HOME
LATEST NEWS
SMT
ROBOTICS and AUTOMATION
ENABLING TECHNOLOGIES
Case Studies
Events
JAPAN FRONTLINE
ABOUT
CONTACT US
ASIA ELECTRONICS INDUSTRY
YOUR WINDOW TO SMART MANUFACTURING
HOME
LATEST NEWS
SMT
Surface Mount Equipment
Advance Packaging Equipment and Material
Semiconductor Equipment and Material
ROBOTICS and AUTOMATION
Industrial Robots
Collaborative Robots
Industrial Control Systems
ENABLING TECHNOLOGIES
IIOT
Analytics
Microchip
Sensors
Connectivity / IPC
Cybersecurity
5G
Digital Twin (Simulation)
Industrial 3D Printing (Additive Manufacturing)
AR and VR in Manufacturing
AI in Manufacturing
Industrial Machine Vision
Test & Measurement
Power Semiconductor
Others
Case Studies
Events
Webinar
eForum
Featured Shows
JAPAN FRONTLINE
Industry Report
Top Interview
Manufacturing Front
Trending Technologies
JAPAN FRONTLINE
EUV photoresist
lithography materials
Photoresist
Semiconductor
semiconductor manufacturing
Semiconductor materials
semiconductor photoresist
Smart Factory
Supply Chain Resilience
TOK
Tokyo Ohka Kogyo
TOK Expands Photoresist Output With New Fab
2026-10-10
advanced manufacturing
chip design
EDA
EDA tools
electronics industry
foundry services
Rapidus
Rapidus CORE
semiconductor ecosystem
semiconductor industry
semiconductor innovation
semiconductor IP
Rapidus Builds Global Ecosystem for 2nm Era
2026-10-06
Broadcom
Celestica
Co-packaged Optics
FUJI
Generative AI
GPU
Pick-and-Place Platform
Semiconductor Packaging
Fuji Unlocks New Era for Broadcom Tomahawk 6 SMT
2026-10-06
Dresden
Germany
inspection system
metrology
Mitutoyo
Semiconductor
semiconductor manufacturing
Mitutoyo to Boost Chip Metrology with New Dresden Hub
2026-10-01
AI
AI data centers
Electronic Components
Inductors
MLCC
Taiyo Yuden
TDK
TDK, Taiyo Yuden Alliance to Target Growth in AI
2026-09-30
Advanced Semiconductors
AI data centers
Co-packaged Optics
Data Center Efficiency
Kyocera
Laser Annealing
Magneto-Optical Garnet
photonics
Semiconductor Technology
Silicon Photonics
Tohoku University
Kyocera, Tohoku Advance AI Data Center Optics
2026-09-12
Japan
Kioxia
manufacturing investments
NAND
NAND Flash memory
SanDisk
Kioxia, Sandisk Reinforce NAND Leadership With $31B
2026-08-28
CMP
Fujifilm
Japan
Semiconductor materials
Fujifilm Opens New AI Chip Materials Line in Oita
2026-08-27
Japan
R&D
Renesas
semiconductor manufacturing
Renesas Shifts Takasaki Strategy to Boost R&D
2026-08-04
Chip Packaging
Israel
Japan
silicon germanium
Silicon Photonics
Tower Semiconductor
Tower Boosts Chip Grit With New Growth Plans in Japan
2026-07-15
Fine ceramics
Japan
Kyocera
Manufacturing
manufacturing investments
Kyocera Expands Chip Supply Capacity With New Plant
2026-07-02
Amperex Technology
battery production
Linergy Power
M&A
TDK
TDK to Boost Battery Business in New Linergy Deal
2026-05-21
SEMICON Southeast Asia
Semiconductor
TANAKA
Tanaka Precious Metal
TANAKA Precious Metal Recycling
TANAKA Highlights Advance Chip Materials, Circular Economy
2026-05-05
Japan
manufacturing investments
ULVAC
vacuum melting furnaces
ULVAC Adds Japan Line for Rare‑Earth Magnet Furnaces
2026-05-04
AI data centers
ROHM
SiC
SiC power devices
xEVs
ROHM’s New SiC MOSFETs to xEVs, AI Servers
2026-04-22
2nm
advanced packaging
Chiplets
Foundry
Japan
Manufacturing
R&D
Semiconductors
Rapidus to Boost 2nm Grit With New Chiplet Expansion
2026-04-13
Ceramic Materials
Electronic Components
Joint Venture
Manufacturing
MLCC
Nippon Chemical Industrial
R&D
TDK
TDK, Nippon Chemical Launch JV to Soar MLCC Innovation
2026-04-06
automotive connector
HIROSE
India
manufacturing investments
Hirose to Open New Automotive Connector Line in India
2026-03-19
Fasford Technology
FUJI
SEMICON China
Xerdia
Fasford to Unveil New Die Bonder at SEMICON China
2026-03-19
ams OSRAM
lighting
M&A
Ushio
Ushio Closes Latest Deal on ams OSRAM’s Lamp Unit
2026-03-06
1
2
3
Next
