German provider of laser micromachining and roll-to-roll laser systems 3D-Micromac AG confirmed bagging multiple system deals from a leading optical solutions provider. Particularly, the customer, which maintains state-of-the-art LED chip factory in Asia, purchased multiple microMIRA^TM Laser Lift-Off (LLO) systems. The customer will install the new microMIRA systems in pilot- and production lines at its state-of-the-art LED chip factory in Asia.

3D-Micromac provides laser micromachining and roll-to-roll laser systems for the semiconductor, photovoltaic, glass and display markets.

Laser Lift-Off an Enabling Process for microLEDs

MicroLEDs have the potential to revolutionize the display industry, promising a variety of advantages. Particularly, for superior viewing angle, high dynamic range with perfect black luminance and high brightness, wide color gamut, fast refresh rates, long lifetime, and low power consumption. Furthermore, potential applications include very large displays for indoor and outdoor use, as well as high-resolution displays for augmented reality (AR) and virtual reality (VR) wearable devices.

However, the microLED fabrication process is vastly more complex than LCD and OLED manufacturing. In addition, it faces several technical challenges that needs solution before microLEDs can be readily available in the mass market.

Among these challenges is detaching and transferring the processed microLED chips from the donor or growth substrate (e.g., sapphire) to an intermediate substrate for subsequent testing without damaging the expensive growth substrate. This allows it to be repurposed for future use. Precisely, the microMIRA system from 3D-Micromac addresses this task with superior performance.

3D-Micromac’s microMIRA system provides highly uniform, force-free lift-off of different layers on large-area substrates at high processing speeds without the need for costly and polluting wet chemical processes. The unique line beam system builds on a highly customizable platform that can incorporate different laser sources, wavelengths, and beam paths to meet each customer’s unique requirements. The system is capable of processing different substrate materials and sizes. Moreover, it can achieve processing speeds (including handling) of up to 60 eight-inch wafers per hour.

Important Company Milestone

According to Uwe Wagner, CEO of 3D-Micromac, “This multiple system order is a testament to our ability to provide innovative and enabling laser micromachining solutions for industrial applications. Serving both mature and emerging markets. It also represents an important milestone for 3D-Micromac as we continue to expand our product offerings and services into the display industry, addressing the production needs for exciting new display technologies, including microLEDs.”

To date, 3D-Micromac has sold more than ten laser processing systems for microLED applications. This includes the industry-benchmark microMIRA laser-lift-off system as well as the recently introduced microCETI™ micromachining platform.

The microMIRA LLO system has been used successfully in mass production by electronics manufacturers globally for years. In addition to gallium nitride (GaN) lift-off from glass and sapphire substrates in microLED display manufacturing, the microMIRA system can also be used for layer separation in semiconductor and sensor manufacturing. Furthermore, for laser annealing and crystallization for surface modification.