300mm | AEI

ASIA ELECTRONICS INDUSTRYYOUR WINDOW TO SMART MANUFACTURING

300mm

ST to Surge Operation Footprint With More Investments

2025-04-14

NXP-Led Tech Firms to Surge Grit With New Plant

2024-12-04

Infineon to Soar Power GaN With First 300mm Offer

2024-09-12

Shin-Etsu Boosts GaN Growth With New 300mm Tech

2024-09-05

NXP, VIS New JV to Make Way for 300mm Line

2024-09-04

Fraunhofer, Infineon Team for New Smart Power Tech

2024-05-24

Toshiba to Boost Power IC Grit With New 300mm Fab

2024-05-24

ROHM Intensifies Chip Tie up with Toshiba

2024-04-01

UK Opens New IC Facility, First 300mm Plant

2024-04-01

imec Eyes New 300mm R&D Facility in Spain

2024-03-15

GF Secures New $1.5B Funding from U.S. Govt

2024-02-21

Amkor, GlobalFoundries Kick Off New Partnership

2024-01-17

Intel Unveils New Advances in Novel Transistor Scaling

2023-12-12

ROHM, Toshiba Seal New Deal in IC Manufacturing

2023-12-11

Texas Instruments Breaks Ground New 300mm Fab

2023-11-06

Siltronic Opens Facility Extension, Boosts Capacity

2023-09-21

NXP Reinforces Investments, R&D in Europe

2023-09-19

TSMC Eyes New €10B Chip Plant in Germany

2023-08-09

Fraunhofer IPMS, Applied Materials Launch New Tech Hub

2023-07-18

GF, ST Finalize New 300MM IC Facility Deal

2023-06-06