HOME
LATEST NEWS
SMT
ROBOTICS and AUTOMATION
ENABLING TECHNOLOGIES
Case Studies
Events
JAPAN FRONTLINE
ABOUT
CONTACT US
ASIA ELECTRONICS INDUSTRY
YOUR WINDOW TO SMART MANUFACTURING
HOME
LATEST NEWS
SMT
Surface Mount Equipment
Advance Packaging Equipment and Material
Semiconductor Equipment and Material
ROBOTICS and AUTOMATION
Industrial Robots
Collaborative Robots
Industrial Control Systems
ENABLING TECHNOLOGIES
IIOT
Analytics
Microchip
Sensors
Connectivity / IPC
Cybersecurity
5G
Digital Twin (Simulation)
Industrial 3D Printing (Additive Manufacturing)
AR and VR in Manufacturing
AI in Manufacturing
Industrial Machine Vision
Test & Measurement
Power Semiconductor
Others
Case Studies
Events
Webinar
eForum
Featured Shows
JAPAN FRONTLINE
Industry Report
Top Interview
Manufacturing Front
Trending Technologies
LATEST NEWS
Avnet
electronics distributor
Singapore
Avnet to Boost APAC Grip With New Singapore Facility
2026-05-07
AI
AI in Manufacturing
Delta Electronics
Motion Control
SEMICON Southeast Asia
Semiconductor
Smart manufacturing
Delta Taps AI, Novel Tools to Advance Chip Packaging
2026-05-06
AI
ASMPT
mobility
SEMICON Southeast Asia
Smart manufacturing
SMT
ASMPT Shows AI-Ready Manufacturing Grit at SEMICON SEA
2026-05-05
Esmo group
SEMICON Southeast Asia
Semiconductor Test
New esmo System Offers Reliable Changeover in IC Test
2026-05-05
B2B Electronics
Malaysia
SEMICON Southeast Asia
semiconductor CMOS
Southeast Asia
SEMICON SEA Special: Players Chart Regional Growth, Resilience
2026-05-05
SEMICON Southeast Asia
Semiconductor
TANAKA
Tanaka Precious Metal
TANAKA Precious Metal Recycling
TANAKA Highlights Advance Chip Materials, Circular Economy
2026-05-05
Japan
manufacturing investments
ULVAC
vacuum melting furnaces
ULVAC Adds Japan Line for Rare‑Earth Magnet Furnaces
2026-05-04
Automotive
EMS
Foxconn
Joint Venture
M&A
Mitsubishi Electric
Foxconn, Mitsubishi Eye New Tie-up on Automotive Tools
2026-04-30
AI
AI in Manufacturing
FPT
Intel
Predictive Maintenance
Simulation
Smart manufacturing
New Intel, FPT Deal to Advance AI in Smart Factories
2026-04-29
EMS
IMI
Manufacturing
Philippines
IMI to Chart 2026 Growth with Strategic Expansion
2026-04-28
advanced packaging
Aerotech
Hybrid bonding
Justin Bressi
Motion Control
nanometer alignment
precision engineering
semiconductor manufacturing
yield optimization
Motion Control Redefines Yield in Advanced Packaging
2026-04-26
Digital Twin
Industrial Automation
OMRON
OMRON, Dassault Bridge Virtual and Real Worlds
2026-04-24
1.4nm process technology
2nm
COWOS
TSMC
TSMC Reveals New A13, A12 Process Tech as AI Chips
2026-04-23
AI data centers
ROHM
SiC
SiC power devices
xEVs
ROHM’s New SiC MOSFETs to xEVs, AI Servers
2026-04-22
DEEPX DX‑M2
generative AI robotics
Hyundai Robotics LAB
on‑device AI
Physical AI computing
robotics AI platform
DEEPX, Hyundai to Build Physical AI Compute for Robots
2026-04-21
Ajai Chowdhry
India
National Quantum Mission
Post-Quantum Cryptography
QKD
Quantum computing
Quantum Computing India
India’s Quantum Leap: Scaling Hardware, Securing Sovereignty
2026-04-20
advanced packaging
AI semiconductors
device prober
HPC semiconductors
KGD testing
Known Good Device
Prexa SDP
semiconductor testing
thermal control technology
Tokyo Electron
Tokyo Electron Launches New Prexa SDP Device Prober
2026-04-17
EMS
IMI
Manufacturing
Philippines
Strong Margins Push IMI to Profit in 2025
2026-04-17
enterprise quantum computing
Ising models
Jensen Huang
NVIDIA
open source AI
quantum processors
quantum‑GPU systems
qubits
research laboratories
NVIDIA Launches Open AI Models for Quantum Computing
2026-04-15
2nm
advanced packaging
Chiplets
Foundry
Japan
Manufacturing
R&D
Semiconductors
Rapidus to Boost 2nm Grit With New Chiplet Expansion
2026-04-13
1
2
3
Next