KOKI Co., Ltd. has released the S3X58-HF1100 high-functional, general-purpose halogen-free solder paste for surface-mount technology (SMT).
Pursuing specific performance in existing solder pastes has led to the deterioration of the performance of another feature, and fulfilling all requirements for products at high levels has been difficult. S3X58-HF1100 has solved various problems in soldering using solder paste, including wetting, ICT properties, flux splattering, voiding, printing, tackiness, electrical reliability, and free of halogen, making full use of the powerful wetting technology and flux coagulation technology.
Adopts New Flux Technology
S3X58-HF1100 adopts a newly engineered flux design and suppresses the reaction of solder powder in room temperature, efficiently improves solder meltability in the reflow process and exhibits good wettability. As a design concept, ease of use at the mounting site has been prioritized. As result, it was able to maintain intermittent printing property after halting of work, and continuous printing performance when it is reused from previous day at high levels.
In conventional flux design, active force is consumed to remove antioxidant film from solder particles; this results in the decrease in the amount of active agents that can be used when the solder melts, and meltability tends to deteriorate. In the newly adopted flux technology, an easy-to-remove film is formed around solder particles, and the secondary antioxidant that traps oxygen—a cause of continuous oxidation—suppresses the oxidation of solder particles, thereby improving solder’s meltability efficiently, and secures high wettability (powerful wetting technique).
The flux formulation of the S3X58-HF1100 solder paste is specifically designed so that flux residue coagulates at the time when the solder starts to melt. When the solder gets molten, instant coagulation and evacuation of the liquified flux brings about various benefits in soldering performance, such as reduction in voiding and improved wetting (flux coagulation technique). The solder alloy consists of Sn+3.0Ag+0.5Cu and has a melting point of 217 to 219°C.