HOME
LATEST NEWS
SMT
ROBOTICS and AUTOMATION
ENABLING TECHNOLOGIES
Case Studies
Events
JAPAN FRONTLINE
ABOUT
CONTACT US
ASIA ELECTRONICS INDUSTRY
YOUR WINDOW TO SMART MANUFACTURING
HOME
LATEST NEWS
SMT
Surface Mount Equipment
Advance Packaging Equipment and Material
Semiconductor Equipment and Material
ROBOTICS and AUTOMATION
Industrial Robots
Collaborative Robots
Industrial Control Systems
ENABLING TECHNOLOGIES
IIOT
Analytics
Microchip
Sensors
Connectivity / IPC
Cybersecurity
5G
Digital Twin (Simulation)
Industrial 3D Printing (Additive Manufacturing)
AR and VR in Manufacturing
AI in Manufacturing
Industrial Machine Vision
Test & Measurement
Power Semiconductor
Others
Case Studies
Events
Webinar
eForum
Featured Shows
JAPAN FRONTLINE
Industry Report
Top Interview
Manufacturing Front
Trending Technologies
LATEST NEWS
3D LiDAR
AI
Edge AI
STMicroelectronics
TOF
ToF Sensors
ST to Boost Edge AI With New LiDAR Solution
2026-06-22
AI
AI data center
DRAM
HBM4
HPC
SK hynix
SK hynix to Power AI Growth With Advance HBM4E
2026-06-20
Adani
AI
AI data center
India
Jabil
Adani, Jabil Target AI Hardware Demand Surge
2026-06-18
FUJI
SMT
Fuji’s New CLT-FG Machine Boosts Flexible Production
2026-06-17
300mm
ASML
imec
Semiconductors
TSMC
Breakthrough Brings 2D Transistors to 300mm Wafers
2026-06-16
AI
AI data center
IQE
Semiconductor
Silicon Photonics
Tower Semiconductor
Tower, IQE Sign InP Deal to Power AI Growth
2026-06-15
India Targets to Grow from Chip Equipment Boom
2026-06-11
AI Infrastructure
Cloud Computing
COMPUTEX
data centers
Delta Electronics
Edge Infrastructure
Energy Efficiency
Liquid Cooling
Sustainability
Delta Electronics to Accelerate Data Center Buildouts
2026-06-11
Applied Materials
manufacturing investments
semiconductor manufacturing
Singapore
Applied Materials to Grow AI Chip Grit in Singapore
2026-06-11
AI
AI data center
circuit breaker
data center
Infineon
Semiconductor
SiC
Siemens
Infineon, Siemens Drive Data Center Reliability With SiC
2026-06-09
AI
AI data center
data center
Semiconductor
Semiconductor Packaging
Teradyne
Tokyo Electron
Teradyne, TEL Power AI Chip Testing with New System
2026-06-09
B2B Robotics
COMPUTEX
Edge AI Trust
edge computing
Neural Axis Architecture
NXP
physical AI
Software-Defined Vehicles
NXP Unveils Bold ‘Physical AI’ Vision at COMPUTEX
2026-06-05
agentic AI
AI
COMPUTEX
Intel
Xeon
Intel Unveils Powerful AI Vision, New Silicon Push
2026-06-03
AI
connectivity
Ethernet
Marvell
NVIDIA
Marvell Bets Big on Optical Connectivity in AI Era
2026-06-02
agentic AI
AI
AI data center
COMPUTEX
data center
Qualcomm
TSMC
Qualcomm Ignites Global AI Agent Hardware Revolution
2026-06-02
AI
AI data center
Asus
Compal
COMPUTEX
Foxconn
gigabyte
idc
Inventec
MSI
Pegatron
quanta
Supermicro
TrendForce
Wistron
Wiwynn
COMPUTEX 2026: Taiwan ODMs Power Global AI Shift
2026-06-01
AI Factory
GTC
Jensen Huang
NVIDIA
Vera CPU
Vera Rubin
NVIDIA: AI Factories Ignite Global Compute Boom
2026-06-01
AI data center
ASEAN
electronics industry
Thailand
Thailand Board of Investment
THECA
THECA 2026: Asia’s Tech Leaders Set Sights on Thailand
2026-06-01
Imec, EVG Push High Yield 200nm Hybrid Bonding
2026-05-29
Applied Materials
EPIC
SCREEN Holdings
semiconductor manufacturing
wafer fabrication
Applied to Boost EPIC Hub With SCREEN as New Partner
2026-05-27
1
2
3
Next