June 2020
Asia Electronics Industry
June 2020 Volume 25, Serial No. 285

ASIA ELECTRONICS INDUSTRY (ISSN 1342-422X) is published monthly by Dempa Publications, Inc., 1-11-15 Higashi Gotanda, Shinagawa-ku, Tokyo 141-8715, Japan Tel: +81-3-3445-6111 Fax: +81-3-3445-6890. Editorial e-mail:; Subscription e-mail:

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Cover | Story

apan and Taiwan share several similarities in terms of geographical locations and distribution of industrial ecology. Linking Taiwan and Japan industrial development experiences to joint advanced technology research and development (R&D) and to expand the international sustainable development will make win-win situation for both markets.

In the coming years, Japan aims to realize Society 5.0, a technology-based, human-centered society that is anchored on its existing government programs such as Abenomics 3.0, Local Creation, and Future Investment Strategy. The Taiwanese government, meanwhile, has made a number of policy adjustments concerning overall national development. In particular, the Five Plus Two Innovative Industries Plan, which will serve as the central driver of Taiwan’s industrial growth in the next era and forge a new model for sustainable development. This plan covers seven industries and projects namely intelligent machinery, Asia Silicon Valley, green energy, biomedicine, national defense and aerospace, new agriculture, and the circular economy.

AEI News
Foxconn Partners With Socionext, Hailo on AI Processing Solution
The Hailo-8 deep learning processor combines Foxconn’s BOXiedge and Socionext’s SC2A11 SynQuacer
The Hailo-8 deep learning processor combines Foxconn’s BOXiedge and Socionext’s SC2A11 SynQuacer

TAIWAN, JAPAN and GERMANY – Hon Hai Precision Industry Co., Ltd. (Foxconn) along with advanced video and imaging systems SoC solutions provider Socionext Inc. and artificial intelligence (AI) chipmaker Hailo have collaborated to bring forth the next-generation AI processing solution for video analytics at the edge.

Foxconn has combined its high-density, fan-less, and highly efficient edge computing solution, BOXiedge, with Socionext’s high-efficiency parallel processor SynQuacer SC2A11, and Hailo-8 deep learning processor. The new combination provides energy-efficient standalone AI inference nodes, which are suitable for applications such as smart cities, smart medical, smart retail, and industrial IoT.

The Hailo-8 deep learning processor delivers up to 26 tera operations per second (TOPS) and is built with an innovative architecture. The BOXiedge AI computing solution is equipped with applications for a broader market relying on low latency, high data rate, high reliability, and quick processing at the edge.;;

In View | This Month
Adoption of 3D Image Sensing Advances in Robot Industry


n the robot industry, the development and practical use of three-dimensional (3D) image sensing technology has been advancing to measure and recognize shape, color, length, position, and orientation of target objects in three dimensions. Amid the continuing issue on labor shortage, rising labor costs, and aging of skilled workers, 3D image sensing technology becomes indispensable in the automation assembly, inspection, and transfer processes that are dependent on human, making use of robots for these processes. Technologies for 3D measurement and recognition of objects have been becoming faster and higher in accuracy at an accelerated pace. Manufacturers have been introducing development results into production lines and physical distribution lines one after another.

Fastest 3D Image Sensor
Omron Corporation has developed the fastest 3D image sensing technology, which enables the shooting of bulk-loaded components to recognize position and orientation in about 0.5sec. Combined with a robot, it realizes high-speed and accurate automation of the assembly process of bulk-loaded components, which has thus far been handled manually. Omron plans to commercialize a compact 3D image sensor, which incorporates the sensing technology, this year.

KIST Develops Solid-State Electrolyte for Lithium Ion Batteries


n army of researchers at state-funded Korean Institute of Science and Technology (KIST) have developed a new solid-state electrolyte to be used with a new breed of solid-state secondary battery.

Led by Dr. Kim Hyung Chul, the research team said that it has laid down the groundwork for commercializing the novel solid electrolyte materials with ion-conductivity characteristics as high as that of fluid-state electrolyte materials.

The development opens the way for the commercialization of solid-state lithium ion batteries.

Argyrodite-Based Solid-State Electrolyte
Unlike fluid-state electrolytes in which ions are freely moving around, the solid-state electrolyte has a natural property to trap ions in its solid grid structure, demonstrating one-tenth or one-hundredth conductivity that of fluid-state electrolyte.

Special | Report
Smart Solutions for Factory Optimization typography
Panasonic Rethinks Manufacturing to Handle Micro-Components
As growth markets like IoT and electric vehicles demand ultrasmall components, Panasonic ensures quality component production by considering PROPER printing, mounting, and packaging processes.

mid the implementation of internet of things (IoT) and the proliferation of electric vehicles (EVs), changes in the manufacturing process accelerate the miniaturization of products, thus necessitating the downsizing of chips. This article introduces Panasonic Smart Factory Solutions Co., Ltd.’s efforts to establish quality product manufacturing by suppressing variations caused by men, machine, material, and method (4M) with respect to the downsizing of chips.

Market Trends
Fig. 1 explains the automotive industry. The proliferation of EVs and IoT products has contributed to the miniaturization and higher densities of modules and printed circuit boards (PCBs), and the basic unit of vehicles has dramatically changed from engine to motors. Communications among in-vehicle units and out-of-vehicle communications, such as vehicle-to-vehicle, vehicle-to-infrastructure communications, as well as global positioning system (GPS) communication, have become the norm. The number of control units mounted with communication modules continues to increase. The car society is also changing from ownership to sharing, and is undergoing major changes toward Level 5 fully autonomous driving.

Special | Report
Smart Solutions subtitle
FUJI Fortifies Portfolio to Effect Full Smart Factory
The company has reinforced its FUJI Smart Factory portfolio led by its NXTR and NXTR PM MACHINES. FUJI AIMS to bring end-to-end factory automation to production facilities and improve overall optimization with the integration of logistics and production.

n 2003, the concept of a truly modular placement machine led to the introduction of the first NXT high-speed modular placement machine. For the succeeding 15 years since then, Fuji Corporation pushed the concept even further in response to the demands of the times, evolving it into the NXT II and NXT III machines, and the support these machines received from users made them the sought-after machines globally.

Building on this NXT concept, Fuji has newly developed a high-end model with the future of manufacturing in mind, the Fuji Smart Factory Platform NXTR.

In addition to the modular concept of the NXT, the NXTR embodies the three zeros concept – zero placement defects, zero machine stops, and zero machine operators.

Data Explosion Spurs Chip Industry to Ramp-up Memory Technologies

he big gap in clock speed between memory chips and central processing units (CPUs) has always been a bottleneck in achieving leapfrog gains in computing power. This as memory chips, especially DRAM chips, are too slow to match the data processing speed of CPUs, leaving the brains of every computing device wait several hundreds of cycles for their turn to work.

The mismatch is getting more and more serious, as data-hungry applications like internet of things (IoT), artificial intelligence (AI) and Big Data analysis are heavily constraining the bandwidth of memory chips. To tackle the daunting challenge, memory chip vendors are working hard on many ways to improve the bandwidth of memory chips.

One prominent way is to innovate the structure of existing chips. The industry’s ramp up to DDR5 is one prime example of how chipmakers work to upgrade the way DRAM chips are designed and fabricated.

Flow Splitter Technology Suits Leading-Edge Chip Manufacturing Process

ith the advances of miniaturization and multiple wafer layers in silicon process, the distribution of film quality on silicon wafer significantly affects the yield improvement of semiconductor device process. Improvements of distribution and throughput are required in film deposition for flat panel display (FPD) as well. Therefore, semiconductor manufacturing equipment and FPD manufacturing equipment adopt the gas supply system that controls gas distribution in the chamber by introducing gases into the process chamber through multiple flow channels. To achieve increasingly complex gas supply control, flow splitters or flow ratio controllers are often used to control the introduced gases to the desired ratios, and diverse numbers of flow channels, flow rate conditions, and high-speed flow rate splitting response performance are required.

HORIBA STEC, Co., Ltd. has developed the FS-3000 flow splitter capable of supporting flexible flow channels and flow rate conditions in order to meet the needs of semiconductor manufacturing equipment and FPD manufacturing equipment. Conventionally, the number of channels was limited, and response adjustment on the site took time, and at maintenance, flow splitter needed to be replaced altogether. FS-3000 can control complex splitting of process gases speedily, thereby meeting expectations for improved film deposition distribution and throughput during the process. It can minimize down time during maintenance.

LINTEC’s “Tape x Equipment” Promote Large-Capacity Thin Packages

he proliferation of smartphones and other mobile terminals has accelerated the trends toward smaller, thinner, and larger capacity packages. For example, 3D NAND flash memories have achieved larger capacities by adopting the cell stack method, wherein memory cells are vertically stacked. For this reason, when thinning wafers in the back-end process, the silicon part after grinding becomes relatively thinner resulting from the thick cell layers (multi layers), and the strength of dies reduces, thus increasing risk of wafer cracks during grinding or transporting. Therefore, requirements for the improvement of packaging technologies to achieve larger capacity and thinner packages, as well as for tapes used in the back-end process and equipment, which support the packaging technologies, have been heightening.

In the back-end process, dicing before grinding (DBG) process is widely adopted (Fig. 1). For use in the DBG process, LINTEC Corporation offers the Adwill E series back grinding tapes (BG tapes); Adwill LD series dicing die bonding tapes (LD tapes); and Adwill RAD series equipment, which laminates and peels tapes. Thus, the company proposes solutions that combine tapes and equipment. These products are introduced in this article.

Keysight’s Virtual Test Kit Propels Autonomous Driving

ecent research showed the automotive semiconductor industry grew to a value of nearly US$42 billion in 2018 and is likely to be US$65.5 billion in 2025, while the semiconductor content per car is estimated to double from a value of US$312 in 2013 to US$652 in 2025. Chipmakers have become involved in the manufacture of automotive sensor, wireless and power management chips for the connected car, which now comes loaded with electronics to run onboard safety and comfort features, and communicate with its surroundings for vehicle-to-everything (V2X) applications.

The road to full autonomous driving sees the modern car having an increasing number of advanced driver-assistance systems (ADAS), with wireless connectivity providing the low-latency V2X connectivity needed for mission-critical safety functions.

Cellular vehicle-to-everything (C-V2X) technologies are one of the fastest evolving parts of the market, but it is impractical to road test an early-stage vehicle to measure its response to other vehicles, GPS, and pedestrians. At the same time, automakers can no longer rely on late-stage road tests as a means of ensuring that inbuilt V2X safety systems work seamlessly on the road.

Color Conversion Technology Emerges for Micro LEDs

icro light-emitting diodes (LEDs) feature excellent characteristics, such as high contrast ratio, high-speed response, low power consumption, and environment resistance compared with existing display devices (Table 1). However, at present, Sony Corporation’s Crystal LED Display System and micro OLED are the only micro LEDs that are in practical use.

Table 1: Comparison of display devices
(Y. Ukai, AEI November 2018)
Comparison of display
This article describes the latest trends of color conversion technologies. It also discusses color conversion materials that achieve full color panels as one of the challenges in bringing micro LEDs to practical use.

Challenges in Bringing Micro LEDs to Practical Use
Micro LEDs attract attention as display devices that support all applications from micro displays, measuring 1 inch and smaller, to ultralarge displays, with several hundred inches and larger. However, this market forecast accompanies the term “potential.”

Component | Materials
Fujitsu Taps Carbon Nanotubes for Flexible Adhesive Sheet
The new adhesive sheet features thermal conductivity three times higher than conventional materials, making it fit as a heat dissipation material.

ujitsu Laboratories Ltd. has developed the first adhesive sheet composed of carbon nanotubes with extremely high thermal conductivity of up to 100W/mK.

Carbon nanotubes have high thermal conductivity and represent a promising candidate for heat dissipation from heat sources including semiconductor devices. Nevertheless, the material remains difficult to handle due to its fragility, rendering it impractical for many purposes. To address this, Fujitsu has successfully developed a technology for laminating vertically aligned carbon nanotubes, while maintaining their original characteristics of high thermal conductivity and flexibility, as well as a technology for bonding them with sufficient adhesion. This technology facilitates the cutting and handling of carbon nanotube sheets, making it possible to use them as a heat dissipation material, for example, in automotive power modules for electric vehicles (EVs).

Component | Materials
Industry, Academe Partner on Research of Solid Type Batteries
Kyoto University and Sumitomo Chemical agreed to jointly develop materials and components for the practical use of solid type batteries with higher capacity, longer cycle life and quicker charging.

yoto University and Sumitomo Chemical Co., Ltd., will jointly develop materials and component technologies that can lead to the practical implementation of solid-type batteries, which have drawn attention as a next-generation rechargeable battery technology. Based on this agreement, Professor Takeshi Abe of the Graduate School of Engineering and Faculty of Engineering at Kyoto University, along with his colleagues, with the support of Sumitomo Chemical, held a course focused on joint research between industry and academia. The course was allocated laboratory-scale manufacturing facilities and battery performance evaluation devices, and was held at Katsura Campus, Kyoto University on April 1, 2020.

Advantages of Solid Type Batteries

Solid type batteries contain solid electrolyte instead of the liquid electrolyte that is used in conventional lithium ion rechargeable batteries. As solid type batteries do not use flammable electrolyte, they are safer than the mainstream lithium ion rechargeable batteries, and are expected to achieve higher battery capacity, longer cycle life, and quicker charging. With these features, solid type batteries are likely to be applied in a wide range of fields, such as small consumer batteries for information devices, wearable devices, and medical use, which are indispensable to people’s daily lives. They are also likely to be used as the next-generation batteries for electric vehicles, which require higher energy density and high output to achieve better cruising range and charging time.

Component | Materials
JFE Chemical Expands Fine Chemical Product Business
As more industries will emerge from 5G, the company plans to develop more electronic materials that suit these industries, thus expanding its portfolio of fine chemical products.


FE Chemical Corporation is proactively expanding its fine chemical product business into the electronics market. Particularly these days, the company is accelerating the development of new products targeted, for example, at the spread of the fifth-generation (5G) mobile communication standard, while offering existing key products.

The company offers a diverse range of functional material products for the electronics market, including fine chemical products, ferrite, and negative electrode materials for lithium ion batteries. It plans to expand business related to these products on a mid- and long-term basis.

Fine Chemical Products

Its core business of fine chemical products use coal tar, which is a rare component and is a by-product obtained at JFE Steel’s ironworks. The company produces indene derivatives and fluorene derivatives from the rare components, and has a good track record in supplying these derivatives.

Group Performs Virtual Control Testing on Optical Access Network


group composed of the University of Tokyo, OKI Electric Industry Co., Ltd., and Mitsubishi Electric Corporation has conducted virtualization control test for optical access networks in preparation for the full-scale implementation of the fifth-generation (5G) mobile communications standard and the internet of things (IoT). This development will contribute to expanding and accelerating service providers’ business through the creation of technologies that allow efficient provision of various IoT services.

Virtual Network Construction
The three parties have successfully carried out virtualization control testing for optical access networks by developing technologies for managing and controlling the communication resources (communication capabilities, such as low latency and large capacity) of a passive optical network (PON), which is, at present, is the most common optical access system.

Hitachi Automotive Amplifies In-Car Software Capabilities
The recent acquisition to a German device software developer will increase Hitachi Automotive System’s ability in complex software development and processes, enabling it to offer solution that will address various societal issues.


itachi Automotive Systems, Ltd., a wholly owned subsidiary of Hitachi, Ltd., has completed the acquisition of all shares of seneos GmbH. This makes the German automotive device software developer a wholly-owned subsidiary of Hitachi Automotive Systems.

Hitachi Automotive Systems supplies products and systems in growth areas such as electrification and is expanding its customer base of European automakers, growing sales of new products and solutions. seneos is a software development system engineering service company focused primarily on the automotive components sector and highlights a solid track record in software applications and designs for mainly European automakers.

Accelerate Advanced Solutions

Moving forward, Hitachi Automotive Systems can harness the software development capabilities that seneos has built in Europe, enhance the competitiveness of its products and systems, and further grow sales. seneos’ software design and application development capabilities will be leveraged on all Hitachi’s products and systems globally to enable a faster response to automaker needs and to accelerate development of advanced vehicle solutions with integrated control systems.

Alps Alpine Expands Automotive Business Domain
The Japanese conglomerate has collaborated with a German sensing technology company to sustain its grip in next-generation sensing technology by introducing solutions that leverage on advanced functionalities and superior cost for performance.


lps Alpine Co., Ltd. has agreed to jointly develop next-generation automotive sensing technology with radar sensor company Acconeer AB. This aims to expand the Japanese conglomerate’s business domain by further developing millimeter wave sensors with advanced functionality and superior cost performance.

The partnership also aims to boost the two companies’ capabilities in deploying the technology in diverse applications employing original sensing algorithms.

The automotive industry is currently undergoing major transformation as demonstrated in connected cars, autonomous driving, shared and services and electric vehicles (CASE). These trends have prompted the emergence of new technology domains and are dramatically reshaping the set of technologies applied to automobiles.

FUJI Reinforces Digital Enterprise Business, Taps Siemens Software
To achieve a fully developed smart factory, digital optimization is required for the entire manufacturing process, including assembly inspection and production design. For this, FUJI has tapped Siemens solutions to further advance the company’s FUJI Smart Factory platform.


UJI Corporation and Siemens Digital Industries Software have agreed to collaborate to broaden FUJI pitch in Japan’s digital enterprise business.

In order to meet the demands of production sites and respond to market diversification, shorter product cycles, and changing workstyles, FUJI has focused on automation and digitalization centered on surface mount technology (SMT) robotics. FUJI has developed machine-to-machine (M2M) link solutions, production schedulers, and material logistic solutions based on the integrated production system Nexim, to achieve digitalization of the SMT production floor in the form of FUJI Smart Factory.

Flexible, Efficient Production

Digitalization, however, is not only needed at the placement process and engineers are calling out for optimization across the entire manufacturing process including assembly inspection processes and product design.

Advanced Inspection Systems Heighten to Meet Diverse Demands
Amid the increasing needs of the industry for high-quality production and improved productivity, Nagoya Electric Works has been expanding its portfolio to meet wide range of market demands and requirements.


agoya Electric Works Co., Ltd. has been strengthening its offer of solutions that meet diversifying market needs by offering solder paste inspection (SPI) systems, automated optical inspection (AOI) systems, and automated X-ray inspection (AXI) systems for use in the printed circuit board (PCB) inspection process.

Nagoya Electric Works has expanded its business as a pioneer in the intelligent transport systems (ITS), including road information providing systems and tunnel disaster prevention systems.

At present, the company is offering two systems in its ITS business, namely road information providing systems and river information providing systems. The company is also offering on-vehicle products, such as solar-powered loading-type on-vehicle indicator equipment, portable sign devices, and yellow light-diffusing type alarm lamps; and LED lighting devices, such as LED lamps for high ceilings for factories, warehouses, and gymnasiums.

Photo 1: Takaaki Hattori, President, Nagoya Electric Works Co., Ltd.
Photo 1: Takaaki Hattori, President, Nagoya Electric Works Co., Ltd.
Yamaha Motor Fortifies Robotics Business in Southeast Asia
The company aims to take advantage of the business potentials of the region, and has augmented its business activities with a new office in order to provide support to the bustling demand for mounters and industrial robots.


amaha Motor Co., Ltd. has opened a new office in the Navanakorn Industrial Estate in Pathum Thani province in Thailand, where the company operates its robotics business. It has opened a showroom in the office to exhibit its products and products of its group companies.

Yamaha Motor intends to strengthen and expand its robotics business, including the semiconductor manufacturing equipment business, in addition to mounters and industrial robots, in the Southeast Asian region.

Photo 1: Yamaha Motor’s showroom in Thailand
Photo 1: Yamaha Motor’s showroom in Thailand
Provides Total Solutions

The new office in Thailand serves as its regional headquarters in Southeast Asia. The company also has regional headquarters in China, the United States, and in Europe. Yamaha Motor has established Yamaha Motor Robotics Holdings Co., Ltd. (YMRH) to integrate its surface mounting process, and the semiconductor back-end process of Shinkawa Ltd., which does semiconductor bonding equipment, and Apic Yamada Corporation, which produces lead frames for semiconductor devices, and molding equipment. YMRH, which has been in operation since July 2019, provides total solutions for both processes.

Yamaha Motor Augments SCARA Portfolio with New Models
Adding its latest models to its fully-developed SCARA robot portfolio reinforces productivity, enabling production facilities with lower cost but higher performance machines.

amaha Motor Co., Ltd. has expanded its SCARA robot lineup as it added the latest YK610XE-10 (arm length: 610mm) and YK710XE-10 (arm length: 710mm) models to the YK-XE Series of SCARA robots. The two new models, which were introduced in April, build on the high motion performance but lower cost of the current YK-XE Series.

Both models deliver high performance – in the shape of 10kg maximum payload and standard cycle time of 0.39 seconds (YK610XE-10) or 0.42 seconds (YK710XE-10) – contributing to improved productivity. In addition, the accessible pricing for these models enables developing production facilities with low cost but high performance machines.

Offers Great Diversity
Together with the YK400XE-4 (400mm arm length) launched last year, the YK-XE Series now includes three models. The expanded product lineup also covers a broader range of applications, encompassing not only assembly, conveyance, and sorting of small components such as smartphones and personal computers, but also of large components such as in home appliances and automobiles.
Test | Measurement
Anritsu’s SmartStudio NR Software Simplifies 5G Device Verification
The new software for the company’s Radio Communication Test Station MT8000A provides more efficient testing of user equipment for 5G services.

nritsu Corporation has introduced the SmartStudio NR environment for interactive graphical unit interface (GUI)-based functional 5G device testing. Serving as control software for the Radio Communication Test Station MT8000A, SmartStudio NR dramatically simplifies testing and reduces cost-of-test when verifying 5G commercial devices being developed for emerging applications.

Testing Simplication
With a built-in, state-machine-based GUI, SmartStudio NR control software simulates a 5G/LTE base station and core network. It uses the MT8000A 5G evaluation platform as a call box to simulate environments, such as sub-6GHz (FR1) RF cable connections and over-the-air (OTA) connections, mmWave (FR2) OTA connections in combination with unique compact shield box design, as well as changing cell parameters, download/upload configuration, and protocol monitoring and logging (PHY/MAC/RLC/PDCP/L3).
SmartStudio NR serves as control software for MT8000A Radio Communication Test Station
SmartStudio NR serves as control software for MT8000A Radio Communication Test Station
SK Telecom to Supply In-Vehicle Infotainment Service to Volvo

K Telecom Co., Ltd. has signed a deal with Volvo Korea, a Korean subsidiary of Swedish car maker Volvo Inc. to jointly develop in-vehicle infotainment service technology and supply it to the Swedish car maker.

Infotainment System Features
The in-vehicle infotainment service from SK Telecom comes built with T-Map real-time car navigation system, Nugu voice-recognition artificial intelligence (AI) system, FLO music album platform, and optimized UX system. These features allow car drivers to experience various infotainment services with a highly optimized in-vehicle UX service.

Under the terms of the deal, the in-vehicle infotainment solution will be embedded into Korean-bound 2020 Volvo car models as a standard basic feature. These car models will start to be sold sometime in the second half of 2020.

Test | Measurement
Anritsu, MediaTek Partner on 5G NR Standalone Protocol Conformance Tests
By integrating MediaTek’s Dimensity 1000 chipset on Anritsu’s ME7834NR 5G NR mobile device test platform, verification of conformance test for 5G NR standalone devices is enabled.

nritsu Corp. and MediaTek Inc. have collaborated on verification of protocol conformance tests for 5G new radio (NR) standalone mode devices. The tests have been verified with MediaTek’s Dimensity 1000 chipset on Anritsu’s ME7834NR 5G NR mobile device test platform.

The conformance tests are defined by 3GPP TS 38.523 and have been validated on multiple sub-6GHz frequency range 1 (FR1) frequency bands.

“Anritsu continues to support our development project with leading-edge test solutions,” said JS Pan, General Manager of Wireless Communication System and Partnership at MediaTek. “We are happy to see our joint efforts extend to verification of industry standard tests for 5G NR.”

ME7834NR 5G NR
ME7834NR 5G NR mobile device test platform
Test | Measurement
NF’s Digital Multimeter Exhibits Enhanced Analysis Capabilities
The latest digital multimeter employs large-capacity memory and measures 12 items and nine arithmetic functions.

F Corporation has released the DM2571 6 1/2-digit digital multimeter (DMM), which features high accuracy, high speed, and large-capacity memory, and supports diverse applications from basic measurement to analysis on a single unit.

DMM Features
DM2571 features DC voltage basic accuracy of 0.0035 percent, and is equipped with 12 measurement items and nine arithmetic functions. It adopts a 4.3-inch large color LCD, and is capable of graphical display and analysis of histogram, bar meter, trend chart, and statistical data, as well as measurement values. In the dual measurement mode, it can display two measurement results simultaneously.
DM2571 digital multimeter
DM2571 6 1/2-digit digital multimeter
New Test Solution Performs True PIM Analysis Over Fiber
The new IQ Fiber MasterTM MT2780A reduces test costs and time associated with deploying and maintaining LTE systems with CPRI front haul.

he IQ Fiber Master™ MT2780A multi-port Common Public Radio Interface (CPRI)-based radio frequency (RF) and passive intermodulation (PIM) analyzer from Anritsu Corporation is the first instrument to perform true PIM analysis over fiber and present RF spectrum results derived from IQ data. MT2780A reduces test costs and time by providing field engineers, field technicians, and third-party contractors with a single instrument to conduct RF interference measurements and PIM troubleshooting on LTE-based systems using CPRI front haul infrastructure.

Offers Real-World Testing
IQ Fiber Master leverages patented PIM over CPRI and RF over CPRI measurement capabilities that allow tests to be conducted on the ground, significantly reducing tower climbs. Field engineers and technicians can use MT2780A to scan the uplink RF signals of a remote radio head (RRH) for in-band interference while simultaneously conducting PIM over CPRI measurements. Supporting all Tier 1 LTE base station radio manufacturers, the single instrument solution can determine if key performance indicators (KPIs) are being affected by interference or PIM.
KOKI Puts up Second Sales Base in Malaysia

OKI Company Ltd., a manufacturer and supplier of soldering solutions, has established a sales channel in Malaysia in March, adding to its global network of sales distributors. The establishment of TREND Electronics (M) Sdn. Bhd. creates KOKI’s second distributor in the country.

Its proven soldering products, including solder paste, wave soldering flux cored solder wire and heat curable SMT adhesive designed for electronics and electrical industries are now made available to more customers in the country particularly those near Penang.

KOKI offers the most advanced production facilities, employs unique production engineering, and ensures full fledged quality assurance system to be able to provide high-quality, high-reliability products in a timely manner.

Through its distributor network, KOKI strives to provide much higher accessibility for customers and the industry in the region and pre- and post- sales support. It is the company’s mission to develop a reliable and sustainable partnership with its customers for a mutually better future.

Film Coating Technology Prevents Reduction of Solar Cell Power

he National Institute of Advanced Industrial Science and Technology (AIST) has developed a technology that can sufficiently suppress the potential induced degradation (PID), simply by covering the solar cell surface with a transparent conductive film. The PID phenomenon exhibits the significant reduction of a solar cell in a short period of time. Going forward, the PID suppression effect will be confirmed for thinner transparent conductive films for practical use. The effect will also be confirmed for transparent conductive films formed by wet coating, which are less expensive than those formed by the sputtering method.

Suppressing PID
Since 2010, AIST has been conducting pioneering research to clarify the mechanisms of PID and development of technology for preventing PID. It has become clear that electric field applied to an antireflection film on a solar cell plays an important role in the occurrence of PID. Based on this knowledge, AIST developed a technology that can sufficiently suppress PID.

Molecule Design Controls Crystal Structure of Organic Semiconductor

IKEN has discovered that the arrangement and orientation (crystal structure) of organic semiconductors can be controlled effectively by precisely designing the structure of organic molecules, utilizing the anisotropy of intermolecular interactions in the crystal structure. The results of this research are expected to contribute to the development of high-performance organic semiconductors for electronic devices, such as display backplanes and ID tags.

Creating High-Performance Organic Semiconductors
Organic semiconductors are attracting attention as key materials in the development of next-generation technologies for lightweight and flexible electronic devices at low cost and low environmental load. In comparison with existing inorganic semiconductors, however, organic semiconductors have a serious problem in application because their electrical characteristics, particularly carrier mobility that affects the performance of electronic devices, are lower. The mobility of an organic semiconductor is largely affected by the arrangement and orientation (crystal structure) of the organic molecules in the crystal, in addition to the properties of individual molecules constituting the semiconductor.

MEMS LiDAR Solution Exhibits Precise Scanning for Autonomous Vehicles

itsubishi Electric Corporation has developed a compact light-detection and ranging (LiDAR) solution incorporating a micro electro mechanical system (MEMS) that achieves an extra-wide horizontal scanning angle to accurately detect the shapes and distances of objects ahead in autonomous driving systems. The new LiDAR solution irradiates objects by laser and uses a dual-axis (horizontal and vertical) MEMS mirror to scan for the reflected light, generating three-dimensional images of vehicles and pedestrians. Mitsubishi Electric expects this compact, low-cost solution to contribute to the realization of safe, secure autonomous driving.

Large Dual-Axis Electromagnetic Mirror
After objects are irradiated by laser, the maximum amount of reflected light must be collected in order to obtain the most precise three-dimensional images, particularly of vehicles and pedestrians. LiDAR systems therefore require mirrors with a large surface area in order to maximize light collection. Additionally, a wide scanning angle is required for accurate vehicle periphery monitoring.

LG to Revamp TV Line, Reinforces Indonesia Facility

G Electronics Co., Ltd. has announced plans to move two of its six TV production lines at its Gumi manufacturing hub in Korea to its consumer electronics production cluster in Cibitung, Indonesia. This move aims to remake the Gumi facility a dedicated product line for high-end and premium centers for rollable and wallpaper TVs.

The Cibitung plant will also assume a new role as LG’s Asian TV production hub with an expected annual capacity of 2 to 3 million TVs. Founded in 1995, the Cibitung manufacturing hub has been churning out a variety of consumers electronics from TVs to monitors to digital signage displays.

The move of TV lines is part of LG’s offshoring plan to relocate its manufacturing facilities across the globe, which is part of a strategic decision-making process to localize production and supply chain for specific regions and countries.

LG is operating four offshore TV factories – two in Mexico, one in Poland, and one in Indonesia. To gain price competitiveness, LG Electronics has started relocating its factories and facilities globally.

Recently, LG started producing all of its smartphones in Vietnam, putting domestic production to a halt while the company’s washing machines and driers are located in United States, Mexico, and Poland.

Robust Car Connectors Cater to Internal, External Environments

apan Aviation Electronics Industry, Limited (JAE) has released a brand new set of connectors, the MX80 Series of compact waterproof in-line connectors for automotive applications.

As the need for high performance automobiles increases, the number of built-in electronic components increases as well. This leads to limited mounting and wiring space, and the demand for smaller connectors becomes ever more evident.

Compact, Waterproof Connectors
To cater to these needs, JAE has developed the MX80 Series small waterproof in-line connectors. The MX80 Series connectors support a variety of vehicle applications, such as side view mirrors, actuating motor functions, indicator lights, blind spot monitors, among others. They are waterproof and possess a small-form factor for use in internal or external vehicle environments.

KEL Launches High-Performance Coaxial Harnesses

EL Corporation has developed and introduced the TSL Series 0.55mm pitch coaxial harness that supports high-speed differential transmission at up to 32Gbps. KEL considers the series a strategic product targeted to complement deployment of fifth-generation (5G) high-speed mobile communications standard and other applications.

The company plans to develop the new set of high-performance coaxial connector into a key product by strengthening proposals for its use in applications, such as 5G and 4K/8K broadcast equipment, as next-generation harnesses specialized for high-speed transmission.

The TSL Series consists of next-generation harnesses capable of higher-speed transmission demanded in the market. It supports high-speed differential transmission at up to 32Gbps (31 poles).

Murata, Google Co-Create Smallest AI Module with Coral Intelligence

urata Manufacturing Co., Ltd., in partnership with Google, has created the smallest artificial intelligence (AI) module–the Coral Accelerator Module. The custom-designed module packages Google’s Edge TPU ASIC within a small form factor. The solution overcomes some of the most pressing challenges in implementing AI solutions by delivering superior noise suppression and simplifying printed circuit board design in a smaller footprint. Miniaturization is key as all board space must be optimized to achieve highly robust functionality in space constrained operations. The result of this collaboration is a solution that speeds up the algorithmic calculations required to execute AI.

The goal of Coral is to enable AI applications running at the device level to quickly move from prototype to production. Coral provides the complete toolkit of hardware components, software tools, and pre-compiled models for building devices with local AI. The AI module is an integral part of the fully integrated Coral platform, which can be implemented in a myriad of applications across numerous industries.

Mouser Stocks up Intel’s Next-Gen Wireless Modules

ouser Electronics, Inc. has made available the Intel Wi-Fi 6 (Gig+) AX200 and AX201 modules in its portfolio for global distribution. The new modules are expected to bring home Wi-Fi to the next level, providing faster and more responsive Intel-based Wi-Fi 6 routers and gateways. This will provide four times capacity for more devices and will rev up home internet to be gigabit ready.

The latest Intel modules included into Mouser’s fold will enable the U.S. chipmaker to make its products readily available to diverse companies.

Intel has been harnessing the capability of the cloud, the ubiquity of the internet of things (IoT), the latest advances in memory and programmable solutions, and the promise of always-on 5G connectivity, disrupting industries and solving global challenges.

Innovations of Electronic Materials Gather Momentum

echnological innovations of electronic materials have been accelerating. Amid the advancements in electric and electronic equipment and automotive technologies, the technological requirements for electronic components and devices have been becoming increasingly severe, and electronic materials manufacturers are obliged to develop new materials to achieve a breakthrough beyond the existing technologies.

Against this backdrop, electronic materials manufacturers have been stepping up research and development (R&D), setting their sights on next-generation technologies. They are focusing on the cultivation of state-of-the-art materials making the most of their core technologies, while at the same time enhancing their existing technologies. By theme, technological development of materials for next-generation 5G communication standard; connected, autonomous, shared and services, and electric (CASE); and next-generation semiconductor process has been gathering steam. Efforts have also been focused on investment strategy and merger and acquisition (M&A) strategy targeting the globalization of their businesses.

IN THE KNOW | Wireless Technologies for IoT
Wireless, Measurement Technologies to Bolster IoT to Mainstream
Wireless communications system will play a crucial ROLE in the enablement of a successful internet of things (IoT) ecosystem. The effective use of an appropriate measuring system, on the other hand, is indispensable for operation verification.

nternet of things (IoT) enables a linked device to collect data from various other devices. Generally, IoT devices are equipped with wireless communications function and communicate with each other wirelessly, thus connection through wired cables is not practical.

When designing an IoT system, it is important to select frequencies and communications system used for wireless communication in accordance with application. Frequencies commonly used for IoT are 2.4GHz band and 900MHz band.

The 2.4GHz band is used for wireless LAN and Bluetooth, and supports high-speed communications of several tens of megabits per second, but it has a short communication range of up to several hundred meters. Communications using the 900MHz band are called low power wide area (LPWA). Although it does not support high-speed communications, it allows long-range communications at low power.

Demand Surges for High Heat-Resistant Parts for Automotive

lectronic components manufacturers have been accelerating the development of automotive components that can withstand temperature range of up to 150˚C. This as demand for high-temperature-resistant components has been increasing in almost all areas of electrical and electronic systems, centering on safety systems, including powertrain systems of electrified vehicles (xEVs) and advanced driver-assistance systems (ADAS).

High reliability technologies for coils, capacitors, and other components are set to advance further from existing 105˚C- and 125℃-resistant technologies.

Passive components for automobiles are required to comply with AEC-Q200 reliability standard for automotive electronics, and high-temperature technologies have advanced from 85 to 105˚C, and even up to 125˚C. Recently, powertrain systems of xEVs have been integrating circuits that require high heat resistance, such as converters, inverters, battery management systems (BMS), and chargers, and mechatronical integration designs have emerged. Furthermore, in light of full-scale implementation of autonomous driving, safety functions, including ADAS, and increased needs for high temperature reliability, the need for high-temperature technologies that support 150˚C have been increasing as well.

Maxim Integrated’s SIMO PMIC Shrinks Compact Devices

axim Integrated Products, Inc. has developed the MAX77654 single inductor, multiple output (SIMO) power management IC (PMIC) to help designer of wearable devices reduce their solution size in half while extending battery life by 20 percent.

This next-generation SIMO PMIC delivers three outputs with just one inductor at 91 percent efficiency, which is 16 percent greater than traditional four-chip systems. With significantly reduced solution size, system designers can pack more functionality in their applications, such as wearables, hearables and other compact consumer devices when compared to using traditional power solutions. MAX77654 builds on Maxim Integrated’s robust portfolio of SIMO PMICs.

“Maxim Integrated’s breakthrough scalable SIMO PMIC, MAX77654, offers the smallest form factor solution with the highest system efficiency,” said Karthi Gopalan, Director, Mobile Solutions Business Unit at Maxim Integrated. “The MAX77654 SIMO PMIC frees up board real estate to pack value-add modules, such as voice commands, payment, GPS receivers, biometrics, gesture control, 3D recognition and camera.”

Taiwan Special

n 2002, Taiwan’s Ministry of Economic Affairs (MOEA) established the Smart Electronics Industry Project Promotion Office (SIPO) to coordinate, plan, promote and augment the country’s development of the semiconductor and smart electronics industry.

Today, SIPO is developing an Internet of Things (IoT) Promotion Platform that focuses on three main Special Interest Groups (SIG), including Smart Car Electronics, Smart Care, and Smart Unmanned Vehicle.

The Smart Care SIG is responsible for creating ICT solutions that could effectively respond to the prevention of pandemic, such as the COVID-19. Some companies included in the Smart Care SIG are featured below with their respective products and solutions.

AVer Information Inc.
AVer product being used in classroom
AVer provides intelligent technology solutions to harness the power of visual communications for business and education. With over 20 years of research, development, and manufacturing excellence, it holds numerous international design, innovation, application, and service awards for exceptional product usability, reliability, and customer satisfaction. Its visualizers, auto tracking cameras, and soundbars are perfect for everyday practice of distance learning.
Business | Strategy
Dongwoon Anatech Comes to Fore of Camera Technology Evolution

orean fabless chipmaker Dongwoon Anatech Co., Ltd. is reinventing itself as a power house for various user interface (UI) technologies, capitalizing on the rapid evolutions in user interface technology.

Dongwoon Anatech’s broad product portfolio makes it well poised to handle the evolution of user interface technologies. Its products range from auto focus (AF) driver IC to optical impact stabilization (OIS) driver ICs to time-of-flight (TOF) driver ICs and tactile feedback haptic driver ICs.

“Inside smartphones are a couple of camera modules embedded both on the front and back. Whenever a user is trying to take a shot, AF and OIS driver ICs are needed to get clean and clear images, which are otherwise taken blurred,” said Kim Dong Cheol (D.C. Kim), Chief Executive Officer with Dongwoon Anatech.

Business | Strategy
JUKI Ventures in Visual Inspection, Develops Hybrid Machine

UKI Corporation has developed a hybrid inspection equipment that adopts XTIA Ltd.’s laser technology. The hybrid inspection equipment detects product defects, which have been difficult to determine using conventional inspection equipment that adopts an optical camera system. The company aims to commercialize the inspection equipment by the end of this year.

JUKI intends to expand the use of the new inspection equipment for inspection of precision components, including inline inspection of automotive components, which require high inspection accuracy and speeds.

Jirou Ishibashi, Managing Officer of JUKI, says, “We will decide on the final specifications after watching reactions (on equipment) at exhibitions, aiming for commercialization within the year, while searching needs.”

JUKI targets to expand its business domain of image inspection technology into visual inspection and measuring markets aside from the surface mounting process.

Automotive World | 2020
Japanese Electronic Components Focus on CASE Trends

lectronic components manufacturers take a serious look at the evolution of connected, autonomous, shared & services, and electric (CASE) in the automotive industry, and develop devices that would cater to the needs of the market. Although production and sales of automobiles are sluggish at present, the number of installed components is expected to continue to increase due to CASE. New product developments for automotives are targeted for medium to long term.

At the Automotive World 2020, held earlier this year in Japan, component manufacturers highlighted their innovations in in-vehicle components and technologies.

Products for Automotive Market
Murata Manufacturing Co. Ltd. showcased sensing technologies, like ultrasonic waves at the AD/ADAS booth, batteries and piezoelectric technologies at the Connected booth, and mainly a full lineup of multilayer ceramic capacitors (MLCCs) at the xEV booth.

Product | News
Taiyo Yuden’s MCOIL MC Series Power Inductor
MCOIL MC Series Power Inductor by TAIYO YUDEN CO., LTD.
TAIYO YUDEN CO., LTD. has started mass production of MCOIL MC Series AECQ200-compliant multilayer chip power inductors. This product is designed for use as a choke coil in power supply circuits for electronic control units (ECUs) that control automotive devices, such as infotainment devices, advanced driver-assistance system (ADAS) units, and telematics systems. The company has attained high reliability, compatible with AECQ200, by sophisticating the materials and multilayer technologies used in the metal multilayer chip power inductor MCOIL MC Series, as the multilayer type has the advantage of realizing the development of smaller, thinner products. The company has commercialized the automotive metal multilayer chip power inductor MCKK1608TR47MVC (1.6×0.8×1.0mm, 0.47μH), while 2012-size products (2.0×1.25×1.0mm) will be released by the end of the year.
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