Applied Materials, Inc. and CEA-Leti have announced the next phase of their longstanding collaboration to accelerate innovation in specialty semiconductors. Specifically, the partnership will expand their joint lab and materials development to address emerging infrastructure challenges in AI data centers.

The joint lab will focus on device innovations for chipmakers serving the IoT, Communications, Automotive, Power, and Sensors (ICAPS) markets. These specialty chips are used in a wide range of applications – from industrial automation to electric vehicles.

Moreover, they play a critical role managing data and power distribution within data centers. Growing resource demands in AI infrastructure have highlighted the need for a new wave of innovation in ICAPS chips to enable more energy-efficient computing.

To Boost Chipmaking in France

Under the new arrangement, Applied and CEA-Leti plan to expand the lab with new equipment and capabilities that move beyond individual process steps to include full-flow development of specialty devices. Additionally, the lab would be equipped with state-of-the-art advanced packaging tools to support heterogeneous integration of chips across different wafer types and process nodes. Thus, enabling entirely new classes of specialty devices for a range of next-generation applications.

The joint facility features several Applied Materials wafer processing systems together with CEA-Leti’s world-class capabilities for evaluating performance of new materials and device validation. The upgraded lab will strengthen the chipmaking ecosystem in France. Specifically, by further expanding the technology hub in Grenoble, a leading site for collaborative innovation across government, academia and industry.

The lab also marks an extension of Applied’s global EPIC Platform, a new high-velocity innovation model designed to accelerate commercialization of new chip technologies. Applied and CEA-Leti will be able to leverage the R&D work taking place across Applied’s global innovation centers to drive progress in specialty semiconductor technologies.

Energy-Efficient Solutions for AI Data Center

Aninda Moitra, corporate vice president and general manager of Applied Materials’ ICAPS business said their combined expertise will help foster breakthroughs and push the boundaries of semiconductor innovation. Therefore, contributing to sustainable advancements in a range of critical applications for the AI era.

Meanwhile, Sébastian Dauvé, CEO of CEA-Leti, said the first phase of the expanded collaboration laid important groundwork for addressing materials-engineering challenges. Thus, the new arrangement will enable them to focus on energy-efficient solutions for AI data center infrastructure.

“The extended collaboration also leverages our complementary strengths to accelerate innovation at the system level, while supporting sustainable growth in France’s semiconductor ecosystem,” he said.

17 June 2025