May 2020
Asia Electronics Industry
May 2020 Volume 25, Serial No. 284

ASIA ELECTRONICS INDUSTRY (ISSN 1342-422X) is published monthly by Dempa Publications, Inc., 1-11-15 Higashi Gotanda, Shinagawa-ku, Tokyo 141-8715, Japan Tel: +81-3-3445-6111 Fax: +81-3-3445-6890. Editorial e-mail:; Subscription e-mail:

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Cover | Story

asertec Corporation develops, manufactures, and sells semiconductor-related inspection systems for leading-edge chipmaking, energy and environment-related equipment, flat panel display (FPD)-related equipment, and laser microscopes. Guided by its corporate philosophy, “Create unique solutions. Create new value,” Lasertec has been striving to achieve business growth with a mission statement, which is “Be the frontrunner of the optical technology field and help customers overcome new challenges.”

Lasertec developed ACTIS A150 actinic extreme ultraviolet (EUV) patterned mask inspection system, the first ever system that uses EUV light for patterned mask inspection, and started marketing it in Sept. 2019.

EUV lithography is a crucial technology for enabling semiconductor manufacturers to achieve the further miniaturization of IC patterns. It is vital for implementing fifth-generation (5G) communications, artificial intelligence (AI), and advanced driver-assistance systems (ADAS). In 2019, leading chipmakers started to prepare for mass production using EUV lithography, and the installation of EUV systems has been in progress on a full scale.

Group portrait of Osamu Okabayashi, President & Representative Director, and ACTIS A150 development team members
Osamu Okabayashi, President & Representative Director, and ACTIS A150 development team members grace the cover of AEI May issue at Lasertec’s head office building in Yokohama, Kanagawa Prefecture. From left, Masanori Hasegawa, Engineer, Technology Department 5; Hiroki Miyai, General Manager, Technology Department 5; Daisuke Ishii, Engineer, Technology Department 5; Okabayashi, President & Representative Director; Yuta Kanehara, Technology Department 5; and Sumire Aoki, Technology Department 2, all from Lasertec Corporation.
AEI News
STMicroelectronics, TSMC Collaborate on GaN-Based Products

SWITZERLAND and TAIWAN – STMicroelectronics (ST) and Taiwan Semiconductor Manufacturing Company Limited (TSMC) have agreed to accelerate the development of gallium nitride (GaN) process technology and the supply of both discrete and integrated GaN devices to market. Through this collaboration, ST’s innovative and strategic GaN products will be manufactured using TSMC’s leading GaN process technology.

GaN is a wide bandgap semiconductor material that offers significant benefits over traditional silicon-based semiconductors for power applications. These benefits include greater energy efficiency at higher power, leading to a substantial reduction in parasitic power losses.

Additionally, GaN-based devices switch at speeds as much as 10× faster than silicon-based devices while operating at higher peak temperatures. These characteristics make GaN ideally suitable for automotive, industrial, telecom, and specific consumer applications across both the 100V and the 650V clusters.

ST expects the delivery of first samples of power GaN discrete devices to its key customers later this year, followed by GaN IC products within a few months.;

In View | This Month
Demand for 7nm Process Peaks, Players Eye 5nm


n the manufacture of leading-edge logic semiconductors, the demand for 7nm process technology for the production of integrated circuits with a line width of 7nm has been rapidly increasing.

Taiwan Semiconductor Manufacturing Company Limited (TSMC), which is one of the leading foundry players, took the lead in the industry and started mass producing integrated circuits using 7nm process technology in Q2 (Apr. to Jun.) of 2018. Since then, TSMC has produced cutting-edge chips for leading fabless companies, such as U.S. companies Apple Inc., Qualcomm Inc. and AMD Corporation; MediaTek Inc. of Taiwan; and HiSilicon Technology Co., Ltd. of China.

In Q4 (Oct. to Dec.) of 2019, sales of 7nm products expanded to 35 percent, making 7nm process the company’s representative process.

Special | Report
Enablers of IoT typography
NICHICON’s New Energy Storage Complements IoT Demand
The advent of internet of things (IoT) applications requires sound and stable power supply. The new lithium ion rechargeable battery with energy harvesting feature emerges as a viable alternative in IoT application areas where stable power supply is unavailable.

he market for the internet of things (IoT) is expected to grow substantially in the coming years with IoT technology being adopted in increasingly broad situations. This is prompted by the launch of fifth-generation (5G) mobile communications system, which enables high-speed, large-capacity, low-inactivity, and multi-connectivity networks. It allows for the spread of low-cost, low-power-consumption communication networks, such as low-power wide-area (LPWA) networks.

When IoT sensors are installed in areas where stable supply of power is unavailable, the use of energy storage devices is required. Primary (non-rechargeable) batteries are often used, but they need to be replaced due to their short lifespan. Replacing primary batteries with secondary rechargeable batteries and integrating them with energy harvesting devices that convert light, heat, vibration, and radio wave energies into electricity can create an independent, maintenance-free system to power IoT sensors. This has increased the market demand for rechargeable batteries optimized for IoT sensor applications.

Film Solar Cell Powers Self-Reliant IoT Sensor System


research group composed of Ricoh Electronic Devices Co., Ltd., Nichicon Corporation, and a team from Kyoto University’s Institute for Chemical Research led by Professor Atsushi Wakamiya, has developed a self-supporting power supply internet of things (IoT) environment sensor system using a film-based perovskite solar cell, the first of its kind. The IoT environment sensor system was showcased at CEATEC Japan held in Oct. 2019.

Development Background
The progress of low-cost and low-power-consuming data communications technologies, such as low power wide area (LPWA) and Bluetooth Low Energy (BLE), as well as big data analysis using artificial intelligence (AI), are expected to develop the IoT edge terminal market, and expand their use in various situations. Although there is no problem in IoT edge terminals connected to commercial power supplies, an energy storage device is however needed when they are installed in locations with unavailable power supply. In many cases, primary batteries with short service lives are used as energy storage devices, and they need to be replaced periodically.

Special | Report
Smart Home-Related Components title
Makers Eye Superior Components, Modules for Smart Homes
As more homes are anticipated to turn smart in the future, component makers are adopting new technologies to achieve highly efficient energy use and safe and comfortable living environment, which are the end goals of smart homes.

lectronic components manufacturers have been putting strengths in developing components and modules for a smart home, the proliferation of which is expected in the future. They are promoting technological development to enhance performance and efficiency of equipment and systems that constitute a smart home, aiming to contribute to the realization of highly efficient energy use and safe and comfortable living environment.

A smart home is a next-generation environment-friendly house, which uses energy efficiently by making the most of energy creation systems, such as photovoltaic (PV) power generation system and home-use fuel cell system; energy storage system, such as home-use storage battery, electrified vehicles (xEVs), such as electric vehicle (EV) and plug-in hybrid vehicle (PHV); home energy management systems (HEMS); and internet of things (IoT) technology. To realize the effective use of energy and contribute to low carbon society, more smart homes are expected to be implemented in the coming years. In addition, a secure and safe, convenient, and comfortable living environment is sought through the use of IoT and artificial intelligence (AI).

Special | Report
Smart Home-Related Components title
Korea Clings as Global Hub of Smart Home Solutions Providers
The enormous potentialS of the smart home market have reinvigorated the entire technology ecosystem, aiming to have a share in this fast-growing market segment. Korean companies startED the foray EARLIER and are expected to dominate in this field.

mart homes of today are where connectivity, automation, sensing, and artificial intelligence technologies meet to connect smart devices, home appliances, sensors and even traditional home fittings like curtains, doors and windows to control and manage security, electricity, lighting, temperature, humidity, and even various home gadgets.

Tech Convergence in the Home
One use case is how Lee Sung Soon, a Korean housewife, recently made a retrofit of her three-room apartment with an array of smart home gadgets, smart sensors, and smart home fittings to make her family members as immune as possible from the outbreak of the novel corona virus disease (COVID-19) pandemic. The housewife thought smart home system not only can save energy costs but can also create a comfortable, clean, safe and secure home environment for the entire family.

Special | Report
5G Developments in Korea title
Korea Reaps 5G Gains as First Industry Mover
Korea’s first-mover strategy in the 5G market pans out AS IT starts to harvest the gains from the influx of demand for telecommunications equipment, service operation and even immersive contents.

orea has been a first mover in fifth-generation (5G) mobile communications, and this strategy is significantly paying off as exports of 5G telecommunications equipment and 5G service contents are starting to take off.

As the first country that rode on the information super-highway, Korea deserves to become a global test bed to optimize 5G technologies.

In terms of base stations installation, about 2,000 buildings across the country, spanning supermarkets, major subway stations and airports, and department stores, will have built-in 5G base stations in 2020 to serve as hub for 5G services. About 200 factories will be connected to 5G networks, enabling operation of smart factories powered by a huge amount of sensors and massive internet of things (IoT) platform.

Special | Report
Broadcasting Technologies text
Hitachi Kokusai Showcases New Camera Systems, DTV Transmitters
With continuous evolution of its camera technologies, Hitachi Kokusai expands HDTV options for industry professionals in search for the most optimal broadcasting solution.

itachi Kokusai Electric Inc. continues to make key technology innovations practical and cost effective for broadcasters and production professionals by evolving support for emerging technologies in its latest HDTV camera systems.

Powerful New CCU Features
The CU-HD550 camera control unit (CCU) (Photo 1) and its accessory, CA-HF550 camera adapter, collectively lower the cost of entry for 1080p60 video production. Also compatible with interlaced Z and SK-Series Hitachi HDTV cameras, the full possibilities of these latest accessories are unleashed when combined with 1080p60-native Hitachi camera heads to form robust acquisition systems with completely progressive signal paths, further bolstering benefits for progressive workflows.

Special | Report
Broadcasting Technologies text
NHK Propels Next-Generation Broadcasting Technology
NHK continues to drive innovations as its research arm, NHK Science & Technology Research Laboratories (STRL), digs deep on the development of a new media that will change the way people experience and view contents across multitude of devices.


apan Broadcasting Corporation (NHK) continues to advance 8K technologies in the wake of its 8K satellite broadcasting in 2018. The company is also looking towards the future by further evolving its broadcast media to suit its “Diverse Vision” development.

Large 8K displays, augmented reality/virtual reality (AR/VR) devices, three-dimensional (3D) displays, haptic devices, and other emerging devices will be widespread in the future among users in addition to smartphones and tablets.

The ways in which users engage with programs and contents will be even more diverse than they are now (Fig. 1). Therefore, the media will evolve along a new axis, presentation dimensions, as well as along the traditional evolving axes, quality and functionality (Fig. 2), by using various devices.

Chip NTC Thermistors Support 5G Device Temperature Monitoring


ifth-generation (5G) wireless standard is beginning to spread in earnest. In 5G networks, where transmission speeds will increase dramatically, the load on related components will also increase. This is because the amount of information to be processed by each individual component per unit time will also increase massively.

Moreover, images and videos, which will probably account for much of the data traffic, will have higher definition, and components surrounding the camera will handle information in larger amounts and at higher speeds. Power supplies that sustain such information processing also require high-speed charging of high-capacity batteries.

Nichicon Keeps up with 5G Capacitor Requirements


ext-generation high-speed communication standard fifth-generation (5G) mobile communication system is expected to heighten needs for different kinds of capacitors.

Compared to conventional 4th-generation mobile communication system/Long-Term Evolution (4G/LTE), 5G is characterized by advanced high speed and large capacity, ultralow latency, and multiple terminal connection features. For this reason, new services, such as telemedicine utilizing high-definition image transmission and Level 3 autonomous driving, are expected to be realized through 5G. It can also serve as a basic technology supporting internet of things (IoT). Commercial 5G services were launched in 19 countries in 2019. In Japan, a pre-service has been provided and the full service is scheduled to start before summer this year (Fig. 1).

JAE Heightens Features of Board-to-Board Connectors for 5G


ommercial services of fifth-generation (5G) mobile communications will start this year, and 5G is expected to be used in all kinds of future devices with the proliferation of internet of things (IoT) (Fig. 1).

Japan Aviation Electronics Industry, Ltd. has been putting efforts into smartphones and base stations, where demand is evident. Also, the company has started to offer proposals to the industrial machinery market for local 5G, which is expected to grow in the future.

Board-to-Board Connectors for Smartphones
Today’s typical board-to-board connectors used in smartphones have a pitch of 0.35mm and a stacking height of 0.6 to 0.8mm. The company achieves high quality and stable supply by using fully automatic assembly machines for production.

Enabling 5G and the Future of Robotics


f robotics and cellular communications seem strange bedfellows, it’s because the fifth generation of wireless, 5G, is the first to wirelessly address the need of such applications rather than just increasing data rates and expanding coverage as previous generations did. This ambitious standard, called IMT-2020 by the International Telecommunications Union (ITU) that globally regulates them, will accomplish this by completely revolutionizing the way cellular networks are built, the devices they can connect with, the frequencies at which they operate, and the applications they serve.

The fifth generation of wireless technology will pave the way for a new generation of robots, some free to roam controlled via wireless rather than wired communications links and exploiting the vast computing and data storage resources of the cloud. Armed with these capabilities, robots can be precisely controlled dynamically in near real time, and be connected to people and machines locally and globally. In short, 5G will fully enable applications such as the “factory of the future” and many, many others that were previously beyond the capabilities of both cellular and robotics technologies.

Parts Makers Strengthen Foray to Automotive Field
Electronic component companies have been working to have their global production facilities earn the coveted International Automotive Task Force (IATF) certifications as a seal of their readiness to meet stringent requirements of the automotive field.

apanese electronic components manufacturers have been stepping up efforts to obtain certification for IATF16949, an international quality management standard specific to the automobile industry, to meet the increasing importance of the automotive market.

Components manufacturers give strong emphasis on activities that will help them earn the certification, particularly on new bases and business departments, which have not yet obtained the certification. These endeavors aim to enhance competitiveness in order to receive orders and expedite full-scale entry into the automotive electronics market.

Component | Materials
Ultrathin Organic Solar Cell Meets Efficiency, Durability
The group combined a new power generation layer with a simple post-annealing treatment to achieve this renewable solar cell.

cientists from the RIKEN Cluster for Pioneering Research and RIKEN Center for Emergent Matter Science have succeeded, in collaboration with international partners, in creating an ultrathin organic solar cell that is both highly efficient and durable. Using a simple post-annealing process, they created a flexible organic cell that degrades by less than 5 percent over 3,000 hours in atmospheric conditions and that simultaneously has an energy conversion ratio of 13 percent.

In Search for Efficient Ultrathin Films
Organic photovoltaics are considered to be a promising alternative to silicon-based conventional films, being more environmentally friendly and cheap to produce. Ultrathin flexible solar cells are particularly attractive, as they could provide large power per weight and be used in a variety of useful applications, such as powering wearable electronics and as sensors and actuators in soft robotics. However, ultrathin organic films tend to be relatively efficient, typically having an energy conversion ratio of around 10 to 12 percent, significantly lower than the ratio in silicon cells, which can be as high as 25 percent, or of rigid organic cells, which can be up to around 17 percent. Ultrathin films also tend to degrade rapidly under the influence of sunlight, heat, and oxygen. Researchers are trying to create ultrathin films that are both energy efficient and durable, but often a difficult tradeoff.

In a research published in Proceedings of the National Academy of Sciences of the United States of America, the group has showed that an ultrathin cell can be both durable and efficient. The group began with a semiconductor polymer for the donor layer, developed by Toray Industries, Inc., and experimented with a new idea that uses a non-fullerene acceptor, increasing the thermal stability. On top of this, they experimented with a simple post-annealing process, where the material was heated to 150ºC after an initial annealing at 90ºC. This step proved to be critical in increasing the durability of device by creating a stable interface between the layers.

Component | Materials
JFE Chemical Puts Additional Investment in APB
The latest capital infusion intends to support the establishment of a mass production technology for hard carbon, a material for polymer batteries.

FE Chemical Corporation has decided to make additional investment in APB Corporation, which develops, manufactures, and sells next-generation lithium ion batteries called “All Polymer Battery.” The company has decided to make additional investment in a third-party allotment of new shares by APB, following its investment in April 2019. With this, JFE Chemical will become APB’s second largest shareholder next to Sanyo Chemical Industries, Ltd.

Manufacturer of Polymer Battery
APB is a startup company, which was established in Oct. 2018 to manufacture and sell all polymer batteries, which are considered as next-generation lithium ion batteries.
Diamond Film Reduces Heat Generation of GaN HEMT

ujitsu Limited and Fujitsu Laboratories Ltd. have developed the first technology for growing a diamond film with highly efficient heat dissipation on the surface of gallium nitride (GaN) high electron mobility transistors (HEMTs), which are used in power amplifiers for technologies like weather radars and communications equipment. The new design reduces the amount of heat generated by the devices during operations by 40 percent, leading to simplification of the cooling system and making it possible to miniaturize radar systems that rely on GaN HEMTs. This improvement to the design will make it significantly easier to install larger numbers of devices for applications, like improved weather forecasting and 5G communications.

This research was partially supported by Innovative Science and Technology Initiative for Security, established by the Acquisition, Technology & Logistics Agency (ATLA) of the Japanese Ministry of Defense.

Research Succeeds in Higher Efficiency Printable Organic PVs

joint research team composed of Hiroshima University, Osaka University, Kyoto University, Chiba University, and Japan Synchrotron Radiation Research Institute (JASRI) has developed a unique semiconducting polymer containing fluorine atoms. The organic photovoltaics (OPVs) fabricated by coating this semiconducting polymer has been found to have higher output voltage and higher energy conversion efficiency (the efficiency of converting solar energy into electric power).

It was clarified also how the position of fluorine atoms in the chemical structure of the semiconducting polymer affects their properties as a semiconductor and the characteristics of OPV.

Insulated ICs Emerge for Future Power Electronics Systems

oshiba Corporation has developed two kinds of insulated ICs realizing next-generation small, energy-saving, and highly reliable power electronics systems. The initial IC is the first single-package bidirectional multiplex transmission IC that realizes two-way communication of three different signals and power transmission of 100mW or more, and is fabricated in a method requiring no special manufacturing processes. It is aimed at miniaturization and increasing reliability of electrical motorization of mobility and motor systems. The second IC is a high-speed insulated measurement IC that can be installed in power supply systems for servers in data centers that require high-speed operation. Toshiba aims to offer sample products in FY2022 and thereafter.

Requirements of Power Electronics Systems
Power electronics systems necessary for power conversion and control are installed in all types of appliances, as well as electric motors of mobility systems and industrial equipment. In order to realize a sustainable society, it is important to reduce the size and weight, save energy, and improve reliability of power electronics systems.

Technology | HIGHLIGHT
Low-Cost Technology Connects 5G Relay Lines Wirelessly

oshiba Corporation has developed a technology for wirelessly connecting high-speed backhaul (relay) lines between terminal and backbone lines in the next-generation high-speed communication standard 5G. This technology eliminates the need to install cables, like optical fibers, and enables the installation of 5G wireless backhaul lines at a cost of one-tenth of conventional technology.

Polarized MIMO-OFDM Plus Distortion Correction
The developed technology combines the existing “Polarized multiple-input multiple-output (MIMO) – orthogonal frequency-division multiplexing (OFDM)” and a newly developed technology for distortion correction. In the Polarized MIMO-OFDM, large-capacity and high-speed communications can be achieved by using waves (electromagnetic waves) with two polarizations – horizontal and vertical – between several receiving antennas. The combination has enabled stable wireless communications with high capacity and high speed.

IN THE KNOW | Capacitors
Capacitor Features Evolve Along 5G, Autonomous Driving, xEVs

ccording to global shipment statistics compiled by the Japan Electronics and Information Technology Industries Association (JEITA), shipments of capacitors, mainly those for smartphones and automobiles, have been expanding since 2013. Although there have been ups and downs, capacitors for the industrial equipment field have also expanded its market scale.

Since fall 2018, demand for capacitors, mainly for high-end smartphones, has slowed down. In addition, robust investments in plants and equipment mainly in China slowed down as well. The growth rate in demand for capacitors for smartphones in 2019 dropped along with the slow demand for capacitors for industrial equipment. In addition, sales of new cars in China and countries in Europe fell from the previous year, while global sales of automobiles also fell from the previous year.

Multiple-Camera Smartphones Become Irreversible Trend

martphones with triple or even quadruple cameras built in are now trending out as a main distinctive feature of high-end premium models, increasingly becoming a decisive factor for consumers’ choices of smartphone.

“Cameras are at the center of smartphone makers’ product differentiation strategy. The competition in the market is now focusing on how to enable users to shoot life-like picture as possible with wider and faster zoom and ultrahigh definition functionality,” said Mike Yoon, Director at Dongwoon Anatech, a Korean fabless chip maker.

“The concept of triple and quadruple camera phone is all about how to take a shot of highly detailed and ultrahigh-definition picture even in low-light or dimly-lit environments. If you have more cameras and more lenses, you can shoot life-like pictures of greater details and ultra-high-resolution,” he added.

Components for 5G Smartphones Continue to Shrink

he implementation of next-generation 5G communication standard has driven the further miniaturization of chip components.

At present, 1005-size chip components, like multilayer ceramic capacitors (MLCCs), make up the largest percentage among chip components incorporated in smartphones. However, chip components in 5G smartphones featuring advanced functions will be downsized to 0402-size, and the adoption of 0201-size is also expected to start.

5G smartphones incorporate various functions by making the most of the high-speed and large-capacity features of 5G. For this reason, the number of components constituting circuits has increased, like more than 800 MLCCs, and the dependence on ultra-miniature chip components has been increasing.

New Materials, Process Adoption Yield High-Frequency PCBs

here has been expanding developments of printed circuit boards (PCBs) that support high-frequency bands against the backdrop of the implementation of fifth-generation (5G) communications and the spread of millimeter wave radars. The development of base materials with new qualities and new process technologies for PCBs have been accelerating proposals and mass production of diverse high-frequency PCBs.

In 5G, high-speed and large- capacity functions; low signal latency; and simultaneous connection of multiple terminals dramatically improve. High-frequency technologies are also required to improve functions of the safety system, including millimeter wave radars, for autonomous driving. Hence, PCBs with good electrical characteristics and support high-frequency bands become indispensable, and high-speed processing, which does not degrade electric signals, is required. Thus the development of PCB materials has become active.

Samsung Display Finds Brighter Prospects for QD Technology

amsung Display Co., Ltd. will gradually phase out its LCD production lines in Korea and China to pin its future on quantum dot (QD) display technology.

The company said on March 31 that it would close a 7-Gen LCD fab line in Asan, Korea and an 8-Gen line in Suzhou, China sometime in 2020 to complete its exit out of LCD business. The 7-Gen and 8-Gen lines have been running at monthly capacity of 165,000 and 363,000 glass substrates, respectively.

As a new strategic focus, Samsung Display, one of the largest flat panel display (FPD) makers, plans to concentrate all of its R&D and financial resources on QD technology to create a new segment of the TV market in the way that the company had done LCD TV in mid-2000s.

New Development of High-Capacitance MLCCs Picks up Steam

ew product development of multilayer ceramic capacitors (MLCCs) has been gathering momentum.

Aside from the slowdown of the global economy, economic activities have significantly declined as well because of the novel coronavirus, and as a result, the prolonged demand-supply imbalance has relaxed.

Electronic component makers have focused their development efforts on fifth-generation (5G) high-speed communication standard and advanced driver-assistance systems (ADAS) driving autonomous driving.

Largest Capacitance in 0201-size
Responding to the growing 5G-compatible smartphones and compact wearable terminals with more functions, Murata Manufacturing Co., Ltd. has developed a small 0201-size MLCC, achieving for the first time a large capacitance of 0.1μF.

Business | Strategy
TOWA Maps out Medium-Term Plan, Builds up New Businesses

OWA Corporation has mapped out its third four-year medium-term management plan, under which the company targets sales of ¥50 billion (US$459 million), operating profit of ¥8 billion, recurrent profit of ¥8 billion (US$73 million), and current net profit of ¥5.6 billion (US$51 million) in the term ending March 2024 (FY2023).

This is the final phase of TOWA 10 Year Vision, which the company implemented since FY2014. With the theme of “Achieving TOWA 10 Year Vision Implementing Paradigm Shift,” the company targets sales of ¥36.1 billion in its semiconductor manufacturing equipment, chemical products, and laser processing systems businesses, and sales of ¥13.9 billion (US$127.8 million) from new businesses, including total solution services (TSS), and tooling business, which includes sales of originally developed tools, and original equipment manufacturing.

Business | Strategy
MCNEX Makes Huge Bet on Automotive Camera Systems

oday’s cars are increasingly built with multiple cameras, as advanced driver assistance systems (ADAS) are rapidly becoming an indispensable part of car electronic systems, allowing car drivers to have a view of its surroundings to avoid a car collision and detect by-passers in a blind spot. In the future, cars are seen to come with at least seven built-in cameras.

The unstoppable trend proves a big boon to a company like MCNEX Co., Ltd, a Korean camera module maker for smartphones, automobiles, smart glasses, and smart home security.

Business | Strategy
Otax Heightens Sales of High Precision Machines in China

utosys Intelligent Equipment Co., Ltd., the Chinese subsidiary of Otax Co., Ltd. and is located in Shenzhen in China’s Guangdong Province, has been solidifying its sales pitch for various types of manufacturing equipment. Leveraging technological capabilities the company has earned in developing equipment for in-house production for installation in factories of the Otax Group, Autosys Intelligent Equipment will step up sales of manufacturing equipment to companies outside the group.

Otax established Autosys Intelligent Equipment as an independent company in spring of 2018 by spinning off the production technology department of OTAX Electronics (Shenzhen) Co., Ltd., which is Otax’s mother plant in Shenzhen. Autosys Intelligent Equipment specializes in the design and manufacture of production equipment. Since then, the company started the manufacture and sale of manufacturing equipment to external customers aside from supplying automated machines to Otax Group’s facilities worldwide.

Product | News
Modules & IC
Epson’ S2D13V52 Scaler IC
Epson’ S2D13V52 Scaler IC by Seiko Epson Corporation
Seiko Epson Corporation has begun sample shipment of the newly developed S2D13V52, a scaler IC for in-vehicle systems that upscales or downscales image data streamed from a host and outputs it on a display. Vehicle electrification and automation are seen driving future demand for higher resolution displays in in-vehicle systems, such as instrument clusters and central information displays. The S2D13V52 scaler IC does not need external memory and uses a proven System-on-Chip, facilitating rapid development of display systems with the desired resolution. The AEC-Q100-compliant scaler IC operates at 105ºC, and supports input cropping and area blanking. Images can be displayed on panels of various resolutions without changing the aspect ratio of images.
Seiko Epson Corporation
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