCore](https://aei.dempa.net/archives/tag/omnicore)
- [Robot Controllers](https://aei.dempa.net/archives/tag/robot-controllers)
- [Cybersecurity](https://aei.dempa.net/archives/tag/cybersecurity)
- [modules](https://aei.dempa.net/archives/tag/modules)
- [KAMP](https://aei.dempa.net/archives/tag/kamp)
- [FANUC](https://aei.dempa.net/archives/tag/fanuc)
- [IonQ](https://aei.dempa.net/archives/tag/ionq)
- [Intel Corp.](https://aei.dempa.net/archives/tag/intel-corp)
- [Ireland Fab](https://aei.dempa.net/archives/tag/ireland-fab)
- [high-functional films](https://aei.dempa.net/archives/tag/high-functional-films)
- [Intel. Pat Gelsinger](https://aei.dempa.net/archives/tag/intel-pat-gelsinger)
- [Ohio Fab](https://aei.dempa.net/archives/tag/ohio-fab)
- [RibbonFETF](https://aei.dempa.net/archives/tag/ribbonfetf)
- [Intel 18A](https://aei.dempa.net/archives/tag/intel-18a)
- [Yandex SDG of Russia](https://aei.dempa.net/archives/tag/yandex-sdg-of-russia)
- [Electronic trading companies](https://aei.dempa.net/archives/tag/electronic-trading-companies)
- [Mitsubishi](https://aei.dempa.net/archives/tag/mitsubishi)
- [Smart Setup Station](https://aei.dempa.net/archives/tag/smart-setup-station)
- [New Energy](https://aei.dempa.net/archives/tag/new-energy)
- [Indonesia](https://aei.dempa.net/archives/tag/indonesia)
- [UMC](https://aei.dempa.net/archives/tag/umc)
- [Epson](https://aei.dempa.net/archives/tag/epson)
- [Transformer](https://aei.dempa.net/archives/tag/transformer)
- [LG U+ Smart Factory Solution](https://aei.dempa.net/archives/tag/lg-u-smart-factory-solution)
- [LG Smart Park home appliance facotry](https://aei.dempa.net/archives/tag/lg-smart-park-home-appliance-facotry)
- [LG Chem](https://aei.dempa.net/archives/tag/lg-chem)
- [Ultium Cells](https://aei.dempa.net/archives/tag/ultium-cells)
- [GM](https://aei.dempa.net/archives/tag/gm)
- [Micromachine Center](https://aei.dempa.net/archives/tag/micromachine-center)
- [CyberOptics](https://aei.dempa.net/archives/tag/cyberoptics)
- [SPI](https://aei.dempa.net/archives/tag/spi)
- [Schaeffler](https://aei.dempa.net/archives/tag/schaeffler)
- [Melior Motion](https://aei.dempa.net/archives/tag/melior-motion)
- [Hitachi](https://aei.dempa.net/archives/tag/hitachi)
- [Keysight Technologies](https://aei.dempa.net/archives/tag/keysight-technologies)
- [Test Automation](https://aei.dempa.net/archives/tag/test-automation)
- [Test and Measurement](https://aei.dempa.net/archives/tag/test-and-measurement)
- [Taping Machine](https://aei.dempa.net/archives/tag/taping-machine)
- [Automated Optical Inspection](https://aei.dempa.net/archives/tag/automated-optical-inspection)
- [Nippon Sanso Taiwan](https://aei.dempa.net/archives/tag/nippon-sanso-taiwan)
- [Stäubli](https://aei.dempa.net/archives/tag/staubli)
- [uniVAL pi software solution](https://aei.dempa.net/archives/tag/unival-pi-software-solution)
- [Fujitsu](https://aei.dempa.net/archives/tag/fujitsu)
- [Simcenter 3D](https://aei.dempa.net/archives/tag/simcenter-3d)
- [GSMA](https://aei.dempa.net/archives/tag/gsma)
- [5G-ACIA](https://aei.dempa.net/archives/tag/5g-acia)
- [industrial 5G](https://aei.dempa.net/archives/tag/industrial-5g)
- [ExxonMobil](https://aei.dempa.net/archives/tag/exxonmobil)
- [open process automation](https://aei.dempa.net/archives/tag/open-process-automation)
- [1-Stop Smart Solution](https://aei.dempa.net/archives/tag/1-stop-smart-solution)
- [Ansys 2022 R1](https://aei.dempa.net/archives/tag/ansys-2022-r1)
- [ASM Assembly Systems](https://aei.dempa.net/archives/tag/asm-assembly-systems)
- [ASM Material Tower](https://aei.dempa.net/archives/tag/asm-material-tower)
- [Storage System](https://aei.dempa.net/archives/tag/storage-system)
- [inspection system](https://aei.dempa.net/archives/tag/inspection-system)
- [NXTR Mounting Platform](https://aei.dempa.net/archives/tag/nxtr-mounting-platform)
- [Remote Machine Support](https://aei.dempa.net/archives/tag/remote-machine-support)
- [Handotai Netsu](https://aei.dempa.net/archives/tag/handotai-netsu)
- [chip bonding](https://aei.dempa.net/archives/tag/chip-bonding)
- [DuPont](https://aei.dempa.net/archives/tag/dupont)
- [polyimide film](https://aei.dempa.net/archives/tag/polyimide-film)
- [flexible circuit materials](https://aei.dempa.net/archives/tag/flexible-circuit-materials)
- [Hyundai Movex](https://aei.dempa.net/archives/tag/hyundai-movex)
- [Robostar](https://aei.dempa.net/archives/tag/robostar)
- [RS Automation](https://aei.dempa.net/archives/tag/rs-automation)
- [THiRA-UTECH](https://aei.dempa.net/archives/tag/thira-utech)
- [Altium](https://aei.dempa.net/archives/tag/altium)
- [Macrofab](https://aei.dempa.net/archives/tag/macrofab)
- [EDA](https://aei.dempa.net/archives/tag/eda)
- [Altimade](https://aei.dempa.net/archives/tag/altimade)
- [application](https://aei.dempa.net/archives/tag/application)
- [IFS](https://aei.dempa.net/archives/tag/ifs)
- [Intel Foundry Services](https://aei.dempa.net/archives/tag/intel-foundry-services)
- [Instruction Set Architecture](https://aei.dempa.net/archives/tag/instruction-set-architecture)
- [ISA](https://aei.dempa.net/archives/tag/isa)
- [RISC-V](https://aei.dempa.net/archives/tag/risc-v)