<?xml version="1.0" encoding="UTF-8"?>
<!-- This sitemap was dynamically generated on 2026-04-03 at 8:55 pm by All in One SEO v4.9.5.1 - the original SEO plugin for WordPress. -->

<?xml-stylesheet type="text/xsl" href="https://aei.dempa.net/default-sitemap.xsl"?>

<rss version="2.0" xmlns:atom="http://www.w3.org/2005/Atom">
	<channel>
		<title>AEI</title>
		<link><![CDATA[https://aei.dempa.net]]></link>
		<description><![CDATA[AEI]]></description>
		<lastBuildDate><![CDATA[Wed, 25 Mar 2026 07:59:06 +0000]]></lastBuildDate>
		<docs>https://validator.w3.org/feed/docs/rss2.html</docs>
		<atom:link href="https://aei.dempa.net/sitemap.rss" rel="self" type="application/rss+xml" />
		<ttl><![CDATA[60]]></ttl>

		<item>
			<guid><![CDATA[https://aei.dempa.net/archives/34849]]></guid>
			<link><![CDATA[https://aei.dempa.net/archives/34849]]></link>
			<title>Arm Launches AGI CPU: A Bold Pivot to AI Silicon</title>
			<pubDate><![CDATA[Wed, 25 Mar 2026 07:59:06 +0000]]></pubDate>
		</item>
					<item>
			<guid><![CDATA[https://aei.dempa.net/archives/34682]]></guid>
			<link><![CDATA[https://aei.dempa.net/archives/34682]]></link>
			<title>New IP Cores to Lift Automotive, Industrial Connectivity</title>
			<pubDate><![CDATA[Wed, 25 Feb 2026 08:59:39 +0000]]></pubDate>
		</item>
					<item>
			<guid><![CDATA[https://aei.dempa.net/archives/34819]]></guid>
			<link><![CDATA[https://aei.dempa.net/archives/34819]]></link>
			<title>NVIDIA, Partners to Take Physical AI to Real World</title>
			<pubDate><![CDATA[Wed, 18 Mar 2026 01:07:00 +0000]]></pubDate>
		</item>
					<item>
			<guid><![CDATA[https://aei.dempa.net/archives/34646]]></guid>
			<link><![CDATA[https://aei.dempa.net/archives/34646]]></link>
			<title>GF, Renesas New Deal to Boost to U.S. Chip Supply</title>
			<pubDate><![CDATA[Wed, 18 Feb 2026 08:19:34 +0000]]></pubDate>
		</item>
					<item>
			<guid><![CDATA[https://aei.dempa.net/archives/34642]]></guid>
			<link><![CDATA[https://aei.dempa.net/archives/34642]]></link>
			<title>Qualcomm to Soar India’s AI Startups with New Funding</title>
			<pubDate><![CDATA[Wed, 18 Feb 2026 08:02:43 +0000]]></pubDate>
		</item>
					<item>
			<guid><![CDATA[https://aei.dempa.net/archives/34765]]></guid>
			<link><![CDATA[https://aei.dempa.net/archives/34765]]></link>
			<title>IBM, Lam Research Eye Sub-1nm Era in New Collaboration</title>
			<pubDate><![CDATA[Wed, 11 Mar 2026 09:16:49 +0000]]></pubDate>
		</item>
					<item>
			<guid><![CDATA[https://aei.dempa.net/archives/34759]]></guid>
			<link><![CDATA[https://aei.dempa.net/archives/34759]]></link>
			<title>Lelon Electronics Opens New Thai Manufacturing Line</title>
			<pubDate><![CDATA[Wed, 11 Mar 2026 07:21:10 +0000]]></pubDate>
		</item>
					<item>
			<guid><![CDATA[https://aei.dempa.net/archives/34616]]></guid>
			<link><![CDATA[https://aei.dempa.net/archives/34616]]></link>
			<title>SEMI: AI Surge Drives Si Wafer Shipments in 2025</title>
			<pubDate><![CDATA[Wed, 11 Feb 2026 09:25:45 +0000]]></pubDate>
		</item>
					<item>
			<guid><![CDATA[https://aei.dempa.net/archives/34608]]></guid>
			<link><![CDATA[https://aei.dempa.net/archives/34608]]></link>
			<title>Keysight&#8217;s New Tool Allows AI at Scale in Chip Design</title>
			<pubDate><![CDATA[Wed, 11 Feb 2026 08:23:10 +0000]]></pubDate>
		</item>
					<item>
			<guid><![CDATA[https://aei.dempa.net/archives/34910]]></guid>
			<link><![CDATA[https://aei.dempa.net/archives/34910]]></link>
			<title>AEM, ASE to Spur New Phase in AI, HPC Test</title>
			<pubDate><![CDATA[Tue, 31 Mar 2026 07:18:06 +0000]]></pubDate>
		</item>
					<item>
			<guid><![CDATA[https://aei.dempa.net/archives/34907]]></guid>
			<link><![CDATA[https://aei.dempa.net/archives/34907]]></link>
			<title>Infineon’s New Module to Redefine AI Power Density</title>
			<pubDate><![CDATA[Tue, 31 Mar 2026 06:11:09 +0000]]></pubDate>
		</item>
					<item>
			<guid><![CDATA[https://aei.dempa.net/archives/34837]]></guid>
			<link><![CDATA[https://aei.dempa.net/archives/34837]]></link>
			<title>ST Expands IoT Lead: Begins MCU Production in China</title>
			<pubDate><![CDATA[Tue, 24 Mar 2026 05:31:08 +0000]]></pubDate>
		</item>
					<item>
			<guid><![CDATA[https://aei.dempa.net/archives/34678]]></guid>
			<link><![CDATA[https://aei.dempa.net/archives/34678]]></link>
			<title>HCL, Foxconn Break Ground of New OSAT Line in India</title>
			<pubDate><![CDATA[Tue, 24 Feb 2026 09:20:50 +0000]]></pubDate>
		</item>
					<item>
			<guid><![CDATA[https://aei.dempa.net/archives/34809]]></guid>
			<link><![CDATA[https://aei.dempa.net/archives/34809]]></link>
			<title>ST, Leopard Imaging to Soar Robot Vision with NVIDIA</title>
			<pubDate><![CDATA[Tue, 17 Mar 2026 08:03:23 +0000]]></pubDate>
		</item>
					<item>
			<guid><![CDATA[https://aei.dempa.net/archives/34814]]></guid>
			<link><![CDATA[https://aei.dempa.net/archives/34814]]></link>
			<title>NXP, NVIDIA Unveil Physical AI for Humanoid Robotics</title>
			<pubDate><![CDATA[Tue, 17 Mar 2026 08:03:03 +0000]]></pubDate>
		</item>
					<item>
			<guid><![CDATA[https://aei.dempa.net/archives/34806]]></guid>
			<link><![CDATA[https://aei.dempa.net/archives/34806]]></link>
			<title>NVIDIA Charts Agentic AI Era With New Vera Rubin</title>
			<pubDate><![CDATA[Tue, 17 Mar 2026 05:59:25 +0000]]></pubDate>
		</item>
					<item>
			<guid><![CDATA[https://aei.dempa.net/archives/34788]]></guid>
			<link><![CDATA[https://aei.dempa.net/archives/34788]]></link>
			<title>New Thai Plant to Soar Lelon’s Capacity Grit</title>
			<pubDate><![CDATA[Tue, 17 Mar 2026 03:10:30 +0000]]></pubDate>
		</item>
					<item>
			<guid><![CDATA[https://aei.dempa.net/archives/34638]]></guid>
			<link><![CDATA[https://aei.dempa.net/archives/34638]]></link>
			<title>AMD, TCS to Soar AI in India With Helios Architecture</title>
			<pubDate><![CDATA[Tue, 17 Feb 2026 02:07:00 +0000]]></pubDate>
		</item>
					<item>
			<guid><![CDATA[https://aei.dempa.net/archives/34709]]></guid>
			<link><![CDATA[https://aei.dempa.net/archives/34709]]></link>
			<title>ROHM Partners With India&#8217;s Suchi to Boost Chip Grit</title>
			<pubDate><![CDATA[Tue, 03 Mar 2026 09:14:24 +0000]]></pubDate>
		</item>
					<item>
			<guid><![CDATA[https://aei.dempa.net/archives/34689]]></guid>
			<link><![CDATA[https://aei.dempa.net/archives/34689]]></link>
			<title>Tower Semiconductor, Salience Labs to Advance Optical Circuit Switch Production</title>
			<pubDate><![CDATA[Thu, 26 Feb 2026 08:31:01 +0000]]></pubDate>
		</item>
					<item>
			<guid><![CDATA[https://aei.dempa.net/archives/34824]]></guid>
			<link><![CDATA[https://aei.dempa.net/archives/34824]]></link>
			<title>Applied Angstrom’s New Atomic Precision Hub Targets AI Chips</title>
			<pubDate><![CDATA[Thu, 19 Mar 2026 23:57:13 +0000]]></pubDate>
		</item>
					<item>
			<guid><![CDATA[https://aei.dempa.net/archives/34833]]></guid>
			<link><![CDATA[https://aei.dempa.net/archives/34833]]></link>
			<title>Fasford to Unveil New Die Bonder at SEMICON China</title>
			<pubDate><![CDATA[Thu, 19 Mar 2026 08:28:17 +0000]]></pubDate>
		</item>
					<item>
			<guid><![CDATA[https://aei.dempa.net/archives/34827]]></guid>
			<link><![CDATA[https://aei.dempa.net/archives/34827]]></link>
			<title>Hirose to Open New Automotive Connector Line in India</title>
			<pubDate><![CDATA[Thu, 19 Mar 2026 08:07:11 +0000]]></pubDate>
		</item>
					<item>
			<guid><![CDATA[https://aei.dempa.net/archives/34655]]></guid>
			<link><![CDATA[https://aei.dempa.net/archives/34655]]></link>
			<title>New Keysight Tools Meet Challenges of AI Data Centers</title>
			<pubDate><![CDATA[Thu, 19 Feb 2026 09:07:00 +0000]]></pubDate>
		</item>
					<item>
			<guid><![CDATA[https://aei.dempa.net/archives/34652]]></guid>
			<link><![CDATA[https://aei.dempa.net/archives/34652]]></link>
			<title>EV’s New System to Meet Needs of High Mix Production</title>
			<pubDate><![CDATA[Thu, 19 Feb 2026 07:47:16 +0000]]></pubDate>
		</item>
					<item>
			<guid><![CDATA[https://aei.dempa.net/archives/34781]]></guid>
			<link><![CDATA[https://aei.dempa.net/archives/34781]]></link>
			<title>Epson, Taiwan’s Manz to Use Inkjet Tech in Chipmaking</title>
			<pubDate><![CDATA[Thu, 12 Mar 2026 07:18:03 +0000]]></pubDate>
		</item>
					<item>
			<guid><![CDATA[https://aei.dempa.net/archives/34775]]></guid>
			<link><![CDATA[https://aei.dempa.net/archives/34775]]></link>
			<title>Applied Materials Taps Micron, SK Hynix as New R&amp;D Partners</title>
			<pubDate><![CDATA[Thu, 12 Mar 2026 01:07:00 +0000]]></pubDate>
		</item>
					<item>
			<guid><![CDATA[https://aei.dempa.net/archives/34622]]></guid>
			<link><![CDATA[https://aei.dempa.net/archives/34622]]></link>
			<title>Samsung Joins Applied’s EPIC Center, to Soar Chip R&amp;D</title>
			<pubDate><![CDATA[Thu, 12 Feb 2026 08:50:19 +0000]]></pubDate>
		</item>
					<item>
			<guid><![CDATA[https://aei.dempa.net/archives/34619]]></guid>
			<link><![CDATA[https://aei.dempa.net/archives/34619]]></link>
			<title>ST, AWS Seal New Deal on Cloud, AI Data Center Chips</title>
			<pubDate><![CDATA[Thu, 12 Feb 2026 01:07:00 +0000]]></pubDate>
		</item>
					<item>
			<guid><![CDATA[https://aei.dempa.net/archives/34724]]></guid>
			<link><![CDATA[https://aei.dempa.net/archives/34724]]></link>
			<title>Altera to Surge FPGA-Based AI for Robotics, Edge</title>
			<pubDate><![CDATA[Thu, 05 Mar 2026 09:19:37 +0000]]></pubDate>
		</item>
					<item>
			<guid><![CDATA[https://aei.dempa.net/archives/34697]]></guid>
			<link><![CDATA[https://aei.dempa.net/archives/34697]]></link>
			<title>Rapidus to Soar 2nm Chips in 2027 in New Funding Round</title>
			<pubDate><![CDATA[Thu, 05 Mar 2026 08:36:58 +0000]]></pubDate>
		</item>
					<item>
			<guid><![CDATA[https://aei.dempa.net/archives/34717]]></guid>
			<link><![CDATA[https://aei.dempa.net/archives/34717]]></link>
			<title>Tanaka’s New Transfer Tech to Boost Chip Performance</title>
			<pubDate><![CDATA[Thu, 05 Mar 2026 06:44:21 +0000]]></pubDate>
		</item>
					<item>
			<guid><![CDATA[https://aei.dempa.net/archives/34917]]></guid>
			<link><![CDATA[https://aei.dempa.net/archives/34917]]></link>
			<title>NVIDIA Expands AI Infrastructure With Marvell Alliance</title>
			<pubDate><![CDATA[Thu, 02 Apr 2026 01:07:00 +0000]]></pubDate>
		</item>
					<item>
			<guid><![CDATA[https://aei.dempa.net/archives/34872]]></guid>
			<link><![CDATA[https://aei.dempa.net/archives/34872]]></link>
			<title>LG Innotek to Accelerate Physical AI with New Alliance</title>
			<pubDate><![CDATA[Mon, 30 Mar 2026 08:08:46 +0000]]></pubDate>
		</item>
					<item>
			<guid><![CDATA[https://aei.dempa.net/archives/34673]]></guid>
			<link><![CDATA[https://aei.dempa.net/archives/34673]]></link>
			<title>Delta Electronics to Help Philippines’ Cebu Soar in EV</title>
			<pubDate><![CDATA[Mon, 23 Feb 2026 08:52:47 +0000]]></pubDate>
		</item>
					<item>
			<guid><![CDATA[https://aei.dempa.net/archives/34795]]></guid>
			<link><![CDATA[https://aei.dempa.net/archives/34795]]></link>
			<title>Micron to Surge Taiwan DRAM Grip, Closes PSMC Fab Deal</title>
			<pubDate><![CDATA[Mon, 16 Mar 2026 07:57:39 +0000]]></pubDate>
		</item>
					<item>
			<guid><![CDATA[https://aei.dempa.net/archives/34632]]></guid>
			<link><![CDATA[https://aei.dempa.net/archives/34632]]></link>
			<title>Yokogawa, ANYbotics to Automate Plant Inspections</title>
			<pubDate><![CDATA[Mon, 16 Feb 2026 08:32:50 +0000]]></pubDate>
		</item>
					<item>
			<guid><![CDATA[https://aei.dempa.net/archives/34751]]></guid>
			<link><![CDATA[https://aei.dempa.net/archives/34751]]></link>
			<title>ABB to Surge Grit in India With New US$75M R&amp;D Funding</title>
			<pubDate><![CDATA[Mon, 09 Mar 2026 08:34:10 +0000]]></pubDate>
		</item>
					<item>
			<guid><![CDATA[https://aei.dempa.net/archives/34700]]></guid>
			<link><![CDATA[https://aei.dempa.net/archives/34700]]></link>
			<title>Micron Inaugurates India’s First OSAT Line</title>
			<pubDate><![CDATA[Mon, 02 Mar 2026 08:07:25 +0000]]></pubDate>
		</item>
					<item>
			<guid><![CDATA[https://aei.dempa.net/archives/34841]]></guid>
			<link><![CDATA[https://aei.dempa.net/archives/34841]]></link>
			<title>India Executes Semiconductor Policy Into Full‑Stack Growth</title>
			<pubDate><![CDATA[Fri, 27 Mar 2026 07:16:40 +0000]]></pubDate>
		</item>
					<item>
			<guid><![CDATA[https://aei.dempa.net/archives/34858]]></guid>
			<link><![CDATA[https://aei.dempa.net/archives/34858]]></link>
			<title>ADI Expands Thailand Plant to Boost Supply Chain</title>
			<pubDate><![CDATA[Fri, 27 Mar 2026 06:51:04 +0000]]></pubDate>
		</item>
					<item>
			<guid><![CDATA[https://aei.dempa.net/archives/34692]]></guid>
			<link><![CDATA[https://aei.dempa.net/archives/34692]]></link>
			<title>ROHM-TSMC GaN Tech Deal: Securing Supply for AI, EV</title>
			<pubDate><![CDATA[Fri, 27 Feb 2026 08:44:05 +0000]]></pubDate>
		</item>
					<item>
			<guid><![CDATA[https://aei.dempa.net/archives/34669]]></guid>
			<link><![CDATA[https://aei.dempa.net/archives/34669]]></link>
			<title>Japan’s METI Approves GS Yuasa’s Li-Ion Battery Line</title>
			<pubDate><![CDATA[Fri, 20 Feb 2026 08:07:00 +0000]]></pubDate>
		</item>
					<item>
			<guid><![CDATA[https://aei.dempa.net/archives/34666]]></guid>
			<link><![CDATA[https://aei.dempa.net/archives/34666]]></link>
			<title>Tower, Scintil Offer First DWDM Lasers for AI</title>
			<pubDate><![CDATA[Fri, 20 Feb 2026 07:41:49 +0000]]></pubDate>
		</item>
					<item>
			<guid><![CDATA[https://aei.dempa.net/archives/34661]]></guid>
			<link><![CDATA[https://aei.dempa.net/archives/34661]]></link>
			<title>Microchip, Hyundai Partner on Advanced in-Vehicle Tech</title>
			<pubDate><![CDATA[Fri, 20 Feb 2026 02:07:00 +0000]]></pubDate>
		</item>
					<item>
			<guid><![CDATA[https://aei.dempa.net/archives/34629]]></guid>
			<link><![CDATA[https://aei.dempa.net/archives/34629]]></link>
			<title>Samsung Stirs Grit in AI Race With First HBM4 Chips</title>
			<pubDate><![CDATA[Fri, 13 Feb 2026 05:07:00 +0000]]></pubDate>
		</item>
					<item>
			<guid><![CDATA[https://aei.dempa.net/archives/34742]]></guid>
			<link><![CDATA[https://aei.dempa.net/archives/34742]]></link>
			<title>TI, NVIDIA Partner on Humanoid Safety With Real-Time Sensor</title>
			<pubDate><![CDATA[Fri, 06 Mar 2026 10:07:00 +0000]]></pubDate>
		</item>
					<item>
			<guid><![CDATA[https://aei.dempa.net/archives/34738]]></guid>
			<link><![CDATA[https://aei.dempa.net/archives/34738]]></link>
			<title>Fuji to Soar Chip Placement Tech as New SATAS Member</title>
			<pubDate><![CDATA[Fri, 06 Mar 2026 07:10:13 +0000]]></pubDate>
		</item>
					<item>
			<guid><![CDATA[https://aei.dempa.net/archives/34733]]></guid>
			<link><![CDATA[https://aei.dempa.net/archives/34733]]></link>
			<title>Ushio Closes Latest Deal on ams OSRAM’s Lamp Unit</title>
			<pubDate><![CDATA[Fri, 06 Mar 2026 07:03:28 +0000]]></pubDate>
		</item>
					<item>
			<guid><![CDATA[https://aei.dempa.net/archives/34878]]></guid>
			<link><![CDATA[https://aei.dempa.net/archives/34878]]></link>
			<title>How Atomic Precision Is Changing Chip Manufacturing</title>
			<pubDate><![CDATA[Fri, 03 Apr 2026 07:07:00 +0000]]></pubDate>
		</item>
				</channel>
</rss>
