At SEMICON Taiwan 2024, EV Group (EVG) will highlight key advances in hybrid and fusion wafer bonding, infrared (IR) laser layer release technology, and lithography for advanced semiconductor and micro-electronics manufacturing and packaging.  

SEMICON Taiwan 2024 expo will be held in Taipei on Sept. 4 to 6.

Mainly, EVG’s innovative high-volume-manufacturing (HVM) ready process solutions and world-class engineering services and process expertise are enabling new ways to build semiconductors. Also, they support leading-edge semiconductor designs and chip integration schemes, such as high bandwidth memory (HBM), backside power distribution networks (BPDN), chiplets and much more.

At SEMICON Taiwan, EVG speakers will present on the following topics:

“Maskless Patterning Solution for Multi-functional Chiplets in Advanced System-in-Package (SiP)” (TechXPOT – Wednesday, September 4, 2:00pm at Stage 4F, TaiNEX 1, Booth L1200)

Kuo Yin-Chuan, Process Technology Engineer at EV Group Taiwan Ltd., will present an overview of EVG’s LITHOSCALE® maskless exposure system. He will explain how LITHOSCALE overcomes the severe limitations of mask-based optical lithography systems in the development of next-generation advanced packaging technologies. These include inaccuracies from die placement and die shift variations caused by over-molding, and limited exposure areas in large-die interposer fabrication.

“Disruptive 3D Integration Technologies for Advanced Stacked Systems” (Heterogeneous Integration Global Summit– Friday, September 6, 2:25pm at Room 701GH, 7th Floor, TaiNEX 2)

Thomas Uhrmann, director of business development at EVG, will present an overview on the current industry trends and technological developments for both wafer-to-wafer and die-to-wafer hybrid bonding. He will discuss key technology differentiators and integration scenarios with respect to the hybrid bonding schemes in combination with IR laser-based carrier solutions that enable disruptive device flows for ultra-thin 3D devices.

According to Dr. Thorsten Matthias, regional sales director Asia/Pacific at EV Group, “Taiwan is a crucial epicenter for the semiconductor industry, producing more than 60 percent of the world’s semiconductors, and about 90 percent of the most advanced-node devices. As such, it is important for EVG to have a strong presence at SEMICON Taiwan. Over the years, EVG has significantly expanded its presence in Taiwan to better meet the growing needs and challenges that our customers and partners in the region face. This year, we have taken additional steps for continued growth and long-term customer commitment in Taiwan in the years to come.”

EVG Sees Continued Growth in Taiwan

Mainly, EVG continues to expand its local offices in Hsinchu, Taichung and Tainan. This is true particularly in Taichung where EVG has added to its process and application engineering team as well as to its sales and service personnel. These growth activities serve to expand and strengthen EVG’s installation and support capabilities to its local HVM customers.

Primarily, EVG’s wafer bonding and lithography products continue to do well in Taiwan. Particularly, the company’s LITHOSCALE maskless exposure lithography systems see strong sales for supporting 3D-IC advanced packaging – a key application for LITHOSCALE. Also, additional strong sales in Taiwan have been seen in fusion and hybrid wafer bonding in 3D-IC advanced packaging.

Also, this past April, EVG hosted its Technology Day event in Hsinchu with the theme “AI, Edge Computing, Hyperconnectivity: Pioneering the Future of Semiconductor Innovation,” featuring presentations and talks from EVG, market analysts, and industry partners, including Applied Materials, ASMPT, and the Industrial Technology Research Institute (ITRI). This year’s EVG TechDay Taiwan was among its most successful in the region to date, breaking a record high triple-digit attendance.

See EVG at SEMICON Taiwan

SEMICON Taiwan attendees interested in learning more about EVG and its innovative process solutions that are enabling advances in automotive, communications, high-performance computing (HPC), artificial intelligence (AI)/machine learning, and augmented/virtual reality (AR/VR), are invited to visit EVG at the EVG-JOINTECH Booth L0316 (4th Floor, Hall 1) on September 4-6 at Taipei Nangang Exhibition Center (TaiNEX).

-28 August 2024-