Toshiba’s Power Devices Reduce Equipment Footprint

Toshiba Electronic Devices & Storage Corporation has launched two intelligent power devices for industrial applications. Particularly, they control the drive of the inductive loads of motors, solenoids, lamps and other devices used in applications such as the programmable logic controllers of industrial equipment. Shipments of the high-side switch (8-channels) “TPD2015FN” and the low-side switch (8-channels) “TPD2017FN” start today.

Applications, Features

The new products use Toshiba’s analog device consolidation process (BiCD)[1] to achieve an on-resistance of 0.4Ω (typ.) in the output stage, over 50% lower than that of Toshiba’s current products[2]. Accordingly, both TPD2015FN and TPD2017FN are housed in an SSOP30 package[3], which has a mounting area about 71% that of the SSOP24[4] package used for the current products[2], a height of 80% that of SSOP24 package, and a narrower, 0.65mm pin pitch. Most importantly, these improvements will help to reduce equipment size.

The maximum operating temperature of the new products is 110°C, higher than the 85°C of the current products[2], suiting them for operation in higher temperatures. In addition, both have built-in over current protection circuits and over temperature protection circuits, which help to improve equipment reliability.

Their applications include programmable logic controllers for industrial use and numerically controlled machine tools. Furthermore, they are also suitable for inverters and servos as well as control equipment with IO-Link.

Meanwhile, the products’ features include monolithic power ICs with built-in N-channel MOSFETs (8-channels) and control circuits. Housed in a small SSOP30 package, they come with a mounting area about 71% that of the SSOP24 package. Furthermore, they have built-in protection functions (over temperature, over current).

Meanwhile, their high operating temperature is Topr (max)=110°C while low On-resistance: RDS(ON)=0.4Ω (typ.) @VIN=5V, Tj=25°C, IOUT=0.5A.


[1] Bipolar CMOS DMOS
[2] Toshiba’s current products: TPD2005F and TPD2007F
[3] SSOP30 package: 9.7 × 7.6 × 1.2mm (typ.)
[4] SSOP24 package: 13.0 × 8.0 × 1.5mm (typ.)