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LATEST NEWS

Lenovo Charts Next Era of Hybrid Era at CES 2026

2026-01-09

Hyundai Mobis, Qualcomm to Soar SDV, ADAS Tech

2026-01-08

Tech Players Harness Power of AI at CES 2026

2026-01-07

AMD Eyes Yotta-Scale Compute to Enable AI Everywhere

2026-01-06

Samsung Shows Off AI Grit in CES 2026 First Look

2026-01-05

USI to Soar Data Center Grit, to Grow Vietnam Line

2026-01-02

SoftBank to Scale AI in New Digital Bridge Deal

2026-01-01

ROHM, Tata to Boost Chip Business in New Alliance

2025-12-23

onsemi-GF New Deal to Soar GaN Power Devices

2025-12-22

Qualcomm to Soar Grit in AI as it Seals Alphawave Deal

2025-12-20

Imec, ASRA Eye Standard Automotive Chiplet

2025-12-19

SEMIFIVE to Soar in Japan With New Office, IC Designs

2025-12-18

Teradyne to Soar Robotics Grit With New U.S. Hub

2025-12-15

Kioxia Develops Core Tech for High Density 3D DRAM

2025-12-12

Siemens, GF to Make More Reliable Chips based on AI

2025-12-12

ST to Boost Europe’s Chip Grit With €1B EIB Credit

2025-12-11

DNP’s Latest Tech to Soar Advanced Logic ICs

2025-12-10

UMC to Surge Si Photonics Grit by Licensing imec Tech

2025-12-09

Rigaku’s New Machine to Surge Advanced Chips

2025-12-09

AI to Surge Global Chip Market to Strong Growth

2025-12-05