DEMPA AEI 2019
August 2019
Asia Electronics Industry
August 2019 Volume 24, Serial No. 275
ASIA ELECTRONICS INDUSTRY (ISSN 1342-422X) is published monthly by Dempa Publications, Inc., 1-11-15 Higashi Gotanda, Shinagawa-ku, Tokyo 141-8715, Japan Tel: +81-3-3445-6111 Fax: +81-3-3445-6890. Editorial e-mail: may@dempa.co.jp;
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Cover | Story
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UJI CORPORATION is a leading company of electronic component mounters and machine tools. Starting with the announcement of the BA automated electronic component insertion machine in 1978, and continuing with the release of the high-speed modular mounter NXT in 2003, FUJI has lead the innovation of electronic component mounting technology. Following the change of the company name from FUJI MACHINE MFG. CO., LTD. to FUJI CORPORATION in April last year, Shinsuke Suhara took office as President, Chief Operating Officer and Chief Technology Officer, and General Manager of the Robotic Solutions Business in June this year. Under the new management system, FUJI will continue the development of next-generation products that lead digital innovation, and is targeting to become the number one brand in the industry.

Suhara engaged in technological development for many years as an engineer, and led the development of the NXT, FUJI’s flagship model, which revolutionized the electronic components mounting technology by adopting a truly modular construction. In 2010, Suhara became a director, and since then, he has held several executive positions as a board member, and assumed the role of President in June.

AEI News
Yokogawa Reinforces IIoT Ability, Takes Stake in Finnish Company
JAPAN and FINLAND – Yokogawa Electric Corporation has struck an agreement to acquire 35.2 percent stake at the Finnish-headquartered Sensire Ltd. for €6 million. This aims to strengthen both companies’ foray into industrial internet of things (IIoT).

Through this initiative, the two companies aim to develop and provide new services that combine Yokogawa’s IIoT architecture; subscription-based IIoT services being developed by its subsidiary, amnimo Inc.; and Sensire’s cold chain temperature monitoring solutions.

Sensire offers a full range of specialized temperature monitoring solutions mainly for the cold chain. Sensire’s compact and power-efficient temperature sensors collect and transmit temperature data to the cloud for access from personal computers and mobile devices.

Yokogawa is developing a cloud-based IIoT architecture in collaboration with Microsoft Corporation, and aims to provide solutions for the remote monitoring of physical quantities.

www.yokogawa.com; www.sensire.com; www.amnimo.com

In View | This Month
Innovations in Automotive, Data Centers Amplify M&As
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ergers and acquisitions (M&As) among semiconductor manufacturers have been growing in recent years. In the semiconductor industry, M&A activities have slowed down after large-scale M&As were made in 2015 and 2016.

In 2019, despite the sluggish market conditions, the industry had six major M&As in the first half. In the logic field, acquisitions of emerging companies that aim to strengthen data center business have been gaining ground as demand for data centers is expected to expand with the growth of artificial intelligence (AI) and and deployment of fifth-generation (5G) mobile communication networks.

NEPCON ASIA
Advances in Digital Manufacturing Take Spotlight
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EPCON Asia will bring together the latest advances in electronics manufacturing across the region as it holds the annual event at the Shenzhen Convention and Exhibition Center from August 28 to 30. The refurbished exhibition, which is used to be known NEPCON South China, will feature six co-located exhibitions that will serve as a channel to the entire supply chain of the electronics manufacturing industry and will revolve around the up-and-coming fifth-generation (5G) mobile standard.

Spanning about 60,000sq.m, NEPCON Asia is expected to become the largest exhibition under the NEPCON series. A total of 800 exhibitors and brands from 38 countries and regions, together with 60,000 buyers, are expected to take part.

NEPCON ASIA
FUJI’s Smart Solutions Provide Optimized SMT Processes
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or performing high-mix and on-demand production, production facilities with surface-mount technology (SMT) production lines are likely facing pressure to configure productive lines that are optimized with autonomy and are flexible enough to respond to manufacturing systems and changes in manufacturing. In order to meet this demand, FUJI Corporation is putting forward "Fuji Smart Factory" (Fig. 1), an innovative manufacturing process concept in which full-scale preparation of production is simulated virtually to ensure reliable outcomes in which real production is performed as planned.

FUJI
NXTR Electronic Component Mounter

1. Zero placement defects
Stable, high-quality placement can be maintained using a newly developed sensing technology to monitor the status of the machine in real time, and control the stress on parts and panels at the same time.

2. Zero machine operators
The newly developed Smart Loader completely automates part supply and changeover for next production according to the production schedule. This prevents short stops from part supply errors and similar issues that are caused by delays and mistakes during supply work.

3. Zero machine stops
NXTR continues the complete modularity concept employed by NXT. Heads and other units can be exchanged without tools, making it possible to perform maintenance offline. Predictive maintenance is made possible through self-diagnosis, preventing sudden machine stops from affecting the production plan.

NEPCON ASIA
Solutions Give Emphasis on Highly Reliable, Higher Quality Parts
Koji Takahashi, Managing Director & Chief Technology Officer, Tokyo Weld Co., Ltd.
Koji Takahashi, Managing Director & Chief Technology Officer, Tokyo Weld Co., Ltd.
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ontinuing the business pitch it did in 2018, Tokyo Weld Co., Ltd. has marked 2019 as another year to meet the growing need for electronic components with lower profile, to meet demands such as those for smartphone applications, and higher quality and reliability, which are being demanded on the other hand in the automotive industry. In a recent interview with AEI, Koji Takahashi, Managing Director and Chief Technology Officer at Tokyo Weld, improvements and enhancements have been introduced in the company’s growing portfolio of machines to meet the needs of the industry.

NEPCON Asia
Japan Unix
SLS: Smart Laser Soldering
Smart Laser Soldering
With the patented laser soldering system by Japan Unix Co., Ltd., manufacturers can perform advanced soldering, while decreasing consumables and waste. The optical system of non-contact soldering avoids icicle formation, prevents impurities from mixing with the solder, and enhances control of solder volumes and of fine soldering work. Its fiber-coupling laser diode offers a 30/45/75W output. Integrated vision system and pyrometer ensures the highest possible quality and productivity of manufacturers’ production.
UNIX-DF304S Desktop Soldering Robot
UNIX-DF304S Desktop Soldering Robot
Japan Unix has newly released the UNIX-DF Series, thus bolstering the lineup of soldering robots.

The company has strengthened the network function of the soldering robot setting its sights to connecting to Industry 4.0 system in the future. Through connection with a computer network in plants, it enables real-time monitoring of operation status, including temperature and error conditions, using exclusive monitoring software. Thus, the UNIX-DF304S enables data management to prevent faults, such as in temperature characteristics, movements and errors.

NEPCON ASIA
Advanced Platform Supports Smart Manufacturing Processes
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echnological innovations such as artificial intelligence (AI) and robotic technologies are expected to dramatically change the entire society, especially with the advent of fifth-generation (5G) mobile standard along with autonomous driving, e-commerce, the use of drones in unmanned services, among many others. In manufacturing fields, improvements in advanced production processes have been gaining traction in order to achieve stable quality, variable-mix, variable-volume production, improved productivity through automation, accurate demand forecast, and flexible management of delivery date.

These changes have prompted JUKI Corporation to expand solutions to achieve automation, labor savings, and higher efficiency at each process of the surface mount technology (SMT) line. In line with this, the company is proposing automated warehouses for electronic components that are linked with the SMT process, and insertion machines that automate manual insertion of components, in addition to chip mounters with high general versatility, and high-speed, high-precision inspection machines.

NEPCON ASIA
JUKI Smart Solutions – Leaders in Manufacturing Innovations
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arrying the theme “JUKI Smart Solutions – Leaders in Manufacturing Innovations”, JUKI Corporation will showcase at NEPCON ASIA 2019 innovative and cutting-edge solutions that lead customers’ factories into smart factories using advanced technologies, including robots, internet of things (IoT), and machine-to-machine technologies.

JUKI's latest line solution
JUKI’s latest line solution
Smart Implementation for SMT Process
Storage & SMT system solution
JUKI will propose automation, efficiency enhancement, and labor savings by linking the SMT line and storage management system. Specifically, the company will introduce smartification through the linkage between the SMT process and the components management process, including the automation of operation from the ISM Series automated warehouse to the SMT process; delivery instruction while stocks are predicted to run out; automated storage and delivery; operator support through visualization of the delivery condition; prevention of picking wrong parts; and reduction of setup time.
SIEMENS Adopts HIROSE’s IEC-Compliant Connector
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IROSE ELECTRIC CO., LTD.’s IEC standard-compliant compact ix Industrial (IX) connectors have been installed in the encoder connection part of the SINAMICS S210 servo drive system developed by SIEMENS AG.

The IX connector, which is compliant to IEC standard (IEC 61076-3-124), is a compact interface connector designed for industrial applications. It offers an overwhelming compact size compared to conventional connector solutions for the same application. The receptacles allow for a parallel 10mm pitch mounting in compact units, thus contributing to size reduction of equipment. The connectors adopt HIROSE’s unique shell design, which is strong against shock and vibration, and offer 5,000 mating cycles to ensure excellent durability.

As the efficiency of factories utilizing Industry 4.0 has been increasing, IX’s ability to be easily assembled with a small number of parts has been highly evaluated and selected for the SINAMICS S210 servo drive system by SIEMENS.

NEPCON ASIA
One-Stop Solution Leads to Smarter Manufacturing Processes
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key to implementing smart manufacturing in electronic components assembly plants is machine-to-machine (M2M) links between equipment that constitute assembly lines. Yamaha Motor Co., Ltd. already has an extensive track record in the development of M2M links, allowing a wide range of M2M links not only between its own equipment but also with those of other firms.

However, in reality, there are various problems or limitations with this kind of set up. For example, manufacturers with varying development concepts or business scale have a significant amount of confidential information that they cannot disclose to one another, and therefore they can exchange only basic information, such as circuit board IDs and bad marks. Also, it is difficult for manufacturers with different resources or business models to develop functions or software in parallel.

NEPCON ASIA
Yamaha Motor
Full-Lineup of One-Stop Solution: Industry First
YST15 Intelligent SMD Storage System
YST15 Intelligent SMD Storage System
YST15 can simultaneously load and unload 33 reels among 1,500 reel components (2,000 as an optional feature) it can handle reel package directly. It automatically reads the ID and prevents human errors when components are loaded. It also deals with tray components and supports humidity control as a standard function. Furthermore, unified management of up to 99 units is possible.

In cooperation with the “Intelligent Factory”, required components to be mounted are automatically delivered in bulk at optimal timing. In addition, it supports “batch supply” using the Yamaha auto loading feeder, which can preset the next components reel during operation, and it also supports automatic conveyance of parts using the automated guided vehicle (AGV). In this way, it reduces the work load and prevents production interruption caused by delayed supply.

NEPCON ASIA
Panasonic Addresses Miniaturization of Components
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n recent years, advanced products emerge amid internet of things (IoT), electric vehicles (EVs), and the fifth-generation (5G) mobile communication system, and these varieties of products have been dramatically changing lifestyles, mobility, and social infrastructure.

Nowadays, sensors and communication modules are incorporated in almost all things, enabling mutual communication between devices. Printed circuit boards (PCBs) become smaller and dispersed, while components continue to track downsizing trends. In the packaging of micro components, the importance of printing, mounting, and bonding processes increases. In order to implement each process, the selection of optimum equipment and materials is required. This article introduces Panasonic Corporation’s efforts to respond to the downsizing of chips.

Special | Report
Next-Generation Cockpit Technologies
Electronic Circuit Boards Technologies Deal With Heat
Present printed circuit board technologies focus on dealing with heat control, high heat resistance and high density properties, and in the future, on flexibility.
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ower circuits related to motor control of automobiles are required to have technologies for high heat-resistance, high heat-release, and handling large current.

Heat-Related Properties

Recently, copper inlay printed circuit boards (PCB), have been drawing attention because their heat-removal characteristics are partially improved using copper pins press-fitted immediately below a heat-generating element. High heat release is realized by bringing copper with high thermal conductivity into direct contact with a heat-generating element. The copper coin diameter is φ3 to φ6mm, and the thickness of corresponding PCBs is about 1 to 2mm.

Special | Report
Next-Generation Cockpit Technologies
Automotives Heat up Demand for Capacitors
For this year, capacitor growth will mainly come from automobiles as smartphones and industrial equipment are faced with slowing demand.
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n the backdrop of the growing market of capacitors is the increasing trend toward the adoption of more and more electronic components, including capacitors, to bolster the functionalities of vehicles, such as advanced driver-assistance systems (ADAS). From the viewpoint of environment sustainability and efficient energy use, the popularity of electrified vehicles (xEVs) contributes to the expansion of capacitors for powertrain systems. However, the growth of capacitors for smartphones has been sluggish, and the demand for capacitors for industrial equipment and energy systems has also slowed down, which was affected by inventory adjustments and the postponement of procurement since last fall in the wake of excess investments in plants and equipment. For the time being, capacitors for automotive application will drive the expansion of capacitor production.

TECH | FOCUS
Study Fuses New Components, Yields Next-Generation Memory
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erroelectric field effect transistor (FeFET) is a promising memory device because of its low-power, high-speed and high-capacity features. Toward three-dimensional (3D) integration for higher capacity, a team of researchers has developed a ferroelectric-hafnium dioxide (Fe-HfO2)-based FeFET with 8nm-thick indium gallium zinc oxide (IGZO) channel instead of polysilicon channel.

They achieved nearly ideal subthreshold swing (SS) of 60mV/dec and higher mobility than polysilicon channel, thanks to the material property of IGZO and junctionless transistor operation. The obtained results will contribute to ultralow power devices for IoT applications.

Gains More Attention
As part of the Precursory Research for Embryonic Science and Technology (PRESTO) program of the Japan Science and Technology Agency (JST), associate professor Masaharu Kobayashi, Institute of Industrial Science, the University of Tokyo, has developed FeFET with Fe-HfO2 and ultrathin IGZO channel. Nearly ideal SS and mobility higher than polysilicon channel have been demonstrated.

Component | Materials
Polyimide Material Suits High-Frequency Electronic Components
Designed for 5G and mmWave radar communications parts, the new material highlights polyimide’s typical properties and low dielectric loss.
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oray Industries, Inc. has developed a polyimide material suitable for electronic components used in 5G communications and for millimeter-wave (mmWave) radar. 5G is an increasingly popular high-speed, stable communications technology capable of handling large data volumes, and millimeter-wave radar is employed in automated driving and other technologies.

The new Toray material has the heat resistance, mechanical characteristics, and adhesive properties typical of polyimides, coupled with the low-dielectric-loss performance that is essential for high-speed communications. It is expected to make a significant contribution to the performance of high-frequency parts in electronic components in these fields.

Component | Materials
New Mechanism to Lower Energy Requirement for OLED Displays
The group has manipulated the triplet excitons to work with a lower voltage to develop this new method.
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method to significantly reduce the amount of energy required by organic light emitting diodes (OLEDs) has been discovered by scientists from RIKEN and the University of California San Diego, in collaboration with international partners. OLEDs have been identified as potential replacements for liquid crystal diodes because of features like flexibility, thinness, and does not require backlight.

The group achieved this by developing a new way to manipulate the excitons—pairs of electrons and holes—that are key to the transport of electrons within OLEDs. Essentially, current passing through the device creates such pairs, and when they change to a lower energy level, and emit visible light in the process. Normally, the excitons in OLEDs arise in two patterns, with the spins being either the same or opposite, and the ones with same spins—known technically as triplet excitons—are three times more common. However, the singlets, which are created along with the triplets, require more energy, and though they can be converted into triplets it still means that the device as a whole requires the energy to create them in the first place.

Component | Materials
Gate-Insulating Film Process Lowers Resistance in SiC-MOSFETs
This technology, if applied, can reduce power consumption and CO2 emissions in future power semiconductor devices.
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oshiba Corporation has developed an advanced gate-insulating film process technology for SiC-MOSFETs, widely seen as the core technology for next-generation semiconductor power device that cuts resistance in the channel region. When applied to actual vertical devices, the technology reduces resistance by approximately 40 percent against today’s technology, and is expected to lower power loss in power inverters for cars, trains, solar cells, elevators, and devices in many other fields. Such reductions will help reduce both power consumption and CO2 emissions.

Metal-oxide-semiconductor field-effect transistors (MOSFETs) fabricated on silicon carbide (SiC), which has material properties superior to those of conventional silicon (Si), are already used in power inverters for cars, rolling stock, solar cells, elevators, and other applications that require high efficiency, and compact, light packages. However, today’s SiC-MOSFETs have high resistance in the channel region, the part of the circuit through which electricity flows. This has created an obstacle to reduce power loss during use, and the semiconductor industry has long recognized the need for new semiconductor process technologies to lower the resistance.

SMTs | IN REVIEW
JRA, SEMI Promote M2M Communication Standard
The two organizations advocate JARAS1014 M2M standard, which facilitates communication among tools of various makes.
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he Japan Robot Association (JARA) has been promoting activities to disseminate JARAS1014 machine-to-machine (M2M) communication standard for surface-mount technology (SMT) lines, in partnership with Semiconductor Equipment and Materials International (SEMI). As part of the effort, JARA set up a booth for special exhibition at JISSO PROTEC 2019 held in June in Tokyo.

Communication Beyond Boundaries
Mounter manufacturers have been focusing efforts on the proposal of smart factory, which achieves significant improvement in productivity, by introducing an integrated production system, and connecting the production line and manufacturing machines in the entire factory to a network. In this system, internet of things (IoT) technology is adopted in the SMT line, in which electronic circuit boards are produced.
SMTs | IN REVIEW
FUJI Cultivates New Demand for Atmospheric Pressure Plasma Unit
The company is also looking into beefing up sales in the international markets as demand continuous to grow.
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UJI Corporation is working on cultivating new demand for Tough Plasma, an atmospheric pressure plasma unit that improves the strength of adhesive bonding, coating, among others. The company is also strengthening sales in international markets, mainly in China.

The manufacturing device Tough Plasma uses properties of electrically neutral radicals contained in plasma to modify metal and other surfaces for improvement of the strength of adhesive bonding. Bonding strength equivalent to that of the conventional plasma processing called flame processing, or converting oxygen in air into plasma by burning mixed gas of combustion gas and air, is achieved.

SMTs | IN REVIEW
SMT-Related Companies Release MID-Compatible Machines
MID has attracted attention for its ability to mount on curved surface parts, which cannot be handled by conventional mounters.
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ore mounting companies are showing interest in mounting of molded interconnect device (MID).

In MID, resin is molded into a three-dimensional object using an injection molding machine, and an electronic circuit pattern is printed on its surface by plating. MID is a type of composite components on which electronic components and module components are mounted and soldered.

Conventionally, the manufacture of a three-dimensional casing composed of planar boards requires a process of connecting several mounting boards by wiring and bonding them to the casing. The use of MID enables mounting of curved surface parts, which cannot be achieved with conventional planar boards, and allows mounting of various parts on three-dimensional molded objects. As a result, restrictions on the mounting place are significantly reduced.

SMTs | IN REVIEW
Full-Digital Welding Robot Integrates Power Source
Panasonic’s welding robot is equipped with a 450A power source as standard feature.
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anasonic Smart Factory Solutions Co., Ltd. has released Super Active TAWERS HP full-digital welding robot with an integrated welding power source. It is equipped standard with a 450A welding power source and has achieved high-current welding. The company eyes monthly production of 40 units.

Low Spatter, Fast Welding
It is a high-current Super Active TAWERS full-digital welding robot with an integrated welding source. It reduces spatters by controlling wire feeding with high precision.

It uses soft steel wires with a diameter of 1.2mm and 1.4mm, and can be used with the TM, TL, and TS Series robots. The Super Active TAWERS HP comes in two types: the high-speed welding type for thin plates and the low spatter welding type for medium-thickness plates.

IN THE KNOW | Manufacturing & Mounting Technologies
Mass Production Changes Course of Mounting Technologies
The popularity of smartphones has become a turning point for the transition to higher-speed, higher-density mounting technologies. Today, with the adoption of smart factory, more changes are expected to occur.
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ith the advent of the 1990s, new digital devices, such as audio-video (A/V) and communication devices, appeared on the market. This prompted the start of mounting technology evolution. More notably, the emergence of cellular phones and the spread of mobile devices, which have evolved into smartphones and tablets, have revolutionized the surface-mount technology (SMT) industry.

Beginning 2008, there has been an increasing demand for higher-speed and higher-density mounting technology, which enables volume production of devices. With the increasing adoption of high-speed mounting machines for the mass production of smartphones and tablet PCs, high-speed machine models that can mount 33 components per second have also appeared. Over the years, as faster mounting speed becomes standard, several factors in mounting technologies were also given weight, like increase in the number of heads and of nozzles, reduction of weight of the head, use of a linear motor in an XY robot and a motor drive feeder, and improvement in the speed of recognizing and processing boards and components.

Technology | Highlight
New Process Yields Low-Temperature Diamond, Silicon Bonding
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ational Institute of Advanced Industrial Science and Technology (AIST) has used heat treatment at relatively low temperature (about 200°C) in the development of a technology to directly bond a chemical-surface-treated diamond substrate with a silicon (Si) substrate, brought into contact in the air (See Fig. 1).

In recent years, research and development activities to realize high-performance semiconductor devices using diamond have been active. In this latest development, the surface reaction of a diamond substrate and a Si substrate is used. Direct bonding is made possible by contact in the air and heating at about 200°C. Almost no disorder is induced in the diamond crystal even after the process. Processes at high temperatures (above 1,000°C) or in ultrahigh vacuum are not required like in the conventional technology. High-quality diamond semiconductors are expected to be produced using this easy process.

Technology | Highlight
Simulation Model Predicts Energy Loss, Noise of Power Devices
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oshiba Electronic Devices & Storage Corporation has developed a compact model for highly accurate simulation and prediction of power loss and noise from electromagnetic interference (EMI) in insulated-gate bipolar transistors (IGBT) and injection enhanced gate transistors (IEGT). The proposed model reproduces measured turn-On and turn-Off switching waveform more accurately that today’s approach, and reduces error rate by over 95 percent while cutting simulation time to less than one-thirtieth.

Maximizing Power Devices
Power devices are essential components of inverter and converter circuits. IGBT and IEGT, which integrate MOS-gate control with bipolar conductivity modulation, are particularly important in high power applications, where they realize high input impedance and low on-resistance. Growth of the electric vehicle and renewable energy markets continues to drive forward demand for IGBT and IEGT.

PRODUCT | HIGHLIGHT
Innodisk Logo
PRODUCT | HIGHLIGHT
Innodisk Logo
iCAP Tackles Main Challenges of Large-Scale IoT Deployment
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nnodisk Corporation’s reliance on technological solutions has spurred an enormous growth of internet of things (IoT) devices. Coupled with artificial intelligence (AI), this trend sees human labor gradually being replaced by cheaper and faster machines. The main challenges facing the company includes 1) IoT spreading to new and more remote areas; 2) fewer operators per device making efficient maintenance harder to implement; and 3) managing the finite lifespan of certain components.

Geographical Spread and Maintenance
The new IoT devices are often located in hard-to-reach places, facing new and difficult challenges. Part of the solution is rugged components, such as Innodisk’s industrial-grade 32GB DRAM Series and 3D NAND Flash. However, these components still require monitoring to ensure that maintenance sessions that are few and far between can be planned accordingly to avoid system crashes.

PRODUCT | HIGHLIGHT
MEMS Ultrasonic ToF Sensors Offer Millimeter-Range Noise Precision
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DK Corporation has ramped up mass production of Chirp CH-101 microelectromechanical system (MEMS)-based ultrasonic Time-of-Flight (ToF) sensor, which uses a tiny ultrasonic transducer chip to send out a pulse of ultrasound and then listen for echoes returning from targets in the sensor’s field-of-view. By calculating the ToF, the sensor can determine the location of an object relative to a device and trigger a programmed behavior.

TDK’s MEMS ultrasonic technology leverages a proprietary ToF sensor in a 3.5×3.5mm package that combines a MEMS ultrasonic transducer with a power-efficient digital signal processor (DSP) on a custom low-power mixed-signal CMOS ASIC. The sensor handles a variety of ultrasonic signal-processing functions, enabling customers flexible industrial design options for a broad range of use-case scenarios, including range-finding, presence/proximity sensing, object-detection/avoidance, and position-tracking. It can detect 1mm range of noise of up to 1m distance.

PRODUCT | HIGHLIGHT
Power Supply IC With BIST Supports Automotive Safety
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OHM Co., Ltd. has made available BD39040MUF-C power supply monitoring IC with Built-In Self Test (BIST). This IC is ideal for automotive application power supply systems requiring fail-safe measures such as electric power steering as well as sensors and cameras for autonomous driving and advanced driver-assistance systems (ADAS).

Rapid advancements in ADAS and automated driving in the automotive sector have spurred demand for functions such as collision prevention and lane assist that reduce the risk of accidents. Accordingly, product development for mounted semiconductors has to take into account how to ensure functional safety (failsafe) in the event of failure considering self-diagnostic and other functions.

SHOW | Report
SID | 2019 (Part 2)
Japanese Display Makers Lead in Technology Shake up
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isplay Week 2019 was held at the San Jose McEnery Convention Center in San Jose, California in the United States from May 12 to 17. Highlights from the exhibition were presented in Part 1 of the article. This second part focuses on the symposia and the presentations that are worth highlighting.

Symposium Outline
This year’s symposium consisted of 81 sessions, which included 322 oral presentations (including 68 invited lectures), and 209 posters. In 2019, the program committee received nearly 730 papers, which was the largest number of papers submitted to Display Week over the past 10 years.

Industry | Report
Advanced Parts to Suit up Next-Generation Robots

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lectronic component and material manufacturers are bringing out new products for robots one after another. Robots, along with in-car equipment, hold immense market potentials and are expected to grow significantly compared with other industrial equipment. Manufacturers have been responding to the market need of improved robotic performance with the release of new products that have been developed based on novel technologies.

Research institutes expect the global industrial robot market will exceed ¥3 trillion in 2025. The market for advanced robotics, or the next generation robots that operate autonomously in the manufacturing floor, is expected to expand 3.1 times in the production and 1.8 times in logistic processes in 2021 compared to 2018.

The industry is expected to flourish as the development of robots and related products is expected to accelerate further.

zoomin
FA, Equipment Makers Tap New Prospects in Pharma
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eading factory automation (FA) and measuring equipment manufacturers took part at Interphex Japan 2019, which showcased wide range of manufacturing equipment for pharmaceutical products and related services. The growing need to further intensify quality control systems in the manufacture of pharmaceutical products paved way for the use of advanced technologies such as robots and internet of things (IoT), creating new business opportunities in the field of pharmaceutical production.

Exhibitors highlighted the theme of driving labor-saving measures for the pharmaceutical production industry at the 21st edition of Interphex Japan.

Business | Strategy
Efficient FA Solutions Increase Manufacturers Profit Margin
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everaging on its own strength for providing a one-stop solution in surface mount technology (SMT) lines from mounters, printers to inspection systems, Yamaha Motor Co., Ltd. proposes solutions that lead to improved profitability of customers. At the recent JISSO PROTEC 2019 held in Tokyo, Japan, the company introduced various software solutions that realize smart factory, in addition to new products, to support customers to optimize their factories.

In the said trade event, Yamaha Motor carried the theme “UP! Your Business” and promoted outstanding machine performance and advantages of installing the machines. The company proposed diverse solutions that improve customers’ profitability, including improved productivity and reduced running costs.

Company | On the move
Under New Brand Name, Shinano Kenshi Takes Aim at Global Market
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n a bid to make its name known globally, Japan-based Shinano Kenshi Co., Ltd., a leading manufacturer of precision motors, has launched ASPINA as a unified corporate brand to disseminate its products to the global markets. Through this move, the company aims to enhance its recognition in the global market and provide an impetus to cultivate demand in growing fields, such as robots, medical equipment, and welfare equipment.

Shinano Kenshi celebrated its 100th founding anniversary in March last year, and used the occassion as a launch pad to the next 100 years with the creation of its first unified brand. The company name remains unchanged.

Cognitive Systems’ WiFi Motion Technology Disrupts Home Security Market
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he global he combination of Wi-Fi motion detection technology and statistical artificial intelligence (AI) is opening up new, affordable market opportunities for smart home monitoring, home security, and elderly wellness care services.

Bruce Annis, Sales Director with Cognitive Systems Corp. of Canada, said, “We are working with router and access point (AP) vendors as well as telecom service carriers to develop market opportunities using our patented WiFi Motion™ technology.”

Cognitive Systems is a venture start-up established in 2014 by former engineers and executives of BlackBerry Limited.

Cognitive Systems’ WiFi Motion technology is a software IP that combines physics and statistical AI algorithms. The physical part collects and understands information on the state of Wi-Fi signals in each of the channels, accessing the physical layers of Wi-Fi chipsets. The statistical AI algorithms identify patterns of movement to determine whether they are from a human, or pets, or some mechanical equipment like fans.

Etron Puts 3D Depth Map Sensor at Fore of AI Ecosystem Push
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ensors and artificial intelligence (AI) are key technology enablers for internet of things (IoT), autonomous driving, virtual reality (VR)/augmented reality (AR) and drones and robotics ecosystems, as they enable these devices and machines to see, feel, hear, and even understand what are around them.

Etron Technology, Inc. of Taiwan and its subsidiary eYs3D are angling to cash in on the way machines react with humans, working together with a spate of system vendors, like Oculus and Gyrfalcon Technology, Crossbar and Kneron to create a string of novel, compelling applications for its own indigenous 3D depth map sensor and controller technologies.

Camera Sensor Fusion Modules
The 3D depth map sensor and controller technologies now underlie Etron’s sensor fusion module product lineup, including EX8040 and EX8040S, calculating distance between two objects or two cameras to render and show objects in 3D format.

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Taitronics | 2019
AIoT Takes Center Stage at Taiwan’s Electronics Show

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he global electronics industry is moving from simple mass production, technology-oriented development mode to multi-integration of innovative applications and customized manufacturing and services. IT spending, which is projected to reach US$3.8 trillion in 2019 according to Gartner, is moving from saturated segments, such as mobile phones, PCs and on-premises data center infrastructure to cloud services and internet of things (IoT) devices.

Opening of TAITRONICS 2018
Photo 1: Opening of TAITRONICS 2018
Startups Get Solid Support from Taiwan Government
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upporting the success of industry startups, the government of Taiwan through Industrial Technology Research Institute (ITRI) has launched a project “IC Design and Semiconductor Application Program”, which was envisioned to support the development of startups and help them break through the bottlenecks of hardware design and trial production.

Under this program is the IoT Integrated Service Center (IISC), a subsystem of ITRI’s multidisciplinary R&D platform that can introduce all the required technologies, including IC design, hardware manufacturing, and field verification to build an AIoT ecosystem. This will in turn become an important base to assist international small and medium enterprises and startups with commercialization of their ideas.

Product | News
Semiconductors & ICs
Toshiba’s TB67H450FNG Motor Driver IC
Toshiba’s TB67H450FNG Motor Driver IC
Toshiba Electronic Devices & Storage Corporation has added TB67H450FNG brush motor driver IC, featuring a maximum rated voltage of 50V and rated current of 3.5A and can be driven in a wide operating voltage range, in its product lineup. Its power supply range of 4.5 to 44V makes it suitable for mobile devices, 5V USB-driven devices, home electric appliances such as robot cleaners and refrigerators that require large power drive, and office automation (OA) equipment and financial equipment. It also has significantly reduced the stand-by mode current using a new power supply circuit system that automatically shifts from the stop mode to the standby mode and turns Off the VCC regulator for driving the internal circuit. It adopts the HSO98 compact surface-mount pin package, which improves heat dissipation and achieves space saving.
Toshiba Electronic Devices & Storage Corporation
http://toshiba.semicon-storage.com

Maxim’s GMSL SerDes Improves MediaTek’s In-Car Infotainment System
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axim Integrated Products, Inc. has confirmed that select products from its automotive portfolio are being used in MediaTek’s AUTUS in-vehicle infotainment (IVI) platform. Maxim capitalizes on the best-in-class video transmission capability that its gigabit multimedia serial link (GMSL) serializer and deserializer (SerDes) technology provides to deliver the high performance, flexibility and efficiency required by carmakers and tier-1 suppliers. Also, Maxim’s power management solutions improve multimedia performance and efficiency for MediaTek’s platform.

Maxim’s advanced GMSL SerDes technology delivers robust video distribution for surround-view applications needed by MediaTek. One MAX9286 automotive deserializer and four MAX96705 serializers provide synchronized video streams from four cameras via 15m of shielded twisted-pair or coaxial cable.

Thanks for reading our August 2019 issue