AEI

ASIA ELECTRONICS INDUSTRYYOUR WINDOW TO SMART MANUFACTURING

SEMIFIVE Boosts Play in HPC Chiplet with New Partner

SEMIFIVE, a leading design solution provider and pioneer of platform-based custom silicon solutions, has announced a collaboration with Synopsys to develop a cutting-edge high-performance computing (HPC) platform. Particularly, the new platform integrates SEMIFIVE’s CPU chiplet with a third-party I/O chiplet into a unified package.

Semifive

Primarily, SEMIFIVE’s HPC chiplet platform will offer notable advantages over traditional chiplet platforms. They will reduce cost, optimize performance, and enable development flexibility. Also, this platform will advance semiconductor technology. Eventually, it will lead to the creation of versatile and customized chiplets to meet the diverse needs of HPC customers.

“We are confident that chiplets represent the future of silicon design. Our collaboration with Synopsys, particularly using their UCIe IP, is a key factor in ushering in the chiplet era,” said Brandon Cho, CEO and co-founder of SEMIFIVE. “By delivering platforms like the HPC chiplet platform, we will enable our customers to bring innovative, customized solutions to market faster than ever before.”

Moreover, SEMIFIVE’s CPU chiplet, manufactured on 4nm process technology, will include Synopsys UCIe controller and PHY IP as well as other IP solutions. Meanwhile, Synopsys’ IP solutions have helped SEMIFIVE achieve multiple generations of silicon success and become a global leader in innovative custom silicon solutions. SEMIFIVE’s portfolio of optimized SoC platforms are pre-designed and validated on advanced process nodes. This allows customers to improve their overall development efficiency.

“Synopsys and SEMIFIVE are helping companies adopt multi-die designs to address the growing compute demands of high-performance systems,” said Michael Posner, vice president of IP product management at Synopsys.

“The combination of Synopsys’ silicon-proven UCIe IP, which has been adopted by multiple hyperscalers, and SEMIFIVE’s extensive SoC platform, helps companies reliably meet their multi-die design requirements and accelerate their development effort,” Posner continued.

“We are confident that chiplets represent the future of silicon design. Our collaboration with Synopsys, particularly using their UCIe IP, is a key factor in ushering in the chiplet era,” said Brandon Cho, CEO and co-founder of SEMIFIVE. “By delivering platforms like the HPC chiplet platform, we will enable our customers to bring innovative, customized solutions to market faster than ever before.”

-12 November 2024-