Nissan Chemical Corporation has agreed to acquire all outstanding shares in Nippon Polytech (NPT). Accordingly, this will strengthen Nissan Chemical’s line in the display field and leverage NPT’s know-how and resources.

Nippon Polytech manufactures the solder resist used in chip-on-film (COF) for displays. Specifically, it has excellent electrical reliability, low bleeding performance, and high bending resistance. Moreover, it can also meet the market demand for fine pitch wiring and has a high market share.

Through this acquisition, Nissan Chemical will expand its portfolio in the display field. Furthermore, it can maximize the use of the know-how and resources held by Nippon Polytech in developing Nissan Chemical’s materials. Specifically, for the display and semiconductor packaging fields, thereby achieving further growth.

Strengthens Core Technologies

COF is a technology for mounting semiconductor chips (driver ICs) on flexible printing circuit boards made of polyimide. It is widely used for mounting driver ICs in LCD/OLED smartphones, PCs, and monitors/TVs.

Solder resist is the insulating ink applied to printed circuit boards. Accordingly, its purpose is to protect the circuits on the boards from contaminants and moisture.

Nippon Polytech has its head office in Hachioji-shi, Tokyo. The corporate philosophy is “We will continue to take the challenge of creating No.1 value and a dream-filled future with products that are trusted and appreciated.” Since founded in 1989, Nippon Polytech has developed, manufactured, and sold solder resist for flexible printed circuit boards. Accordingly, they have been essential for displays of smartphones, notebook PC, TVs, among others.

Meanwhile, Nissan Chemical Corporation contributes to solving social issues providing products and services. Specifically, through four business areas – Performance materials, Agricultural chemicals, Chemicals, and Healthcare. The company plans to acquire new technologies and accelerate growth in each business area by improving and combining core technologies.

03 September 2024