Global industry association SEMI said worldwide silicon wafer shipments in 2025 increased 5.8% to 12,973 million square inches (MSI) while wafer revenue slipped 1.2% to US$11.4 billion over the same period.

SEMI’s Silicon Manufacturers Group (SMG) said 2025 marks silicon MSI resuming growth amid AI-driven strong demand for advanced epitaxial wafers in logic and polished wafers for high-bandwidth memory. Nonetheless, the softness in revenue is mostly attributed to the slow momentum in traditional semiconductor applications, where the demand and pricing environment are yet to improve.

Two-Track Trajectory

Ginji Yada, Chairman of SEMI SMG said 2025 to 2026 wafer market is shaped by diverging trends across technology nodes. Specifically, demand for 300mm wafers remains strong in advanced applications, particularly AI-driven logic and HBM supported by the ongoing adoption of sub-3nm processes.

“These technology transitions are driving increased requirements for wafer quality and consistency, reinforcing the need for advanced material solutions. Investments in data centers and generative AI continue to underpin demand in leading-edge segments, where performance and reliability are critical, said Yada, who is also the Executive Office Deputy General Manager, Sales and Marketing Division at SUMCO Corporation.

Meanwhile, Yada noted the legacy semiconductor segment shows gradual signs of stabilization. Particularly, wafer and chip inventory levels in mature-node applications—such as automotive, industrial, and consumer electronics—have begun to normalize after extended inventory adjustments.

“While supply-demand conditions are improving sequentially, the pace of recovery remains moderate, with demand recovery still sensitive to macroeconomic factors and end-market dynamics. As a result, the overall market outlook reflects a two-track trajectory: sustained demand and technical advancement in advanced nodes, alongside a cautious and incremental rebound for demand in mature technology segments.”

Silicon wafers are the fundamental building material for semiconductors, which are vital components of all electronic devices. The highly engineered thin discs are produced in diameters of up to 300mm and serve as the substrate material on which most semiconductors are fabricated.

11 February 2026