Micron Technology, Inc. said it will officially break the ground of its new megafab in Onondaga County in New York on January 16. The company made the announcement after it has finalized the necessary regulatory permit approvals, marking the start of the construction of the US$100 billion project.

The project, Micron said, is the largest private investment in New York state’s history. Moreover, it will be home to the most advanced memory manufacturing in the world and will help meet the growing demands of the AI systems. With up to four fabs, this will be the largest semiconductor facility in the United States.

Micron Chairman, President and CEO Sanjay Mehrotra and other top executives will join with officials from the Trump administration, Congress and New York state and local government, as well as distinguished business leaders and members of the community, to celebrate this major step together. The groundbreaking ceremony will be followed by a celebration program at Syracuse University’s National Veterans Resource Center where executives and officials will provide remarks.

“Breaking ground at Micron’s New York megafab is a pivotal moment for Micron and the United States,” said Sanjay Mehrotra, Chairman, President and CEO of Micron Technology.

In addition, Mehrotra said, “As the global economy enters the AI era, leadership in advanced semiconductors will be the cornerstone in innovation and economic prosperity. Our investments and progress solidify our position as the only United States manufacturer of memory.”

11 January 2026