March 2021
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Asia Electronics Industry
March 2021 Volume 26, Serial No. 294

ASIA ELECTRONICS INDUSTRY (ISSN 1342-422X) is published monthly by Dempa Publications, Inc., 1-11-15 Higashi Gotanda, Shinagawa-ku, Tokyo 141-8715, Japan Tel: +81-3-3445-6111 Fax: +81-3-3445-6890. Editorial e-mail:; Subscription e-mail:

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Cover | Story

okyo Weld Co., Ltd. manufactures terminal coating machines, testing and sorting machines, and taping machines for discrete semiconductors and passive electronic components, including inductors, capacitors, and resistors. Five years ago, Tokyo Weld released the automated optical inspection (AOI) systems, and has been continuing to advance the systems to meet the trend of component miniaturization. It has also promoted the development of an AOI system equipped with an artificial intelligence (AI) function and an AOI system for odd-formed components.

Koji Takahashi, Chief Technology Officer at Tokyo Weld, notes, “In 2020, the adoption of remote work and online conferences spread instantly amid the coronavirus pandemic. This created secondary effects, such as increased sales of smartphones, personal computers, and tablets, augmentation of servers to respond to the demand for remote work, and progress in the establishment of 5G infrastructure. Moreover, more miniaturized electronic components, which are necessary for network connection devices have emerged. I believe that this trend will continue, in particular of components for smartphones, and the demand for production expansion of electronic components will increase further. This year, we will make it our commitment to continue improving the processing capacities of existing inspection systems, and taping machines as our company’s main products.”

AEI News
MediaTek Taps TSMC’s 6nm Technology in New 5G SoCs
 5G-integrated chips
MediaTek’s Dimensity 1200 and 1100 are the latest 5G-integrated chips for flagship-grade smartphones.

TAIWAN – MediaTek Inc. has announced its latest 5G smartphone chipsets, the Dimensity 1200 and Dimensity 1100, which both come integrated with artificial intelligence (AI) and support sophisticated camera and multimedia features for 5G experiences. The two chipsets will be processed using 6nm technology of Taiwan Semiconductor Manufacturing Company, Limited (TSMC) and will further enhance MediaTek’s 5G portfolio.

The Dimensity 1200 and 1100 pack a highly integrated 5G modem with MediaTek’s 5G UltraSave technology for big power savings. Both chipsets support every connectivity generation from 2G to 5G, in addition to supporting the latest connectivity features.

The Dimensity 1100 is designed with an octa-core CPU, which includes four Arm Cortex-A78 cores operating at up to 2.6GHz and four Arm Cortex-A55 efficiency cores, along with a nine-core Arm Mali-G77 GPU.

In View | This Month
Makers Count on New Trends, Processes to Sustain Demand


n 2021, the creation of new markets driven by the expansion of demand for personal computers and network-related systems and equipment, which in turn is brought about by remote work, online class setups, and increase in the need for online shopping platforms amid the novel coronavirus (COVID-19) pandemic, is expected to propel the growth of factory automation and manufacturing equipment industry. Aside from these new growth areas, the imminent deployment of fifth-generation (5G) communications standard and autonomous driving are expected to drive the industry.

Looks at New Opportunities
In the United States, the manufacturing industry is on a wait-and-see approach on how the administration of newly-elected President Joe Biden will have an impact on the U.S.-China trade tension. Nonetheless, it is certain the Chinese manufacturing industry has almost overcome the threats of COVID-19 and is driving the demand for production equipment.

Smallest Bluetooth Low Energy Module Broadens Usage Range

oshiba Corporation starts shipment of the smallest Bluetooth Low Energy module with proprietary Slot Antenna on Shielded Package (SASP) technology.

Bluetooth has made crucial contributions to today’s widespread popularity of wearable devices, including smart watches and devices worn on and in the ear, thanks to modules that meet the Bluetooth Low Energy standard for smaller devices with lower power consumption.

Toshiba has now widened these horizons even further with the development of a Bluetooth Low Energy module that is ultrasmall at only 4×10mm and weighs about 0.09g, making it almost undetectable when worn. The module is expected to bring wearable devices into previously impossible areas, including sportswear, buttons, and even ordinary clothes.

Special | Report
Local 5G typography
Local 5G Propels Growth of Enterprise Network Market
Local 5G can deliver the same features of ultrahigh-speed and larger-capacity communication transmission of 5G mobile system. In locations, such as municipalities, factories or residential areas where the benefits of 5G cannot be maximized, local 5G has immense potential.

ommercial 5G services in Japan started in Mar. 2020 in some parts of Tokyo, Osaka, and Nagoya metropolitan areas. However, installation of base stations lags behind other countries. There are also feedbacks of insufficient download and upload speeds; primarily because, at the moment, sub-6GHz bands are used as the mainstream 5G bands in Japan, and full-scale installation of base stations that support millimeter wave (mmWave) bands, which enable faster communications, is still planned for 2021 to 2022.

In addition, there are also problems unique to Japan’s big cities that hamper the delivery of quality 5G service. In Japan’s large cities, there are fewer areas where buildings and houses orderly coexist following land readjustment and many are still in disarray. For this reason, many mmWave bands base stations, which handle waves with high rectilinear advancing property, needs to be installed.

Special | Report
Electronic Components Ride on Waves of Industry Trends
The electronics industry is in a juncture of another disruption as the health crisis has changed the social norm. On top of the new normal, key trends like 5G, CASE, IoT, and AI are going mainstream. Collectively, these will bring in new developments TO the sector for the next decade.

long with the incessant progress in information technology (IT) and electronics is the continuous advancement of electronic components technologies. Within 10 years, the market is expected to witness dramatic transformation in people’s lifestyles and social infrastructure courtesy of fifth-generation (5G) communications; connected, autonomous, shared & services, and electric (CASE) trends in automobile; internet of things (IoT) and artificial intelligence (AI). Electronic components manufacturers look at these changes as business opportunities, stepping up business activities for the medium to long term.

Industry Prospects
For the electronic components industry, 2020 was a turbulent year as the expansion of coronavirus infections directly hit the market. However, 2021 started while still battling the COVID-19 pandemic, and with the continued economic tensions, like the prolonged U.S.-China trade war, uncertainty for the future remains high.

Special | Report
Emerging Automotive Trends Boost Outlook of Parts Makers
As vehicle trends and technologies advance further, the number of components inside them need to increase as well to complement the evolution.

lectronic components manufacturers have been becoming more aggressive to secure more sales in the automotive market. In recent years, technological innovations have been advancing on connected, autonomous, shared & services, and electric (CASE), and mobility as a service (MaaS).

Electrified vehicles (xEVs) have been emerging as well amid the growing trend to protect the environment by reducing carbon footprints. Electronic components manufacturers aim to expand their automotive electronic components business by accelerating the development of new products and technologies to respond to these changes in the automotive field.

Special | Report
Electrified Vehicles Rev up Progress of Components
Generally, electronic components for xEVs pursue downsizing and higher efficiency. For parts on autonomous driving, solid-state LiDAR are making progress. Developments related to body control systems are directed towards functional enhancement, while higher heat resistant components are demanded for powertrain systems.

here has been an accelerated shift to electrified vehicles (xEVs) to promote global environment protection and lower fuel consumption. New electronic components have been developed one after another to push the market proliferation of xEVs.

Components for xEVs
To drive a motor of xEVs, various electronic components are used in the main constituting units of xEVs, such as inverter, DC/DC converter, on-vehicle charger, and battery. High-performance magnets with both high heat resistance and magnetic property are used in motors to achieve compact and high-power motors.

Special | Report
Article subtitle
Smart Agriculture Sets to Revolutionize Farming Industry
With unique farming solutions, the agricultural sector can benefit from IOT-DRIVEN precision mapping systems, ocean farming, artificial intelligence, and unmanned vehicles to improve their traditional farming processes. Digi-Key’s broad array of components and technologies stand ready to serve this industry in the future.

he internet of things (IoT) is almost ubiquitous now, it is everywhere; and agriculture is truly one of the areas where it can have the biggest impact. Smart farming in the agriculture industry is an emerging concept that has the opportunity to revolutionize farming for the digital era. The driving force of smart farming is IoT, which connects the agriculture process from start to finish to be more data-driven, data-enabled and efficient, while also optimizing the human labor involved.

Man working on Drone
Drones will become key equipment in smart agriculture.
Solving the challenges of modern agriculture will set farmers, agtech (agricultural technology) designers and others involved in the technology up for explosive growth this year and beyond. The future of smart agriculture brings so much excitement, as well as the benefits it will have on the entire farming community.
Special | Report
Article tab
Advance Chip Making to Address Advent of Novel Trends
The emergence of cutting-edge applications has brought technological challenges on the lap of chip makers, who have been employing new techniques not only to scale down chip circuitries but to accommodate data-driven and bandwidth-hungry applications.

s the industry welcomes 2021 with optimism, chip makers are bracing for a new wave of growth amid the emergence of data-hungry application such as artificial intelligence (AI) and machine learning, as well as other applications related to fifth-generation (5G) communication standard. These enablers are expected to create huge demand for compute power and data storage spaces.

However, chip makers also find themselves on the receiving end of technological challenges as data-driven applications call for innovations in chip-making technologies and chip architecture.

AI and machine learning neural networks will clamor for more of data to feed itself, squeezing the need for more storage spaces and compute resources. The same is true with the rapid adoption of 5G technology, which is creating data explosion in almost all computing devices from smartphones to personal computers to data centers.

Entegris Bankrolls Capital for New Manufacturing Facility in Taiwan

ntegris, Inc., a leading supplier of advanced materials and process solutions for the semiconductor and other high-technology industries, will expand its manufacturing presence in Taiwan with an investment of approximately US$200 million over the next three to five years.

Entegris plans to commence construction of the new facility in early 2021 and expects to begin initial operations in late 2021 as it ramps to full production in subsequent phases. Located in Southern Taiwan’s Kaohsiung Science Park, the new, 27,000 square-meter facility will develop and produce solutions critical to chipmakers. These include filters for microcontamination control, gas delivery systems, advanced chemistries, and other Entegris products and services. The site where the new facility will be located totals approximately 61,700 square meters, which will allow for the expansion of manufacturing capacity, as needed.

Technological Evolution of 5G Outpaces LTE

n 2020, the global shipment of smartphones dropped more than 10 percent compared to 2019 owing to sluggish economic activities amid the novel coronavirus (COVID-19) pandemic. However, fifth-generation (5G) communication system grew dramatically, mainly in China, with nearly 300 million units of smartphones shipped in 2020 alone. This pace of proliferation of 5G is faster than that of Long-Term Evolution (LTE), which emerged in 2009 (Fig. 1).

In North America, the shift of mobile communications networks to 5G has been rapidly progressing with the release of radio frequency bands from 3 to 5GHz called mid-band and the use of dynamic spectrum sharing (DSS), which flexibly divides the resource of a single radio frequency band into LTE and 5G in accordance with demand.

Inverters Play Crucial Role to Achieve Sustainable Society

nverters are power conversion devices that convert direct current (DC) power into alternating current (AC) power. Inverters that are incorporated in home electric appliances, such as air conditioners and washing machines, as well as elevators and industrial robots, control the rotation speed of motors by adjusting the voltage and frequency of AC power.

Promote Energy-Efficient Motors
Aids energy savings, energy creation, energy storage
Inverters contribute to energy saving of motors in a wide range of fields. Motors are estimated to account for about 50 percent of total power consumption in the world. As the use of electric vehicles (EVs) become a global trend, the demand for motors and inverters continues to increase, signifying growing interests on energy savings.

Inverters also suppress power consumption of devices that do not incorporate a motor. For example, brightness of fluorescent lights and temperature adjustment of induction heaters (IH) are efficiently controlled by inverters to suppress power consumption (Figure).

Small Lithium Ion Batteries Exhibit Excellent Characteristics

n 2019, Nichicon Corporation released the SLB Series small lithium ion secondary battery. The SLB Series uses lithium titanate (LTO) for the negative electrode to achieve a high input and output density comparable to that of an electric double layer capacitor (EDLC), and can correspond well to rapid charge and discharge at a 20C rate.(*1)

This durable battery features a small capacity deterioration even if charging and discharging are repeated for tens of thousands of cycles at a high rate. It has excellent low temperature characteristics, allowing to function even in an environment of −30°C. Also, it is almost completely free from precipitation of lithium metal, which causes short circuits and deterioration, making it a safe power storage device with extremely low risk of being ignited and/or emitting smoke.

ROHM’s Reference Design Simplifies ADAS, Infotainment Systems

n recent years, the importance of advanced driver-assistance systems (ADAS) that support high level of Automotive Safety Integrity Level (ASIL) has increased as automobile accident prevention measures and autonomous driving progress. For safe automated driving, accurate sensing, timely control and fast display imaging are necessary. For the unit to achieve safety requirements, it is also necessary to monitor the internal operating conditions and to take care of any lack of functionality because of unit failure. In order to achieve this, the number of installed cameras and sensors to monitor any external situation has been increasing and multifunctionality to inform and display these situations are required in the infotainment system. With the addition of electronic circuits to monitor the operating conditions in each unit, the electronic circuits are becoming more complex and a greater amount of time is being devoted to the design of units and systems.

Market Requirements for Reference Design
In terms of increasing the number of on-board units and the number of required functions, the electronic circuits of ADAS/infotainment peripheral units require more complex designs, such as optimal combination of cost, size and characteristics, highly-efficient power supply, design for the automotive units and many elements, and safety function.

ePTFE-Reinforced PEM Improves Fuel Cell Durability, Reduces Costs

urability is also a critical performance factor that affects the life of a fuel cell system. The DOE target for fuel cells is 5,000 hours (approximately 150,000 miles of driving) under realistic operating conditions. Typically, the lifetime of PEM is determined by its ability to withstand mechanical and chemical degradation occurring together in real-world conditions.

Mechanical durability
Relative humidity (RH) cycling is the primary mechanism for mechanical degradation. Increasing and decreasing RH during operation causes cyclic swell/shrink of PEM, which can lead to cracks and holes. Degradation can result in a steady decline in performance or catastrophic failure of the fuel cell stack. Using reinforced membranes significantly reduces swelling (Figure 5), improves RH cycling durability, and extends the PEM life. However, there is a generally known trade-off: the reinforcement material increases the membrane’s resistance, resulting in lower performance. Also, inappropriate reinforcement may not have the effect of ensuring sufficient durability.

Component | Materials

Toray Yields Eco-Friendly PET Films from Used Electronic Components
The company has established a collection and recycling system for used films from electronic component applications to develop the eco-friendly PET film.

oray Industries, Inc., has developed Ecouse (pronounced eco-use) polyethylene terephthalate (PET) films. It succeeded in constructing a recycling system by collecting used films from electronic component applications, and recovering eco-friendly films that help materialize a sustainable economy. After setting up an annual production capacity of 2,500 metric tons, the company will bring the product to mass production.

PET films are used in diverse applications, including electronic components, packaging materials, and display items. The supply chain of electronic components from film production through disposal is relatively short, prompting moves to consider recycling systems. The challenge, however, has been an absence of techniques to remove diverse coatings, resins, and other materials from each process in the supply chain. This has hampered reusing materials in films, so the focus has been on waste disposal and thermal recycling.

Component | Materials

ITOCHU Co-Develops Material Recycling Technology for Multi-Layer Film Packaging
Together with Toyo Ink, ITOCHU will create a material recycling technology for multi-layer film packaging and aims to attain 40 percent material cycling rate.

TOCHU Corporation has recently entered into an agreement for the cooperative development of material recycling technology for multi-layer film packaging with Toyo Ink SC Holdings Co., Ltd. Following the agreement, they target practical use of a high-quality material recycling by 2022 utilizing the technologies and networks of both companies.

Environmental solutions to address the problem of disposable plastics have been getting attention. In Japan, while about 16 percent of plastic eliminated as waste is simply burned, buried, or otherwise processed without being reused, about 56 percent relies on incineration methods, such as thermal recycle and heat reclaiming. Today, large amounts of plastic are not recycled. In particular, food packaging, refill pouches for detergent and other sanitary products, and film packaging, known as flexible packaging, feature a multi-layer structure that uses different materials to ensure the required performance, which differs based on use. This includes printed ink and adhesives between the polyolefin or polyester film. A major problem in recycling these materials is the difficulty in separating the layers.

Component | Materials

High Durability Alloy Supports Pin-In-Paste Method
KOKI’s original alloy provides less strain that arise between the components and the substrates, and prevents damage to components.

OKI Co., Ltd. has put on the market the HR6A58-G820N original high durability alloy, which supports the pin-in-paste (through hole) method.

The solder paste combines optimal amounts of elements that increase liquidus temperature and elements that lower solidus temperature. It effectively suppresses lifting-off that generates at the joining section of insertion components, such as connectors, and has been a problem with conventional high durability alloys. It suppresses the progress of cracks in the thermal cycle.

Provides High Ductility, Strength

The new alloy adopted in HR6A58-G820N is designed to provide high ductility, strength, and heat resistance to the joining section after soldering. By rendering ductility to the joining section, it alleviates the strain due to the difference of thermal expansion coefficients between components and the substrate and prevents damage to components.

Component | Materials

Sputtering Target Reduces Light Reflectance of Display TFT Wiring
Mitsubishi Materials’ blackening film sputtering target was designed to achieve higher definition of display and reduce noise caused by reflected light.

itsubishi Materials Corporation has started mass production of DIABLA blackening film sputtering target for display thin-film transistor (TFT) wiring.

Sputtering targets are electronic materials used to form thin films by depositing substances, such as alloys and metal oxides, on electronic substrates at an atomic level. Sputtering targets for blackening film are used to blacken wiring by depositing a film on the TFT wiring of organic light-emitting diode (OLED) or LCD panels, and reduce the visible light reflectivity of the TFT wiring (reduced reflection).

view of the DIABLA's external appearance
External appearance of DIABLA

Component | Materials

Teijin, SEMCORP to Develop Solvent-Based Coating Separators
Through a comprehensive license agreement, the two companies will manufacture solvent-based coating separators for lithium ion batteries used in electronic devices and storage systems.

eijin Limited has signed a technical license agreement with Shanghai Energy New Materials Technology Co., Ltd. (SEMCORP), a leading producer of base films for lithium ion secondary batteries (LiBs), to manufacture solvent-based coating separators used in LiBs for electric vehicles and additional applications, such as electronic devices and energy storage systems. The comprehensive agreement also includes Teijin’s development of new solvent-based coating separators.

Through the agreement, Teijin expects to strengthen its market presence by offering new separators for LiBs one after another. Teijin is committed to steadily improve its coating technologies for extra safe and efficient separators. For SEMCORP, the agreement will allow the company to expand its manufacture and sale of solvent-based coating separators that meet the functionality and safety needs of customers.

Rexxam Bolsters Production Systems, Augments Portfolio
To maximize business potentials and growth, the company is reinforcing its production systems and is expanding its product portfolio to meet evolving demand requirements of wide range of industries.

exxam Co., Ltd. offers diverse businesses, including printed circuit board assembly (PCBA) automated optical inspection (AOI) systems business, electronic manufacturing services (EMS), and semiconductor-related equipment business. While bolstering its production system not only in Japan but also overseas, the company has been expanding the models mainly of PCBA AOI systems, including a model with an artificial intelligence (AI) function.

Hiroyuki Sumida, Vice President, Rexxam Co., Ltd. said the company was not quite optimistic to expect growth because of the U.S.-China trade tensions since 2019 and then the novel coronavirus (COVID-19) pandemic in 2020, which both have impacted the global economy.

Hiroyuki Sumida, Vice-President, Rexxam Co., Ltd.
Hiroyuki Sumida, Vice-President, Rexxam Co., Ltd.
Multitask Machines Cut Tools, Space in Production Floor
The new multitask machine from FUJI highlights improved flexibility, automation and versatility, giving manufacturers the ability to consolidate machines used in factory floors and save on costs and space.

UJI Corporation has developed GYROFLEX T4000, a robot-equipped multitasking machine, bringing together the company’s sophisticated technologies in cutting and automation of machine tools.

For the past years, the manufacturing industry had to deal with production challenges that have been hampering productivity in the manufacturing floor. To address this issue, FUJI has proposed the GYROFLEX T4000 as a solution to address these challenges with its built-in characteristics anchored on flexibility, automation, and versatility.

Front of the GYROFLEX T4000 multitasking machine
GYROFLEX T4000 multitasking machine
Yamaha Motor Robots Strike Balance Between Cost, Reliability
The compact yet highly rigid new models deliver high reliability and durability to support various manufacturing needs and supports requirements for smart factory.

amaha Motor Co., Ltd. has expanded its Robonity Series of single-axis robots with the introduction of the ABAS basic model and the AGXS advanced model as well as the EP-01 robot positioner set. The company’s Robonity, a play on “robot” and “infinity”, expresses a series with a rich array of variations.

Highlighting greater usability, the new models come with improved operability and supports industrial internet of things (IIoT) requirements, maintaining high quality features and longer life cycle that have been developed through the company’s vast experience in robot development for the last 40 years.

HORIBA MIRA to Open Autonomous Vehicle Development Center

ORIBA MIRA Limited is set to open this month ASSURED CAV, a comprehensive connected autonomous validation (CAV) ecosystem. ASSURED CAV offers comprehensive support from the design of CAV to verify actual vehicles.

The new, globally unique autonomous vehicle development center is set to provide the most complete environment for the acceleration of future mobility. It has been specifically designed to enable the automotive industry, policy makers and government to develop autonomous vehicle technology, ensuring it is robust to the wide range of eventualities seen on public roads, before being released to consumers.

Test | Measurement
Power Electronics Creates Market for Measuring Instruments
Aside from power and current measurement for power semiconductors for the industrial field, electric vehicles offer huge potentials for measurement instruments of power devices.

ower electronics, a power conversion technology using power semiconductors, are used in a wide range of fields from automobiles to electric trains. They are also employed in the industrial field, like electrical infrastructure, particularly in utility power grids and home electric appliances, such as air conditioners and induction heaters. All these electronic products that use power electronics require the measurements of power and current. Targeting the development of equipment and devices with improved conversion efficiency, new demand for measurements have emerged.

With the trend toward the electrification of vehicles, the use of next-generation semiconductors that use silicon carbide (SiC) and gallium nitride (GaN) in place of conventional silicon (Si) is anticipated, and the development of power electronics technology has advanced, necessitating measurements that meet the advancement of power electronics technology.

Companies Team up to Advance Automotive Mobility Solutions
The management integration of the companies led by Hitachi Automotive Systems will utilize the existing resources to create sophisticated technologies and solutions and respond to industry demands.

itachi Automotive Systems, Ltd., Keihin Corporation, Showa Corporation and Nissin Kogyo Co., Ltd. concluded management integration to form Hitachi Astemo, Ltd., which will aim to become a leading provider of mobility solutions to the automotive industry. The name “Astemo” is derived from the words “Advanced Sustainable Technologies for Mobility” and describes the mission of the integrated company to “provide a safe, sustainable and comfortable mobility life through technologies that contribute to an advanced and sustainable society”.

Accelerate Development
Driven by technological megatrend of Connected, Autonomous, Sharing and Electrification (CASE), the automotive industry is undergoing profound change requiring companies to have the scale and resources to create the leading technologies and sophisticated solutions required for today’s mobility demands.
BYTON, Foxconn Collaborate to Boost EV Development
The partnership will pave the way for the fusion of expertise of the two companies and provide backbone in the production of a new electric vehicle that aims to foster the advancement of the EV industry.

YTON and Foxconn Technology Group, along with Nanjing Development Zone, have entered a strategic cooperation framework agreement to jointly accelerate production of BYTON’s electric vehicle model M-Byte. Actual production is targeted by first quarter of 2022.

Alignment of Vision
According to the agreement, Foxconn will provide its expertise in advanced manufacturing technology, solid operational management experience, and will share industrial resources to support the production of BYTON’s M-Byte. The series version of the premium electric sports utility vehicle (SUV) BYTON M-Byte celebrated its premiere at the IAA Frankfurt in 2019, featuring seamless connectivity and unique user experience. The partnership will advance the growth of each company’s EV business and foster a greater development of the EV industry.
Renesas, Microsoft to Accelerate Connected Vehicle Development
R-Car of Renesas will make use of Microsoft’s Connected Vehicle Platform and Azure internet of things (IoT) to improve development efficiency for cloud-based mobility devices.

enesas Electronics Corporation has collaborated with Microsoft Corporation to accelerate the development of connected vehicles. Renesas’ R-Car Starter Kit, based on Renesas’ R-Car automotive system-on-chip (SoC), is now available as a development environment for the Microsoft Connected Vehicle Platform (MCVP). MCVP combines a partner ecosystem with a horizontal platform of Azure cloud, AI and edge services on top of which mobility companies can build customer-facing solutions. Renesas has also been certified for Azure IoT Hub and Azure IoT Edge.

Deliver Value-Add Services
MCVP helps mobility companies accelerate the delivery of digital services across vehicle provisioning, two-way network connectivity, and continuous over-the-air updates of compartmentalized functionality. Within the Renesas development environment, customers can utilize MCVP components and Renesas Board Support Package (BSP) in addition to multimedia package for R-Car. In addition, the R-Car Starter Kit is certified as an Azure IoT Edge device.
Touchless Panel Projects Holographic Images, Operates in Midair

ai Nippon Printing Co Ltd. (DNP) has adopted the Lippmann hologram technology to develop HOLOTOUCH DNP touchless panel, which displays images floating on air. The display can be operated by touching the image with a finger.

Lippmann hologram excels in the expression of three-dimensional (3D) images and can project images on the air away from the film. It can be done by irradiating light of a point light source, like a light-emitting diode (LED), onto a film, where the images are recorded, from a certain angle. The floating distance can be adjusted up to about 50mm.

Touchless Panel Device
HOLOTOUCH makes use of the Lippmann hologram technology to float on air operation buttons drawn on the film, combined with a sensor that detects the position on air using infrared rays. HOLOTOUCH is DNP’s original system with patent still pending. As a lightweight and compact touchless input terminal, it allows the operation of an existing information terminal without directly touching its surface.

Research Sets Record in Multimode Optical Fiber Transmission

world record transmission of 1Pbit/sec in a multimode optical fiber increases the current record data rate in multimode optical fibers by more than 2.5 times.

Wideband optical transmission in fibers with more than 15 modes is demonstrated for the first time, enabled by mode multiplexers and a transmission fiber optimized for high optical bandwidth.

This demonstration advanced high-density and large capacity transmission in optical fibers that can be produced with standard methods.

A group of researchers from the Network System Research Institute of Japan’s National Institute of Information and Communications Technology (NICT) led by Georg Rademacher; NOKIA Bell Labs (Bell Labs, USA) led by Nicolas K. Fontaine; and Prysimian Group of France led by Pierre Sillard succeeded in the world’s first transmission exceeding 1Pbit/sec in a single-core multi-mode optical fiber. This increases the current record transmission in a multi-mode fiber by a factor of 2.5 times.

Hyperfluorescence Resolves Efficiency, Life Issues of Blue OLED

sing a new combination of emitter molecules, researchers in Japan have demonstrated the promise of a novel approach to finally overcome a major challenge facing organic light-emitting diodes (OLED) displays, that is, a blue light source that matches the excellent performance of the red and green.

The researchers split energy conversion and emission processes between two molecules, achieving devices that produce pure-blue emission with high efficiency, maintain brightness for relatively long times, and lack any expensive metal atoms, which have been difficult to obtain simultaneously so far.

Challenge with Blue OLEDs
OLEDs are acclaimed for their vibrant colors and ability to form thin and even flexible devices as they use carbon-containing molecules to convert electricity into light.

Interface Connectors Increase Safety of SRS Devices

apan Aviation Electronics Industry, Ltd. (JAE) has introduced the MX72C/D Series squib connector for automotive supplemental restraint system (SRS) devices. The new product conforms to international interface standards ISO-19072-5 and USCAR 999-U-002-1-Z04 with omitted shorting bar (shunt-less), which is becoming popular in the United States as well as countries in Europe.

Enables Secure Engagement
Recent changes to automotive passenger safety requirements worldwide serve as a catalyst to an increased level of collision safety performance, especially in countries in Europe and the United States. In addition to the common SRS devices found in a vehicle, new applications such as knee, thorax, and pedestrian airbags have started to become a trend to ensure safety of drivers, passengers, and even pedestrians.

Antennas Play Key Role in Connector Makers’ Business

eading connector manufacturers have been strengthening their antenna business. Setting their sights on fifth-generation (5G) communications, internet of things (IoT), low power wide area (LPWA) communication, and automotive devices, they aim to bring their business into a new platform by developing high-performance, high-reliability antennas leveraging radio frequency (RF) technologies they have nurtured over long years.

With the full implementation of 5G, expansion of IoT, and increase in demand for connected cars, the market of antenna-equipped devices is expected to expand in the medium term.

Eyeing these trends, connector manufacturers have been stepping up the development of original antennas, which are compact and high-performance and support diverse frequency bands. They are endeavoring to provide solutions to a wide range of applications, and aim to expand their antenna business, targeting diverse fields, including social infrastructure monitoring systems, connected homes, connected cars, and smart factories, as well as various mobile terminals and wireless solutions.

Robust Chip Demand Spreads from Automotive to IT Market

hat started to take place in the automotive market is rapidly spreading to the consumer market, fueling fears that chip fabrication capacity will run short of demand even for information technology (IT) devices, like PCs, smartphones, and other smart gadgets.

The contract chip-making business unit of Samsung Electronics Co., Ltd. is aiming to boost its chip fabrication capacity, as IT vendors are rushing in droves to buy Samsung Foundry’s fabricated chips.

The world’s second largest foundry chipmaker has been running its foundry chip-making facilities at full throttle since November last year, but still cannot keep up with the surge in demand. For example, the contract chipmaker is in a quandary on how to allocate its resources across its customers, as its captive customers Mobile Business Unit of Samsung Electronics and Qualcomm are requiring more resources to fabricate their respective system-on-chip (SoCs). Specifically, it is having trouble keeping up with the rush of order for Exynos 2100 5nm circuitry mobile application processor chips, as its 5nm chip fabrication capacity is being shared among its customers.

Radio Wave Visualization Technique Rolls Non-Stop Production

he National Institute of Information and Communications Technology (NICT) and Toyota Motor Corporation have successfully conducted an experiment on stabilization technology for radio wave systems that support production sites, including visualization of radio waves. By visualizing radio waves, the technology detects unregistered terminals that have been brought in, and prevents the stoppage of the production line by eliminating the effects of congestion of unplanned radio waves. Toyota will continue doing trial demonstration by successively deploying the technology to factories other than the one where the experiment was conducted, aiming to put the technology into practical use in an early stage.

Trial Demonstrations
In the trial demonstration conducted this time, NICT constructed an experiment system, conducted the experiment, and analyzed data. Toyota has set up an experiment environment, including that of the production line of a factory, as well as support system for the implementation of experiment.

Business | Strategy
Partnership Lifts Production Efficiency of Motors for EVs

ITTOKU Co., Ltd. has commercialized a laser welding machine for motors of electrified vehicles (xEVs) in collaboration with Furukawa Electric Co., Ltd. NITTOKU has combined its factory automation (FA) control and image processing technologies with Furukawa Electric’s laser welding technology and copper material characterization technology to improve efficiency of customers’ motor production process, including higher speed, simplification, and quality stabilization. NITTOKU also created an original production system for motors.

Enhance Added Values
NITTOKU has developed the Linear Index Transfer system (LITs) for production lines by applying various technologies related to automated production, including control, transfer, handling, image processing, sensing, and communication technologies, the company has nurtured the production of automatic coil winding machines used in a variety of fields, including motors, transformers, speaker voice coils and sensors. Using this transfer system as a platform, the company has been expanding its global business into a precision FA engineering company by promoting open innovation with other companies.

Data Acquisition System Achieves ASIL-D Compliance for BMS

sing the MAX17852 14-channel, high-voltage, ASIL-D data-acquisition system from Maxim Integrated Products, Inc., automotive battery management systems (BMS) can deliver the highest level of safety for voltage, current, temperature and communication while also contributes to saving space and reducing solution cost. Designed for integration within electric vehicles, hybrid electric vehicles, and other transportation systems, the IC is ideal for smart junction box, 48V and other automotive battery systems, which can see voltages up to 400V and beyond.

“Enabling systems to achieve the highest level of safety (ASIL D) for a BMS system is really a must for consumers to feel safe in their electrified vehicles,” said Tamer Kira, Executive Director for the Automotive Business Unit at Maxim Integrated. “MAX17852 is the fastest and most accurate in voltage, current and temperature measurements, and that is why it is the first battery data acquisition system in the industry to achieve the highest safety rating for all the major components of a BMS system.”

Company | On the move
IRISO ELECTRONICS Puts Weight on High-Speed Connectors

RISO ELECTRONICS CO., LTD. has been stepping up the development of high-speed transmission connectors with the release of two connector series. The company’s 11530 Series Auto I-Lock flexible printed circuit (FPC)/flexible flat cable (FFC) connectors support 25Gbps, while the 10143 Series floating board-to-board connector is equipped with power supply terminals and supports 16Gbps.

The company adds value to its new connection solutions with the addition of high-speed transmission feature to Auto I-Lock and floating, which are the company’s two specialized technologies.

The company offers the 11530 Series Auto I-Lock FPC/FFC connectors that support 25Gbps as a differentiated product by multiplying support of high-speed transmission and its original Auto I-Lock technology. Supporting high-speed transmission of 25Gbps, the 11530 Series secures high-speed transmission paths that are necessary for 5G base stations and servers.

Support High-Speed Transmission
Fifth-generation (5G) communications require high-speed transmission of 25Gbps. However, it is difficult to satisfy this specification through transmission using substrate pattern. The 25Gbps transmission capability has been achieved using Auto I-Lock, which has been received well in automatic assembly, and an FFC.

President and Chief Executive Officer, IRISO ELECTRONICS CO., LTD.
Ikuo Yuki, President and Chief Executive Officer, IRISO ELECTRONICS CO., LTD.
JAE Sets Sights on Eco-Friendly Vehicles for Business Growth

n this sit-down interview with AEI, Tsutomu Onohara, President, Japan Aviation Electronics Industry, Limited (JAE), lays down the company’s business focus for 2021. He said the company expects growth of connectors to come from mobile phones, information and communications, and environment-friendly vehicles, putting emphasis on the expansion of the automotive market considering the growing concern for the environment.

AEI: How do you describe the recent business trend?

Onohara: At present, the second wave of COVID-19 infection is a concern. Nonetheless, the demand for mobile devices and automobiles, which are the company’s main markets, is back on the recovery track.

President, Japan Aviation Electronics Industry, Limited (JAE)
Tsutomu Onohara, President, Japan Aviation Electronics Industry, Limited (JAE)
Product | News
Semiconductors & ICs
ML7436N Wireless Communication LSI by LAPIS
ML7436N Wireless Communication LSI by LAPIS
LAPIS Technology Co., Ltd. has developed the high-performance ML7436N multiband wireless communication LSI, covering sub-1GHz (400 to 960MHz) and 2.4GHz frequency bands. It also supports sub-1GHz communications. It is equipped with an Arm Cortex-M3 32-bit CPU core capable of high-speed operation and a 1,024KB large-capacity memory. It exhibits stable wireless characteristics against environmental changes, such as voltage and temperature changes, and realizes high-quality and stable communication indoors and outdoors. It incorporates a hardware engine, which supports various encryption standards, such as Advanced Encryption Standard (AES) and Direct Memory Access (DMA) controller, which is optimal for packet processing. Thus, it reduces the load on CPU to 1/2,000 of conventional product. It also incorporates a new hash function and a true random number generator (TRNG) with enhanced random properties, enabling secure and high-reliability communications. The company provides the LSI for smart meters, smart street lights and other infrastructure devices, as well as for smart factories and smart logistics.
LAPIS Technology Co., Ltd.
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