IBM and University of Dayton in Ohio, United States will do joint research and development of next-generation semiconductor technologies and materials to advance critical technologies in the era of artificial intelligence (AI).

The agreement includes IBM providing over US$10 million worth of equipment to the chip nanofabrication facility that will be built inside University of Dayton campus.

“This collaboration continues IBM’s tradition of bringing together industry and academia to fuel innovation,” said James Kavanaugh, Senior Vice President and Chief Financial Officer, IBM. “Students and researchers at the University of Dayton will have exciting opportunities to contribute to the next wave of chip and hardware breakthroughs that are essential for the AI era.”

On the other hand, Jeff Hoagland, President and CEO, Dayton Development Coalition said the cooperation will boost their tech ecosystem and will cement Dayton region’s reputation as a premier hub for advanced manufacturing and technology.

Foster Innovation, Skilled Workforce

This agreement builds on a longstanding relationship between IBM and the University of Dayton. Currently, they work together as part of the University of Dayton’s Digital Transformation Center and as members of the AI Alliance, which IBM helped launch in 2023.

IBM will provide to University of Dayton its state-of-the-art semiconductor equipment for a new semiconductor nanofabrication facility inside the university’s campus. Accordingly, the facility, with planned completion in early 2027, will serve as hub for advanced chip research and workforce development. Thus, providing hands-on, lab-to-fab learning opportunities for the university’s students and researchers.

IBM and the University of Dayton strive to advance innovation and cultivate a skilled workforce which is essential to the long-term success of the U.S. semiconductor industry.

Anchored in Dayton, this collaboration will establish a new ecosystem for research and development with potential to drive impact at both regional and national levels.

20 November 2025