Korean custom AI semiconductor design company SEMIFIVE has announced it has secured multiple AI semiconductor design projects in Japan. Moreover, it has also established a new subsidiary in Tokyo.

These will enable the company to accelerate its global expansion to meet the rapidly increasing demand for application-specific integrated circuits (ASICs).

According to SEMIFIVE, the project wins were achieved based on the trust it has earned brought about by its accumulated expertise in cutting-edge process nodes, extensive experience in turnkey design for large-die chips, and high-performance ASIC design capabilities based on core IP.

Cutting Edge Technologies for AI, Data Center

In these newly secured projects, SEMIFIVE is developing high-performance semiconductors for AI and data center applications. Accordingly, some of these projects will incorporate next-generation technologies such as 3D IC-based advanced packaging. Such are likely to improve data-processing efficiency, reduce energy consumption, and increase integration density.

Meanwhile, with SEMIFIVE’s new subsidiary in Tokyo, the company is strengthening its ability to engage with local customers and manage projects more efficiently. This new subsidiary represents SEMIFIVE’s sixth global location, following its established presence in the United States, China, Vietnam, India, and the Czech Republic. This strategic move is a significant milestone in the company’s global expansion efforts, further solidifying its international network.

“Japan’s semiconductor market is accelerating, fueled by surging demand for high-performance chips, robust government investment, and concerted efforts to build a vibrant AI ecosystem,” said Brandon Cho, CEO and co-founder of SEMIFIVE. “We aim to position Japan as a strategic hub—deepening our technology leadership and collaborating closely with Japanese innovators to drive the AI revolution.”

18 December 2025