Hirose Electric Co., Ltd.’s BK35 Series of RF-compatible substrate-to-FPC connectors highlight full shield structure and combined power and signal for high-speed transmission. This innovative product can contribute to the evolution of mobile devices by combining power, electromagnetic interference (EMI) and radio frequency (RF) circuits.

Importance of Noise Reduction

Smartphones have become increasingly indispensable in human’s daily lives, facilitating activities from online shopping to mobile banking. There are over 5.5 billion smartphone users globally and a penetration rate exceeding 70%. Thus, the demand for further miniaturization and enhanced functionality continues to grow. Consequently, electronic components are more densely packed, making it crucial to address electromagnetic noise generated within devices.

Smallest Footprint in Class with Full Armor Protection

Mainly, the BK35 Series connector features electromagnetic compatibility (EMC) shielding. Moreover, it suits a small footprint, measuring only 0.35mm in pitch, 0.6mm in height, and 2.2mm in depth. Despite its size, it is fully shielded to minimize EMI. On top of this, it is capable of excellent RF signal transmission up to 40GHz. Its fully shielded structure provides enhanced EMI protection, offering superior performance in high-frequency applications. Additionally, the series supports high-speed data transmission up to 40Gbps. Also, it complies with standards, such as USB4.0 Gen3x2 and PCIe Gen4, making it an innovative component for advancing mobile device technology.

Future Product Development

The BK35 series is applicable not only for smartphones, but also for wearable devices such as smartwatches and wireless earbuds, laptops, routers, handy-type medical devices, drones, and other devices.

Against this background, Hirose Electric remains committed to addressing the diversifying needs for connectivity. It will continue to contribute to the ongoing evolution of devices.

-25 March 2024-