Onto Innovation Inc. has introduced the new Firefly^® G3 inspection and metrology system for automated process control in production of panel-level substrates.

Accordingly, the Firefly G3 system has already been shipped to a tier-one customer supporting with AI chiplet-based panel-level packages. The company expects several additional customers to take delivery in the first half of 2024.

The Firefly G3 system’s inspection and metrology capabilities uniquely complement Onto’s JetStep^® family of panel-level lithography systems. Particularly, using proprietary feed-forward and feedback software can provide high-resolution data. This optimizes layer-over-layer overlay accuracy throughout all layers on each side of the panel being processed. This is a unique capability in improving current panel performance and yield.

Improve Yields, Throughput

“The Firefly G3 system, when combined with Onto’s Clearfind^® technology and TrueADC^® software, replaces multiple tools and operators used for defect review and classification. This enables customers to improve yields and increase their panel substrate throughput,” says Mayson Brooks, vice president and general manager of Onto’s inspection business.

Moreover, Brooks said the flexibility of the Firefly G3 system is available in a wide range of applications. This includes the detection of under-film bubbles and particles. In addition, Brooks said defects not found at an early stage can lead to shorts and opens later in the manufacturing process.

This next-generation Firefly system goes beyond 2D inspection and metrology by supporting additional process control steps. Particularly, by introducing 3D metrology sensors. With the new-generation 3D sensors, the system can measure film thicknesses and the height of metal RDL lines. The addition of these sensors allows customers to collect critical data required to mature their process in a shorter time.