On-device artificial intelligence (AI) applications have been an emerging trend of late. However, temperature rises in the process of data transfer. Thus, resulting in device performance deterioration.

Leading Korean chip supplier SK Hynix Inc. has found a way to address this critical problem and has adopted a special material to its DRAM products for a highly efficient heat dissipation.

Specifically, SK Hynix has started adopting for the first time High-K Epoxy Molding Compound to its DRAM products for a more highly efficient heat dissipation. 

Addresses Smartphone Performance

Typically, most flagship smartphones adopt the package on package (PoP) structure, packaging method commonly used for mobile products. Here, different types of chips are stacked vertically to improve space, efficiency, performance, and flexibility of combinations. However, such system also triggers a performance degradation of the device itself as heat generated within the mobile application processor stays inside DRAM.

SK Hynix started employing High-K Epoxy Molding Compound to its DRAM to address issues of performance degradation of smartphones, which comes as heat generated in the process of fast data transfer for on-device AI applications. The company said global smartphone companies welcome the launch of the product on expectations that it will help address the heat issue of high-performance flagship smartphones.

The EMC component is a critical material for semiconductor packaging. Particularly, it protects chips from various external conditions such as water, heat, impact, and electronic charge. The material provides a channel where heat can be dissipated.

SK Hynix has improved the thermal conductivity of EMC by addition Alumina to Silica, which has been adopted for EMC material so far. Thus, High-K EMC raises thermal conductivity with adoption of a material with high heat-transfer coefficient in EMC.

Leadership in Next-Gen DRAM

The adoption of the technology enables improved thermal conductivity by 3.5 times. Moreover, the thermal resistance in the vertical course of the heat also improved by 47 percent. Therefore, the new technology will be able to contribute to a longer battery runtime and product lifespan by improving performance of a smartphone and reducing power consumption.

“It’s a meaningful achievement that goes beyond a simple performance improvement as it addresses the inconvenience that many high-performance smartphone users may have had,” Lee Gyujei, Head of Package Product Development, said. “We are committed to firmly establishing our technological leadership in the next-generation mobile DRAM market with our technological innovation in materials.”

02 September 2025