SINFONIA Technology Co., Ltd. showcased various clean transport systems at SEMICON Taiwan 2023. Among them are load ports, equipment front end modules (EFEM) or air transfer units, and sorters for transferring wafers. 

A load port is installed at the front section of semiconductor manufacturing equipment. It puts in and out wafers to and from wafer storing pods, such as front opening unified pod (FOUP) and standard mechanical interface (SMIF). SINFONIA Technology proposed a load port equipped with a 300/200mm wafer auto switching function for the front-end process. The load port is usable for both 200mm and 300mm wafers simply by replacing the 300mm FOUP with the 200mm open cassette adapter. It meets the need to process both sizes of wafers. 

Meanwhile, SINFONIA Technology proposed a tape frame FOUP-compatible load port for the back-end process. The company has adopted its original technology that prevents the sucking of particles; thus it achieved a particle-free load port. The adoption of advanced packaging technologies, such as three-dimensional (3D) integration and direct bonded wafers, has been progressing. These advanced technologies require packages manufactured in cleaner environments in the back-end processes as well.

SINFONIA Technology has been receiving increasing inquiries for the tape frame FOUP load port. The company puts hope on the expansion of demand in the Taiwanese market. 

Takashi Ogura, General Manager, Clean Transport System Sales Department, Clean Transport System Division, SINFONIA Technology Co., Ltd., said, “In the front-end processes, which require a high level of cleanness, our company has a proven track record of sales and a high degree of recognition. Going forward, the demand for clean transport systems will increase in the back-end processes as well, and so does business opportunities for our company. I will pay close attention to the trends of leading-edge technologies, such as miniaturization and 3D integration, and support state-of-the-art semiconductor manufacturing.” 

At its booth, the company introduced a 200mm SMIF load port under development on a panel. It supports automated transport of SMIF pods, thus meeting increasing needs for automation down the road. The company plans to showcase the SMIF load port at SEMICON Japan in December.