Thailand has approved its first national strategy for the semiconductor and advanced electronics industry, setting an ambitious long-term roadmap to establish a fully integrated domestic chip ecosystem and strengthen its position in global supply chains. The strategy targets more than THB 2.5 trillion (about US$80 billion) in cumulative investment by 2050, while creating over 230,000 new jobs and generating annual industry revenues of THB 5 trillion.

The framework was endorsed by the National Semiconductor and Advanced Electronics Policy Board, chaired by Deputy Prime Minister and Finance Minister Ekniti Nitithanprapas. The initiative aims to move Thailand beyond its traditional strengths in assembly and testing and into higher-value semiconductor activities across the global value chain.

Three-Phase Roadmap Targets “Made-in-Thailand” Chips

At the core of the strategy is the vision of developing “Made-in-Thailand” chips through a systematic expansion of capabilities spanning chip research and design, front-end wafer manufacturing, advanced packaging, assembly and testing, and advanced electronics applications.

The roadmap will be implemented in three phases. By 2030, Thailand plans to strengthen its existing assembly and testing base, expand advanced packaging capabilities, and establish foundations for upstream wafer production. By 2040, the country intends to attract additional anchor investors in chip design, wafer fabrication, and other advanced manufacturing technologies. By 2050, the objective is to build a complete semiconductor supply chain and develop domestic companies into globally competitive industry champions.

“This is Thailand’s first comprehensive national framework for building semiconductor capabilities and moving the country into higher-value activities across the global supply chain,” said Ekniti Nitithanprapas. “It gives investors a clear view of our technology priorities, infrastructure commitments and workforce-development plan through 2050.”

Focus on High-Growth Technology Segments

To maximize competitive advantages, the strategy prioritizes three technology platforms aligned with Thailand’s industrial strengths and growing global demand. These include photonics for artificial intelligence, data centers, and high-speed communications; power semiconductors for electric vehicles, energy storage systems, and power grids; and sensors for connected devices, automation, automotive applications, smart devices, and medical technologies.

The government also plans to strengthen capabilities in integrated circuit (IC) design and advanced back-end packaging technologies, including wafer-level packaging, power packaging, and emerging 2.5D and 3D packaging solutions.

Incentives, Talent and Technology Development

Implementation will be supported through a coordinated policy package covering investment incentives, workforce development, technology advancement, infrastructure expansion, and business-environment improvements. Measures will include tax incentives, grants, low-interest financing, support for research facilities, and programs designed to attract highly skilled domestic and international talent.

“Thailand is focusing on semiconductor segments where we already have strong infrastructure and supply-chain depth, and the government will align policy, funding and institutional support across agencies to back this strategy,” said Narit Therdsteerasukdi, Secretary General of the Thailand Board of Investment.

With global semiconductor manufacturers increasingly diversifying supply chains, Thailand’s new strategy signals a long-term commitment to becoming a major regional hub for advanced semiconductor manufacturing, innovation, and talent development.

24 September 2026