Japanese conglomerate Sumitomo Chemical has announced that its wholly owned South Korean subsidiary, Dongwoo Fine-Chem Co., Ltd., has signed a joint venture agreement with Samsung Electro-Mechanics Co., Ltd. to establish a new company focused on the development, manufacturing and sale of glass core substrates for advanced semiconductor packages. The venture is expected to be established in 2026, subject to regulatory approvals.

The move comes as demand for high-performance semiconductors continues to rise, driven by generative artificial intelligence (AI), expanding data center investments and growing requirements for advanced computing applications. These trends are increasing the need for larger, denser and more power-efficient semiconductor packages.

Glass Core Technology Gains Momentum

Glass core substrates are attracting industry attention as a potential platform for next-generation semiconductor packaging. The technology offers high rigidity, dimensional stability, low warpage and low thermal expansion, enabling larger package sizes, enhanced reliability and higher-density wiring. According to Sumitomo Chemical, these advantages make glass core substrates particularly suitable for future AI-related semiconductor applications.

The new venture plans to combine Dongwoo Fine-Chem’s expertise in thin-glass processing, automated manufacturing systems and quality-controlled production with Samsung Electro-Mechanics’ strengths in advanced package substrate design, high-density wiring technologies and commercialization capabilities.

Supply System Planned for 2027

The planned company, tentatively named GlaSSEM, will be headquartered in Pyeongtaek, South Korea. Samsung Electro-Mechanics will hold a 66% stake, while Dongwoo Fine-Chem will own the remaining 34%. The venture is expected to establish a supply system by the second half of fiscal 2027 before gradually expanding production capacity.

Representative Lee Dongwoo is slated to lead the company, which will focus on the development, manufacture and sales of glass core substrates for advanced semiconductor packages.

Supporting Semiconductor Industry Growth

Sumitomo Chemical stated the new company will bring together technologies and expertise from both companies, highlighting the collaborative approach behind the venture.

The company also noted that “the Group will further strengthen its business foundation in the next-generation semiconductor package field” through the establishment of the joint venture.

Sumitomo Chemical said the partnership aligns with its strategy to expand its semiconductor materials business and strengthen its position in next-generation packaging technologies while supporting continued innovation across the semiconductor industry.

09 July 2026