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			<title>Micron to Soar U.S. Chip Talent With New Center</title>
			<pubDate><![CDATA[Wed, 26 Aug 2026 02:42:27 +0000]]></pubDate>
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			<guid><![CDATA[https://aei.dempa.net/archives/35225]]></guid>
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			<title>Delta Electronics to Accelerate Data Center Buildouts</title>
			<pubDate><![CDATA[Wed, 17 Jun 2026 06:41:42 +0000]]></pubDate>
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			<guid><![CDATA[https://aei.dempa.net/archives/35343]]></guid>
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			<title>Bosch Secures $225M to Boost US SiC Chip Output</title>
			<pubDate><![CDATA[Wed, 15 Jul 2026 08:47:10 +0000]]></pubDate>
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			<guid><![CDATA[https://aei.dempa.net/archives/35346]]></guid>
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			<title>Tower Boosts Chip Grit With New Growth Plans in Japan</title>
			<pubDate><![CDATA[Wed, 15 Jul 2026 08:34:10 +0000]]></pubDate>
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			<guid><![CDATA[https://aei.dempa.net/archives/35387]]></guid>
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			<title>Renesas Shifts Takasaki Strategy to Boost R&amp;D</title>
			<pubDate><![CDATA[Wed, 05 Aug 2026 09:37:32 +0000]]></pubDate>
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			<guid><![CDATA[https://aei.dempa.net/archives/33927]]></guid>
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			<title>UVJP to Scale Manufacturing Tech to New Heights</title>
			<pubDate><![CDATA[Wed, 02 Sep 2026 02:27:14 +0000]]></pubDate>
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			<guid><![CDATA[https://aei.dempa.net/archives/34133]]></guid>
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			<title>Murata Philippines Sees New Trends to Stir MLCC Growth</title>
			<pubDate><![CDATA[Wed, 02 Sep 2026 02:13:05 +0000]]></pubDate>
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			<guid><![CDATA[https://aei.dempa.net/archives/34227]]></guid>
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			<title>Stable Demand to Boost Mouser’s Grit in South Asia</title>
			<pubDate><![CDATA[Wed, 02 Sep 2026 01:26:00 +0000]]></pubDate>
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			<guid><![CDATA[https://aei.dempa.net/archives/34824]]></guid>
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			<title>Applied Angstrom’s New Atomic Precision Hub Targets AI Chips</title>
			<pubDate><![CDATA[Wed, 02 Sep 2026 01:25:09 +0000]]></pubDate>
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			<guid><![CDATA[https://aei.dempa.net/archives/34878]]></guid>
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			<title>How Atomic Precision Is Changing Chip Manufacturing</title>
			<pubDate><![CDATA[Wed, 02 Sep 2026 01:24:11 +0000]]></pubDate>
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			<guid><![CDATA[https://aei.dempa.net/archives/34994]]></guid>
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			<title>Motion Control Redefines Yield in Advanced Packaging</title>
			<pubDate><![CDATA[Wed, 02 Sep 2026 01:23:12 +0000]]></pubDate>
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			<guid><![CDATA[https://aei.dempa.net/archives/34841]]></guid>
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			<title>India Executes Semiconductor Policy Into Full‑Stack Growth</title>
			<pubDate><![CDATA[Wed, 02 Sep 2026 01:22:15 +0000]]></pubDate>
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			<guid><![CDATA[https://aei.dempa.net/archives/34929]]></guid>
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			<title>India Braces for US$400B Electronics Peak by 2030</title>
			<pubDate><![CDATA[Wed, 02 Sep 2026 01:21:21 +0000]]></pubDate>
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			<guid><![CDATA[https://aei.dempa.net/archives/34970]]></guid>
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			<title>India’s Quantum Leap: Scaling Hardware, Securing Sovereignty</title>
			<pubDate><![CDATA[Wed, 02 Sep 2026 01:15:15 +0000]]></pubDate>
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			<guid><![CDATA[https://aei.dempa.net/archives/35431]]></guid>
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			<title>India to Boost Global Chip Role at SEMICON India 2026</title>
			<pubDate><![CDATA[Wed, 02 Sep 2026 01:12:34 +0000]]></pubDate>
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			<guid><![CDATA[https://aei.dempa.net/archives/35247]]></guid>
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			<title>India Targets to Grow from Chip Equipment Boom</title>
			<pubDate><![CDATA[Wed, 02 Sep 2026 01:11:47 +0000]]></pubDate>
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			<guid><![CDATA[https://aei.dempa.net/archives/35296]]></guid>
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			<title>SEMI: AI Boom to Fuel Memory Fab Spending Past US$50B</title>
			<pubDate><![CDATA[Tue, 30 Jun 2026 07:07:00 +0000]]></pubDate>
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			<guid><![CDATA[https://aei.dempa.net/archives/35370]]></guid>
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			<title>Pax Silica to Power Philippines&#8217; AI Vision</title>
			<pubDate><![CDATA[Tue, 28 Jul 2026 04:07:00 +0000]]></pubDate>
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			<guid><![CDATA[https://aei.dempa.net/archives/35360]]></guid>
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			<title>Siemens to Boost AI-Powered SoC Design in New Deal</title>
			<pubDate><![CDATA[Tue, 21 Jul 2026 11:07:00 +0000]]></pubDate>
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			<guid><![CDATA[https://aei.dempa.net/archives/35422]]></guid>
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			<title>Lam Research to Soar R&amp;D with New US$3B Investments</title>
			<pubDate><![CDATA[Tue, 18 Aug 2026 13:05:43 +0000]]></pubDate>
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			<guid><![CDATA[https://aei.dempa.net/archives/35261]]></guid>
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			<title>Breakthrough Brings 2D Transistors to 300mm Wafers</title>
			<pubDate><![CDATA[Tue, 16 Jun 2026 10:11:47 +0000]]></pubDate>
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			<title>Intel Strengthens Europe Supply Chain with €5B</title>
			<pubDate><![CDATA[Tue, 14 Jul 2026 03:07:00 +0000]]></pubDate>
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			<guid><![CDATA[https://aei.dempa.net/archives/35392]]></guid>
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			<title>NVIDIA Unlocks US$500B in New AI Compute Financing Market</title>
			<pubDate><![CDATA[Tue, 11 Aug 2026 03:07:00 +0000]]></pubDate>
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					<item>
			<guid><![CDATA[https://aei.dempa.net/archives/35395]]></guid>
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			<title>Kioxia, Sandisk Set New QLC NAND Density Record</title>
			<pubDate><![CDATA[Tue, 11 Aug 2026 02:08:44 +0000]]></pubDate>
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			<guid><![CDATA[https://aei.dempa.net/archives/35322]]></guid>
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			<title>Micron Expands Automotive Push with New Ford Deal</title>
			<pubDate><![CDATA[Tue, 07 Jul 2026 07:07:00 +0000]]></pubDate>
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			<guid><![CDATA[https://aei.dempa.net/archives/35318]]></guid>
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			<title>APEM, Alps Alpine Expand HMI Alliance in Europe</title>
			<pubDate><![CDATA[Tue, 07 Jul 2026 01:07:00 +0000]]></pubDate>
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			<guid><![CDATA[https://aei.dempa.net/archives/35380]]></guid>
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			<title>UMC to Accelerate AI Growth With New Expansions</title>
			<pubDate><![CDATA[Thu, 30 Jul 2026 10:07:00 +0000]]></pubDate>
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			<guid><![CDATA[https://aei.dempa.net/archives/35376]]></guid>
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			<title>Delta to Target AI Growth with New Malaysia Office</title>
			<pubDate><![CDATA[Thu, 30 Jul 2026 08:07:38 +0000]]></pubDate>
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			<guid><![CDATA[https://aei.dempa.net/archives/35270]]></guid>
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			<title>Adani, Jabil Target AI Hardware Demand Surge</title>
			<pubDate><![CDATA[Thu, 18 Jun 2026 09:32:16 +0000]]></pubDate>
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					<item>
			<guid><![CDATA[https://aei.dempa.net/archives/35266]]></guid>
			<link><![CDATA[https://aei.dempa.net/archives/35266]]></link>
			<title>Fuji’s New CLT-FG Machine Boosts Flexible Production</title>
			<pubDate><![CDATA[Thu, 18 Jun 2026 08:26:45 +0000]]></pubDate>
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					<item>
			<guid><![CDATA[https://aei.dempa.net/archives/35350]]></guid>
			<link><![CDATA[https://aei.dempa.net/archives/35350]]></link>
			<title>TEL Accelerates Fab Automation With NVIDIA AI</title>
			<pubDate><![CDATA[Thu, 16 Jul 2026 08:20:58 +0000]]></pubDate>
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					<item>
			<guid><![CDATA[https://aei.dempa.net/archives/35407]]></guid>
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			<title>Sony, TSMC Forge Powerful Image Sensor JV</title>
			<pubDate><![CDATA[Thu, 13 Aug 2026 02:55:31 +0000]]></pubDate>
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			<guid><![CDATA[https://aei.dempa.net/archives/35404]]></guid>
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			<title>Onto to Soar X-Ray Chip Push in New Rigaku Investment</title>
			<pubDate><![CDATA[Thu, 13 Aug 2026 02:29:12 +0000]]></pubDate>
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			<guid><![CDATA[https://aei.dempa.net/archives/35325]]></guid>
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			<title>Sumitomo, Samsung Electro-Mechanics to Form New JV for Chip Materials</title>
			<pubDate><![CDATA[Thu, 09 Jul 2026 05:23:39 +0000]]></pubDate>
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			<guid><![CDATA[https://aei.dempa.net/archives/35299]]></guid>
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			<title>Kyocera Expands Chip Supply Capacity With New Plant</title>
			<pubDate><![CDATA[Thu, 02 Jul 2026 09:37:46 +0000]]></pubDate>
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			<guid><![CDATA[https://aei.dempa.net/archives/35291]]></guid>
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			<title>Applied Materials to Soar AI Chips with New Systems</title>
			<pubDate><![CDATA[Mon, 29 Jun 2026 01:54:27 +0000]]></pubDate>
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			<guid><![CDATA[https://aei.dempa.net/archives/35280]]></guid>
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			<title>ST to Boost Edge AI With New LiDAR Solution</title>
			<pubDate><![CDATA[Mon, 22 Jun 2026 10:07:00 +0000]]></pubDate>
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			<guid><![CDATA[https://aei.dempa.net/archives/35276]]></guid>
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			<title>SK hynix to Power AI Growth With Advance HBM4E</title>
			<pubDate><![CDATA[Mon, 22 Jun 2026 06:32:30 +0000]]></pubDate>
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			<guid><![CDATA[https://aei.dempa.net/archives/35356]]></guid>
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			<title>esmo Expands Semiconductor Footprint With New Sites</title>
			<pubDate><![CDATA[Mon, 20 Jul 2026 11:07:00 +0000]]></pubDate>
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			<guid><![CDATA[https://aei.dempa.net/archives/35255]]></guid>
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			<title>Tower, IQE Sign InP Deal to Power AI Growth</title>
			<pubDate><![CDATA[Mon, 15 Jun 2026 09:15:36 +0000]]></pubDate>
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					<item>
			<guid><![CDATA[https://aei.dempa.net/archives/35384]]></guid>
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			<title>Marvell New Funding to Scale Tech Presence in India</title>
			<pubDate><![CDATA[Fri, 31 Jul 2026 07:07:00 +0000]]></pubDate>
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			<guid><![CDATA[https://aei.dempa.net/archives/35454]]></guid>
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			<title>Renesas to Boost Robotics With New Beijing AI Lab</title>
			<pubDate><![CDATA[Fri, 28 Aug 2026 07:07:00 +0000]]></pubDate>
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			<guid><![CDATA[https://aei.dempa.net/archives/35451]]></guid>
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			<title>Kioxia, Sandisk Reinforce NAND Leadership With $31B</title>
			<pubDate><![CDATA[Fri, 28 Aug 2026 05:07:00 +0000]]></pubDate>
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			<guid><![CDATA[https://aei.dempa.net/archives/35443]]></guid>
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			<title>Fujifilm Opens New AI Chip Materials Line in Oita</title>
			<pubDate><![CDATA[Fri, 28 Aug 2026 02:17:34 +0000]]></pubDate>
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			<guid><![CDATA[https://aei.dempa.net/archives/35285]]></guid>
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			<title>IBM Unveils Breakthrough 0.7nm Chip Tech</title>
			<pubDate><![CDATA[Fri, 26 Jun 2026 09:14:18 +0000]]></pubDate>
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			<guid><![CDATA[https://aei.dempa.net/archives/35364]]></guid>
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			<title>AI Materials Foundry to Power Faster R&amp;D Breakthrough</title>
			<pubDate><![CDATA[Fri, 24 Jul 2026 02:01:56 +0000]]></pubDate>
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			<guid><![CDATA[https://aei.dempa.net/archives/35434]]></guid>
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			<title>Koh Young Expands Production for AI Growth</title>
			<pubDate><![CDATA[Fri, 21 Aug 2026 02:07:00 +0000]]></pubDate>
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			<guid><![CDATA[https://aei.dempa.net/archives/35333]]></guid>
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			<title>Micron to Soar US Investments to US$250B Amid AI Surge</title>
			<pubDate><![CDATA[Fri, 10 Jul 2026 01:07:00 +0000]]></pubDate>
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			<guid><![CDATA[https://aei.dempa.net/archives/35311]]></guid>
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			<title>Infineon to Boost Chip Capacity With New Power Fab</title>
			<pubDate><![CDATA[Fri, 03 Jul 2026 11:07:00 +0000]]></pubDate>
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			<guid><![CDATA[https://aei.dempa.net/archives/35303]]></guid>
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			<title>Micron, GM Lock in Memory Supply in New Strategic Deal</title>
			<pubDate><![CDATA[Fri, 03 Jul 2026 07:37:37 +0000]]></pubDate>
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