Indium Corporation introduces the new, high-reliability Au-based Precision Die-Attach (PDA) Preforms. Compared to standard preforms, these gold-based PDA preforms offer a higher level of precision to reduce defects, control bondline thickness (BLT), and deliver high-yield performance and reliability in critical die-attach applications.

To Lessen Solder Defects

Mainly, semiconductor laser die-attach applications require the highest quality, ultra-precise solder preforms. Specifically, this ensures accuracy and repeatability during assembly for a guaranteed, highly reliable end-product. Indium’s Au-based PDA Preforms offer the new gold standard.

Among the features of the new product include, 1) highly accurate thickness control; 2) precise edge quality; 3) optimized cleanliness; 4) default waffle pack method, and 5) available for gold-based alloys.

“We are excited to offer our gold-based PDA preforms because they uniquely meet our customers’ needs for highly automated, precision processes,” said Indium Corporation Senior Product Manager Jeff Anweiler.

 “They not only reduce solder-related defects and die-tilt, but they also increase process yield performance. These products deliver superior thermal transfer, operational efficiency, and device reliability, especially for critical laser and RF applications, as well as 5G communications.”

Indium’s Au-based PDA Preforms are available in the following alloys: Primary alloys (80Au/20Sn, 79Au/21Sn) and Development alloys (78Au/22Sn; 77Au/23Sn; 76Au/24Sn; 75Au/25Sn, and 88Au/12Ge, 96.8Au/3.2Si, 82Au/18In).

Generally, selecting the right preform characteristics and packaging is crucial for consistent success in production processes. Every application has unique parameters. This makes it essential to design a preform and its packaging to meet these specific needs.

-18 July 2024-