Recently, Japanese automated machine maker, Tenryuseiki Co., Ltd. started shipping the TSP-770 solder paste printer, which features smallest-class equipment size. The printer was designed with mini and micro light-emitting diodes (LEDs) in mind.

Tenryuseiki works under the auspices of Serendip Holdings.

Supports Mounting of Micro LEDs

In recent years, more and more manufacturers are adopting mini LEDs and micro LEDs for use as backlights of smartphones, tablets, and large-size displays.

These LEDs are very small, measuring only about 0.3×0.3mm. In screen printing, the mask openings for these LEDs become very small, and the filling of solder paste cannot be done securely. Additionally, as the mounted LEDs on printed circuit boards (PCBs) are very small, PCBs must also undergo a significant reduction in size. Hence, existing equipment must achieve optimal equipment-occupied area productivity according to customers.

To address the said challenges, Tenryuseiki started the verification of fine printing three years ago. To this end, the company adopted the TH squeegee, which enables high levels of filling even if the mask opening is very small. At the same time, it enabled the printer to support up to M-size substrates, thus downsizing the printer. As a result, the printer improves equipment-occupied area productivity during fine-pitch printing. 

To secure the quality of fine pitch printing, solder paste and mask play significant parts, aside from equipment. Along this line, Tenryuseiki has put in place a system to secure the quality of fine-pitch printing. Moreover, it also addressed the challenges customers are facing through collaboration with manufacturers of solder paste and mask. Today, the company is already evaluating substrates with leading LED manufacturers in Taiwan and China. Eventually, the company will sell the printer to them in stages. 

Tenryuseiki has a track record in equipment customization that meets customers’ needs. It has strength in the construction of production lines that maximize productivity. In FY2022, the company designed and built many customized equipment for solder paste printing and pre- and post-transfer processes, leveraging its know-how accumulated in its over 60 years of experience in the design and manufacture of automated machines, including automated connector assembly machines. 

Recently, Tenryuseiki renewed the design concepts of TSP-77, which now features a modular unit. It also allowed flexibility for design changes. The company aims to meet the required customized specifications that match the characteristics of target substrates in the solder paste printing process and the processes and production methods unique to plants where the printer is used.

The company will actively meet the needs for special requirements in Japan, while meeting new demands of existing users.