March 2020
Asia Electronics Industry
March 2020 Volume 25, Serial No. 282
Sony’s Vision-S concept electric car at an event
Evaluation Kits
4-inch μLED wafer bonded on a 6-inch donor quartz substrate, and a 4-inch μLED wafer

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Cover | Story

exxam Co., Ltd. deploys various businesses, including printed circuit board assembly (PCBA) automated optical inspection (AOI) systems business, electronics manufacturing services (EMS), and semiconductor-related equipment business.

Hiroyuki Sumida, Vice President, Rexxam Co., Ltd., says, “In FY2019, negative factors, such as effects of U.S.-China trade tensions, and a disastrous climate occurred in succession, and we cannot expect growth as planned. However, beginning 2020, we put the new plant in Thailand into full operation, and built new relationship with an Indian partner. We have also bolstered our company’s production system in India, and Thailand as well as countries in Europe, where sales of air conditioning equipment have been brisk.”

In 2018, demands for surface mount components increased rapidly. In particular, in line with the miniaturization trend of multilayer ceramic capacitors (MLCCs), Rexxam accelerated the replacement of mounters at its mounting lines in Suzhou and Shenzhen, the company’s main plants in China, to state-of-the-art mounters. It has been actively investing into the mounting line at its main plant in Japan.

AEI News
Tech Alliance Takes Steps to Fortify Cybersecurity

GERMANY – Member companies of the Charter-of-Trust (CoT) partners have agreed to deliver next-generation products with preset cybersecurity, following a clear security by default philosophy. At present, the partners agree that no uniform regulations govern the issue with many products leave the factory solely dependent on safety systems that do not provide comprehensive protection.

As a first step, the Charter partner companies have now defined which security features should be present and activated by default in next-generation products – ranging from strong authentication features to a unique product identity – and the requirement that passwords must be changed upon first use.

At the Munich Security Conference in February 2018, Siemens and eight partners from the industrial sector launched a joint charter for more cybersecurity for the first time. Two years after signing, the Charter of Trust has grown to 17 members, including Airbus, Cisco, IBM, Mitsubishi, NXP Semiconductor, among others.

Special | Report
Enablers of IoT typography
Intelligent Factories to Thrive on Total Mounting Solutions
Japanese SMT equipment companies aggressively promote total mounting solutions leveraging IoT technologies to advance the adoption of smart factories.

ith the emergence of the fourth industrial revolution or Industry 4.0, which was initially conceptualized and proposed by Germany, the global manufacturing industry has increasingly ventured in internet of things (IoT)-based production systems. Technologies, such as IoT, Big Data, artificial intelligence (AI), and industrial robots have revolutionized productivity and have unearthed various production benefits, including lower costs, higher product quality, and improved working hours and working environments. In 2020, smart factories realizing Industry 4.0 will spread further.

Japanese SMT equipment companies are expanding their proposals for smart factories in Japan and overseas.
Japanese SMT equipment companies are expanding their proposals for smart factories in Japan and overseas.
Japanese SMT equipment companies are expanding their proposals for smart factories in Japan and overseas.
Special | Report
SEMICON Korea typography
Digi-Key’s Full Breadth of Devices Hasten IoT Build up
As IoT becomes mainstream, Digi-Key’s broad portfolio of sensors, modules and wireless development kits can support design engineers to bring their cost-efficient modules to the market at the fastest rate.

he world of technology is changing faster than ever these days, and the pace of new technology introduction to wireless applications has not subsided. The internet of things (IoT) is fueling innovation in nearly every part of human lives. Simply connecting the “things” that were never connected before is leading to new data insights that translate into meaningful change. IoT is a mega technology trend that will not only be an endurance test for legacy systems, but will also shape the fate of small and big companies in many different industries. Estimates revealed that there will be 50 billion connected IoT devices by 2020 and 100 billion by 2025.

As transmission standards have changed to accommodate IoT devices, it has never been easier for a wireless enthusiast to try his hand at designing a new modulation scheme, and there are plenty of new sensors available to pair with a wireless link. These technologies are also more accessible to everyone than ever before. This article from Digi-Key Electronics talks about each of these developments and taking hold of this inexpensive and pervasive technology today.

Power Supply Technology Propels Smart Community

he concept of smart community is to build a rich society capable of sustainable development by achieving energy security, environment sustainability, economy, and safety based on utilization of internet of things (IoT).

The development of a resilient society capable of handling natural disasters is becoming an urgent issue, along with the full utilization of sustainable energy. In response to this, Japan’s Ministry of Economy, Trade and Industry has created a committee to discuss energy resource aggregation business (ERAB), and national efforts are being made to develop a virtual power plant (VPP) (Figure 1).

Creating an Energy Source Network
A VPP is intended to network various energy-related devices to establish an optimal and safe power supply and demand environment. It particularly focuses on the large electric storage capacity of electric vehicles (EVs) and V2X equipment, like V2Home, V2Grid, V2Building, and V2Factory, which charges and discharges the EVs.

Samsung Fits in Novel Technology in Latest Image Sensor


amsung Electronics Co., Ltd., has introduced ISOCELL Bright HM1, the next-generation 108-million-pixel image sensor. Mass-production has already begun, with the first adoption in Samsung’s soon-to-be-released Galaxy S20 5G Ultra.

With a spectrum of light-enhancing technologies spanning from Nonacell and Smart-ISO to real-time High Dynamic Range (HDR), ISOCELL Bright HM1 allows brighter and more detailed 108-million-pixel photographs and crystal-clear 8K videos at 24fps, even under extreme lighting conditions. As such, the CMOS image sensor chip enables users to take a vivid and crystal-clear picture in a dimly-lit or extremely dark light environment.

Yongin Park, Executive Vice President of the Sensor Business at Samsung Electronics, said, “To capture meaningful moments in our lives, Samsung has been driving innovations in pixel and logic technologies that enable ISOCELL image sensors to take astounding photographs even when lighting conditions aren’t ideal.”

Piezo-Based Actuators Upgrade Emerging Haptic Solutions

hether for smartphones, vehicles, industrial controls, domestic appliances or gaming consoles – the future belongs to piezo-based pushbutton solutions with haptic feedback. TDK Corporation offers a unique portfolio of products that are suitable for every imaginable haptic application.

As a result of the demand for greater convenience and safety, multifunctional human-machine interfaces (HMIs), such as touchscreens and other touch-sensitive surfaces can now be found almost everywhere. Existing solutions for haptic feedback, such as eccentric rotary mass (ERM) or linear resonant actuators (LRA) have a number of drawbacks. These include their relatively large dimensions, the insertion height being particularly relevant for display controllers, and a high demand for power in battery-operated devices such as smartphones or tablets. Furthermore, neither the frequency nor the strength of the feedback are at best the only variable within very narrow limits, and they do not have any sensory capabilities.

Fujitsu Reinforces Vehicle Security With New Partnership
The partnership aims to improve vehicle cybersecurity lifecycle management by leveraging the technologies and expertise of Fujitsu and its new partner, Upstream Security.

ujitsu Limited have partnered with Upstream Security Ltd., a cutting-edge security solution provider for connected vehicles, for vehicle cybersecurity. The companies will collaborate in the development of security operations solutions for connected vehicles.

As more vehicles are connected to the network, they are increasingly prone to the growing risk of cyberattacks. International and domestic committees have already started discussing regulation and standardization of cyber security for connected vehicles. Car manufacturers and fleet operators need to address and protect against vehicle data loss and unlawful vehicle application control, while developing solutions for security operations.

Toyota, Joby Aviation Fly to New Heights Together
Aside from being a lead investor, Toyota will also share its manufacturing expertise as well as experience in quality and cost controls for the development and production of Joby Aviation’s breakthrough eVTOL aircraft.

oyota Motor Corporation has collaborated with aerospace company Joby Aviation in a bid to explore new flight path for mobility. In entering partnership with Joby, Toyota recognizes the long-term potential of the urban air mobility market to meet the evolving needs of society.

Joby has been known for delivering safe air travel by developing and commercializing all-electric vertical take-off and landing (eVTOL) aircraft for fast, quiet and affordable air transportation services.

“Air transportation has been a long-term goal for Toyota, and while we continue our work in the automobile business, this agreement sets our sights to the sky,” said Toyota Motor Corporation President and Chief Executive Officer Akio Toyoda. “As we take up the challenge of air transportation together with Joby, an innovator in the emerging eVTOL space, we tap the potential to revolutionize future transportation and life. Through this new and exciting endeavor, we hope to deliver freedom of movement and enjoyment to customers everywhere, on land, and now, in the sky.”

DENSO, NTT Com to Put Vehicle Security Technology to Test
In rendering the tests, the collaboration aims to check how effective the V-SOC technology in handling various cyberattacks and its resilience in connected cars.
clipart Diagram of V-SOC technology
Diagram of V-SOC technology

ENSO Corporation and NTT Communications Corporation (NTT Com) are set to validate their jointly developed Vehicle Security Operation Center (V-SOC) technology for monitoring and analyzing vehicle’s security status. The validation was supposed to happen from January.

The two companies are creating the technology to realize resilient security solutions for connected cars.

Connected cars are becoming increasingly popular and sophisticated. In this evolution, novel automotive technologies and solutions continuously appear utilizing ICT technology. Concurrently, cyberattacks are growing more sophisticated and stealthy. Thus, cybersecurity in connected car is paramount and requires security technology that can swiftly detect and analyze cyberattacks and then seamlessly provide the appropriate support according to the situation.

Volkswagen Bolsters Future in EV, to Integrate Aeva’s Novel LiDAR System
Volkswagen has raised its stakes in the manufacture of electric vehicles as it poured investments in startup 4D LiDAR maker Aeva.

olkswagen (VW) AG of Germany has invested in Aeva Inc., a U.S. startup developing vision sensors for autonomous driving vehicles. Aeva’s newly developed single-chip light detection and ranging (LiDAR) sensor is expected to be on an electric vehicle planned for release by VW in 2022.

Headquartered in Mountain View in California, Aeva was founded in 2017 by former Apple Inc. and Nikon Corp. engineers. Aeva has recently developed a single-chip LiDAR for autonomous driving vehicles using signal processing technology called frequency modulated continuous wave (FMCW) radar technology.

High Performance, Low-Cost Chips
The company has succeeded in integrating almost all functions required for a LiDAR sensor used for the measurement of distance and objects into the ultrasmall optical chip. While most conventional LiDAR products are called 3D LiDAR sensors, the new chip is called 4D LiDAR on a chip and is capable of measuring the distance and direction of objects up to 300m ahead.
Bosch System Adds Safety Layer in Vehicles
Powered by artificial intelligence, the interior monitoring system of Bosch is trained to use interior recordings and real driving situations to draw the right conclusions and warns an inattentive driver or recommend the use of break or other driving actions to ensure safety.

erman automotive supplier Bosch has developed a new interior monitoring system featuring cameras and powered by artificial intelligence (AI). This system aims to avert critical driving situations and possibly also accidents as cars in the future will use sensors not simply to monitor the road but also the driver and other passengers.

The Bosch system may go into production in 2022, the same year European Union will make safety technology to warn drivers of distractions a standard feature in new vehicles. The EU expects that, by 2038, their new safety requirements for vehicles will save more than 25,000 lives and help prevent at least 140,000 severe injuries.

Constantly Monitors Drivers
Bosch recognizes the associated risks in distracted driving or driver drowsiness, prompting them to develop an interior monitoring system that detects and alerts to this danger and provides driving assistance. A camera integrated in the steering wheel detects when drivers’ eyelids are getting heavy, when they are distracted, and when they turn their head toward their passenger or the rear seats.
JAE’s Connectors Hinge on Automated Assembly of Industrial Equipment


apan Aviation Electronics Industry, Limited (JAE) has been stepping up the deployment of floating connectors for industrial equipment that can be automatically assembled by industrial robots. To expand the product lineup of these connectors, JAE has released a product that has achieved high-speed transmission exceeding 8Gbps, and a horizontal connection type, which meets the needs for smaller connectors.

Growing Demand for Automated Assembly
At production sites, production lines with installed robots and automated machines have been becoming increasingly popular to improve productivity and quality, and to reduce manpower. With connectors for connecting boards in industrial equipment, the adoption of floating-type board-to-board connectors has been increasing in addition to conventional board-to-board connectors, in order to enable assembly using robots and secure vibration resistance and connection reliability. At the same time, higher transmission speeds are required for connectors as well in order to meet higher information processing speeds accompanying the implementation of internet of things (IoT) and networking of industrial equipment.

Component | Materials
New Material Eases Bonding on Insulation Substrate of Power Modules
It can bond semiconductor device in high temperature to a copper material used in insulation substrate for power modules without pressure.

itsubishi Materials Corporation has developed a sintering bonding material that enables high-temperature semiconductor device to be directly bonded, without pressure, onto copper material used on insulation substrate for next-generation power modules.

In order to bond high-temperature semiconductor device onto copper material for next-generation power modules, including inverters for controlling power supplies of high-output motors in electrified vehicles (xEVs), it has conventionally been necessary to plate precious metal, such as gold or silver, on the substrate surface, and apply pressure while heating.

Properties of Bonding Materials
The new product enables pressureless bonding of high-temperature semiconductor device without the need for plating of precious metal onto the copper material on the substrate surface. Yet, it exhibits bonding strength of 30MPa or higher and heat resistance of 200°C or higher, which are equivalent to those of conventional products.
Component | Materials
Shin-Etsu Chemical Promotes Advanced Materials for 5G Products
Among the products to be released include the quartz cloth with low transmission loss, thermoset ultralow dielectric resin, and heat dissipation materials.

hin-Etsu Chemical Co., Ltd. has put in line several new products for market release to take advantage of the surging demand for highly advanced materials in the period of fifth-generation (5G) communication.

Shin-Etsu has newly developed a quartz cloth and a thermoset ultralow dielectric resin ideal for electronics devices, printed circuit boards, IC substrates, antennas, and radar domes that will be used in 5G high-frequency, including millimeter-wave, communication. The company also bolstered its lineup of heat dissipation materials.

In connection with these newly developed products, Shin-Etsu concluded a licensing agreement with American company Novoset, LLC regarding the manufacturing and sales of high-performance thermoset ultralow dielectric resins that Novoset has developed.

Component | Materials
Toray Creates Revolutionary PPS Film for 5G Circuit Boards
The new PPS film exhibits high dielectric characteristics and thermal dimensional stability at high temperatures.

oray Industries, Inc. has created a polyphenylene sulfide (PPS) film that maintains outstanding dielectric characteristics, that is, low dielectric losses of electrical energy; flame retardancy, and chemical robustness of polymer while remaining thermal resistance at 40°C – higher than conventional counterparts. The new film resists deformation and is dimensionally stable near its melting point. PPS is a super engineering plastic that also offers excellent electrical insulation. It is classified as crystalline with a melting point of 280°C.

By employing the new film in flexible printed circuits offering 5G and other fast data rates would offer two key benefits. First, the film would cut the transmission losses of communication devices at high frequencies. Second, it would help stabilize high-speed communication across the temperature and humidity spectrums.

Toray has already completed the technology for the new film on a pilot basis, and looks to have a mass production setup in place during fiscal 2020 to help swiftly popularize devices in the fast-expanding 5G arena.

Tokyo Weld’s High-Speed Taping Machine Suit Ultrasmall Parts
The company has developed a high-speed taping machine and an automated optical inspection system with Multi-Module Vision Handle transfer method.

okyo Weld Co., Ltd. has been accelerating the development of new products, including a high-speed taping machine for ultrasmall components and an automated optical inspection (AOI) system, which adopts the Multi Module Vision Handler (MMVH) transfer method.

Tokyo Weld is a manufacturer of terminal coating machines, testing and sorting machines, and taping machines for discrete semiconductors, such as diodes, transistors, and light-emitting diodes (LEDs), and passive electronic components, such as inductors, capacitors, and resistors.

The company has also been expanding its AOI systems business, which it positions as the third pillar, and has been increasing the product lineup.

Koji Takahashi
Photo 1: Koji Takahashi, Marketing Director & Chief Technology Officer, Tokyo Weld Co., Ltd.
Yaskawa’s Collaborative Robot Aims at Food Industry
The new MOTOMAN-HC10DTF collaborative robot features a surface coating, and is specifically designed for food production lines where hygiene is a priority.

askawa Electric Corporation has brought to market the latest MOTOMAN-HC10DTF as an addition to its new lineup of collaborative robots. It has a payload capacity of 10kg and maximum reach of 1200mm, and can be installed in food production lines.

In recent years, labor shortages have become serious in the food industry, and there has been a growing demand for collaborative robots that can work alongside people without safety fences. However, installation of industrial robots in production lines where workers need to touch foods directly has been difficult because of hygiene aspect.

In response to these challenges, Yaskawa has released MOTOMAN-HC10DTF, a collaborative robot that uses dedicated coating on the surface of the robot to clean the robot. It also uses food grease to ensure the safety and hygiene required in the food production line. Taking over the features of the human collaborative robots MOTOMAN-HC Series, this new model can be installed in a limited space because it does not require a safety fence, and can be also easily operated even by customers who are not familiar with robot operations with its safety functions and simple handlings. Alongside with its attention to food safety, Yaskawa was able to install collaborative robots to customers’ food production lines. With the new machine, Yaskawa can respond to the diversifying needs of customers not only in the food industry, but in various processes, including transportation in the chemicals and cosmetics industries.

Photo 1: MOTOMAN-HC10DTF collaborative robot
Yamaha Motor to Release Fastest Surface Mounter
The latest model, YRM20 highlights a placement capacity of 115,000cph and is envisioned to become a platform for an intelligent factory.

amaha Motor Co., Ltd. is set to launch YRM20 surface mounter with the fastest placement capacity of 115,000cph in April. The company positions YRM20 as a next-generation mounter that will become a platform for an intelligent factory, achieving the smartification of mounting lines, which the company has been promoting.

In Feb. 2015, Yamaha Motor received the assets transfer from Hitachi High-Tech Group’s surface mounter business. This signaled Yamaha’s foray into the high-speed mounter field, which was Hitachi High-Tech Group’s forte, on full scale.

Yamaha Motor was producing and selling Hitachi High-Tech Group’s Σ Series high-speed mounter, and after the transfer of the business, the company has developed and commercialized YRM20 by making the most of technological synergy of the two companies.

 YRM20 surface mounter high-speed multi-purpose rotary head and newly designed in-line head
The YRM20 surface mounter is equipped with the newly developed high-speed multi-purpose rotary head and newly designed in-line head.
ASM’s Solutions Empower Integrated Smart Factory
Among the solutions include the latest generations of the SIPLACE SX and SIPLACE TX placement platforms, powerful NeoHorizon printers and innovative software solutions.

he placement solutions at ASM booth at Internepcon Japan cover the entire spectrum from high-volume to high-mix electronics production. The high-speed SIPLACE TX placement modules highlight their superior precision in Systems-in-Place (SIP) placement applications. Also being shown are new products like the ASM AutoRefill Feeder and the ASM Measuring Feeder. The ASM AutoRefill Feeder has automatic tape entries for two component reels, which make the setup and refill procedures much more efficient, and the ASM Measuring Feeder delivers a significant improvement in process stability by verifying the major electrical properties of passive components.

Peland Koh (left) and Yuzo Ishizaki Internepcon Japan
Peland Koh (left), Vice President CRM and Regional Managing Director, Rest of Asia, ASM Assembly Systems Singapore Pte Ltd and Yuzo Ishizaki, General Manager for SMT Solutions, ASM Assembly Technology Co., Ltd. at Internepcon Japan
FUJI Expands Applications of Compact Multijoint Robot
Leveraging SmartWing’s ability to be used upon installation, the digital point soldering system, as a new application, has been developed.

UJI CORPORATION has been expanding applications of the SmartWing compact multijoint robot. By making the most of SmartWing’s easy-to-use characteristics, and it can be used immediately upon installation to suit a wide range of applications.

With a maximum payload of only 2kg, SmartWing has begun to be used widely as a compact multijoint robot, which changes conventional work through easy automation.

Key Features of SmartWing
The use of coordinate correction technology and vision data eliminates the need for teaching with physical guidance, which is necessary for conventional robots, thus significantly reducing time required for startup.
Mass Transfer Technique to Bring Micro LEDs to Mainstream Market

ass transfer technologies for micro light emitting diodes (micro LEDs) have different characteristics and involved varying processes. The diversification of various mass transfer technologies will bring more opportunities to the industry.

At the recent LED & Laser Diode Technology Expo held in Tokyo, various mass transfer technologies for micro-LEDs have been highlighted. Shin-Etsu Chemical Co., Ltd. took part in the said trade event and highlighted its own mass transfer technology for micro LEDs.

LED & Laser Diode Technology Expo is an exhibition gathering various technologies for LEDs, laser diodes. R&D and design engineers from various sectors, such as lighting, automotive, medical and other industrial fields visit the exhibition to find solutions.

Stereo Camera Allows Automatic Emergency Braking at Intersections

itachi Automotive Systems, Ltd. has newly developed a stereo camera that enables automatic emergency braking (AEB) at intersections on its own, and combines distant object detection with wide angle view, sans a millimeter wave radar.

As automobiles continue to expand globally, there is a growing need for technologies that enhance safety driving, particularly at intersections. As of 2020, the New Car Assessment Programme (NCAP) will include AEB among the criteria in its leading automotive safety performance assessment.

Detecting Pedestrians at Intersection
Sensor technologies with horizontal, wide angle view are necessary to detect pedestrians to avoid accidents when an automobile turns at an intersection. To achieve this, it is essential to continuously detect vehicles ahead, and requires a CMOS with consistently high pixilation, a camera sensor, or a combination of multiple sensors, including a radar that detects objects in the surrounding area or in the distance.

Industry Insight
Bluetooth Previews Future of Wireless Audio

luetooth Special Interest group (SIG) has recently announced the next-generation Bluetooth Low Energy (LE) Audio, which aims to enhance wireless audio experience. The new technology, which will hit end devices within the next year or two, is expected to develop new use cases.

The latest Bluetooth technology is expected to change the landscape of audio experience and connectivity the same way Bluetooth also created the wireless audio market 20 years ago.

In an interview with Asia Electronics Industry (AEI), Ken Kolderup, Vice President for Marketing at Bluetooth SIG, Inc., said the new Bluetooth LE Audio will seek to address advanced use cases in the field of audio, such as true wireless earbuds and multi-point sharing.

Cross-Industrial Cooperation Eyes Challenges of CASE

apanese car electronics companies have been stepping up cooperation with other companies in order to prepare for a major trend in the automotive industry, that is, CASE or connected, autonomous, shared & services, and electric. Since 2018, amid the ongoing restructuring of the industry, car electronics companies have been promoting cross-industrial cooperation and rushing to develop services that would prove useful in the CASE era.

Management Integration
Over the past year, the car electronics-related industry has undergone significant changes. Amid intensifying competition in the market, some companies had difficulties in expanding profits, and as a result, mergers and acquisitions (M&A) and business tie-ups have advanced. In particular, over the past year, Hitachi Group accelerated its restructuring, which includes the transfer of Clarion Co., Ltd. to Faurecia Group, a leading French auto parts manufacturer. It has also decided on the management integration of Hitachi Automotive Systems, Ltd. and Honda Group’s parts makers in 2020.

CES | 2020
Novel Car Technologies Take Spotlight


lobal technology event CES in Las Vegas typically hosts new products and technologies in the consumer electronics sphere. Since CES made its start in the 1960s, it has been known as the birthplace of various cutting-edge devices close to the hearts of consumer electronics patrons – from the latest TV, media players, as well as a host of home appliances and the latest phones and mobile devices.

In recent years though, the biggest consumer electronics event has housed even the latest cars and automotive technologies. CES visitors have witnessed the rapid development of automotive technologies varying from the latest advanced driver-assistance systems (ADAS) and novel sensors suitable for autonomous driving, and even the fusion of enabling technologies, such as fifth generation (5G) mobile standard, internet of things (IoT) and artificial intelligence (AI), into next-generation car technologies.

CES | 2020
Valens Technology Simplifies Cabling in Connected Vehicles


sraeli-based fabless chipmaker Valens Semiconductor propelled at CES 2020 its chipset solution to simplify cabling and the use of wire harnesses inside the car that connect multitudes of features and functions in hosts of controllers. Backed by its rich portfolio of automotive-grade chipset family, the company aims to bring its architecture not only to today’s connected cars but also to future use cases in autonomous vehicles.

In an interview with Asia Electronics Industry (AEI), Dana Zelitzki, Vice President for Marketing at Valens Semiconductor said the company leverages the HDBaseT technology, a standard formed way back in 2010 for professional audio and video devices, to its automotive business the company started to foray five years ago.

“We have used the same technology, an enhanced one, inside the car. The car is very complex and challenging with very high number of cables – bundled and twisted. Our technology is designed to maintain that link and enable high-speed data transmission over simplified cabling,” said Zelitzki.

CES | 2020
Continental Tackles Security in Vehicle Mobility


erman automotive tier one supplier Continental AG has highlighted its wide technology portfolio and solutions for mobility and autonomous vehicle technology at CES 2020. Nikolai Setzer, Member of the Executive Board at Continental said mobility is one of the most important human that will serve as a driving force of a society’s future.

“The innovations we are having now is the largest change that the industry is going since it was born. Industries have been merging and we are showing our strength with our smart vehicle architecture and connectivity as well as software and systems,” said Setzer.

Increasing Vehicle Security
Continental said it has been working with partners to integrate ultra-wideband (UWB) technology into future vehicles to make keyless vehicle operation more secure and convenient. When integrated into smartphones, UWB technology can enable new functions, such as secure keyless vehicle access or parking vehicles remotely.

CES | 2020
AEye Fuses AI in LiDAR Platform for ADAS, Autonomous Cars


Eye, Inc. has highlighted at CES 2020 its cutting-edge iDAR platform for advanced driver-assistance (ADAS) system and autonomous vehicles, which the company said would help car original equipment manufacturer (OEM) and automotive tier one supplier realize automated vehicles.

Barry Behnken, Senior Vice President of Engineering at AEye said iDAR, which stands for intelligent detection and ranging, addresses the challenges in perception and path planning, which most LiDAR sensors in the market at present could not address. AEye’s iDAR platform takes solid-state agile 1550nm LiDAR, fuses it with a low-light HD camera, and integrates artificial intelligence to create an agile and smart perception sensor that is fully software definable.

“What we do at AEye, we architected LiDAR in the way we think it should be implemented. The important elements in iDAR is it takes solid-state agile LiDAR, use with a powerful low-light camera, and then artificial intelligence. This (fusion) creates a smart software-definable platform that enables faster, more accurate and more reliable artificial perception,” Behnken said.

CES | 2020
Aeva’s LiDAR to Help Realize Mainstream Automated Driving


eva, Inc. highlighted at CES 2020 is latest next-generation light detection and ranging (LiDAR) system based on frequency modulated continuous wave (FMCW), which integrates key elements of a LiDAR sensor into a miniaturized chip. The company’s AERIES LiDAR platform, which integrates its 4D LiDAR-on-chip, comes with significantly reduced size and power consumption compared with other LiDAR systems out in the market today.

“We employ a different technology, compared with 99.5 percent LiDAR systems in the market today, by orders of magnitude,” said Soroush Salehian, Chief Executive Officer and Co-Founder at Aeva in an interview.

“Because we use FMCW, our system is super sensitive and can measure instant velocity for every point for a full range performance of over 300m. With our 4D LiDAR-on-chip, we are able to address the major roadblocks to bringing autonomous vehicles to the mainstream,” Salehian added.

Philippine Mission Propels Buoyant Electronics in U.S. Roadshow


he Philippines’ Department of Trade and Industry (DTI) and the Semiconductor and Electronics Industries in the Philippines Foundation, Inc. (SEIPI) sent a delegation to United States to promote the country’s exports and investments in the electronics sectors. The delegates in particular took part in networking forums at the recent CES 2020 in Las Vegas and attended meetings and conferences.

Considered as the industry’s biggest consumer electronics event, the annual CES has been the global stage of various innovations and cutting-edge products in various fields as well as enabling technologies, such as artificial intelligence, fifth generation (5G) communications, intelligence of things, among others.

SEIPI President Dr. Dan Lachica speaks at the Philippine Electronics
SEIPI President Dr. Dan Lachica speaks at the Philippine Electronics Industry seminar and networking forum at CES 2020.
NEPCON Japan / Automotive World | 2020
Finger Gesture Technology for Cars Enhances HMI Options


uman machine interface (HMI) enables drivers to use devices without keeping off his or her concentration away from driving.

At NEPCON Japan 2020 and Automotive World 2020 held in January in Tokyo, NEC Corporation, and Kodenshi Corporation showcased their finger gesture technologies.

What is Finger Gesture?
Finger gesture is an emerging user interface for inputting instructions to programs using finger gestures alone. A new model vehicle from BMW already adopts gesture control technology using a three-dimensional (3D) time-of-flight (TOF) sensor. This sensor can differentiate the number of fingers and their movements. BMW’s new car model enables the operation of audio equipment and mobile phone using gestures, such as the number of held-out fingers, palm’s forward/backward and leftward/rightward movements, and rotation.

Business | Strategy 2020
Electronic Components All Set for Breakthrough
Electronic Components All Set for Breakthrough


he industry is set to witness a new period of social transformation to be driven mainly by fifth-generation (5G) communications; connected, autonomous, shared & services, and electric (CASE) trend in automobiles; artificial intelligence (AI); and internet of things (IoT).

Commercial 5G services will start in spring 2020 in Japan. Users will get to see the unparalleled speed this technology will bring.

To cope with labor shortages, automation technologies will also advance. Factories will become “smart” by implementing industrial robots and industrial internet of things (IIoT) and propel advancement of manufacturing technologies.

Automotive electronics will revolutionize functions and features of vehicles, which are evolving to become more electrified in an aim to provide safer and more secure ride, and comfort for the driver and passengers. Amid growing needs for environmental protection, expectations for wider use of clean energy technologies have also been heightening.

In the lead-up to the Tokyo summer Olympics and Paralympics in Japan, the public and private sectors will go all out to promote diverse technological innovations leveraging these industry developments. Innovative mobility technologies to realize smooth movement during the event will be introduced, while guide robots with translation functions targeted at foreign visitors are expected to play active roles. Visitors will get to see and experience these breakthroughs first hand.

Murata Manufacturing
Co., Ltd.
Chairman of the Board and President
Tsuneo Murata, Chairman of the Board and President
The industry is characterized by the increasing use of electronic components in vehicles, popularity of high-functional smartphones, and start of 5G communications. Infrastructure to roll out an IoT society is being put in place in stages, and business opportunities for our company have been expanding as we have a diverse product lineup, supply capability, and a broad base of customers.

The 5G smartphone market will expand to 150 to 200 million units in FY2020. However, it will likely expand more sharply. With 5G base stations, the number of small cells will increase and cells that cover wide areas. Massive MIMO technology will dramatically increase the number of antennas, electronic components, and amount of communication data per single base station, and will expand demand in memories and servers.

The production of automobiles has been increasing moderately, however, the contents of the growth has significantly changed. The shift to xEVs and the advancement of autonomous driving progress rapidly. A wide range of passive components and MLCCs are on the uptrend, creating new demand for communication modules and sensors.

I expect that the energy business will turn profitable in FY2021. There is no change in the direction to shift the laminate type to those for small mobile devices. We will also place importance on power batteries.

Last year, we came out with a medium-term plan. Although trade tensions and economic slowdown have surfaced, we will stick to our profitability targets.

Nippon Chemi-Con Corporation
Representative Director and President
Norio Kamiyama, Representative Director and President
The demand for hybrid capacitors that combine characteristics of both aluminum capacitors and polymer capacitors has been rapidly increasing for use mainly in automobiles and fifth-generation (5G) base stations. We will expand our production capacity for hybrid capacitors. The adoption of polymer capacitors has also been expanding to the low voltage area of automobiles with rated voltage of 25V and lower. This year, we will launch 150°C-resistant products compatible with SiC and GaN power devices.

A greater number of ECUs will be incorporated in vehicles, and environment-friendly vehicles will also increase in the medium to long term. Not only hybrid, polymer and aluminum electrolytic capacitors, but also the business scale of coils, camera modules, varistors and multilayer ceramic capacitors will expand.

We have also started to supply lead-type EDLCs for backup, in addition to the large type for energy regeneration. Expectations for EDLCs expand for use in 48V micro hybrid systems and on-board chargers, as well.

The demand for components for 5G base stations, which has already begun to emerge, will continue to increase through 2022 to 2023. Responding to the installation of many microcells, we are bringing new environment-resistant products of small aluminum electrolytic, polymer and hybrid capacitors onto the market.

Product | News
S-57TZ S Series Hall Effect IC by ABLIC
S-57TZ S Series Hall Effect IC by ABLIC

ABLIC Inc.’s S-57TZ S Series is a high-accuracy Zero Crossing Latch (ZCL) Hall Effect IC that operates with high temperature and high-withstand voltage developed by CMOS technology. The newly developed IC switches output voltage level when the IC detects magnetic flux density (magnetic field) polarity changes. The ZCL detection method realizes polarity changes detection with the higher accuracy than the conventional bipolar latch method. Using this IC with a magnet makes it possible to detect the rotation status in various devices. The IC series uses a thin (0.80mm maximum thickness) TSOT-23-3S or ultra-thin (0.50mm maximum thickness) HSNT-6(2025) package, allowing for device miniaturization. It contributes to the reduction of mechanism operation dispersion through high accuracy detection of magnetic flux density polarity changes. It is suitable for devices that require high quality and contributes to a device safe design through built-in reverse voltage protection circuit and output current limit circuit.

Ricoh Develops Solid-State Dye-Sensitized Solar Cell Module


ith the concept of “creating a charging-free world” in the internet of things (IoT) society, RICOH Co., Ltd. has developed a solid-state dye-sensitized solar cell (DSSC) module, which exhibits high power generation capability even under weak light sources, such as indoor lighting.

Consisting solely of solid-state materials, the DSSC module has achieved high safety and durability. RICOH is the first to release a solid-state DSSC module.

With the rapid expansion of the IoT market, sensors have increased explosively, and securing power supply for sensors has emerged as a big issue. Against this backdrop, self-supporting power supply systems that operate sensors are attracting attention. In particular, dye-sensitized solar cells that exhibit good power generation performance under indoor lighting have been developed for this purpose.

Tetsuya Tanaka
Tetsuya Tanaka, General Manager, Energy Harvesting Business Center, RICOH Co., Ltd., shows the first solid-state dye-sensitized solar cell module.
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