Test Research, Inc. (TRI) has introduced the TR7700QC SII Core Features 3D AOI equipped with essential inspection functionalities tailored for the electronics manufacturing industry.

Mainly, the Core Features 3D AOI showcases a user-friendly programming for easy setup. It features flexible IPC-610 inspection algorithms, optional AI-powered solutions, and highlights compliance with the latest Smart Factory standards. Moreover, with a 12MP high-speed camera, it offers four factory-setting configurations ranging from high-resolution 10μm to high-speed 15μm.

Also, it is powered by IPC-610-compliant algorithms. Thus the new 3D AOI system can inspect the most intricate solder joint defects, including THT components. Moreover, the interactive 3D models help operators quickly review detected defects, such as lifted BGA components, IC leads, connectors, switches, and other mounted devices.

Additionally, the TR7700QC SII also features the Multi-Step Function, enabling efficient inspection of both tall (up to 40mm) and short components during the same inspection. Finally, the TR7700QC SII supports current Smart Factory Standards, including the IPC-CFX and The Hermes Standard (IPC-HERMES-9852).

-26 September 2024-