Toshiba Electronic Devices & Storage Corporation (Toshiba) starts volume shipment of TLP3475W, a photorelay in a small, thin WSON4 package. It reduces insertion loss and suppresses power attenuation in high-frequency signals ^[1]. Also, it is suitable for pin electronics of semiconductor testers, which use a large number of relays and require high-speed signaling.

Toshiba’s optimized package designs reduce parasitic capacitance and inductance in the new photorelay. This reduces insertion loss and improves the transmission characteristic of high-frequency signals to 20GHz (typ.) ^[2], about 1.5 times lower ^[2] than Toshiba’s current product, TLP3475S.

Specifically, TLP3475W uses a small, thin WSON4 package that is only 0.8mm (typ.) thick (1.45mm×2.0mm) (typ.), making it the smallest ^[3] photorelay in the industry to realize improved high-frequency signal transmission characteristics. It is 40% lower in height than Toshiba’s ultra-small S-VSON4T package, allowing more products to be mounted on the same circuit board, and will contribute to improved measuring efficiency.

Also, it passes the high-frequency signals: f=20GHz (typ.) @Insertion loss(S21) = -3dB and features normally open function (1-Form-A).

Toshiba will continue to expand its product line-up to support semiconductor testers that deliver higher speeds and greater functionality.

Aside from semiconductor testers, the new photorelay is ideal for probe cards and measuring equipment.

Notes:

^[1] When the frequency band is in the range of several hundreds of megahertz to several tens of gigahertz.

^[2] The frequency band where the power attenuation ratio (insertion loss) when the signal passes through the output MOSFET is -3dB.

^[3] For photorelays. As of October 2023, Toshiba survey.