AEI

ASIA ELECTRONICS INDUSTRYYOUR WINDOW TO SMART MANUFACTURING

Shin-Etsu to Innovate Adhesives with New Technology

Shin-Etsu Chemical Co., Ltd. agreed to acquire a dry adhesive technology that utilizes biomimicry developed by Setex Technologies, Inc. Accordingly, it aims to develop a new market with Shin-Etsu Chemical specializing in the corporate market while Setex focuses on the consumer market.

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Setex’s gripping technology

Primarily, Setex is a startup that has developed a technology for providing materials with strong friction and adhesion. Specifically, it built a structure resembling a gecko’s hand on their surfaces. Shin-Etsu Chemical views this technology, which gives functions to materials utilizing biomimicry as a new underlying technology. The combination of the technology acquired from Setex with Shin-Etsu Chemical’s optimal materials will enable their application to the following diverse fields without using chemical adhesives.

・Handling of workpieces with adhesive-residue free in clean processes

・Adding a holding function to workpieces in hot processes in which adhesives cannot be used

・Promoting customers’ GX and contributing to the realization of environmentally friendly processes with a technology for repeatedly adhering materials without chemical adhesives

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Create Potential Uses in Semiconductor Process

Moreover, Shin-Etsu Chemical will endeavor to apply the adhesive technology to various products used in semiconductor and other manufacturing processes. Also, the company will make new technological proposals under the name of ShineGrip™. Specifically, this technology suits applications that require repeated friction and adhesion on material surfaces.

Shin-Etsu Chemical produces semiconductor process materials and other functional materials used in various industries. To meet more sophisticated customer requests, it will provide innovative, effective solutions to help customers solve their problems. Specifically, it will combine its own materials to the unique technology that adds a function through pattern processing on a surface.

-24 April 2024-