Tokyo Electron Ltd. (TEL) has launched Prexa SDP, a new device prober designed to meet the growing demand for high‑precision testing of singulated semiconductor devices used in advanced packaging applications.

As demand for computing capability continues to rise, advanced semiconductors for high‑performance computing (HPC) and AI applications increasingly rely on 2.5D and 3D packaging technologies that integrate multiple devices into a single chip. According to TEL, improving the final yield of these products requires the accurate selection of Known Good Devices (KGDs) from pools of singulated, unpackaged components prior to packaging.

The company identified heat absorption and precise temperature control during testing as key challenges in KGD screening, particularly as device performance and heat generation increase. While conventional testing has focused on entire wafers, TEL emphasized that high‑precision testing of singulated devices is becoming essential for advanced semiconductor manufacturing.

Probing Beyond Wafer Level

Prexa SDP builds on TEL’s established Prexa wafer prober platform and incorporates the company’s proprietary temperature control technology for high‑heat‑generating devices. The system is designed specifically to enable reliable testing of singulated devices, extending TEL’s probing capabilities beyond wafer‑level applications.

The new device prober integrates core wafer prober technologies, including high‑precision contact performance, wafer handling, probe mark inspection, and a graphical user interface, while introducing enhanced heat absorption performance. A newly developed thermal head supports high‑precision active thermal control, enabling stable device transport and accurate KGD selection even for high‑power devices.

Yohei Sato, General Manager of the ATS Business Unit at Tokyo Electron, highlighted the growing importance of testing in advanced packaging workflows, stating that the Prexa SDP combines TEL’s proven wafer prober expertise with its proprietary thermal control technology to deliver the testing quality and system reliability required for advanced packaging operations.

TEL stated that it will continue developing production and testing technologies that support advanced packaging for HPC and AI semiconductors, with the goal of improving yield and product quality for its customers.

17 April 2026