Korean DRAM and NAND flash memory supplier SK Hynix has entered a strategic agreement with American semiconductor solutions provider Qnity Electronics, Inc. Specifically, the agreement is on the supply of polishing pads for chemical mechanical planarization (CMP) in semiconductor fabrication.

Enabling Chip Advancements

The alliance will support SK hynix’s needs for advanced CMP pads, used for their next-generation semiconductor manufacturing and mass production processes. The agreement affirms the continuation of the two companies’ continuing collaboration in providing CMP materials for SK hynix’s growing memory business.

“This agreement reflects our shared commitment to enabling advancements in the semiconductor and electronics industries through collaboration,” said Sanjay Kotha, Global Business Director, CMP Technologies, Qnity™, DuPont Electronics. “We’re proud to have a key role in supporting SK hynix’s innovation roadmap through our CMP solutions.”

The two companies signed the agreement on Oct. 7 during at the sidelines of SEMICON West in Phoenix, Arizona in the United States.

Early this year, DuPont announced the separation of its electronics business by way of spin-off transaction effective November 1. Therefore, creating Qnity Electronics, Inc.

CMP is a semiconductor process that involves the use of tribological chemical-mechanical surface reactions. Typically, CMP systems have a polisher, cleaner, and metrology equipment in a conventional configuration. It has become a vital semiconductor process for the manufacture of many devices in the market.

17 October 2025