Singapore’s lead public sector research and development (R&D) agency Agency for Science, Technology and Research (A*STAR) and GlobalFoundries (GF) have agreed to collaborate in advanced semiconductor packaging. A*STAR has made the announcement during the inaugural “Innovate Together” event held during the sidelines of SEMICON Southeast Asia 2025.

SEMICON Southeast Asia 2025 is the region’s flagship global electronics manufacturing and semiconductor supply chain event held from May 20 to 22.

Role of Advanced Packaging

Advanced packaging has become a key R&D priority for the semiconductor industry. Specifically, there has been a growing demand for artificial intelligence (AI) and other data-intensive applications ranging from high performance data computing and datacenters to 5G / 6G communication and more.

To meet these needs, advanced packaging technologies will play crucial role in delivering the compact, high-performance and energy-efficient technology solutions needed to drive the industry’s long-term growth.

Under the MOU framework, A*STAR will provide GF with access to its R&D facilities, capabilities and technical support. On the other hand, GF will provide critical equipment to A*STAR to further its R&D efforts. The collaboration will accelerate GF’s plan to develop and ramp its advanced packaging solutions and expand its offerings to provide customers one-stop solutions for semiconductor chips to be manufactured, processed, packaged and tested at GF’s Singapore manufacturing facility.

This collaboration will see skills enhancement initiatives implemented for GF employees, where they can develop new expertise in the area of advanced packaging. Moreover, it reflects both A*STAR’s and GF’s shared dedication to nurturing the next generation of high technology talent, as well as the continuous upskilling and retraining of talent in tandem with the industry’s evolving needs.

The MOU with A*STAR follows an earlier announcement by GF in January, where the company announced plans to create a new Advanced Packaging and Photonics Center for advanced packaging and testing of U.S.-made essential chips within its New York manufacturing facility. Together, these developments mark significant progress on GF’s strategic roadmap to enhance and scale its advanced packaging offerings in response to customer demand across the regions.