The Electronic Chemicals and FA Systems Division of Tamura Corporation took part in the recently concluded SEMICON Taiwan 2023. There, the division, which specializes in solder products, featured a wide range of products that captured the attention of visitors.

Tamura offers abundant varieties of products optimum for various semiconductor packages. In addition, it supports advanced packages that are increasingly becoming multifunctional and complex. 

Meets Next-Generation Technologies

Nobuo Tajima, General Manager of Taiwan Tamura Technology Co., Ltd., said, “In Taiwan where semiconductor manufacturers concentrate, products for semiconductor packages make up the main market. The advancement of semiconductors has been progressing, and diverse package technologies are emerging. For that reason, the importance of solders has been increasing.” Tamura showcased products that support micro joining. Particularly, these included a solder paste for the formation of optimum micro bumps and a solder paste for ultra-fine pitch solder bump forming. 

Tamura’s solder pastes for micro bump formation are compatible with narrower pitches and achieve fine bump formation and stable bump heights. Moreover, they suppress the occurrence of voids and contribute to the improvement of quality. They also feature excellent printability, enabling the formation of fine bumps. 

Tajima said, “Next-generation technologies such as chiplets, necessitate fine joining on substrates. Hence, Tamura offers products that support miniaturization, meeting various needs.”

Aside from solder pastes for the formation of micro bumps, Tamura also introduced solder pastes for pre-coating. The pre-coat processing prevents copper pad oxidization and deterioration due to heat. In addition, Tajima said, “(Pre-coating) leads to higher yield and stable quality of flip-chip mounting.”  Tamura contributes to semiconductor manufacturing by leveraging on its diverse portfolio of solder products.