USI Designs Dual-Core Bluetooth 5.0 AoP Module, Eyes IoT

The ubiquity of internet of things (IoT) devices has proportionally increased the need for wireless and seamless connections to the internet. In line with this trend, Universal Scientific Industrial Co., Ltd. (USI) releases the WM-BZ-ST-55 dual-core Bluetooth 5.0 Antenna-on-Package (AoP) module. The WM-BZ-ST-55 AoP module capitalizes on USI’s proprietary heterogeneous integration and miniaturization technology, and consumes a small amount of power.

Novel Antenna-on-Package Technology

Measuring 7.2×9.3×0.96mm, the WM-BZ-ST-55 AoP module features STMicroelectronics’ STM32L4 Arm® Cortex®-M4 microcontroller unit (MCU) with the Cortex-M0 + dedicated kernel-managed radio frequency (RF) chip. This freestanding compact module is packaged with partial metal sputtering shielding. It includes STMicroelectronics’ STM32WB55 series RF system-on-chip (SoC) that supports BLE5.0, Zigbee and Thread wireless connection, incorporating BTLE, and integrated with 2.4GHz antenna.

WM-BZ-ST-55 Antenna-on-Package module

“Traditional Bluetooth modules were often excessively large in size or paired with external antennas due to the difficulty in reducing the antenna size,” said Kevin Lan, General Manager of Wireless & Mobility Solutions BU, USI. “By employing USI’s Antenna-on-Package technology and selected conformal shielding process, we can integrate the Bluetooth with the antenna and reduce the size smaller than a single IC in a BGA package. Furthermore, we design the WM-BZ-ST-55 module with a built-in Cortex®-M4 microcontroller that not only offers cost savings for customers’ chip designs. It can also incorporate in a wide range of space-constrained IoT devices.”

The WM-BZ-ST-55 AoP module combines features that meet stringent customer requirements with USI’s leading-edge miniaturization technology. In addition, it uses computer-aided simulation software from the beginning of the module design to simulate the antenna efficiency, radiation pattern and gain. Completing simulation at the initial design stage helps streamline the design process, further shortening the design cycle. USI’s WM-BZ-ST-55 Bluetooth AoP module operates at a temperature range of between -40 and 85°C. It is an ideal Bluetooth module for applications, like remote sensors, wearable trackers, building automation controllers, computer peripherals, unmanned aerial vehicles (UAVs), and other IoT devices.

The company is currently applying for international certification from communication regulators, including the US (FCC), EU (CE), Canada (IC), among others.