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Intel's New Fab 9 Makes Milestone in 3D Chip Packaging

Intel its new Fab 9, the chip giant’s cutting-edge factory in Rio Rancho, New Mexico. The milestone is part of Intel’s previously announced US$3.5 billion investment to equip its New Mexico operations. Particularly, for the manufacturing of advanced semiconductor packaging technologies, including Intel’s breakthrough 3D packaging technology, Foveros.

Intel’s global factory network is a competitive advantage that enables product optimization, improved economies of scale, and supply chain resilience. Moreover, the Fab 9 and Fab 11x facilities in Rio Rancho represent the first operational site for mass production of Intel’s 3D advanced packaging technology.

A drone photo shows Intel’s new Fab 9 in Rio Rancho, New Mexico, in January 2024. Fab 9 is part of Intel’s previously announced $3.5 billion investment to equip its New Mexico operations for the manufacturing of advanced semiconductor packaging technologies. (Credit: Intel Corporation)

In addition, it is also Intel’s first co-located high-volume advanced packaging site. Hence, marking an end-to-end manufacturing process that creates a more efficient supply chain from demand to final product.

Propels 3D Packaging Technology

Fab 9 will help fuel the next era of Intel’s innovation in advanced packaging technologies. The semiconductor industry is moving into a heterogeneous era that uses multiple “chiplets” in a package. Thus, advanced packaging technologies, such as Foveros and EMIB (embedded multi-die interconnect bridge), offer a faster and more cost-efficient path toward achieving 1 trillion transistors on a chip. Furthermore, it extends Moore’s Law beyond 2030.

A photo from January 2024 at Intel’s new Fab 9 in Rio Rancho, New Mexico shows chiplet bonding as part of Intel’s advanced packaging technology called Foveros. This breakthrough 3D packaging technology offers flexible options for combining multiple chips that are optimized for power, performance and cost. (Credit: Intel Corporation)

Foveros, Intel’s 3D advanced packaging technology, is a first-of-its-kind solution that enables the building of processors with compute tiles stacked vertically, rather than side-by-side. It also allows Intel and foundry customers to mix and match compute tiles to optimize cost and power efficiency.

“This investment by Intel underscores New Mexico’s continued dedication to bring manufacturing back home to America,” said Gov. Michelle Lujan Grisham. In addition, Grisham said, “Intel continues to play a key role in the state’s technology landscape and strengthen our workforce, supporting thousands of New Mexico families.”

Commitment to Sustainability 

Intel remains committed to minimizing its environmental footprint as it expands its operations to support the demand for semiconductors. As such, its Fab 9 is on track to meet its goal to recycle at least 90% of construction waste. Thus, exceeding the goal most recently in November and December 2023.

Intel also purchases renewable electricity to meet 100% of its New Mexico electricity use. The company has also funded three nonprofit-led water restoration projects benefiting New Mexico watersheds that target to restore more than 100 million gallons of water annually. Thus, these projects helped Intel return and restore more than 100% of its New Mexico fresh water to the community and local watersheds in 2022. It also conserved more than 500 million gallons of water at its New Mexico site, the equivalent annual water use of more than 4,500 U.S. homes.

A photo shows bunny-suited manufacturing technicians at Intel’s Fab 11X in Rio Rancho, New Mexico, in January 2024. Fab 11X and the new adjoining Fab 9 represent Intel’s first co-located high-volume advanced packaging site, marking an end-to-end manufacturing process that creates a more efficient supply chain from demand to final product. (Credit: Intel Corporation)

About Intel New Mexico 

Intel’s presence in Rio Rancho dates to 1980, with a cumulative investment of more than US$16 billion in capital. Moreover, Intel’s commitment goes beyond business operations as it extends into the community. Over the past five years, Intel employees volunteered more than 65,000 hours in New Mexico. Additionally, Intel, the Intel Foundation and Intel employees have donated more than US$6.5 million to support local nonprofits and schools since 2018.

Intel actively engages with the Rio Rancho community through volunteering, collaborations with nonprofits and investments in education. For example, Intel has helped establish endowment scholarships among five New Mexico colleges and universities.