MediaTek Yields First IC Using TSMC's New 3nm Process

MediaTek and TSMC have jointly announced the fruition of their cooperation towards 3nm. Particularly, MediaTek has successfully developed its first chip using TSMC’s leading-edge 3nm technology. Hence, the industry can expect MediaTek’s flagship Dimensity system-on-chip (SoC) with volume production next year.

This marks a significant milestone in the long-standing strategic partnership between MediaTek and TSMC. Most importantly, the two companies are now taking full advantage of their strengths in chip design and manufacturing flagship SoCs.

MediaTek has successfully developed its first chip using TSMC’s 3nm process technology, with volume production in 2024 in sight.

Power of 3nm in Every Pocket

Joe Chen, President of MediaTek said the company holds to its vision of using the world’s most advanced technology to create cutting-edge products. Particularly, products that aim to improve lives in meaningful ways.

In addition, Chen said, “TSMC’s consistent and high-quality manufacturing capabilities enable MediaTek to fully demonstrate its superior design in flagship chipsets. Hence, offering the highest performance and quality solutions to our global customers and enhancing the user experience in the flagship market.”

Dr. Cliff Hou, Senior Vice President of Europe and Asia Sales at TSMC said the collaboration of the two companies means the power of the most advanced semiconductor process technology can be as accessible as the smartphone in your pocket. Furthermore, Hou said, “Throughout the years, we have worked closely with MediaTek to bring numerous significant innovations to the market.”

Benefit to End-User Experience

TSMC’s 3nm process technology provides enhanced performance, power, and yield, in addition to complete platform support for both high-performance computing and mobile applications. Comparatively, TSMC’s 3nm technology, compared with 5nm, offers as much as 18% speed improvement at same power. Hence, it offers a 32% power reduction at the same speed and an approximately 60% increase in logic density.

MediaTek’s Dimensity SoCs, built with industry-leading process technology, can meet the ever-increasing user experience requirements. Particularly, for mobile computing, high-speed connectivity, artificial intelligence, and multimedia. MediaTek’s first flagship chipset using TSMC’s 3nm process will empower smartphones, tablets, intelligent cars, and various other devices starting in the second half of 2024.