The Fraunhofer Institute for Photonic Microsystems IPMS is working with the Korean TSN Lab to develop a next generation of 10Base-T1s IP cores. Specifically, the technology aims to cater automotive and industrial communications applications and address the need for scalable and cost-efficient network infrastructures.

Korea’s Ministry of SMEs and Startups (MSS), along with the Korea Technology and Information Promotion Agency for SMEs (TIPA), is organizing the funding program.

Why 10Base-T1S Matters?

Currently, 10Base-T1S, a low-speed Ethernet PHY standard, is the only Ethernet technology that supports multi-drop connectivity. Therefore, it is emerging as a key enabler for consolidating fragmented in-vehicle and industrial communication systems, including CAN and LIN networks.

By significantly reducing cable complexity, cost, and vehicle weight, 10Base-T1S offers substantial advantages for automotive, industrial automation, and robotics applications.

The TSN Lab-led endeavor recently completed its six-month, Phase 1 preliminary study. With its success, Phase 1 validates the market potential of the 10Base-T1S technology and the project has now entered its main development phase.

The Phase 1 study covered comprehensive requirement analyses with domestic and international automotive manufacturers. The study also included functional and performance benchmarking of competitor semiconductor solutions.

The joint project aims to deliver a robust, silicon-proven 10Base-T1S IP solution tailored to the stringent requirements of next-generation automotive and industrial communication systems, with a clear focus on enabling adoption in international markets, including Europe.

Fraunhofer IPMS: Enabling Silicon-Proven Innovation

As a globally recognized research institute specializing in ASIC, FPGA, and SoC design, Fraunhofer IPMS brings more than 20 years of experience and over 200 international licenses to the collaboration. The institute will contribute its expertise in advanced microelectronics design, verification, and system integration to accelerate the realization of production-ready IP solutions.

“The continuous advancement of our TSN IP core portfolio is key to scalable, real-time connectivity in automotive and industrial applications. Collaboration with the TSN Lab accelerates the delivery of a robust, silicon‑proven 10Base‑T1S IP solution and brings innovation into practical use faster,” says Alexander Noack, Division Director Data Communication and Computing at Fraunhofer IPMS.

Through this collaboration, Fraunhofer IPMS strengthens its commitment to supporting globally competitive semiconductor innovation and fostering cross-border R&D partnerships.

25 February 2026