DEMPA AEI 2019
July 2019
Asia Electronics Industry
July 2019 Volume 24, Serial No. 274
ASIA ELECTRONICS INDUSTRY (ISSN 1342-422X) is published monthly by Dempa Publications, Inc., 1-11-15 Higashi Gotanda, Shinagawa-ku, Tokyo 141-8715, Japan Tel: +81-3-3445-6111 Fax: +81-3-3445-6890. Editorial e-mail: may@dempa.co.jp; Subscription e-mail: circulationmanila@dempa.co.jp. The magazine is distributed free to qualified subscribers in ASEAN countries (Thailand, Indonesia, The Philippines, Malaysia, Singapore, Brunei, Vietnam, Myanmar, Cambodia and Laos), as well as Korea,Taiwan and Hong Kong.

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Cover | Story
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n its process automation business, Panasonic Corporation has been pushing forward a proposal for the global market of a comprehensive solution, which supports the full process of components mounting factories, by using machine-to-machine (M2M) and internet of things (IoT) technologies.

Hiroyuki Aota, President, Panasonic Smart Factory Solutions Co., Ltd.; Managing Executive Officer, Panasonic Corporation; Senior Vice President, Connected Solutions Company; and Director, Process Automation Business Division, says, “In surface-mount technology (SMT) lines, there are greater needs for improved productivity of the entire mounting line rather than higher specifications for individual machines. Our company has been promoting management to provide values in the whole life cycle from customers’ production process design, installation of equipment, start of production, proposal for process improvement, maintenance, to updating and reuse.”

July 2019 Cover Photo
(From left): Hitoshi Suda, CS 7 Section, CS Dept.; Atsuko Miyagi, Business Promotion Section, Corporate Planning Dept.; and Kei Ohnuma, CS 7 Section, CS Dept. from Panasonic Factory Solutions Sales & Engineering; Hiroyuki Aota, President, Panasonic Smart Factory Solutions Co., Ltd., Managing Executive officer, Panasonic Corporation, Senior Vice President, Connected Solutions Company, and Director Process Automation Division; Akihiro Akiyama, Executive Vice President, Panasonic Smart Factory Solutions Co., Ltd.; Kentaro Miki, CS 3 Section, CS Dept.; Panasonic Factory Solutions Sales & Engineering Japan Co., Ltd., and Susumu Toyoda, Devt Section, Screen Printing Technology Devt Dept., Panasonic Smart Factory Solutions Co, Ltd.
The company has been promoting Connected Factory, which achieves the improvement of productivity and high-quality production by visualizing the manufacturing process using IoT and M2M technologies, on the global markets. Connected factory is based on mounting manufacturing execution system (MES) software, PanaCIM-EE Gen2, which integrally manages the entire production floor, and is combined with iLNB integrated line management system, which is capable of distributed control of each mounting line. Furthermore, it collectively manages materials management and maintenance required on the entire floor, realizing optimum quality, cost and delivery (QCD) balance.
AEI News

Toshiba Memory, Western Digital Invest in New Facility

K1 facility in Kitakami in Japan’s Iwate Prefecture

K1 facility in Kitakami in Japan’s Iwate Prefecture

JAPAN and UNITED STATES – Toshiba Memory Corporation and Western Digital Corp. have agreed to jointly invest in the K1 manufacturing facility, which Toshiba Memory is presently constructing in Kitakami in Japan’s Iwate Prefecture. The two companies’ joint capital investments in equipment will enable initial production output of 96-layer 3D flash memory beginning 2020.

The K1 facility will produce 3D flash memory to support growing demand for storage in applications such as data centers, smartphones and autonomous cars. Construction of the K1 facility is expected to be completed in end of 2019.

Toshiba Memory and Western Digital will continue to cultivate and extend their leadership in their respective memory businesses by actively developing initiatives aimed at strengthening technology competitiveness, advancing joint development of 3D flash memory, and making capital investments according to market trends.

www.toshiba-memory.com; www.westerndigital.com

In View | This Month
Technology Enablers Drive Market Opportunities
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he fusion of artificial intelligence (AI), internet of things (IoT), and 5G communications technology, as well as ultra-high performance sensors is revolutionizing not only the way human interact with machines but how people are doing business, living lives at home and elsewhere, and managing houses, offices and even factories.

The dramatic changes in user interfaces as (UI) user experiences (UX) are creating new market opportunities, promising to pump up new vigor in the years-long idle global IT markets.

For example, a constellation of sensor networks like cameras, light detection and ranging devices (LiDAR), radars, voice- and sound-recognition MEMS microphones are now generating tons of data and feeding them for AI, dramatically changing the way that we are generating and mining data.

The unlimited availability of data across the internet is enabling AI to infer and create infinite source of data patterns on how to do business, live daily lives, manage and operate houses, offices, factories, cities and even cars in intelligent ways.

Special | Report
Next-Generation Cockpit Technologies
ADAS, Autonomous Driving Heighten Role of Vehicle Cockpit
Manufacturers have been accelerating research and development to pursue state-of-the-art automotive cockpit, which is now assuming crucial role in a vehicle’s control system and integrates various automotive control functions.
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anufacturers in the automotive and automotive electronic components industries have been propelling technologies for next-generation cockpits, setting their sights on future vehicles. Automotive cockpits have been undergoing transformation from conventional instrument cluster that displays travel speed and other parameters to a high-performance computer system, which integrally supports autonomous driving, safety driving, eco-driving, and driver monitoring. Automotive-related manufacturers have been accelerating research and development of concept models of innovative next-generation vehicle cockpits targeting advanced cruise control, and improved safety, convenience and comfort of the driver.

Amid the progress in increasing integration of electronic components and higher functionalities of automobiles, automotive cockpit technologies will continue to advance further. With the progress in autonomous driving function and advanced driver-assistance systems (ADAS) technologies, the amount of information handled by a vehicle has been expanding. Needs for improved safety of vehicles and comfort of the driver have also been becoming stronger.

Special | Report
Next-Generation Cockpit Technologies
Electronic Components Revolutionize Automotive Cockpits
Today’s automotive cockpits now carry a plethora of electronic components to enable highly advanced and multiple functions of future car models.
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s automotive cockpits have become increasingly high functional, new electronic components are installed to power these functions. In terms of electronic parts that support next-generation cockpits, electronic components manufacturers have been accelerating technological development for information and communications devices that support the advancement of vehicles as information and communications terminals, travelling control devices, components for the safety system, and functional modules for enhancing the comfort of the driver.

On-Board Communication Modules
The importance of on-board communication modules has been increasing as major devices that support the advancement of autonomous driving and advanced driver-assistance systems (ADAS) and the evolution of automobiles into connected cars.

With vehicle-to-everything (V2X) modules compliant with IEEE802.11p that perform vehicle-to-vehicle (V2V) and vehicle-to-infrastructure (V2I) communications, 760MHz-band modules have been put to practical use for the Japanese market, and the development of 5.9GHz-band modules for the U.S. and European markets has been under way. IEEE802.11p standard features high speed, high reliability, and security. It supports safety driving by enabling direct communications between running vehicles and communications between infrastructure at intersections and vehicles.

Special | Report
Next-Generation Cockpit Technologies
Novel In-Vehicle Trends Innovate Touch Panel Technologies
Touch panel manufacturers have been infusing advanced engineering technologies to develop best-in-class touch panels for applications in the automotive sphere, which have been undergoing rapid development and improvement.
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utomotive touch panels continue to undergo massive technological advancements. Manufacturers have been accelerating technological development of touch panels for next-generation vehicles in order to meet the advancement of vehicle cockpits, the progress of advanced driver-assistance systems (ADAS) and autonomous driving technologies, the spread of connected cars, and the increasing needs for improved operability and driver comfort.

Manufacturers put all their efforts into advanced engineering of automotive touch panels with high added values targeting factory-installed car navigation systems and display audio systems for production in 2020 and beyond.

On-board touch panels are faced with tough requirements in terms of quality and performance. Importance is placed on environment-resistant performance, such as temperature resistance and humidity resistance; optical characteristics, such as high transmittance and low reflectance. Further importance is also placed on vibration-resistant performance, waterproof and dustproof countermeasures, and noise-suppression countermeasures.

Aside from these, other technological requirements include longer life cycle, low power consumption, fingerprint-proof surface, as well as lower operating costs.

Special | Report
Advanced Automotive Electronics
Component Makers to Bask on Prospects of Next-Generation Vehicles
The automotive market is a major driver of electronic components, and with the simultaneous innovations in the mobility field, part makers are hopeful on stable growth.
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lectronic components manufacturers have been stepping up efforts setting their sights on next-generation vehicles. At present, the automobile market is facing an era of major changes that is said to occur “once in 100 years.” Various moves, including the advancement of autonomous driving and advanced driver-assistance systems (ADAS), evolution toward connected cars, and shift to electric vehicles (EVs) have been simultaneously progressing. Recognizing these technological innovations as business opportunities, electronic components manufacturers respond to future needs of automobiles, targeting to achieve stable growth of their automotive electronic components business in the medium to long term.

Special | Report
Advanced Automotive Electronics
Car Ecosystem Gathers Momentum to Achieve Autonomous Car
As more technologies become available to enable varying levels of driving autonomy, the entire automotive ecosystem are stepping up technological advancements to realize commercial production starting 2020.
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arious technological developments across the automotive ecosystem have been gathering momentum, all aiming to contribute to the realize autonomous vehicles. Car original equipment manufacturers (OEMs) in Japan, United States, and other countries in Europe are eyeing commercial production of Level 3 autonomous cars around 2020 or 2021 and research and development (R&D) personnel of various companies have been working double time.

Meanwhile, the fifth-generation (5G) mobile communications standard, the commercial deployment of which is expected from 2020 onwards, will play a crucial role in realizing autonomous cars.

Setting their sights on these moves, electronic components manufacturers go in full swing developing sensors and communications devices, imaging devices, and control components that are element technologies to support the progress of autonomous driving.

Special | Report
Electronic Parts for Smartphones
Smartphones Hinge Growth on 5G, New High-End Features
Although shipment growth has been sluggish in recent years, functions and features of smartphones continue to advance to meet new trends, such as 5G. Parts makers see this as a tailwind and are advancing technical strengths to meet the requirements of next-generation smartphones.
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anufacturers have been strengthening technology development and advancement of electronic components to meet the demand for next-generation smartphones, which are evolving to further integrate higher functionalities. Because of this, there have been an increasing need for highly sophisticated components that will be integrated in future smartphones.

Foldable and bendable displays have been the prevalent trends among recently introduced smartphones. Meanwhile, devices that are capable of the latest fifth-generation (5G) mobile standard are expected to take off as several markets have already started early deployment of 5G services.

As innovations continue to hover this important market segment, component manufacturers see the need to constantly expand business and technology to meet the continuing evolution of smartphones.

Special | Report
Electronic Parts for Smartphones
High-Density Components Keep Pace with Innovation
Parts manufacturers have stepped up in reinforcing technical features of electric components and mounting process employed to meet the evolving requirements of smartphones, which continue to advance in terms of technologies and functions.
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n order to mount many functions in a small board area, high-density mounting of circuit components for smartphones has been progressing. For this reason, in circuit components incorporated in smartphones, the percentage of ultrasmall chip components has been increasing further.

Smartphones have been polarized into smaller models and relatively large products. The common trend for both models is the advancement of technologies for high functionalities. For this reason, mounting technology employs high density process, printed wiring boards (PWBs) have become finer, and on the whole, downsizing of chip components that are mounted on PWBs advances.

TECH | FOCUS
Research Paves Way to Accurate Beamforming for 5G
CMOS chips on an 18×163.5mm evaluation board
CMOS chips on an 18×163.5mm evaluation board
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team of more than 20 researchers at Tokyo Institute of Technology (Tokyo Tech) and NEC Corporation has demonstrated a 39GHz transceiver that could be used in the next wave of fifth-generation (5G) wireless equipment including base stations, smartphones, tablets and internet of things (IoT) applications.

Although research groups including the current team have until now largely focused on developing 28GHz systems, 39GHz will be another important frequency band for realizing 5G in many parts of the world.

Better Quality, Cost Effective Scalability
The new transceiver (shown in the Figure) is based on a 64-element (4×16) phased-array design. Its built-in gain phase calibration means that it can improve beamforming accuracy, and thereby reduce undesired radiation and boost signal strength. Fabricated in a standard 65nm complementary metal-oxide-semiconductor (CMOS) process, the transceiver’s low-cost silicon-based components make it ideal for mass production, which is a key consideration for accelerated deployment of 5G technologies.

TECH | FOCUS
Novel Lasing Technique Achieves Organic Laser Diodes
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apanese researchers have demonstrated that a long-elusive kind of laser diode based on organic semiconductors is indeed possible, paving the way for the further expansion of lasers in applications such as biosensing, displays, healthcare, and optical communications.

Long considered a holy grail in the area of light-emitting devices, organic laser diodes use carbon-based organic materials to emit light instead of the inorganic semiconductors, such as gallium arsenide and gallium nitride, used in traditional devices.

The lasers are in many ways similar to organic light-emitting diodes (OLEDs), in which a thin layer of organic molecules emit light when electricity is applied. OLEDs have become a popular choice for smartphone displays because of their high efficiency and vibrant colors, which can easily be changed by designing new organic molecules.

Organic laser diodes produce a much purer light enabling additional applications, but they require currents that are magnitudes higher than those used in OLEDs to achieve the lasing process. These extreme conditions caused previously studied devices to break down well before lasing could be observed.

MOBILITY
JAE’s High-Pin-Count Connector Promotes Airbag Reliability
The role of connectors in vehicle safety features is becoming more crucial. JAE’s latest airbag connectors are designed to be compact and high density to meet the growing safety control systems inside a vehicle.
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n order to improve automotive safety, great importance has been placed on introducing safety features to protect the complete process of a running vehicle. To comply with this trend, airbags are being installed in various areas of vehicles such as on the side, the rear seats, among others.

To improve safety in automotive airbag electronic control units (ECUs), Japan Aviation Electronics Industry, Ltd. (JAE) has developed and introduced the MX67A Series high pin count and miniaturized connector for automotive airbag ECUs.

Compatible with Mulitiple Pins
Safety control systems are shifting from collision safety to preventive safety. The addition of preventive safety system increases the number of contacts required for Supplemental Restraint System (SRS)-ECU connectors in order to process large amounts of data from additional on-board sensors.

At the same time, in addition to new safety features, various other control systems are being installed to improve driving performance and comfort, increasing the number of total installed systems. As a result, each new system must be high-density, compact, and lightweight. Due to this requirement, SRS-ECUs also have limited installation space, hence it is necessary for the connector to be compact while having compatibility with a large number of pins.

MX67A Series automotive connector by JAE
MX67A Series automotive connector by JAE
MOBILITY
ROHM Expands IGBT to Robust Automotive Demands
The AEC-Q101-compliant IGBTs highlight leading-edge low conduction loss to contribute to high efficiency and miniaturization of applications, particularly in electric vehicles.
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OHM Co., Ltd. has added four new automotive-grade 1,200V-rated insulated-gate bipolar transistors (IGBTs), which are ideal for inverters used in electronic compressors and for switching circuits used in positive temperature coefficient (PTC) heaters. The new RGS Series represents ROHM’s large lineup of AEC-Q101-compliant IGBTs in both 1,200V-rated and 650V-rated variants.

This series delivers class-leading low conduction loss that contributes to reducing size and to improving efficiency of applications.

RGS Series AEC-Q101-compliant IGBT
RGS Series AEC-Q101-compliant IGBT
Compact, Highly-Efficient Designs
In recent years, car makers offering electric vehicles have been increasing amid growing environmental concerns and rising fuel costs. Increasing the number of electric vehicles also advances the need for electric compressors often driven with IGBTs. Internal combustion engine vehicles use the heat dissipated from the engines as source to heat the cabin.
MOBILITY
Robust Connectors Lift Vehicle Quality to New Heights
Hirose Electric has developed a durable board-to-board connector suitable for powertrain connection and can withstand the pressure in high vibration environments and high temperature ranges.
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s hybrid cars and electric vehicles (EVs) continue to gain momentum worldwide, there is also a growing need for the motors and inverters used in these eco cars to withstand challenges of heat generation and vibration. Furthermore, vehicles also need to continue operating safely over a longer period of time.

Hirose Electric Co., Ltd. has introduced its latest FX26 Series board-to-board floating connector to meet the requirements of automotive-grade connectors that should not only be tough but also strong enough to withstand high heat and vibration over long period of time.

The company has recently showcased the latest connector series at the recent Automotive Engineering Exposition 2019 in Yokohama, Japan.

FX26 Series floating connector
FX26 Series floating connector
Resolves Contact Failure Causedby Vibration
Hirose Electric understands the market needs for high heat and vibration resistance as among the criteria needed to meet the market demands these days. The company has developed the latest connectors to satisfy in-vehicle quality. A unique floating structure solves the problem of contact failure caused by vibration.
MOBILITY
Tesla Propels Details of Ride-Sharing Service Plan
With the car’s longer driving mileage but minimal maintenance cost, future Tesla car owners can reap healthy profit in the planned Robotaxi ride-sharing service network.
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esla, Inc. has reinforced its Tesla Master Plan to include in the program the planned Tesla Network’s Robotaxi ride-hailing service network in 2020. Tesla Chief Executive Officer Elon Musk disclosed the enormous potentials electric car owners to earn from the ride-sharing service, as well as the longevity of the autonomous ride-sharing Robotaxis.

The Tesla Master Plan includes the deployment of the company’s Robotaxi program from 2020 as soon they meet approval from regulatory bodies.

Tesla car's ECU board
Tesla car’s ECU board
Low Operating Cost
New Tesla vehicles are equipped with autonomous driving chip and these vehicles that can be included in the Robotaxi ride-sharing services and owners can easily manage their electric cars with the use of a smartphone application. The business model will be similar to other ride-sharing app, such as Uber.
MOBILITY
Novel Process Technologies Yield Automotive-Grade MLCCs
Used for noise suppression and snubber applications of power supply circuits in vehicles, Taiyo Yuden’s latest multilayer ceramic capacitors meet stringent reliability test standards.
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aiyo Yuden Co., Ltd. has commercialized nine items of HMK105B7103KVHFE 1005-size multilayer ceramic capacitors (MLCCs) with medium to high rated voltages. The company has achieved about 75 percent downsizing from its existing 1608-size MLCCs by improving materials and process technologies it has nurtured over the years. These products are compliant with AEC-Q200 reliability test standard for automotive passive components.

Taiyo Yuden's 1005-size MLCCs
Taiyo Yuden’s 1005-size MLCCs
High Performance, Reliability
The latest MLCCs are used for noise suppression and snubber applications of power supply circuits in automotive information infrastructure equipment, including vehicle body, infotainment system, base station communication equipment, and servers.
Component | Materials
Ultraheat-Resistant Polyimide Film Targets 5G Smartphones
The new film from Kaneka will be used as a flexible printed circuit board material.
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aneka Corp. has developed PIXEO SR ultraheat-resistant polyimide film, which accommodates high-speed and high-frequency fifth-generation (5G) wireless communication. 5G smartphones to be released this year will adopt PIXEO SR as flexible printed circuit board material.

Kaneka aims to expand sales of the polyimide film as a product, which supports higher functionalities of digital devices, targeting sales of ¥15 billion in 2023.

PIXEO SR ultraheat-resistant polyimide film
PIXEO SR ultraheat-resistant polyimide film
Component | Materials
Nihon Superior Benefits from Higher Demand of Preform Solders
Increasing adoption of preform solders for power modules and home electric appliances have boosted sales.
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ihon Superior Co., Ltd. has been expanding sales of preform solders. Preform solders are designed in various shapes in accordance with the application to enable efficient soldering.

These perform solders use SN100C silver-less, lead-free solder, and accommodate various applications, in terms of size, shape (strip, ribbon, washer), and thickness.

Inquiries for preform solders have increased and sales have been brisk.
PIXEO SR ultraheat-resistant polyimide film
SMTs | IN REVIEW
Mitsubishi Electric Infuses Funding to Realtime Robotics
With the partnership, Mitsubishi Electric can integrate motion planning technology to its industrial robot systems.
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itsubishi Electric Corporation has taken an equity stake in Realtime Robotics, Inc. a U.S. technology startup that develops and commercializes motion-planning technologies. With the funding from Mitsubishi Electric, it is expected to accelerate the development of industrial robot systems offering enhanced safety and performance.

Motion planning is the process of calculating and determining the optimized path that a robot should take to reach a goal without colliding with any obstacle. Realtime Robotics’s motion path planning solution performs the necessary calculations in real time.

Following the investment, Mitsubishi Electric expects to release new industrial robot systems that integrate Realtime Robotics’s motion-planning technologies by 2020. At the same time, Mitsubishi Electric will continue collaborating with other companies as well to further enhance its smart-manufacturing solutions with innovative technologies.

SMTs | IN REVIEW
FUJI to Release High-End Concept Mounter
It is compatible with integrated production system and is equipped with automated components feeding system.
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UJI Corporation is set to release to the market a new concept mounter FUJI Smart Factory Platform NXTR in the spring of 2020.

The concept of NXTR is to free the operator from menial tasks and maintain quality and productivity at high levels amid growing needs for machine-to-machine (M2M) internet of things (IoT) technology to realize high-quality production.

This high-end model is the first to incorporate an automated components feeding system to achieve full automation of the electronic components mounting process.

Promotes Stable, High Quality Printing
FUJI has developed NXTR targeting to achieve three zeros in the surface mounting process: zero mounting defect, zero operator, and zero machine downtime.

Incorporating the newly developed sensing technology, NXTR monitors the mounting state in real time, and simultaneously controls stress to electronic components and printed circuit boards, thereby ensuring stable and high mounting quality.

SMTs | IN REVIEW
Panasonic Releases Top-of-the Line Full Digital Welding Machine
Integrating MTS-CO2 Control and SP-MAG Control technologies, the new machine features ultralow spatter.
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anasonic Smart Factory Solutions Co., Ltd. has released the YD-350VZ1 full-digital CO2/metal active gas (MAG) welding machine as a new lineup of full digital welding machine. It is the top-of-the line model of the V Series full digital welding machine, which was released in Nov. 2014, and features ultralow spatter in CO2/MAG welding.

Featured Functions
The company’s proprietary hybrid electronic reactor developed for the V Series has improved arc stability in a wide current area. This has been achieved through full software control of the waveform of a welding current using multiple electronic reactors.

The MTS-CO2 Control and SP-MAG Control spatter reduction control technologies incorporated for the first time in Panasonic’s TAWERS robot systems with integrated welding power source technology have then been deployed in the YD-350GZ4 full digital welding machine, enabling ultralow spatter in semi-automatic welding.

YD-350VZ1 full digital CO2/MAG welding machine
YD-350VZ1 full digital CO2/MAG welding machine
Test | Measurement
NF Releases Precision Low-Noise DC Voltage Source
The new measuring tool suits the detection of signal from photodiodes.
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rom NF Corporation comes the LP6016-01 precision low-noise direct current (DC) voltage source. As a high-quality bias voltage source and control voltage source of sensors and devices, it fulfills a wide range of needs from evaluations during research and development to shipping tests of products.

When evaluating phase noise, frequency accuracy and frequency stability of crystal oscillators, the stability of the control voltage source affects evaluation results. It is critical to use a precision voltage source for the evaluation of voltage-controlled crystal oscillators (VCXOs), and this is where the strength of LP6016-01 lies.

Test | Measurement
Anritsu Posts Robust Sales of 5G Test Solutions
The company has reaped the fruits of its initial development investments in 5G with the outstanding sales result.
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nritsu Corporation has seen steady expansion of the sales of measuring instruments for fifth-generation (5G) mobile communications networks. In FY2018 ending Mar. 2019, the company posted an increase in earnings performance and a significant increase in profits in consolidated results. The company targets sales of over ¥100 billion in FY2019 ending Mar. 2020 by continuing to step up its competitiveness in 5G.

Surpassing Sales Target
In its consolidated results in FY2018 ending Mar. 2019, Anritsu posted sales of ¥99.7 billion, a year-on-year increase of 16 percent; operating profit of ¥11.2 billion, a year-on-year increase of 129 percent; and profit in the current term of ¥9 billion, a year-on-year increase of 210 percent. In particular, profits increased significantly.
Technology | Highlight
Improved IGBT Pulls Off Low Voltage, High Power Efficiency
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he difficulty of further increasing the power conversion efficiency of silicon-based components in power electronics seems to indicate that researchers are reaching the limits of potential advances to this technology. However, a research group headed by The University of Tokyo recently challenged this view by developing a power switching device that surpassed previous performance limits, illustrating that silicon technology can still be further optimized.

The researchers have developed an improved insulated-gate bipolar transistor (IGBT), which is a type of switch used in power conversion to switch high voltages of around 600 to 6500V.

Achieves Stable Switching at 5V
To design IGBT, the team used a scaling approach. The scaling simulations revealed that downscaling part of an IGBT to a third of its original size could lower its operating voltage from 15V to just 5V and substantially decrease its driving power.

“Our IGBT scaling approach was based on a similar concept used in traditional microelectronics and indicated that an IGBT with an operating voltage of 5V should be feasible,” says Takuya Saraya. “However, we thought that a driving voltage of 5V might be too low to surpass the unexpected noise level and ensure reliable operation.”

Technology | Highlight
Mitsubishi Electric, HERE Team up Yields Driver Alert System
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itsubishi Electric Corporation and HERE Technologies have successfully piloted a system that enables vehicles to automatically warn others about upcoming road hazards with lane-level precision. Towards the end of March, the two companies successfully completed field tests of the technology they called Lane Hazard Warning in California, the United States. This also followed a successful trial in Japan’s Ibaraki Prefecture.

Warns Drivers Ahead
The companies now intend to make the technology available broadly to automakers for them to test in their vehicles. Lane Hazard Warning enables an event detected by a vehicle’s sensors – such as a disabled or slow car, a slippery road, debris or a pothole – to be precisely localized to a specific lane and this information to be transmitted in real-time via the cloud to other vehicles approaching the same area.

“When something unusual happens on the road ahead drivers often have very little time to react and that can put them and their passengers at risk,” said Hiroshi Onishi, Executive Officer and Group President of Automotive Equipment at Mitsubishi Electric. “Together with HERE Technologies, we’ve developed a new system designed to give drivers a few valuable extra seconds or minutes to prepare for a potential danger on the road ahead, such as by switching lanes or simply driving with greater caution.”

Product | Highlight
FDK Boosts Capacity of All-Solid-State SMD Battery
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DK CORPORATION has developed a high-capacity model of a small all-solid-state surface-mount device (SMD) battery. This newly developed product can safely provide electric power to internet of things (IoT) device, wearable device, real-time clock (RTC), and products related with semiconductor, such as static RAM/microcontroller units, as well as industrial equipment and automotive electrical equipment used in harsh environments.

Doubles Energy Density
FDK developed in Dec. 2018 high-voltage small all-solid-state SMD battery that features small size, high energy density, high safety and long life. The company has continued to increase the capacity of this product to accommodate expansion of its range of application.

Switching Relay Helps Extend Cruising Distance of EVs, PHVs
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ujitsu Component Limited has developed the 6.6kW (32A-250VAC) switching automotive relay for electric vehicle and plug-in hybrid vehicle (PHV) on-board chargers. The new FTR-K5 Series relay component, which is one of the first in its class, is a printed circuit board (PCB) relay that meets the 6.6kW capacity requirement as well as automotive relay specifications.

Fujitsu Component has made available already samples of the switching automotive relay and will begin mass production in March 2020.

Features of FTR-K5 Series
To extend the cruising distance of EVs and PHVs, the capacity of the on-board battery must be increased. At present, existing standard 3.3kW chargers need too much time to fully recharge. To resolve this problem, the on-board charger capacity is being increased to 6.6kW. Relays used for the charger must also switch 6.6kW (32A-250VAC).

zoomin
MediaTek Spells Cutting-Edge Solutions in 5G, AI Era
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ediaTek Inc. has put on spotlight its latest innovations in the field of artificial intelligence (AI) and fifth generation (5G) mobile standard at the recent COMPUTEX Taipei 2019. The company highlighted its innovative systems-on-chip (SoC) across multiple platforms such as mobile device, home entertainment, connectivity, and internet of things (IoT) products.

Joe Chen, President at MediaTek said the company puts premium dedication to innovate as it positions AI and 5G as key market driving forces in the future that would lead next-generation advancements in mobile technologies and advanced multimedia solutions and products.

Groundbreaking 5G SoC
At COMPUTEX Taipei 2019, Chen revealed MediaTek’s full 5G readiness as it introduced 5G chipset, a multimode 7nm 5G SoC designed to power the first wave of high-end 5G smartphones. The multimode compact 5G chipset, which comes built in with the MediaTek Helio M70 5G modem, includes Arm’s Cortex-A77 central processing unit (CPU), Mali-G77 GPU and MediaTek’s most advanced AI processing unit (APU) to meet the power and performance demands of 5G to deliver superfast connectivity and extreme user experiences.

IN THE KNOW | Mounting Technologies
Innovations Chart Progress in Manufacturing, Mounting Processes
The first part of the series digs deeper on the evolution in manufacturing processes, particularly mounting technology, which plays vital role in the manufacture of electrical and electronic devices.
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n manufacturing, various elements such as products, materials, components, costs, and methods are all integrated. The same is true for manufacturing electrical and electronic devices, and these elements continue to evolve in line with the times. The mounting technology, which plays an important role in the process of manufacturing electrical and electronic devices, has also greatly progressed in the Heisei era, which is the period in Japanese history corresponding to the reign of former Japanese Emperor Akihito from January 8, 1989 until his abdication on April 30. This article looks back on the progress of mounting technology in the Heisei era.

From Vacuum Tubes to Semiconductors
The age of vacuum tubes was through 1930. At that time, electronic components were attached to a bakelite plug plate and the wiring used the aerial type in which a copper thin wire passes through an empire tube. The power consumption of the vacuum tube was high, the weight of the transformer was particularly heavy, and the casing (chassis) was made strong.

Industry | Report
Taiwan Takes Aim as Vital Parts Supplier for Next-Gen Vehicles
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utomotive industry players from around the world gathered together for the Taipei AMPA 2019 6-in-1 Megashow, a mega event on automotive components, car electronics, intelligent transport systems (ITS), and electric vehicles (EVs) held last April 24 to 27 at Nangang Exhibition Center in Taipei, Taiwan.

This year’s edition focused heavily on technologies in sensor fusion, deep neural network for image recognition and connected cars, as well as components for EVs. One of the highlights was the area where visitors can experience an autonomous driving car equipped with advanced driver-assistance systems (ADAS) technologies.

Eric C. C. Liu
Eric C. C. Liu, Ph.D, Deputy Director, Information Technology Industries Div., Industrial Development Bureau, Ministry of Economic Affairs
MediaTek Gives Weight for SoCs in Automotive
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ediaTek Inc. has been accelerating the development of system on chips (SoCs) for advanced driver-assistance systems (ADAS) and car after-market applications. Presently ranked as the fourthbiggest fabless semiconductor, MediaTek has been supplying innovative SoCs to the global market for smartphones, home entertainment equipment and products related to internet of things (IoT).

JC Hsu, Corporate Vice President at MediaTek Inc., said, “Since 2015, we have been aggressive already in developing SoCs for automotive application following the growing trend towards electric vehicles (EVs), emergence of connected cars, and the increased requirement for safety of vehicles.”

JC Hsu
JC Hsu, Corporate Vice President, MediaTek Inc.
Industry | Report
Philippine Electronics Market to Test Resiliency Amid Trying Times
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he Semiconductor & Electronics Industries in the Philippines Foundation, Inc. (SEIPI) reaffirmed the group’s commitment to support in building the nation amid the challenges it faces both in the international and local fronts. At the sidelines of the 16th Philippine Semiconductor & Electronics Convention and Exhibition (PSECE 2019), officials of SEIPI outlined their respective efforts to help in the country’s efforts for growth.

PSECE 2019, which was held on May 30 to June 1, 2019 in Pasay City, evolves around the theme “Enhancing the Role of the Semiconductor and Electronics Industry in Nation-Building”. The Parts Localization booths also displayed parts and materials with potential for local sourcing.

Around 192 exhibitors joined this year’s PSECE, highlighted by four country pavilions from Germany, Singapore, Taiwan and China. A job fair was also conducted to provide direct employment opportunities to qualified applicants.

Tax Plan Casts Uncertainties in Philippines’ Electronics Industry
Senate Minority Leader Franklin Drilon
Senate Minority Leader Franklin Drilon (middle) delivers opening keynote for Philippine Semiconductor and Electronics Convention and Exhibition 2019 (PSECE 2019).
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he Philippines’ electronics sector has agreed to push further discussions with the national government in a bid to settle uncertainties in the tax reform package. This after the Semiconductor and Electronics Industries of the Philippines (SEIPI) said the industry has already lost about US$1 billion worth of possible investments and expansion plans to Vietnam, Thailand, and China, which could have generated 10,000 jobs.

“SEIPI exerted a lot of efforts with our partner industries to talk to Congress people…and seek audience to explain the electronics industry and our concerns,” said Dan Lachica, President of SEIPI at the recent Philippine Semiconductor and Electronics Convention and Exhibition 2019 (PSECE 2019).

Industry | Report
Japanese EMS Companies Expand Overseas Business
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apanese electronic manufacturing services (EMS) companies have been expanding their businesses mainly in the overseas markets. Presently, they have plants in operation in Japan, China and Southeast Asian countries as well as in Mexico and countries in Europe. Moreover, some companies have been engaging in merger and acquisition (M&A) to expand their business.

UMC Electronics
Photo 2: UMC Electronics (Dongguan) Co., Ltd.

Higher Contracts for Automotive Electronics
SIIX Corporation has EMS production bases in Japan, China, Thailand, Indonesia, the Philippines, Mexico, Hungary, Slovakia, and Hungary.

The company has expanded contracts for manufacturing services for automotive-related equipment, and sales of automotive-related equipment already account for more than 50 percent of the company’s entire sales. In particular, in the European region, plants in Slovakia and Hungary have been expanding business manufacturing on-vehicle equipment and industrial equipment as mainstay products.

JAE Adds Straight Receptacle to 12G-SDI Compatible Coaxial Connector
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he newly developed straight receptacle by Japan Aviation Electronics Industry, Limited (JAE) brings in a new addition to the BNC0 Series line up of coaxial connectors. The BNC0 Series coaxial connector features superior mounting and high-frequency performance and is compatible with 12G-SDI, which is ideal for 4K uncompressed transmission.

Suits 4K/8K Broadcasting Applications
An increase in high-resolution 4K/8K video equipment used in various applications, such as broadcasting equipment, network cameras and medical equipment, has been noted lately. This has led to an increase in video data volume, which requires a boost in transmission speeds. To comply with this industry trend, there has been great demand for corresponding interfaces, including connectors.

Industry | Report
5G Rollout Unravels New Demand Niche in Manufacturing
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roundworks for the implementation of the 5th generation (5G) mobile communication system have already been underway on a full scale. The start of 5G services will be a huge opportunity for manufacturers and production facility providers to expand markets. The practical use of 5G will enable smart factories, which make use of internet of things (IoT) as espoused by manufacturing equipment companies, to evolve even further.

It has been forecasted that in 2020s, global mobile communication traffic will increase more than a thousand-fold compared in 2010. 5G is aimed to greatly increase the capacity of network systems to respond to such increasing traffic at low cost and with low power consumption.

Research and development are being carried out, taking into account a wide range of performance properties, such as more than 10Gbps ultrahigh-speed communication, further latency reduction, and support for connections to numerous terminals associated with the spread of IoT and internet of everything.

Industry | Report
Connectivity Trends Push Connector Makers for Product Expansion
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mid the environment of internet of things (IoT), 5G wireless standard, and connected industries, innovations have been moving ahead in a broad range of fields, such as portable terminals, automobiles, and industrial equipment/infrastructure. As a result, demand for more advanced connector technology and the importance of connection technology have been increasing in an era where all kinds of devices and equipment are connected through networks.

Connectors for Mobile Devices
Various connector manufacturers have developed compact and high-performance connectors for portable devices, such as smartphones and wearable devices. While sales growth of smartphone units has slowed down worldwide recently, manufacturers continue to develop terminals with higher functionality.

In smartphones, there is a strong need for faster charging and waterproof performance. Various connector manufacturers are stepping up the development of connectors, such as micro connectors for internal connections used in the next-generation portable terminals, interface connectors, and large-current connectors, based on these market needs.

Industry | Report
Japan, Thailand Cooperate on End-of-Life Vehicle Recycling
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apan’s New Energy and Industrial Technology Development Organization (NEDO) and Thailand’s Ministry of Industry (MOI) and Industrial Estate Authority of Thailand (IEAT) have jointly conducted a demonstration project for the recycling of end-of-life vehicles (ELVs). In Thailand, the popularity of vehicles has been advancing and the increase of ELVs is anticipated down the road. The demonstration project was conducted as part of the measures to address ELVs. At present, however, there is no legal system for ELVs in Thailand.

The demonstration project was carried out as one of the themes of “Demonstration Projects to Introduce Energy-Saving Resource Circulation Systems in Asia,” which has been implemented since FY2016. Following external expert examinations based on the results of feasibility studies conducted in FY2017, the demonstration project in Thailand will be carried out over three years from FY2018.
Dismantling of end-of-life vehicles using a heavy vehicle dismantling machine in Japan.
Dismantling of end-of-life vehicles using a heavy vehicle dismantling machine in Japan.
One | Asia
EDB Singapore to Set up Most Advanced Semiconductor Ecosystem
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laying an important role in the manufacture of semiconductors worldwide, Singapore aims to achieve further growth of the semiconductor industry by attracting new investments through diversification and active introduction of next-generation manufacturing technologies. Pee Beng Kong, Executive Director, Singapore Economic Development Board (EDB Singapore), who recently visited Japan, described the country’s efforts to construct the most advanced semiconductor manufacturing ecosystem in the world.

Pee Beng Kong, Executive Director, EDB Singapore
Pee Beng Kong, Executive Director, EDB Singapore
Business | Strategy
Iriso Electronics Rides on Waves of Autonomous Driving
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utonomous driving sits at core of Iriso Electronics Co., Ltd.’s business expansion plans for the medium to long term. The company targets to expand sales of its products for autonomous driving-related applications to about 2.3-fold from FY2018 (ending Mar. 2019) to FY2021 (ending Mar. 2022). The company aims to achieve this by strengthening the proposal of solutions that meet the needs of autonomous driving vehicles and connected cars.

Changes that accompany the evolution of vehicles toward autonomous driving include increase in the number of sensors [on-board cameras, radars, Light Detection and Ranging (LiDAR)]sensors), trends toward sensor fusion, increase in communications mechanisms, and advancement of in-car networks. Iriso regards these as business opportunities. The company intends to dramatically increase sales of its connectors for autonomous driving-related applications in the medium to long term by proposing solutions that meet customer needs, including, downsizing, automatic assembly, high-speed transmission, and functionality.

“We consider dramatic changes emerging in the automotive electronics market as opportunities, and we push forward with technological development to propose solutions that solve customers’ problems,” notes Ikuo Yuki, President and Chief Executive Officer of Iriso Electronics.

Company | On the move
Kaga Electronics Commences In-House Production of Spot Soldering Equipment
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n an effort to expand its electronics manufacturing services (EMS) business, electronics distributor Kaga Electronics Co., Ltd. has started in-house production and external sales of manufacturing equipment.

Kaga Electronics has been pushing forward with the globalization of its EMS business. In line with this, the company has been optimizing its plants worldwide located in Suzhou, Shenzhen, and Hubei in China, Thailand, Indonesia, Malaysia, Czech Republic, Mexico, Vietnam, Turkey and India. It also carries a wide variety of products, ranging from automotive electronics, industrial equipment, office automation (OA) equipment, air-conditioning equipment, medical equipment, and information and communications equipment.

While its EMS business is doing well, the company has ventured into in-house manufacturing of production equipment primarily to reduce product cost. Among these products include printed boards, modules, units, and finished products. Notably, the production of automotive electronics has been growing, and the company has been receiving many orders for industrial equipment and medical equipment as well.

Show | Preview
Vietnam-Japan SIE/Vietnam Manufacturing Expo | 2019
Partnership to Spur Growth Opportunities in Vietnam

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outheast Asia’s leading industry event organizer Reed Tradex and the Japan External Trade Organization (JETRO) located in Hanoi, Vietnam, have agreed to strengthen business partnerships between Japanese and Vietnamese companies in supporting industries and push forward Vietnam’s manufacturing to become a globally competitive industry. The partnerships will be signified through the Vietnam-Japan Supporting Industries Exhibition (SIE 2019) and the Vietnam Manufacturing Expo (VME 2019).

The process of strengthening business operations in the supporting industries has become more evident amid the normalization of monetary policy in developed countries and the escalation of trade tensions between United States and China. Meanwhile, the trend of businesses relocating from China to Vietnam has been bringing host of opportunities to the country.

Show | Report
SID | 2019 (First of Two Parts)
International Event Previews Future of Displays

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isplay Week 2019 was held from May 12 to 17 at San Jose McEnery Convention Center in San Jose, California in the United States. Sunday Short Courses were held on May 12, Business Conference and Monday Seminars as well as the Symposium and exhibition were held from May 13 (Photo 1). This year, the event drew about 7,000 attendees. However, the absence of key display manufacturers Samsung Electronics Co., Ltd. of Korea and Sharp Corporation of Japan were noticeable this year.

San Jose Convention Center
Photo 1: San Jose Convention Center
Exhibit Highlights
During the event, leading-edge technologies were showcased. Among them include 8K organic light-emitting diode (OLED) panels, thin-film-transistor LCDs (TFT-LCDs), foldable displays, rollable displays, micro-LED displays, local dimming displays using mini-LED backlight, quantum dot (QD) displays, and human-machine-interface (HMI) displays for automotive application.
Show | Report
COMPUTEX Taipei | 2019
Leading ICT Show Builds Global Technology Ecosystems
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rganizers of COMPUTEX Taipei 2019 considered the five-day show a huge success, attracting 42,495 international buyers from 171 countries. This represented an uptick of 0.5 percent from the previous year. The top 10 buyer countries are China, the United States, Japan, South Korea, Hong Kong, Thailand, Singapore, Germany, Malaysia, and India.

Once again, COMPUTEX established the role of Asia’s a leading ICT tradeshow that connects businesses along industry supply chains and opens up infinite possibilities in the technology ecosystem.

For the first time, a CEO Keynote was held at COMPUTEX pre-show International Press Conference with Advanced Micro Devices, Inc. (AMD) President and Chief Executive Officer Dr. Lisa Su as the keynote speaker. Dr. Su addressed how the next-generation of computing will drive innovation. She also invited Microsoft, ASUS, Acer and close to 20 industry partners to present the computing industry ecosystem.

AMD Vies for IC Leadership with New High-Performance Processors
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OMPUTEX Taipei 2019 hosted for the first time the CEO Keynote to gather strategic foresight from the industry stalwarts themselves. Dr. Lisa Su, Chief Executive Officer at Advanced Micro Devices, Inc. (AMD), gave the keynote speech highlighting her vision on high-performance computing architecture. Dr. Su also unveiled the latest and most-advanced models of AMD’s 7nm-circuitry CPU and GPU offerings.

Computing Trends
Dr. Su pinpointed two key computing infrastructure trends where high-performance computing architectures direly needed.

“There is tremendous demand for computing. We see two key areas. (First), it demands better (user) experiences. So, all the devices we interact with — those devices at work, play, and through our daily lives — we want those devices to be better, more responsive, and to understand what we want. That requires tremendous computing power. On the other side, we also see hundreds of devices giving lots of data. What are you going to do with data? We want data to be smarter, help us to make better decision, and help us to make our lives a lot easier. That demands more of computing on the other side of computing infrastructure.”

Product | News
Components & Devices
PiezoListen Speaker by TDK
PiezoListen Speaker by TDK
TDK Corporation’s PiezoListen is an ultrathin piezoelectric speaker that produces sound over a broader frequency range and with a greater output in the low range than any existing piezoelectric speakers. It features an operating frequency range of 400 to 20,000Hz and achieves a high sound pressure of 80dB, even at low voltages of 24VP-P or below. The speakers have a maximum output power of 34W and an impedance of 2 to 100Ω. With a thickness of just 0.49mm, PiezoListen is also one of the thinnest piezo speakers available. The development of the low-profile, high-displacement piezoelectric element was made possible by TDK’s patented lamination and material technologies. TDK plans to extend the product lineup of PiezoListen with a sound positioning speaker with an operating frequency range of 1000 to 20,000Hz that will allow users to create their own 3D audio experience. PiezoListen speakers are ideal for televisions, tablets, laptops, and surround sound systems.
TDK Corporation
www.tdk.com

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