Industrial automation solutions provider Delta and its U.S.-based subsidiary Universal Instruments have unveiled various industrial solutions at SEMICON Taiwan 2024.

Accordingly, the latest set of next-generation solutions will enable digital twins and AI-based automation in semiconductor manufacturing applications.

These include the DIATwin Virtual Machine Development Platform, which accelerates new product development by up to 20 percent. Leveraging its extensive experience in industrial automation, Delta develops the Wafer Edge Profile Measurement Solution. Specifically, for semiconductor front-end processing, which features highly customizable features for added equipment value. Combining the strengths of Universal Instruments, Delta showcased the High-Speed, Multi-Die Advanced Packaging equipment for back-end processing. Most importantly, it operates three times faster than industry standards with placement repeatability within 3 micrometers. Delta is leading the semiconductor equipment sector by planning to adopt the SEMI E187 cybersecurity certification. Thus, this will help customers enhance the reliability of their semiconductor manufacturing platforms.

Seamless Front-End, Back-End Processes

Andy Liu, General Manager of Delta’s Industrial Automation Business Group (IABG), said Delta offered advanced integrated hardware and software solutions at SEMICON Taiwan. “Our rapid advancement in AI and digital twin technologies enable the seamless integration of front-end and back-end processes, ultimately ensuring the reliability and optimal performance of our customers’ equipment and operations. Moreover, we are also demonstrating how we leverage AI and digital twin technologies to optimize the cybersecurity of semiconductor equipment manufacturers.”

At SEMICON Taiwan 2024, Delta highlighted the DIATwin Virtual Machine Development Platform. In addition, Delta also demonstrated its innovative digital twin platform developed on the NVIDIA Omniverse^TM platform.

Moreover, Delta’s digital twin platform can virtually link specific production lines and aggregate data from a diverse range of equipment and systems. Thus, enabling to generate synthetic data to train its computer models to achieve 90% accuracy.

Highlights of Delta’s SEMICON Taiwan 2024

Cyber-Physica Integration: DIATwin Virtual Machine Development Platform

The DIATwin Virtual Machine Development Platform is an intelligent design and development tool. It provides automated prototype design, virtual machine construction, offline process planning, and virtual machine commissioning.

By integrating Delta’s Wafer Edge Profile Measurement Machine, DIATwin effectively bridges the gap between virtual and physical equipment. Leveraging its high-fidelity physics engine and component library, DIATwin significantly enhances efficiency in system integration, maintenance, and upgrades.

Front-End Processing: Wafer Edge Profie Measurement Solution

After the processes of crystal growth, slicing, and grinding, silicon wafers require precise edge profile measurement to ensure they meet quality standards. For that reason, Delta employs non-destructive AOI optical technology to measure wafer notches, flat edges, and chamfers with micro-scale repeatability. This achieves a high throughput of approximately 60-120 wafers per hour.

Moreover, Delta offers optional modules for roughness detection, edge AOI defect inspection, OCR laser-marking ID inspection, and wafer thickness measurement. The system supports automated robotic loading/unloading and AGV transport systems, seamlessly integrating diverse functions into a single machine, thereby boosting equipment value.

Back-End Processing: High-Speed, Muti-Die Advanced Packaging Solution 

In the post-Moore’s Law era, Universal Instruments has developed a High-Speed, Multi-Die Advanced Packaging equipment solution. This system integrates the FuzionSC™ Platform with a High-Speed Wafer Feeder. Therefore, enabling semiconductor manufacturers to place both passive components and a full range of die on diverse substrates and carriers using a single equipment platform. The FuzionSC™ solution operates three times faster than industry standards, with placement repeatability within 3 micrometers, fulfilling the diverse needs of advanced semiconductor packaging assembly.

SEMI E187 Cybersecurity Solution

Given the high value of the semiconductor industry, cybersecurity is critical. Thus, to enhance protection, Delta plans to obtain SEMI E187 certification for its self-developed Wafer Edge Profile Measurement Machine and High-Speed Wafer Feeder. This includes early vulnerability detection through SBOM scanning, vulnerability tracking, and application whitelisting. These will help address the increasing cybersecurity demands across the supply chain.

06 September 2024