AI-generated applications are escalating the demand for higher computing power. In response, Foxconn Interconnect Technology Ltd (FIT), a subsidiary of Hon Hai, is joining forces with MediaTek to co-develop a groundbreaking 51.2T solution, inclusive of Co-Packaged Optics (CPO).

CPO aims to revolutionize the integration of optical transceivers. Particularly, it incorporates them directly onto the same package as the ASIC, moving away from traditional separate modules. Meanwhile, Fit builds upon the foundation laid by the Red Dot Design Award-winning FITCONN 800G high-speed connector. Accordingly, it further advanced its CPO capabilities by utilizing MediaTek’s cutting-edge ASIC platform. Specifically, this includes high-speed SerDes and silicon photonics technologies. The collaboration leverages FIT’s adeptness in CPO socket creation and integration capabilities. Thus, it will deliver superior high-performance computing systems tailored for switches within front-end and back-end networks.

Within data centers, CPO is instrumental in increasing bandwidth and reducing electrical pathways. Thereby, it improves latency and accelerates data transmission speeds. Mainly, the architecture’s ability to demonstrate significant total system power savings underscores its value and potential. From a connectivity standpoint, CPO enriches FIT’s existing optical communication offerings, spanning 800-1600G. Further, collaborating with MediaTek will enable the evolution of next-generation network communication technologies.

“We are deeply honored to partner with MediaTek on this venture. This trailblazing technology will introduce revolutionary products to the market, ensuring stable and reliable high-speed connectivity solutions,” said Mr. Joseph Wang, CTO of FIT Hon Teng. “Anticipating the product’s launch, we are committed to collectively furnishing our customers with a broader spectrum of efficient connectivity solutions, thereby propelling the high-performance computing era forward.”

“MediaTek’s vision is to deliver versatile ASIC platforms to clients, providing them with state-of-the-art technologies designed for the rapidly expanding data center and server markets,” said Vince Hu, Corporate Vice President at MediaTek. “By working together with FIT on the CPO initiative, we will create new market opportunities by enabling and powering next-generation high-speed transmission solutions.”

MediaTek unveiled its product lineup, showcasing FIT’s CPO socket, in March 2024 at OFC, the premier global event dedicated to optical communication and networking.

-08 April 2024-