Ansys and Intel Foundry have collaborated to provide multiphysics signoff solutions for Intel’s innovative 2.5D chip assembly technology. Particularly, using EMIB technology to connect the die flexibly and without the need for through-silicon vias (TSVs).

Thus, Ansys’ accurate simulation engines deliver higher speeds, lower power consumption, and greater reliability. Specifically, in advanced silicon systems for artificial intelligence (AI), high-performance computing, autonomous driving, and graphic processing.

Pave Way for More Competitive Products

Ansys RedHawk-SC Electrothermal™ is an electronic design automation (EDA) platform that enables multiphysics analysis of 2.5D and 3DICs with multiple dies. Accordingly, it can perform thermal analysis with anisotropic thermal conduction. This has been essential for Intel’s new backside power distribution technology.

Thermal gradients also lead to mechanical stresses and warpage that can impact product reliability over time. Power integrity verification is necessary through chip/package co-simulation. This gives the 3D system-level context needed for maximum accuracy.

“Intel’s enablement of Intel 18A and EMIB technology is a differentiated approach to multi-die assembly that has several significant advantages over traditional stacking techniques,” said Rahul Goyal, vice president & general manager, product and design ecosystem enablement at Intel. In addition, Goyal said the collaboration will make the full benefit of this innovation easily accessible to their joint customers. Thus, enabling them to create more competitive products.

Meanwhile, John Lee, vice president and general manager of the electronics, semiconductor, and optics business unit at Ansys, said the collaboration will bring breakthrough in complex Multiphysics challenges. Particularly, this will meet stringent thermal, mechanical, performance, and reliability requirements.

Moreover, Lee said,  “Ansys’ multiphysics signoff platform gives our mutual customers the flexibility to adopt EMIB technology for their system architecture and assemble the best-of-breed solutions for higher performance products and a smooth user experience.”