imec announced Wednesday (Oct. 15) that more companies have committed to join its Automotive Chiplet Program (ACP). In the program, imec and partners aimed to draw chiplet architectures that will drive high-performance computing in software-defined vehicles.
US chip company GlobalFoundries will be joining the program as a foundry partner. Moreover, semiconductor and system companies Infineon, Silicon Box, STATS ChipPac, and Japanese autonomous driving tech developer TIER IV have also committed to join ACP. Therefore, expanding imec’s network to further accelerate the development and adoption of cutting-edge chiplet architecture for the automotive industry.
More vehicles nowadays integrate high-performance software-defined platforms. For that reason, traditional monolithic chip designs are increasingly challenged to meet the demands of advanced driver-assistance systems (ADAS), autonomous driving and other immersive in-vehicle infotainment.
Therefore, chiplet architectures offer a scalable, flexible and cost-effective alternative that can be seamlessly integrated into the sophisticated compute systems of software-defined vehicles.
Imec’s ACP brights together automotive and semiconductor ecosystems stakeholders to bring about research initiative to accelerate adoption of chiplet architectures and packaging technologies and meet automotive-grade requirements.
As a foundry partner, GF will provide advanced manufacturing capabilities. Specifically, its differentiated technology portfolio and global footprint of fabs in the United States, Europe, and Asia to support development and manufacturing of ACP’s chiplet-based platforms.
Launched in late 2024, ACP leverages imec’s world-leading track record in advanced 2.5D and 3D packaging with resources and expertise from different parts of the automotive value chain. Among its first partners to have committed to join include ARM, ASE, BMW Group, Bosch, Cadence Design Ssytems, Siemens, Silicon Auto, Synopsys, Tenstorrent, and Valeo.
16 October 2025